SE8810(SOT 23)

WILLAS
FM120-M+
THRU
SE8810
FM1200-M+
SOT-23
Plastic-Encapsulate
1.0A SURFACE
MOUNT SCHOTTKY BARRIER MOSFETS
RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
N-Channel
MOSFET
capability, low forward voltage drop.
• High current
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
DESCRIPTION
• Silicon epitaxial planar chip, metal silicon junction.
Lead-free
partsuse
meet
environmental
standards
of
•The
SE8810
advanced
trench
technology
to provide excellent
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
SOT-23
0.071(1.8)
0.056(1.4)
MIL-STD-19500 /228
• RoHS product for packing code suffix "G"
1. GATE
Mechanical data
2. SOURCE
and low gate charge. It is ESD protected. This device is suitable
RDS(ON)
Halogen free product for packing code suffix "H"
for use as a uni-directional or bi-directional load switch,facilitated by its
• Epoxy : UL94-V0 rated flame retardant
plastic, SOD-123H
• Case : Molded
common-drain
configuration.
0.031(0.8) Typ.
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.040(1.0)
0.024(0.6)
3. DRAIN
ina
ry
0.031(0.8) Typ.
Method 2026
MARKING:
8810 by cathode band
• Polarity : Indicated
• Mounting Position : Any
• Weight : Approximated 0.011 gram
MAXIMUM RATINGS (Ta=25℃ unless otherwise noted)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATINGS
Gate-source voltage
Marking Code
Value
Unit
VDS
20
V
SYMBOL FM120-MH FM130-MH
FM1200-MH UNIT
VGS FM140-MH FM150-MH FM160-MH
±12 FM180-MH FM1100-MH FM1150-MH
V
VRRM
12
20
13
ID
30
14
40
15
50
16
607
18
80
10
100
115
A
150
120
200
Volts
Maximum
RMSDrain
Voltage
Pulsed
Current
VRMS
14
21
IDM
28
35
42
30
56
70
105
A
140
Volts
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
80
100
150
200
Volts
Pr
el
Maximum Recurrent Peak Reverse Voltage
Continuous drain current
Power dissipation*
IO
Maximum Average Forward Rectified Current
Symbol
im
Ratings at 25℃ ambient temperature
unless otherwise specified.
Parameter
Single phase half wave, 60Hz, resistive of inductive load.
Drain-source
For capacitive
load, voltage
derate current by 20%
Thermal resistance from junction to ambient Peak Forward Surge Current 8.3 ms single half sine-wave
Junction
temperature
superimposed
on rated
load (JEDEC method)
IFSM
RΘJA
Typical Thermal Resistance (Note 2)
Storage temperature
CJ
Typical Junction Capacitance (Note 1)
PD
0.3
1.0
RθJA
417
TJ
150
40
120
-55~ +150
-55 to +125
* Repetitive
rating
: Pulse width limited by junction
temperature.
Operating
Temperature
Range
TJ
Storage Temperature Range
Amps
℃/W
30
Tstg
W
Amps
℃
℃/W
℃
PF
-55 to +150
℃
- 65 to +175
TSTG
℃
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
@T A=125℃
IR
0.50
0.70
0.85
0.5
0.9
0.92
Volts
10
mAmp
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
2012-06
2014-01
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
SE8810
FM1200-M+
SOT-23 Plastic-Encapsulate MOSFETS
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+ PACKAGE
Pb Free Product
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
ELECTRICAL
(T =25℃ unless otherwise noted)
surface mounted applicationain order to
• Low profileCHARACTERISTICS
SOD-123H
optimize board space.
Parameter
Symbol
Test Condition
loss, high efficiency.
• Low power
• High current capability, low forward voltage drop.
STATIC PARAMETERS
• High surge capability.
for overvoltage
• Guardring
Drain-source
breakdown
voltageprotection.V (BR) DSS VGS = 0V, ID =250µA
• Ultra high-speed switching.
Zero gate voltage drain current
IDSS
VDS =16V,VGS = 0V
junction.
