Details

I583/I783 Series
2.0 mm x 2.5 mm Ceramic Package SMD TCXO
Applications:
Product Features:
Low Current Consumption
Ultra Miniature Package
RoHS Compliant
Compatible with Leadfree Processing
2.50+/- 0.2
Server & Storage
CDMA/WCDMA
802.11 / Wifi
T1/E1, T3/E3
3
1
2
2.0+/-0.2
Frequency
(Contact Sales Channel for other available frequencies)
Output Level
Clipped Sinewave
0.8 V p-p Min.
Output Load
Clipped Sinewave
10K Ohms / 10 pF
Frequency Stability
Vs Temperature
Vs Voltage
Vs Load(5%)
4
1.1 Max.
0.6
0.10
See Frequency Stability Table
 0.2 ppm Max.
.0.2 ppm Max.
Frequency Tolerance @ 25 C
2 .0 ppm (After 2 Reflow)
Aging
 1 ppm / Year Max.
1
2
4
3
0.5
0.10
nd
Recommended Pad Layout
2.80
See Supply Voltage Table , tolerance  5%
Supply Voltage
Current
2.0 mA Max.
Voltage Control (I783)
4
3
1
2
0.6
2.3
1.5 VDC  1.0 VDC,  5.0 ppm Min. (Custom Available)
1.4
No pattern area
Operating
See Operating Temperature Table
Pin
1
2
3
4
Storage
-40 C to +85 C
Harmonics
-8.0 dBc Max.
Phase Noise
-130 dBc/Hz @ 1KHz
Connection
Vcontrol / N.C.
GND
Output
Vcc
Dimension Units: mm
Package
I583 (Clipped Sinewave TCXO)
I783 (Clipped Sinewave TCVCXO)
Part Number Guide
Operating Temperature
Sample Part Number: I583-5P8-26.000 Mhz
FrequencyStability vs Temperature
Supply Voltage
7 = 0 C to +50 C
P = 2.0 ppm
1 = 0 C to +70 C
Q = 2.5 ppm
7 = 3.0 V
3 = -20 C to +70 C
R = 3.0 ppm
8 = 2.8 V
5 = -30 C to +85 C
J = 5.0 ppm
2 = 2.7 V
1 = 1.8 V
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
08/13/13_C
Specifications subject to change without notice
Page 1
Frequency
3 = 3.3 V
- 26.000 MHz
I583/I783 Series
2.0 mm x 2.5 mm Ceramic Package SMD TCXO
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: XXXX(Freq.Code,Production Code,Year, Month,Date) (Example=“GB17L”)
Line 2: XXXXX (Crystal Code)
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
08/13/13_C
Specifications subject to change without notice
Page 2
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