Details

ISM88 Series
3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVPECL
Product Features:
Applications:
Surface Mount Package
Low Jitter
Reflow Compatible
Compatible with Leadfree Processing
Test Equipment
Server & Storage
Sonet /SDH
Frequency
25 MHz to 350.000 MHz
Output Level
VOH = VCC - 1.02 VDC Min.
VOL = Vcc - 1.62 VDC Max.
Duty Cycle
50% ±5%
Rise / Fall Time
1.0 nS Max.
Output Load
50  to Vcc - 2.0 VDC
Frequency Stability
±25ppm
Enable Phase Delay
2 mS Max.
Disable Phase
Delay
200 nS Max.
Supply Voltage
See Input Voltage Table, Tolerance ±5 %
Current
55 mA Typical, 90 mA Max.
Operating
0 C to +70 C
Storage
-40 C to +85 C
Integrated Jitter
RMS
0.3 typ. (12 KHz to 20 MHz Band)
Part Number Guide
Package
ISM88 -
Recommended Pad Layout
Pin Connection
1
Enable
2
N.C.
3
VSS
4
Output
5
Comp. Output
6
VDD
Sample Part Number:
Input
Voltage
Operating
Temperature
Symmetry
(Duty Cycle)
3 = 3.3 V
1 = 0 C to +70 C
5 = 45 / 55 Max.
6 = 2.5 V
2 = -40 C to +85 C
Dimension Units: mm
ISM88 – 3159AH - 156.250
Output
9 = LVPECL
Stability
(in ppm)
Enable /
Disable
Frequency
A = 25*
H = Enable
- 156.250 MHz
Z = 30
B = 50
C = 100
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. * Not available for all
temperature ranges and frequencies.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
01/11_A
Specifications subject to change without notice
Page 1
ISM88 Series
3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVPECL
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
01/11_A
Specifications subject to change without notice
Page 2
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