Silicon Protection Array (SPA™) Products 12pF EMI Filter Array with ESD Protection SP6001 SERIES Pb GREEN RoHS The Littelfuse SP6001 SPA series integrates 4, 6 and 8 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Features • ESD, IEC61000-4-2, ±30kV contact, ±30kV air • EMI filtering of frequencies from 800MHz to 3GHz Pinout 1 • Greater than -30dB attenuation (TYP) at 1GHz 4 UDFN-08 • Small, low-profile UDFN package (TYP 0.5mm height) GND 5 8 Applications SP6001-04UTG-1 1 6 GND UDFN-12 12 • Keypad interface for portable electronics • Mobile phone • LCD and camera display interfaces for handsets • Portable navigation device • Smartphone • Connector interfaces for portable electronics 7 SP6001-06UTG-1 1 Application Examples 8 GND UDFN-16 PCB Connector for LCD Display 9 16 SP6001-04UTG-1 Baseband D1 SP6001-08UTG-1 D2 IC D3 D4 Functional Block Diagram SP6001-04UTG-1 1 SP6001-06UTG-1 8 Cd 1 Cd Cd Cd Camera Module SP6001-08UTG-1 Baseband D1 12 D2 D3 2 7 Cd Cd Cd Cd 3 6 2 Cd Cd Cd Cd 11 D4 IC D5 D6 10 3 D7 D8 4 5 Cd 9 4 Cd Cd Cd Cd Cd Cd Cd 8 5 6 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 7 141 Revised: January 11, 2011 SP6001 Series SP6001 Description Silicon Protection Array (SPA™) Products 12pF EMI Filter Array with ESD Protection Thermal Information Absolute Maximum Ratings Symbol Parameter TOP Operating Temperature Storage Temperature TSTOR Parameter Value Units -40 to 85 °C Storage Temperature Range °C Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) -60 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Rating Units -65 to 150 °C 150 °C 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ 7.0 Max Units 6.0 V 8.5 Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VRWM=5V Resistance RA IR=10mA Diode Capacitance1,2 CD VR=2.5V,f=1MHz Line Capacitance1,2 CL VR=2.5V,f=1MHz (-20%of Typ) IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 VESD Cutoff Frequency3 F-3dB (-10% of Typ) 7.8 (+10%of Typ) 0.1 85 (-15% of Typ) 100 1.0 115 (+15% of Typ) 12 19 Above this frequency, appreciable attenutation occurs 24 V μA Ω pF 29 (+20%of Typ) 115 pF MHz Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Total line capacitance is two times the diode capacitance (CD). 3 50Ω source and 50Ω load termination Insertion Loss (S21) CH1 S 21 log MAG Analog Crosstalk (S41) 5 dB/ REF 0 dB 1 _:-5.8807 dB CH1 S Cor Cor Del Smo Smo 1 x2 Start log MAG 10 dB/ REF 0 dB 1 x2 START Stop 6 000.000.000MHz 3.000 000MHz 3.000 000 MHz Stop 6 000.000 000 MHz Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 SP6001 Series Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. 142 Revised: January 11, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Silicon Protection Array (SPA™) Products 12pF EMI Filter Array with ESD Protection Line Capacitance vs. DC Bias Soldering Parameters 40 30 - Time (min to max) (ts) 60 – 180 secs 3°C/second max 10 TS(max) to TL - Ramp-up Rate 3°C/second max - Temperature (TL) (Liquidus) Reflow 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Package Dimensions — UDFN-08 D UDFN-08 Max A 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 E Min A1 A A3 K E2 D2 0.127 REF Min 0.250 0.006 0.010 D 1.600 1.800 0.063 0.071 D2 1.100 1.300 0.043 0.051 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 L K 0.200 b L 0.150 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C 