Details

I606 Series
10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS
Applications:
Product Features:
Small Surface Mount Package
Low Noise
Pb Free/ RoHS Complient
Compatible with Leadfree Processing
SD/HD Video
Wireless Base Stations
Sonet /SDH
Server and Storage
1 MHz to 180.000 MHz
Output Level
LVDS
LVPECL
Duty Cycle
Vod = 393 mV Typ., 475 mV Max.
‘0’ = Vcc - 1.63 V Max.
‘1’ = Vcc - 1.02 V Min.
50% ±10%
Rise / Fall Time
0.6 nS Max.
Output Load
LVDS
LVPECL
Frequency Stability
100 Ω Differential
50 Ω to Vcc - 2.0 VDC
50 ppm Max.
Start-up Time
10 mS Max.
Supply Voltage
3.3 VDC ± 5%
Current
LVDS = 90 mA Max., LVPECL = 130 mA Max.
Linearity
15% Max.
Pullability
See Table Below
Control Voltage
1.65 VDC ± 1.5 VDC
Input Impedance
50K Ω Min.
Jitter
<1.0 pS RMS (12 kHz to 20 MHz)*
Operating
See Operating Temperature Table in Part Number Guide
Storage
-55° C to +125° C
Package
I606
10.2 Max.
6.0 Max.
Frequency
Part Number Guide
14.3 Max.
0.5
Typ.
2.54
Recommended pad layout
0.8
8.8
3.0
Pin Connection
1 Voltage Control
2 Enable/Disable
3 GND
4 Output
5 Comp. Outout
6 Vcc
Sample Part Number:
Operating
Temperature
Stability
(in ppm)
Dimension Units: mm
I606–1BC8H–155.520
Pullability
Output
Enable /
Disable
H = Enable
1 = 0° C to +70° C
**D = ±15
B = ±50 ppm
8 = LVDS
3 = -20° C to +70° C
A = ±25
C = ±100 ppm
9 = LVPECL
2 = -40° C to +85° C
B = ±50
Frequency
-155.520 MHz
C = ±100
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
*Frequency related, for additional information contact your sales representative. ** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 1
I606 Series
10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: XXXXX (I606-XXXXX- Freq)
Line 3: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 2
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