Details

5.0 mm x 7.0 mm Ceramic Package SMD Oscillator
ISM81 Series
Product Features:
Wide Temperature Range (-55º to +125ºC)
Frequency Stability option ±50 ppm over the full operating temperature range.
Low Phase Noise
RoHS Compliant
Frequency
1.000 MHz to 125.000 MHz
Output Level
CMOS
Logic ‘0’ = 10% of Vcc max
Logic ‘1’ = 90% of Vcc min
Duty Cycle
Specify 50% ±10% or ±5% See Table in Part Number Guide
Rise / Fall Time
5 nS Max. for 10% to 90% of waveform
7.00
IYWW
FREQ
5.00
1.70 max
15 pF
Output Load
Frequency Stability
See Frequency Stability Table (Includes room temperature tolerance
and stability over operating temperature)
5.08
1
2
4
3
2.60
Aging (Initial First
Year)
±3 ppm max
Start-up Time
5 mS Max.
Supply Voltage
See Input Voltage Table, tolerance ±5 %
Current
50 mA Max.
1.40
5.08
0.01
uF
1.50
Operating
-55 C to +125 C
Storage
-55 C to +125 C
Phase Jitter:
(12kHz – 20MHz)
1 pS RMS max
Tri-State (Pin 1)
Function
Enable / Disable Time
Current, Standby Mode
Standby
100 nS Max. N.C. or ≥ 70% Vcc = Enable. ≤ 30% Vcc = Disable
20 µA
3.70
2.40
Recommended
Pad Layout
Pin Connections
PIN 1
PIN 2
PIN 3
PIN 4
Enable / Disable
or NC
Ground
Output
Vcc
Dimension Units: mm
Part Number Guide
Input
Package
Voltage
ISM81
1 = 1 .8 V
2 = 2.7 V
3 = 3.3 V
6 = 2.5 V
7 = 3.0 V
Sample Part Number:
Operating
Temperature
Symmetry
(Duty Cycle)
Output
7 = -55ºC to +125ºC
5 = 45 / 55 max
6 = 40 / 60 max
3 = 15pF
6 = 30pF *
ISM81-3756BH-20.000
Stability (in
Enable /
Frequency
ppm)
Disable
B = ±50 ppm
C= ±100 ppm
H = Enable
O = N/C
20.000
*Oscillator may not meet 5% symmetry over temperature range with 30 pF load.
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
07/14/14_A2
Specifications subject to change without notice
Page 1
5.0 mm x 7.0 mm Ceramic Package SMD Oscillator
Pb Free Solder Reflow Profile:
ISM81 Series
Typical Application:
*Units are backward compatible with 240º C reflow processes
Package Information:
MSL = N.A. (Package does not contain plastic; storage life is unlimited under normal room conditions.)
Termination = e4 (Au over Ni over W base metallization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking:
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
Proprietary and Confidential
This document contains proprietary information, and such information may not be disclosed to others for any purpose nor
used for manufacturing purpose without the written permission of ILSI America.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
07/14/14_A2
Specifications subject to change without notice
Page 2
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