RClamp0524J RailClamp® Ultra Low Capacitance TVS Arrays PROTECTION PRODUCTS - RailClamp® Description PRELIMINARY Features RailClamps® are ultra low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). The RClampTM0524J has a typical capacitance of only 0.30pF between I/O pins. This allows it to be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). Each device is designed to protect four lines (two differential pairs). The RClamp0524J is in a 8-pin, RoHS/WEEE compliant, SLP2710P8 package. It measures 2.7 x 1.0 x 0.5mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. They are designed for easy PCB layout by allowing the traces to run straight through the device. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as HDMI, DisplayPortTM, MDDI, and eSATA interfaces. ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20μs) IEC 61000-4-4 (EFT) 40A (5/50ns) Package design optimized for high speed lines Flow-Through design Protects four I/O lines Low capacitance: 0.3pF typical (I/O to I/O) Low clamping voltage Low operating voltage: 5V Solid-state silicon-avalanche technology Mechanical Characteristics SLP2710P8 8-pin package (2.7 x 1.0 x 0.5mm) RoHS/WEEE Compliant Lead Pitch: 0.5mm Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications Dimensions High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) DisplayPortTM Interface MDDI Ports LVDS Serial ATA PCI Express Circuit Diagram 2.70 0.40 1 2 1.00 Pin 1 0.60 Pin 2 Pin 3 Pin 4 0.20 0.50 GND 0.50 Nominal Dimensions in mm Revision 07/20/2010 4-Line Protection 1 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Ppk 150 Watts Peak Pulse Current (tp = 8/20μs) IPP 5 A ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) VESD +/- 17 +/- 12 kV TJ -55 to +125 °C TSTG -55 to +150 °C Operating Temperature Storage Temperature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Any I/O pin to ground Reverse Breakdown Voltage V BR It = 1mA Any I/O pin to ground Reverse Leakage Current IR VRWM = 5V, T=25°C Any I/O pin to ground 1 μA Clamping Voltage VC IPP = 1A, tp = 8/20μs Any I/O pin to ground 15 V Junction Capacitance Cj VR = 0V, f = 1MHz Between I/O pins 0.4 pF Junction Capacitance Cj VR = 0V, f = 1MHz Any I/O pin to ground 0.8 pF © 2011 Semtech Corp. 2 Minimum Typical Maximum Units 5 V 6 V 0.30 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 % of Rated Power or IPP Peak Pulse Power - PPP (kW) 100 1 0.1 90 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 0 1000 25 Pulse Waveform Percent of I PP 80 e-t 50 td = IPP/2 30 20 30 150 Line to Line 25 20 Line to Gnd 15 Waveform Parameters: tr = 8µs td = 20µs 10 5 10 0 0 0 5 10 15 20 25 0 30 2 3 4 5 6 ESD Clamping for +8kV pulse per IEC 61000-4-2 Normalized Capacitance vs. Reverse Voltage 1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1 Peak Pulse Current - IPP (A) Time (µs) CJ(VR) / CJ(VR=0) 125 35 Clamping Voltage -VC (V) 90 40 100 40 Waveform Parameters: tr = 8µs td = 20µs 100 60 75 Clamping Voltage vs. Peak Pulse Current 110 70 50 Ambient Temperature - TA (oC) Pulse Duration - tp (us) f = 1 MHz 0 1 © 2011 Semtech Corp. 2 3 Reverse Voltage - VR (V) 4 5 3 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Typical Characteristics (Con’t) Insertion Loss S21 - I/O to I/O CH1 S21 LOG Insertion Loss S21 - I/O to GND 6 dB / REF 0 dB CH1 S21 LOG 6 dB / REF 0 dB 1: -0.076 dB 900 MHz 3 0 dB 1 1: -0.086 dB 900 MHz 2: -0.062 dB 1.8 GHz 3 0 dB 2 1 3: -0.1087 dB 2.5 GHz -6 dB 3: -0.126 dB 2.5 GHz -6 dB -12 dB -12 dB -18 dB -18 dB -24 dB -24 dB -30 dB -30 dB -36 dB -36 dB -42 dB -42 dB -48 dB 2: -0.0336 dB 1.8 GHz 2 -48 dB 1 MHz START . 