NUC2401MN D

NUC2401MN
Integrated Common Mode
Choke with Integrated ESD
Protection
Description
The NUC2401MN is an Integrated Common Mode Filter for the
elimination of common mode noise in high speed data line
applications such as IEEE1394, USB2.0 and other LVDS type
applications. ESD protection is integrated into the Common mode
filter for superior protection and significant part count reduction.
Features
•
•
•
•
•
•
•
Common mode EMI Filtering and ESD Protection
Integration of 5 Discrete components
±12 kV ESD Protection per IEC61000−4−2 (Contact Discharge)
DFN: 2.0 x 2.2 mm Package
Moisture Sensitivity Level 1
ESD Rating:
Machine Model (MM) = 1.6 kV;
Human Body Model (HBM) = 16 kV
This is a Pb−Free Device
SIMPLIFIED SCHEMATIC
VCC 6
I/O 1, 9
I/O 8, 12
I/O 2, 10
I/O 7, 11
MARKING
DIAGRAM
8
DFN8
CASE 506BL
1
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution offers Cost and Space Savings
• Reduces Parasitic Inductances Which Offer a More “Ideal” Common
•
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Mode Filtering
Integrated Solution Improves System Reliability
1
C2 = Specific Device Code
M = Date Code
G
= Pb−Free Device
(Note: Microdot may be in either location)
PIN CONNECTIONS*
Applications
•
•
•
•
•
•
C2 MG
G
High Speed Differential Data Lines
USB2.0
IEEE1394
LVDS
MIPI
MDDI
D−
1
N/C
9
N/C
12
8
D−
D+
2
10
11
7
D+
GND
3
N/C
N/C
6
VCC
GND
4
5
GND
GND
(Top View)
*NOTE: Pins 1 and 9, Pins 2 and 10, Pins 7 and 11,
Pins 8 and 12 are internally connected in pairs. It is
recommended not to solder to Pins 9, 10, 11, 12.
ORDERING INFORMATION
Device
Package
Shipping†
NUC2401MNTAG
DFN8
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
January, 2010 − Rev. 2
1
Publication Order Number:
NUC2401MN/D
NUC2401MN
MAXIMUM RATINGS (TA = 25°C unless otherwise stated)
Symbol
Value
Units
VPP
±12
kV
Operating Temperature Range
TOP
−40 to 85
°C
Storage Temperature Range
TSTG
−55 to 125
°C
TL
260
°C
ILINE
100
mA
Parameter
ESD Discharge IEC61000−4−2
Contact Discharge
Maximum Lead Temperature for Soldering Purposes (1/8” from Case for 10 Seconds)
DC Current per Line
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Symbol
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Test Conditions
Min
Typ
Max
Unit
5.0
V
8.6
V
VRWM
VBR
IR = 1 mA
6.0
7.6
Leakage Current
IR
VRWM = 5.5 V
2.0
mA
Maximum Peak Pulse Current
IPP
8x20 ms Waveform
12
A
Clamping Voltage
VC
IPP = 5 A
10
V
Resistance Pin 1 to Pin 8
RA
2.2
5.0
W
Resistance Pin 2 to Pin 7
RB
2.2
5.0
W
Capacitance (Note 1)
CLINE 1
0.8
1.0
pF
Capacitance (Note 2)
CLINE 2
0.8
1.0
pF
Common Mode Cut−Off Frequency (Note 3)
f3dB
(Above this Frequency, Appreciable
Common Mode Attenuation Occurs)
40
MHz
Common Mode Impedance
ZC
@ 100 MHz
90
W
1. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 1 or 4 to GND.
2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 8 or 5 to GND.
3. 50 W source and 50 W load termination.
10000
0
Differential Mode
INSERTION LOSS (dB)
−5
IMPEDANCE (W)
1000
Common Mode
100
10
Differential Mode
1
1
10
100
−10
−15
Common Mode
−20
−25
−30
1000
10000
−35
1
FREQUENCY (MHz)
10
100
1000
10000
FREQUENCY (MHz)
Figure 1. Impedance Characteristics vs.
Frequency
Figure 2. Insertion Loss Characteristics vs.
Frequency
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2
NUC2401MN
I/O 1
I/O 8
I/O 2
I/O 7
NUC2401MN
2
4
Network Analyzer
1
3
Normal (Differential) Mode
Figure 3. Normal (Differential) Mode Test
Configuration
I/O 1
I/O 8
I/O 2
I/O 7
Differential Signal Driver and
Transmission Line
NUC2401MN
Figure 4. Application Circuit
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3
Differential Signal Buffer and
Transmission Line
NUC2401MN
PACKAGE DIMENSIONS
DFN8, 2.2x2, 0.5P
CASE 506BL−01
ISSUE O
A
B
D
PIN ONE
REFERENCE
2X
0.10 C
2X
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
E
NOTE 5
END VIEW
DETAIL B
A
A1
A3
SIDE VIEW
C
ÇÇÇ
ÉÉÉ
EXPOSED Cu
9X
0.08 C
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
SEATING
PLANE
0.10 C A B
DETAIL A
1
4
L1
E2
DETAIL A
0.10 C A B
8
5
e
8X
MILLIMETERS
MIN
MAX
0.85
0.95
0.00
0.05
0.20 REF
0.15
0.25
2.20 BSC
0.34
0.54
2.00 BSC
0.60
0.80
0.50 BSC
0.20
−−−
0.30
0.50
−−−
0.15
L
D2
L
K
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
TOP VIEW
0.10 C
NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED ENDS OF THE TERMINALS ARE
ELECTRICALLY ACTIVE.
OPTIONAL
CONSTRUCTIONS
b
8X
0.10 C A B
e/2
0.05 C
SOLDERING FOOTPRINT*
0.90
0.24
0.55
NOTE 3
BOTTOM VIEW
8X
(0.28)
(0.825)
2.30
0.62
0.80
(0.20)
1
(0.50)
PACKAGE
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
4X
(0.25)
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
AUXILIARY BOTTOM VIEW
(FOR REFERENCE ONLY)
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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4
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Sales Representative
NUC2401MN/D