Details

4 Pad Ceramic Package Quartz Crystal, 1.0 mm x 1.2 mm
Product Features:
ILCX21 Series
Applications:
Low Cost SMD Package
Ultra Miniature Package
Compatible with Leadfree Processing
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
IOT
36 MHz to 80 MHz (Contact Sales Representative for
developed frequencies)
Frequency
ESR (Equivalent Series Resistance)
36.0 MHz – 40.0 MHz
40.0 MHz – 48.0 MHz
48.0 MHz – 80.0 MHz
150  Max.
80  Max.
60  Max.
Shunt Capacitance (C0)
3.0 pF Max.
Frequency Tolerance @ 25 C
30 ppm Standard (see Part Number Guide for more options)
Frequency Stability over
Temperature
50 ppm Standard (see Part Number Guide for more options)
Crystal Cut
AT Cut
Load Capacitance
6 pF Standard
Drive Level
100 µW Max.
Aging
3 ppm Max. / Year Standard
Temperature
Operating
-20 C to +70 C (see Part Number Guide for more options)
Storage
-40 C to +85 C
Part Number Guide
Package
ILCX21 -
Sample Part Number:
Tolerance
(ppm) at Room
Temperature
ILCX21 - FB1F6 - 37.400
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range
B = ±50 ppm
B = ±50 ppm
0 = 0°C to +50°C
F = ±30 ppm
F = ±30 ppm**
1 = 0°C to +70°C
G = ±25 ppm
G = ±25 ppm**
2 = -10°C to +60°C
H = ±20 ppm
H = ±20 ppm**
3 = -20°C to +70°C
I = ±15 ppm
I = ±15 ppm**
5 = -40°C to +85°C
J = ±10 ppm*
J = ±10 ppm**
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
Load Capacitance
(pF)
6 pF Standard
Or Specify
Frequency
- 37.400 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 01/20/16_A
Page 1 of 2
4 Pad Ceramic Package Quartz Crystal, 1.0 mm x 1.2 mm
Pb Free Solder Reflow Profile:
ILCX21 Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
5000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I, Date Code (yww)
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 01/20/16_A
Page 2 of 2
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