030 MHz © 2011 Semtech Corp. 10 MHz 100 MHz 1 MHz 3 1 GHz GHz STOP 3000. 000000 MHz START . 030 MHz 4 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Applications Information Design Recommendations for HDMI Protection Adding external ESD protection to HDMI ports can be challenging. First ESD protection devices have an inherent junction capacitance. However, adding even a small amount of capacitance will cause the impedance of the differential pair to drop. Second, large packages and land pattern requirements cause discontinuities that adversely affect signal integrity. The RClamp0524J is specifically designed for protection of high-speed interfaces such as HDMI. They present <0.3pF capacitance between the pairs while being rated to handle >±8kV ESD contact discharges (>±15kV air discharge) as outlined in IEC 61000-4-2. Each device is in a leadless SLP package that is less than 1.1mm wide. They are designed such that the traces flow straight through the device. The narrow package and flow-through design reduces discontinuities and minimizes impact on signal integrity. This becomes even more critical as signal speeds increase. 8 7 GND 6 5 1 2 GND 3 4 Pin Identification 1, 2, 3, 4 Inp ut Lines 5, 6, 7, 8 Outp ut Lines (N o Internal Connection) GN D Ground SLP2710P8 Pin Configuration (Top View) Pin Configuration Figure 1 is an example of how to route the high speed differential traces through the RClamp0524J. The solid line represents the PCB trace. The PCB traces are used to connect the pin pairs for each line (pin 1 to pin 8, pin 2 to pin 7, pin 3 to pin 6, pin 4 to pin 5). For example, line 1 enters at pin 1 and exits at Pin 8 and the PCB trace connects pin 1 and 8 together. This is true for lines connected at pins 2, 3, and 4 also. Ground is connected at the center tabs. One large ground pad should be used in lieu of two separate pads. HDMI Connector 12 11 10 TDR Measurements for HDMI The combination of low capacitance, small package, and flow-through design means it is possible to use these devices to meet the HDMI impedance requirements of 100 Ohm ±15% without any PCB board modification. Figures 3 and 4 show impedance test results for a TDR risetime of 200ps and 100ps respectively, using a Semtech evaluation board with 100 Ohm traces throughout. Measurements were taken using a TDR method as outlined in the HDMI Compliance Test Specification (CTS). In each case, the device meets the HDMI CTS © 2011 Semtech Corp. 1 GND GND 9 8 7 1 6 5 4 GND GND 3 2 1 Figure 1. Flow through Layout Using R Clam p052 4J Clamp052 p0524J 5 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Applications Information requirement of 100 Ohm ±15% with plenty of margin. For signal integrity purposes, the best results will be obtained by using the RClamp0524J to protect the high-speed differential pairs. This is because the device is designed such that the data lines from the connector line up with the I/O pins of the device without altering the trace routing. Either the RClamp0504P or RClamp0524J may be used to protect the remaining lines (I2C, CEC, and hot plug) depending on layout constraints. B A Layout Guidelines for Optimum ESD Protection Good circuit board layout is critical not only for signal integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the following