• Silicon epitaxial planar chip, metal silicon
• Lead-free parts meet environmental standards of VGS =±4.5V, VDS = 0V
MIL-STD-19500
/228
Gate-body
leakage current
Min0.146(3.7)Typ
0.130(3.3)
20
V
0.071(1.8)
0.056(1.4)
VGS =±8V, VDS = 0V
Halogen free product for packing code suffix "H"
Gate threshold voltage (note 1)
VGS(th)
Mechanical data
VDS =VGS, ID =250µA
Forward tranconductance (note 1)
• Polarity : Indicated by cathode band
Diode forward voltage(note 1)
• Mounting Position : Any
SWITCHING
• WeightPARAMETERS(note
: Approximated 0.011 2)
gram
Turn-on delay time
gFS
VSD
tr
Q
Vgs
RRM
Maximum
RMS Charge
Voltage
Gate-Drain
VRMS
Q
gd
VDC
20
mΩ
mΩ
0.031(0.8) Typ.
35
mΩ
S
1
V
6.5
ns
12.5
ns
51.5
ns
16
ns
115
nC
150
120
200
Volts
56 4
70
105
nC
140
Volts
100
150
200
Volts
14
21
28
35
42
20
30
40
50
60
IFSM
Guaranteed by design, not subject to production
testing.
CJ
Typical Junction Capacitance (Note 1)
TJ
Operating Temperature Range
Storage Temperature Range
80
1.0
30
superimposed on rated load (JEDEC method)
RΘJA
nC
10
100
Pulse Test : Pulse width≤300µs, duty cycle≤0.5%.
Typical Thermal Resistance (Note 2)
20
18
80 1
Peak Forward Surge Current 8.3 ms single half sine-wave
2.
V
16
60
IO
Maximum Average Forward Rectified Current
1.
12
13
14
15
V20
DS =10V,V
30GS =4.5V,I
40 D =7A
50
Pr
el
Qg
Gate-Source
Charge
Maximum
Recurrent
Peak Reverse Voltage
Notes :
1
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
Maximum DC Blocking Voltage
V =5V,V =10V,
tf
Total Gate Charge
Marking Code
µA
IS=1A, VGS = 0V
GS
DS
Ratings at 25℃ ambient temperature unless otherwise specified.
R
=1.35Ω,R
L
GEN=3Ω
Turn-off
delay
d(off)
Single
phase
halftime
wave, 60Hz, resistive of inductive tload.
For capacitive load, derate current by 20%
RATINGS
±10
Dimensions in inches and (millimeters)
td(on)
Turn-off fall time
µA
9
VDS =5V, ID =7A
im
±1
26
0.031(0.8) Typ.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Turn-on rise time
µA
0.040(1.0)
0.024(0.6)
ina
ry
Method 2026
1
0.4
VGS =10V, ID =7A
• Epoxy : UL94-V0 rated flame retardant
Drain-source
1)
RDS(on)
VGS =2.5V, ID =5.5A
Molded plastic,(note
SOD-123H
• Case : on-resistance
,
VGS =1.8V, ID =5A
• Terminals :Plated terminals, solderable per MIL-STD-750
Unit
0.012(0.3) Typ.
IGSS
• RoHS product for packing code suffix "G"
Max
40
120
-55 to +125
Amps
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
TSTG
℃
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
@T A=125℃
IR
0.50
0.70
0.85
0.5
0.9
0.92
Volts
10
mAmps
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
2012-06
2014-01
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
SE8810
FM1200-M+
SOT-23 Plastic-Encapsulate MOSFETS
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123+ PACKAGE
Pb Free Product
Package outline
Features
Outline Drawing
SOT-23
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize board space.
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
ry
0.031(0.8) Typ.
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
0.071(1.8)
0.056(1.4)
.110(2.80)
.063(1.60)
.047(1.20)
.122(3.10)
.106(2.70)
Halogen free product for packing code suffix "H"
Mechanical data
0.012(0.3) Typ.
.006(0.15)MIN.
MIL-STD-19500 /228
• RoHS product for packing code suffix "G"
0.146(3.7)
0.130(3.3)
ina
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Pr
eli
m
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
RATINGS
.080(2.04)
Marking Code
.070(1.78)
Maximum Recurrent Peak Reverse
Voltage
.008(0.20)
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
VRRM
12
20
13
30
14
40
15
50
16
60
18
80
VRMS
14
21
28
35
42
56
70
Maximum DC Blocking Voltage
VDC
20
30
40
50
60
80
100
Maximum Average Forward Rectified Current
IO
IFSM
Maximum RMS Voltage
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
RΘJA
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note 1)
CJ
Operating Temperature Range
TJ
.004(0.10)MAX.
