LITTELFUSE SP4061

TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
SP4061 Series 2.5V 20A Rail Clamp Array
RoHS
Pb GREEN
Description
The SP4061 integrates 4 channels of low capacitance
diodes with an additional zener diode to protect sensitive
I/O pins against lightning induced surge events and
ESD. This robust device can safely absorb up to 20A per
IEC61000-4-5 (tP=8/20μs) without performance degradation
and a minimum ±30kV ESD per IEC61000-4-2 international
standard. The low loading capacitance makes the SP4061
ideal for protecting high-speed signal pins.
Pinout
Features
1
3
5
GND
9
• E
SD, IEC61000-4-2,
±30kV contact, ±30kV air
• L
ow capacitance of 3.5pF
(TYP) per I/O
• E
FT, IEC61000-4-4, 40A
(tp=5/50ns)
• L
ow leakage current of
1µA (MAX) at 2.5V
• L
ightning, IEC61000-4-5,
20A (tp=8/20µs)
7
Functional Block Diagram
9
Applications
7
5
• 10/100/1000 Ethernet
Interfaces
• VoIP Phones
• Customer Premise
Equipment (CPE)
• PBX Systems
• Set Top Boxes
Application Example
RJ-45 Connector
*Package is shown as transparent
Tx+
J1
1
GND
Ethernet PHY
Tx-
3
SP4061
PHY
Rx+
J8
Rx-
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
SP4061 Series
180
Revision: September 22, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Parameter
Units
Rating
Units
-65 to 150
°C
Peak Current (tp=8/20μs)
20.0
A
PPK
Peak Pulse Power (tp=8/20µs)
300
W
Maximum Junction Temperature
150
°C
TOP
Operating Temperature
-40 to 85
ºC
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
TSTOR
Storage Temperature
-50 to 150
°C
SP4061
IPP
Storage Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
VRWM
Test Conditions
Min
Snap Back Voltage
VSB
ISB=50mA
Reverse Leakage Current
ILEAK
VR=2.5V, I/O to GND
Clamp Voltage1
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1
VESD
Diode Capacitance
1
Diode Capacitance
1
Typ
Max
Units
2.5
V
2.0
V
0.5
1.0
µA
IPP=1A, tp=8/20µs, Fwd
5.0
V
IPP=5A, tp=8/20µs, Fwd
6.3
V
IPP=10A, tp=8/20µs, Fwd
8.0
V
IPP=20A, tp=8/20µs, Fwd
11.5
V
(VC2-VC1)/(IPP2-IPP1)
0.35
Ω
IEC61000-4-2 (Contact)
±30
kV
IEC61000-4-2 (Air)
±30
kV
CI/O-GND
Reverse Bias=0V
3.5
CI/O-I/O
Reverse Bias=0V
2.0
5.0
pF
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Pulse Waveform
Clamping Voltage vs. IPP
110%
12.0
100%
10.0
90%
Clamp Voltage (VC)
Percent of IPP
80%
70%
60%
50%
40%
30%
8.0
6.0
4.0
2.0
20%
10%
0.0
0%
0.0
5.0
10.0
15.0
20.0
25.0
0
30.0
Time (μs)
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
5
10
15
20
Peak Pulse Current-IPP (A)
181
Revision: September 22, 2011
SP4061 Series
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Ordering Information
Capacitance vs. Bias
5.0
Part Number
Package
Marking
Min. Order Qty.
SP4061-04UTG
µDFN-10
TH4
3000
Capacitance (pF)
4.0
3.0
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
DC Bias (V)
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Ramp-do
Ramp-down
TS(min)
tS
time to peak temperature
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Time
Part Numbering System
SP 4061 - 04 U T G
G= Green
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
T= Tape & Reel
Package
U= µDFN-10
Series
Pre-Plated Frame
Flammability
tL
Preheat
Product Characteristics
Lead Plating
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
25
Peak Temperature (TP)
tP
TP
Temperature
Reflow Condition
Number of
Channels
Part Marking System
TH4
Number of
Product Series
Channels
T = SP4061
Assembly Site
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
SP4061 Series
182
Revision: September 22, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Package Dimensions — µDFN-10
Top View
µDFN-10 (2.6x2.6mm)
D
Millimeters
Symbol
A
E
Min
Nom
Max
Min
Nom
Max
0.45
0.50
0.55
0.018
0.020
0.022
0.130 Ref
A3
B
0.10 C
0.17
0.22
0.27
0.006
0.008
0.010
D
2.50
2.60
2.70
0.097
0.101
0.105
0.085
D2
2.10
2.15
2.20
0.081
0.083
E
2.50
2.60
2.70
0.097
0.101
0.105
E2
1.21
1.26
1.31
0.046
0.049
0.051
0.45
0.014
0.50 BSC
0.35
L
0.020 BSC
0.40
0.016
0.018
A3
A
Seating
Plane
0.005 Ref
b
e
Side View
Inches
Recommended Solder Pads µDFN-10L 2.6x2.6mm
0.05 C
C
b
0.10 M C B A
B
Bottom View
D2
Z
F
G
C
2X
Y
C
X
P
Dimension
E2
Symbol
Millimeters
Inches
B
2.30
0.091
C
2.20
0.087
F
1.41
0.056
G
1.65
0.065
P
0.50
0.020
X
0.37
0.015
Y
0.55
0.022
Z
2.75
0.108
e
Embossed Carrier Tape & Reel Specification — µDFN-10 (2.6x2.6mm)
P0
P2
P1
Reel Size:7 inches
D0
E
A0
F
T
W
D1
5º MAX
K0
B0
5º MAX
Pin 1 Location
User Feeding Direction
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
183
Revision: September 22, 2011
Symbol
Millimeters
A0
2.82 +/- 0.05
B0
2.82 +/- 0.05
D0
Ø1.50 + 0.10
D1
Ø 0.50 + 0.05
E
1.75 +/- 0.10
F
3.50 +/- 0.05
K0
0.76 +/- 0.05
P0
4.00 +/- 0.10
P1
4.00 +/- 0.10
P2
2.00 +/- 0.05
T
0.25 +/- 0.02
W
8.00 + 0.30 /- 0.10
SP4061 Series
SP4061
A