Details

Leaded Oscillator, VCXO, TTL / HC-MOS
Metal Package, Full Size DIP and Half DIP
I202 / I203 Series
I203 Package
Product Features:
20.7
Applications:
4
3
1
2
12.6
CMOS/TTL Compatible Logic Levels
Low Noise
Compatible with Leadfree Processing
RoHS Compliant
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
7.62
15.24
Frequency
1 MHz to 51.840 MHz
5.1 Max.
6 Min.
Output Level
HC-MOS
TTL
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
Duty Cycle
50% ±5%
Rise / Fall Time
10 nS Max.*
0.048
0.36
I202 Package
12.6
Output Load
HC-MOS
TTL
Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL
15 pF
Frequency Stability
See Frequency Stability Table
Supply Voltage
See Input Voltage Table, tolerance ±10 %
Current
50 mA Max.*
Control Voltage
1.65 VDC ±1.5 VDC for Vcc = 3.3 VDC, 2.5 VDC ±2.0 VDC for
VCC = 5.0 VDC
Slope
Positive
4
3
1
2
12.6
7.62
7.62
5.1 Max.
6 Min.
0.48
Jitter
<1.0 pS RMS (12 kHz to 20 MHz)**
Operating
See Operating Temperature Table in Part Number Guide
Storage
Package
I202 I203 -
0.36
-55° C to +125° C
Part Number Guide
Operating
Temperature
Dimension Units: mm
Pin Connection
1 Control Voltage
2 GND
3 Output
4 Vcc
Frequency
Stability
Sample Part Number: I202-1BC3-27.000 MHz
Pullability
Supply Voltage
1 = 0° C to +70° C
F = ±20 ppm
B = ±50 ppm min.
5 = 5.0 VDC
3 = -20° C to +70° C
X = ±30 ppm
C = ±100 ppm min.
3 = 3.3 VDC
4 = -30° C to +75° C
B = ±50 ppm
K = ±150 ppm min.
2 = -40° C to +85° C
C = ±100 ppm
L = ±200 ppm min.
Frequency
- 27.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Frequency, supply, and load related parameters. Frequency related, for additonal information contact your sales representative.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
10/10_B
Specifications subject to change without notice
Page 1
Leaded Oscillator, VCXO, TTL / HC-MOS
Metal Package, Full Size DIP and Half DIP
I202 / I203 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4- (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: XXXX (Part Number detail = I203-XXXX-Freq.)
Line 3: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
10/10_B
Specifications subject to change without notice
Page 2
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