517BA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1.8x2, 0.5P
CASE 517BA−01
ISSUE A
DATE 08 SEP 2009
SCALE 4:1
D
PIN ONE
LOCATION
0.10 C
2X
2X
A
B
ÍÍÍ
ÍÍÍ
ÍÍÍ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.20mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
ÇÇÇ
ÇÇÇ
ÉÉÉ
EXPOSED Cu
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTIONS
E
L
L
TOP VIEW
L1
A3
DETAIL B
DETAIL A
OPTIONAL
CONSTRUCTIONS
0.05 C
A
0.05 C
A1
NOTE 4
C
SIDE VIEW
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
XXX
XMM
D2
b1
6X
1
DETAIL A
6
K
L
1
XXXX = Specific Device Code
MM = Lot Number
3
2X
4
5X
e
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
E2
b
0.10 C A
0.05 C
MILLIMETERS
MIN
MAX
0.50
0.60
0.00
0.05
0.20 REF
0.15
0.30
0.20
0.40
1.80 BSC
1.50
1.70
2.00 BSC
0.90
1.10
0.50 BSC
0.20
--0.15
0.35
--0.10
DIM
A
A1
A3
b
b1
D
D2
E
E2
e
K
L
L1
RECOMMENDED
MOUNTING FOOTPRINT*
B
NOTE 3
1.70
BOTTOM VIEW
5X
0.25
6X
0.48
1.10 2.30
1
0.35
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON44546E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
UDFN6 1.8X2, 0.5P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON44546E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY B. LOFTS.
14 AUG 2009
A
CORRECTED DIMENSION B. REQ. BY B. LOFTS.
28 AUG 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2009
September, 2009 − Rev. 01A
Case Outline Number:
517BA
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