Storage Temperature Range
.083(2.10)
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
10
115
.003(0.08)
100
150
120
200
Volts
105
140
Volts
150
200
Volts
1.0
30
40
120
-55 to +125
Amps
Amps
℃/W
PF
-55 to +150
℃
- 65 to +175
TSTG
℃
VF
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
@T A=125℃
IR
.020(0.50)
.012(0.30)
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
NOTES:
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
0.50
.055(1.40)
.035(0.89)
CHARACTERISTICS
Maximum Forward Voltage at 1.0A DC
0.70
0.85
0.9
0.92
0.5
Volts
mAmps
10
2- Thermal Resistance From Junction to Ambient
Dimensions in inches and (millimeters)
Rev.D
2012-06
2014-01
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
THRU
SE8810
FM1200-M+
SOT-23
Plastic-Encapsulate MOSFETS
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
Pb Free Product
SOD-123+
PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123H
• Low profile surface mounted application in order to
optimize board space.
0.146(3.7)
• Low power loss, high efficiency.
0.130(3.3)
Device PN Packing • High current capability, low forward voltage drop.
(1) (2)
capability.
• High surge SE8810 ‐T
G ‐WS Tape&Reel: 3 Kpcs/Reel • Guardring for overvoltage protection.
Packing code, Tape & Reel Packing Ultra high-speed switching.
•Note: (1)
epitaxial planar chip, metal silicon junction.
• Silicon(2) RoHS product for packing code suffix ”G”;Halogen free product for packing code suffix “H” • Lead-free parts meet environmental standards of
MIL-STD-19500
/228
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Ordering Information: Mechanical
data
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
0.071(1.8)
0.056(1.4)
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.
ina
ry
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
• Terminals :Plated terminals, solderable per MIL-STD-750
0.012(0.3) Typ.
0.031(0.8) Typ.
Dimensions in inches and (millimeters)
***Disclaimer*** MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
WILLAS reserves the right to make changes without notice to any product im
changes. WILLAS or anyone on its behalf assumes no responsibility or liability SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
RATINGS
Marking Codefor any errors or inaccuracies. Data sheet specifications and its information 12
13
14
15
16
18
10
115
120
20
30
40
50
60
80
100
150
200
Maximum Recurrent
Peak
Reverse
Voltage
Volts
V
RRM
contained are intended to provide a product description only. "Typical" parameters Volts
14
21
28
35
42
56
70
105
140
Maximum RMS Voltage
VRMS
which may be included on WILLAS data sheets and/ or specifications can Volts
Maximum DC Blocking Voltage
20
30
40
50
60
80
100
150
200
VDC
and do vary in different applications and actual performance may vary over time. Amps
Maximum Average
Forward Rectified Current
IO
1.0
Peak ForwardWILLAS does not assume any liability arising out of the application or Surge Current 8.3 ms single half sine-wave
30
IFSM
Amps
superimposed on rated load (JEDEC method)
use of any product or circuit. ℃/W
40
Typical Thermal Resistance (Note 2)
RΘJA
PF
120
Typical Junction Capacitance (Note 1)
CJ
-55 to +125
-55
to
+150
Operating Temperature
Range
T
J
℃
WILLAS products are not designed, intended or authorized for use in medical, Pr
el
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase
half wave, 60Hz, resistive of inductive load.
specification herein, to make corrections, modifications, enhancements or other For capacitive load, derate current by 20%
Storage Temperature Range
TSTG
- 65 to +175
℃
life‐saving implant or other applications intended for life‐sustaining or other related CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH UNIT
applications where a failure or malfunction of component or circuitry may directly Volts
0.9
Maximum Forward Voltage at 1.0A DC
0.92
VF
0.50
0.70
0.85
or indirectly cause injury or threaten a life without expressed written approval 0.5
Maximum Average
Reverse Current at @T A=25℃
IR
mAmps
10
@T A=125℃
Rated DC Blocking
Voltage
of WILLAS. Customers using or selling WILLAS components for use in NOTES:
such applications do so at their own risk and shall agree to fully indemnify WILLAS 1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
Inc and its subsidiaries harmless against all claims, damages and expenditures. 2- Thermal Resistance From Junction to Ambient
2012-06
2014-01
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP.