Details

I605 Series
5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS
Applications:
Product Features:
Small Surface Mount Package
Based Output for many frequencies
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
SD/HD Video
Wireless Base Stations
Sonet /SDH
VoIP
T1/E1, T3/E3
5.0
0.2
7.0 0.3
Frequency
1 MHz to 170.000 MHz
Output Level
HC-MOS
TTL
Duty Cycle
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
50% ±5%
Rise / Fall Time
10.0 nS Max.
Output Load
15pF, Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 TTL
Frequency Stability
50 ppm Max.
Start-up Time
10 mS Max.
Supply Voltage
See Input Voltage Table, tolerance ±5 %
Control Voltage
1.65 VDC ±1.5 VDC for 3.3 VDC, 2.5 VDC ±2.0 VDC for 5.0 VDC
Pull Range
See Pullability Table
Current
50 mA Max**
Linearity
10% Max.
2.0 Max.
5.08
Recommended Pad Layout
5.08
4.2
Bypass =0.01 uF
Temperature
Operating
Storage
See Operating Temperature Table in Part Number Guide
-55 C to +125 C
Phase Jitter
<3 pS RMS
Pin
1
2
3
4
5
6
2.0
Connection
Control Voltage
Enable / Disable
Ground
Output
N.C.
Vdd
Dimension Units: mm
Part Number Guide
Package
I605 -
Operating
Temperature
Sample Part Number: I605-1BC3H-20.000
Stability
Pullability
(in ppm)
Supply
Voltage
Enable /
Disable
Frequency
H = Enable
- 20.000 MHz
1 = 0 C to +70 C
*D = 15
B = 50 PPM Min.
5 = 5.0 VDC
6 = -10 C to +70 C
A = 25
C = 100 PPM Min.
3 = 3.3 VDC
3 = -20 C to +70 C
B = 50
4 = -30 C to +75 C
C = 100
2 = -40 C to +85 C
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
* Not available at all frequencies. ** Frequency, supply, and load related parameters.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/10_C
Specifications subject to change without notice
Page 1
I605 Series
5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/10_C
Specifications subject to change without notice
Page 2
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