View the Part Number Specific Data Sheet for full specifications

PART NUMBER DATA SHEET
EA3250FA12-8.000M TR
REGULATORY COMPLIANCE
ECLIPTEK
R
CORPORATION
(Data Sheet downloaded on Jun 28, 2016)
2011/65 +
2015/863
168 SVHC
ITEM DESCRIPTION
Quartz Crystal Resonator 3.2mm x 5.0mm x 1.0mm 4 Pad Ceramic Surface Mount (SMD) 8.000MHz ±30ppm at 25°C, ±50ppm
over -40°C to +85°C 12pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
8.000MHz
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over -40°C to +85°C
Aging at 25°C
±3ppm/Year Maximum
Load Capacitance
12pF Parallel Resonant
Shunt Capacitance
5pF Maximum
Equivalent Series Resistance
120 Ohms Maximum
Mode of Operation
AT-Cut Fundamental
Drive Level
100µWatts Maximum
Spurious Response
-3dB Minimum (Measured from Fo to Fo+5000ppm)
Storage Temperature Range
-40°C to +125°C
Insulation Resistance
500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test
MIL-STD-883, Method 1014, Condition A
Flammability
UL94-V0
Gross Leak Test
MIL-STD-883, Method 1014, Condition C
Mechanical Shock
MIL-STD-883, Method 2002, Condition B
Moisture Resistance
MIL-STD-883, Method 1004
Moisture Sensitivity
J-STD-020, MSL 1
Resistance to Soldering Heat
MIL-STD-202, Method 210, Condition K
Resistance to Solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-883, Method 2003
Temperature Cycling
MIL-STD-883, Method 1010, Condition B
Vibration
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 1 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
ECLIPTEK
PART NUMBER DATA SHEET
R
CORPORATION
EA3250FA12-8.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3.2
±0.2
1.4 ±0.1
MARKING
ORIENTATION
2
5.0
±0.2
3
1.2 ±0.1 (X4)
PIN
CONNECTION
1
Crystal
2
Cover/Ground
3
Crystal
4
Cover/Ground
LINE MARKING
2.6
±0.1
1
1.0
MAX
4
1
E8.000
E=Ecliptek Designator
2
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
0.9 ±0.1
(X4)
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.20 (X4)
1.50 (X4)
Solder Land
(X4)
2.30
1.00
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 2 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
EA3250FA12-8.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
All Dimensions in Millimeters
Compliant to EIA-481
4.00 ±0.10
0.60 MAX
DIA 1.50 +0.10/-0.00
0.10 MAX
2.00 ±0.10
1.75 ±0.10
7.50 ±0.10
MARKING
ORIENTATION
16.00 ±0.30
DIA 1.50 MIN
8.00 ±0.10
B0
A0
K0
Direction of Unreeling
1.50 MIN
22.40 MAX
DIA 40 MIN
Access Hole at
Slot Location
360 MAX
DIA 50 MIN
DIA 20.20 MIN
DIA 13.00 ±0.20
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
16.40 +2.00/-0.00
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 3 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
EA3250FA12-8.000M TR
ECLIPTEK
R
CORPORATION
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 4 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
EA3250FA12-8.000M TR
ECLIPTEK
R
CORPORATION
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate)
Preheat
- Temperature Minimum (TS MIN)
- Temperature Typical (TS TYP)
- Temperature Maximum (TS MAX)
- Time (tS MIN)
Ramp-up Rate (TL to TP)
Time Maintained Above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Target Peak Temperature (TP Target)
Time within 5°C of actual peak (tp)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
5°C/Second Maximum
N/A
150°C
N/A
30 - 60 Seconds
5°C/Second Maximum
150°C
200 Seconds Maximum
245°C Maximum
245°C Maximum 2 Times / 230°C Maximum 1 Time
10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
5°C/Second Maximum
N/A
Level 1
Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device. )
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device. )
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 10/24/2014 | Page 5 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626
1-800-ECLIPTEK or 714.433.1200