Details

ISM34 Series
2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, HC-MOS
Applications:
Product Features:
RoHs Compliant
CMOS Logic Levels
Compatible with Leadfree Processing
Small Footprint Package
Real Time Clocks
Metering
Industrial Control
Time Reference
System Clock
Frequency
32.768 kHz
Output Level
HC-MOS
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
Duty Cycle
Specify 50% ±10% or ±5% See Table in Part Number Guide
Rise / Fall Time
50 nS Max.
Output Load
15pF ±5%
Recommended Pad layout
Frequency Stability
See Frequency Stability Table (Includes room temperature tolerance and
stability over operating temperature)
Enable / Disable Time
200 nS Max.
Start Up Time
28 mS Max.
Supply Voltage
See Input Voltage Table, tolerance ±5 %
2.6
2.0
1.3
1.4
Current
Pin Connection
1
Enable
2
GND
3
Output
4
Vcc
1.0 mA Max.
Operating
See Operating Temperature Table in Part Number Guide
Dimension Units: mm
-40 C to +90 C
Storage
Part Number Guide
Package
ISM34 -
Input
Voltage
Sample Part Number:
Operating
Temperature
Symmetry
(Duty Cycle)
3 = 3.3 V
1 = 0 C to +70 C
5 = 45 / 55 Max.
6 = 2.5 V
6 = -10 C to +70 C
6 = 40 / 60 Max.
1 = 1.8 V*
3 = -20 C to +70 C
ISM34 -3153BH – 32.768
Output
3 = 15 pF HC-MOS
Stability
(in ppm)
Enable /
Disable
A = 25
H = Enable
B = 50
C = 100
4 = -30 C to +75 C
2 = -40 C to +85 C
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
06/11 _B
Frequency
Specifications subject to change without notice
Page 1
- 32.768 kHz
ISM34 Series
2.5 mm x 3.2 mm Ceramic Package SMD Oscillator, HC-MOS
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
16 +/-.3
8 +/-.2
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
06/11 _B
Specifications subject to change without notice
Page 2
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