guidelines are recommended: z Place the device as close to the connector as possible. This practice restricts ESD coupling into adjacent traces and reduces parasitic inductance. z The ESD transient return path to ground should be kept as short as possible. Whenever possible, use multiple micro vias connected directly from the device ground pad to the ground plane. z Avoid running critical signals near board edges. X-axis Y-axis A 1.905 101.0 B 2.081 107.0 (nsec) (Ohm) Figure 2 - TDR Measurement with 200ps risetime using Semtech Evaluation Board B A X-axis Y-axis A 1.80 96 B 2.076 108.0 (nsec) (Ohm) Figure 3 - TDR Measurement with 100ps risetime using Semtech Evaluation Board Note: Measurements were taken on SLP HDMI EVAL Rev C Board that has 100Ω differential traces impedance throughout (No trace Compensation). © 2011 Semtech Corp. 6 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Applications Information RClamp0524J Data 2+ Data 2Data 1+ Data 1- To HDMI Graphics Chip Data 0+ Data 0Clk+ Clk- RClamp0524J CEC SCL SDA Gnd 5VPower HP Detect 1 6 RClamp0504P Figure 4. HDMI Protection Example A+ Host Rx Host Rx + B- A- 1 RClamp0524J A+ ESATA Host Plug Host Tx + Host Tx - B+ 1 ESATA Device Plug A- BB+ - RClamp0524J Figure 5. eSA TA Pr o t ection Exam ple eSAT Pro Example © 2011 Semtech Corp. 7 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Applications Information 1 RClamp0524J DISPLAY PORT CONNECTOR 1 RClamp0524J Ohm μ 1 RClamp0524J Figure 6. Displa yP or ot ection Exam ple DisplayP yPor ortt Pr Pro Example © 2011 Semtech Corp. 8 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Applications Information Spice Model RClamp0524J Spice Model R Clamp0524J Spice Parameters © 2011 Semtech Corp. Parameter Unit D1 (LCR D) D2 (LCR D) D3 (T VS) IS Amp 1E-20 1E-20 2E-12 BV Volt 100 100 9.36 VJ Volt 0.7 0.7 0.6 RS Ohm 0.458 1.0 2.6 IB V A mp 1E-3 1E-3 1E-3 CJO Farad 0.4E-12 0.6E-12 56E-12 TT sec 2.541E-9 2.541E-9 2.541E-9 M -- 0.01 0.01 0.23 N -- 1.1 1.1 1.1 EG eV 1.11 1.11 1.11 9 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SO-8 Outline SLP2710P8 A D DIMENSIONS MILLIMETERS MIN NOM MAX B DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A1 C b1xN bbb C A B A2 R0.125 0.47 0.50 0.53 0.00 0.03 0.05 (0.13) 0.15 0.20 0.25 0.35 0.40 0.45 2.60 2.70 2.80 0.90 1.00 1.10 0.50 BSC 0.60 BSC 0.30 0.38 0.43 8 0.08 0.10 2 1 E/2 A A1 A2 b b1 D E e e1 L N aaa bbb LxN 2X R0.075 7 PLACES N e1 bxN e NOTES: bbb C A B D/2 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP2710P8 P1 P DIMENSIONS DIM C G P P1 X X1 Y Y1 Z Y Z (C) (Y1) G X X1 INCHES (.034) .008 .020 .024 .008 .016 .027 (.061) .061 MILLIMETERS (0.875) 0.20 0.50 0.60 0.20 0.40 0.675 (1.55) 1.55 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2011 Semtech Corp. 10 www.semtech.com RClamp0524J PRELIMINARY PROTECTION PRODUCTS Marking Codes Ordering Information 0524J PIN 1 INDICATOR YYWW Part Number Number of Lines Qty per Reel Reel Size RClamp0524J.TCT 4 3000 7 Inch Note: Lead finish is lead-free NiPdAu. YYWW = Date Code Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape Part Number RClamp 0524J Tape Width 8 mm A0 1.21 +/-0.10 mm B, (Max) D 4.2 mm 1.5 + 0.1 mm - 0.0 mm ) B0 K0 2.91 +/-0.10 mm D1 E 0.5 mm ±0.05 1.750±.10 mm 0.66 +/-0.10 mm F 3.5±0.05 mm K (MAX) P P0 P2 2.4 mm 4.0±0.1 mm 4.0±0.1 mm 2.0±0.05 mm T(MAX) 0.4 mm W 8.0 mm + 0.3 mm - 0.1 mm Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2011 Semtech Corp. 11 www.semtech.com