0.350 0.000 0.006 0.014 TL TS(max) Ramp-do Ramp-down Preheat TS(min) time to peak temperature UDFN-16 Min Max A 0.45 0.55 0.01 0.02 A1 0.00 0.05 0.00 0.002 0.00 REF 0.25 0.00 0.00 D 3.20 3.40 0.12 0.13 D2 2.70 2.90 0.10 0.11 E 1.25 1.45 0.04 0.05 E2 0.30 0.50 0.01 0.01 e 0.40 BSC K 0.20 L 0.15 D2 0.01 BSC 0.00 0.01 e ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Max A 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 143 Revised: January 11, 2011 b 0.127 REF Min Max 0.005 REF b 0.150 0.250 0.006 D 2.400 2.600 0.094 0.102 D2 1.900 2.100 0.075 0.083 0.010 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e 0.00 0.35 Inches Min A3 A 0.15 A3 b L b 0.127 REF Millimeters E Max K E A1 L K E2 D2 Time UDFN-12 D Inches Min A3 tS Package Dimensions — UDFN-12 Millimeters A tL 25 Package Dimensions — UDFN-16 D Critical Zone TL to TP Ramp-up 0.016 BSC 0.008 tP TP 0.005 REF 0.150 0.400 BSC 60 – 150 seconds 250+0/-5 °C Max b e e Inches 217°C Peak Temperature (TP) Temperature Millimeters - Temperature (tL) 5.0 E2 0.5 DC Bias (V) A3 200°C 20 0.0 A3 150°C Average ramp up rate (Liquidus) Temp (TL) to peak 0 e - Temperature Min (Ts(min)) - Temperature Max (Ts(max)) A1 Capacitance (pF) Pre Heat Pb – Free assembly 0.400 BSC K 0.200 L 0.150 0.350 0.016 BSC 0.008 0.000 0.006 0.014 SP6001 Series SP6001 Reflow Condition 50 Silicon Protection Array (SPA™) Products 12pF EMI Filter Array with ESD Protection Embossed Carrier Tape & Reel Specification – UDFN-12 P2 P2 o/ D t E E t AO P F oD / Millimetres E Max Min Max 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 1.00 - 0.040 - 1.50 min P 3.90 10P P Inches Min D K0 BO D1 KO F W W A0 Millimetres 0.059 min 4.10 Min Max Min Max 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.55 0.65 0.021 0.025 D 1.575 +/- 0.008 P 1.50 min 3.90 10P 40.0 +/- 0.20 0.161 1.575 +/- 0.008 7.70 8.30 0.303 0.327 1.95 2.05 0.077 0.081 W 7.90 8.30 0.311 0.327 0.069 P2 1.95 2.05 0.077 0.081 1.33 1.53 0.052 0.060 1.55 1.75 0.061 B0 1.90 2.1 0.075 0.083 A0 K0 0.95 1.15 0.037 0.045 B0 2.63 2.83 0.103 0.111 K0 0.58 0.78 0.023 0.031 0.30 max 0.012 max t Embossed Carrier Tape & Reel Specification – UDFN-16 + + + E F + + + + G= Green T= Tape & Reel Package 04 = 4 Channel UDFN-08 06 = 6 Channel UDFN-12 08 = 8 Channel UDFN-16 Ø 1.00 ± 0.05 T 0.009 max SP 6001 – 0x U T G - 1 Silicon Protection Array Series Number of Channels P1 + 0.22 max Part Numbering System D0 P0 P2 + 0.154 W t W 0.059 min 4.10 P2 A0 + Inches E 0.161 0.154 40.0 +/- 0.20 BO D Embossed Carrier Tape & Reel Specification – UDFN-08 UDFN-08 (1.7x1.35mm) UDFN-12 (2.5x1.35mm) UDFN-16 (3.3x1.35mm) Part Marking System 12º MAX 12º MAX A0 B0 K0 Millimetres SP6001 Series J H x JH4 Inches Min Max Min Max A0 1.55 1.75 0.06 0.06 B0 3.50 3.70 0.13 0.14 D0 1.40 1.60 0.05 0.06 E 1.65 1.85 0.06 0.07 F 5.45 5.55 0.21 0.21 K0 0.85 1.05 0.03 0.04 P0 3.90 4.10 0.15 0.16 P1 1.95 2.05 0.07 0.08 P2 3.90 4.10 0.15 0.16 T 0.26 0.30 0.01 0.01 W 11.90 12.30 0.46 0.48 JH6 Product Series J = SP6001 JH8 Assembly Site 4 = UDFN-08 6 = UDFN-12 8 = UDFN-16 Ordering Information Part Number Package Size (mm) Marking Min. Order Qty. SP6001-04UTG-1 uDFN-08 1.7x1.35 JH4 3000 SP6001-06UTG-1 uDFN-12 2.5x1.35 JH6 3000 SP6001-08UTG-1 uDFN-16 3.3x1.35 JH8 3000 144 Revised: January 11, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.