TI TPS658610A

TPS658610A
www.ti.com
SLVSAH3 – AUGUST 2010
Advanced Power Management Unit
Check for Samples: TPS658610A
1 Introduction
1.1
Main Features
1
• BATTERY CHARGER
– Complete Charge Management Solution for a
Single Cell Li-Ion/Li-Pol Cell With Dynamic
Power Management and Thermal Foldback.
– Maximum 1.0A charge current
– Programmable Adapter and USB Charge
Operation
• INTEGRATED POWER SUPPLIES
– 3 Programmable Step-Down converters
• Software Controlled Enable/Forced PWM
Mode
• Automatic Power Saving Mode
• Maximum 1.2A Outputs
– 11 Programmable General Purpose LDOs
• 7 With Output Voltages of 1.25V to 3.3V
• 2 With Output Voltages of 0.725V to 1.5V
or 1.25V to 2.586V (factory configurable)
• 1 “Always On” With Output Voltages of
1.25V to 3.3V
• 1 With Output Voltage of 1.70V–2.475V
• DISPLAY SUPPORT FUNCTIONS
– 4 PWM Outputs With Programmable
Frequency and Duty Cycle
– Dual RGB LED Drivers
– Constant Current WLED Driver
• 26.5V (max) at 25mA
• Over-Voltage Protection
• Programmable Current Level and
Brightness Control
• HOST INTERFACE
– Interrupt Controller With Maskable Interrupts
– External ADC Triggering and Step-Down
Converter Mode Control
1.3
• SYSTEM MANAGEMENT
– Dual Input Power Path
• USB Current Limiting
• Max 18V Over-Voltage Protection
– Power Good Monitoring on all Supply
Outputs
– Software Reset Function
– Hardware On/Off and Reboot Control
– 11 Channel ADC With 3 Operating Modes
• Single Conversion
• Peak Detection
• Averaging
1.2
•
•
•
Applications
Smart Phones
Portable Navigation Devices
Portable Media Players
Overview
The TPS658610A provides an easy to use, fully integrated solution for handheld devices, integrating
charge management, multiple regulated power supplies, system management and display functions in a
small 6x6 package. The I2C interface enables control of a wide range of subsystem parameters. Internal
registers have a complete set of status information, enabling easy diagnostics and host-controlled
handling of fault conditions.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
To request a full data sheet, please send an email to:
[email protected].
PACKAGE OPTION ADDENDUM
www.ti.com
18-Apr-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS658610AZQZR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQZ
120
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TPS658610AZQZT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQZ
120
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS658610AZQZR
BGA MI
CROSTA
R JUNI
OR
ZQZ
120
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
TPS658610AZQZT
BGA MI
CROSTA
R JUNI
OR
ZQZ
120
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS658610AZQZR
BGA MICROSTAR
JUNIOR
ZQZ
120
2500
336.6
336.6
28.6
TPS658610AZQZT
BGA MICROSTAR
JUNIOR
ZQZ
120
250
336.6
336.6
28.6
Pack Materials-Page 2
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