Precautions for the use of DIP Switch Revision 2 Valid from 07.05.2002 page 1 of 6 This document is only valid on the date of printing: 21/02/2014 Document Control No 1 2 3 4 Page All All All 4-5 Change Description Created Up grading definition of washing& cleaning Document format update Handling of the components (add tooling way and setting pictures) Issued by Jasmin Hsu Jasmin Hsu Jasmin Hsu Jasmin Hsu Date: 24.07.2012 21.01.2013 11.04.2013 21.02.2014 I:\User_Groups_Only\17_EMC_Product_&_Development\Article_Master\eiCan\Switch\SwDIP\Master_Data\05_Precaution\Precaution _DIP Switch_version4_20140221.doc Precautions for the use of DIP Switch Revision 2 Valid from 07.05.2002 page 2 of 6 This document is only valid on the date of printing: 21/02/2014 Precautions for the use of Dip switches 1. General information: This guide-line provides general information about the handling of our dip switches. 2. Recommended Soldering Profiles 2.1 Recommended soldering profiles for SMT parts Please download our Hot-Air Reflow standard profile from our website under the following link: http://www.weonline.com/web/en/passive_bauelemente_standard/download_center_pb s/Download_Center_PBS.php?p=2#dbfilter File name: “Standard Soldering Profile” All our products are proven and tested by Wuerth Elektronik soldering test standard. 2.2 Recommended soldering profiles for THT parts Please download our soldering standard from the Internet under the following link: http://www.weonline.com/web/en/passive_bauelemente_standard/download_center_pb s/Download_Center_PBS.php?p=2#dbfilter File name: “Standard Soldering Profile” All our products are proven and tested by Wuerth Elektronik soldering test standard. I:\User_Groups_Only\17_EMC_Product_&_Development\Article_Master\eiCan\Switch\SwDIP\Master_Data\05_Precaution\Precaution _DIP Switch_version4_20140221.doc Precautions for the use of DIP Switch Revision 2 Valid from 07.05.2002 page 3 of 6 This document is only valid on the date of printing: 21/02/2014 2.3 Recommended for hand soldering: 350°C for 3 sec. max or 270°C for 5 sec. max. 2.4 Recommended for vapor phase soldering Our dip switch products are not qualified for VPH. Qualification of usability must be approved on customer side for his process, gladly with free samples offered by Wuerth Elektronik. 2.5 Cleaning, Washing and Coating For non-washable series, Parts out of this series are not construed for washing, so that washing can cause a malfunction afterwards. For our washable series Please do not submerse our washable products into water or cleaning agents or put them in locations exposed to water/liquids completely. When cleaning by hand (brushing), please do not use excessive force on our switch to avoid malfunction afterwards, because you could deform function relevant areas or you could damage sealing functions. Do not clean washable series immediately after soldering. The cleaning may be absorbed into the switch through respiration while the switch cools. If our product is potted in customer applications, the potting material might shrink during and after hardening. According to this the product is exposed to the pressure of the potting material with the effect that the product is possibly damaged by this pressure and so the electronics as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the products need to be checked in case any malfunctions or destructions on the product have occurred. I:\User_Groups_Only\17_EMC_Product_&_Development\Article_Master\eiCan\Switch\SwDIP\Master_Data\05_Precaution\Precaution _DIP Switch_version4_20140221.doc Precautions for the use of DIP Switch Revision 2 Valid from 07.05.2002 page 4 of 6 This document is only valid on the date of printing: 21/02/2014 3. Handling of the component Please keep our switch at “off” position during the soldering process. For series with top tape, please remove the tape after your process is completed. For setting of the position, we recommend to use a ball pen or (optimum) plastic tweezers with flat surface for operation and do not apply with excessive force as , it could cause damage or deformation of the moveable contact area and result into function errors. Correct setting way : 1) For the flat type, please remove the tape first after soldering process. 2) One side of the tweezers hold the cover, the other side hold in vertical direction to the moveable actuator. 3) Use slide force to change the setting. I:\User_Groups_Only\17_EMC_Product_&_Development\Article_Master\eiCan\Switch\SwDIP\Master_Data\05_Precaution\Precaution _DIP Switch_version4_20140221.doc Precautions for the use of DIP Switch Revision 2 Valid from 07.05.2002 page 5 of 6 This document is only valid on the date of printing: 21/02/2014 Do not use sharp surface like below : Sharp surface may easier damage the moveable contact and cause to malfunction. Also sharp setting tools may cause the cover or visual damages of the components. Please do not focus the force pressure point only on 1 point. By holding like this offers the moveable contact only the pressure on one side and it can cause easier the deforming of moveable contact or damage the slider window and cause the deforming of the contact or over sliding of the moveable contact and cause to malfunction. I:\User_Groups_Only\17_EMC_Product_&_Development\Article_Master\eiCan\Switch\SwDIP\Master_Data\05_Precaution\Precaution _DIP Switch_version4_20140221.doc Precautions for the use of DIP Switch Revision 2 Valid from 07.05.2002 page 6 of 6 This document is only valid on the date of printing: 21/02/2014 Please let the board or parts cool down completely before setting the positions. 4. Storage & operation condition Storage temperature : -40°C ~ 85°C Operation temperature: -40°C ~ 85° C 5. Compliance Wuerth Elektronik products are Rohs compliance products. For a 3rd parties RoHs report, please contact us. For any further information, please feel free to contact our sales representatives. I:\User_Groups_Only\17_EMC_Product_&_Development\Article_Master\eiCan\Switch\SwDIP\Master_Data\05_Precaution\Precaution _DIP Switch_version4_20140221.doc