Details

ISM36 Series
2.0 mm x 1.6 mm Ceramic Package SMD Oscillator, CMOS
Applications:
Product Features:
Very Low Current Consumption
CMOS Logic Levels
Compatible with Leadfree Processing
Small Footprint Package
AT Cut Temperature Stability Charactertics
Real Time Clocks
Metering
Industrial Control
Time Reference
System Clock
Frequency
32.768 kHz
Output Level
CMOS
‘0’ = 0.1 VDD Max., ‘1’ = 0.9 VDD Min.
Duty Cycle
50% ±5%
Rise / Fall Time
50 nSec Max. 1.8V (20% to 80% VDD Level)
40 nSec Max. 2.5V (20% to 80% VDD Level)
30 nSec Max. 3.3V (20% to 80% VDD Level)
15pF Max.
Output Load
Frequency
Tolerance (at 25°C)
See Part Number Guide Below
Frequency Stability
See Part Number Guide Below
Enable / Disable
Time
Start Up Time
200 nS Max.
Supply Voltage
See Input Voltage Table, tolerance ±10%
Current Operating
40 µA Max. (F=32.768kHz, VDD = 3.3V, 15 pF load)
Current Standby
3 µA Max.
Stand-by Function
Output Enable (High) = 0.7 VDD Min,
Output Disable (Low/High Impedance) = 0.3 VDD Max.
Operating
See Operating Temperature Table in Part Number Guide
Storage
-40° C to +105° C Standard
7.0 mS Max. (VDD = 3.3V)
10.0 mS Max. (VDD = 1.8V)
Part Number Guide
Package
ISM36 -
Input
Voltage
Sample Part Number:
ISM36 -32ZBH – 32.768 kHz
Operating
Temperature
Frequency Tolerance 25°C
(in ppm)
Stability
(in ppm)
Enable /
Disable
3 = 3.3 V
1 = 0 C to +70 C
D= 10
E= 10*
H = Stand-by
6 = 2.5 V
3 = -20 C to +70 C
D= 15
D= 15
1 = 1.8 V
5 = -30 C to +85 C
F= 20
F= 20
2 = -40 C to +85 C
Z = 30
Z = 30
B = 50
B = 50
Frequency
- 32.768 kHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vdd (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all
operating temperature options.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 01/19/16_A
Page 1 of 2
2.0 mm x 1.6 mm Ceramic Package SMD Oscillator, CMOS
ISM36 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8.0 +/-.3
4.0 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I-Date Code (YWW)
Line 2: Frequency
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 01/19/16_A
Page 2 of 2
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