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ESDA13P70-1U1M
High power transient voltage suppressor
Datasheet - production data
Description
The ESDA13P70-1U1M is an unidirectional single
line TVS diode designed to protect the power line
against EOS and ESD transients.
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The device is ideal for applications where high
power TVS and board space saving are required.
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Figure 1. Pin configuration
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Features
• Low clamping voltage
• Typical peak pulse power:
– 1300 W (8/20µs)
• Stand-off voltage 12 V
• Unidirectional diode
• Low leakage current:
– 0.2 µA at 25 °C
Complies with the following standards:
• IEC 61000-4-2 level 4
– ±30 kV (air discharge)
– ±30 kV (contact discharge)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
• Portable multimedia, tablets, mobile phone,
smart phone
• USB VBUS protection
• Power supply protection
• Battery protection
November 2015
This is information on a product in full production.
DocID028170 Rev 1
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Characteristics
1
ESDA13P70-1U1M
Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol
Parameter
Value
Unit
VPP
Peak pulse voltage:
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air discharge
> 30
> 30
kV
PPP
Peak pulse power (8/20 µs)
1300
W
IPP
Peak pulse current (8/20 µs)
70
A
Tstg
Storage temperature range
-55 to +150
°C
Top
Operating junction temperature range
-55 to +150
°C
Figure 2. Electrical characteristics (definitions)
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Table 2. Electrical characteristics (values, Tamb = 25 °C)
Symbol
2/10
Test conditions
Min.
Typ.
12.5
13
Max.
Unit
VBR
IR = 1 mA
IRM
VRM = 12 V
200
nA
IRM
VRM = 9 V
100
nA
VCL
IPP = 60 A 8/20 µs
20
V
VCL
IPP = 10 A 8/20 µs
16
V
Rd
8/20 µs
0.1
DocID028170 Rev 1
V
Ω
ESDA13P70-1U1M
Characteristics
Figure 3. Peak pulse power dissipation versus Figure 4. Peak pulse power versus exponential
initial junction temperature (typical values)
pulse duration (typical values)
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Figure 5. Peak pulse current versus clamping
voltage (maximum values)
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Figure 6. Leakage current versus junction
temperature (typical values)
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Figure 7. ESD response to IEC 61000-4-2
(-8 kV contact discharge)
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Figure 8. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
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Package information
2
ESDA13P70-1U1M
Package information
•
Epoxy meets UL94, V0
•
Dot indicates pin 1
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
QFN 1610 package information
Figure 9. QFN 1610 package outline
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Table 3. Package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
0.020
0.021
0.023
A
0.51
0.55
0.60
A1
0.00
0.02
0.05
b
0.75
0.80
0.85
0.029
0.031
0.033
D
1.50
1.60
1.70
0.059
0.063
0.067
E
0.90
1.00
1.10
0.035
0.039
0.043
e
L
4/10
Inches
0.002
1.05
0.30
0.35
0.041
0.40
DocID028170 Rev 1
0.011
0.013
0.016
ESDA13P70-1U1M
Package information
Figure 10. Footprint, dimensions in mm
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Figure 11. Alternative footprint, dimensions in
mm
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Figure 12. Marking
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Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Figure 13. Tape and reel specifications
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Recommendation on PCB assembly
ESDA13P70-1U1M
3
Recommendation on PCB assembly
3.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 14. Stencil opening dimensions
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7
b)
:
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 15. Recommended stencil window
position
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Figure 16. Alternative stencil window
position
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ESDA13P70-1U1M
3.2
3.3
3.4
Recommendation on PCB assembly
Solder paste
1.
Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste recommended.
3.
Offers a high tack force to resist component displacement during PCB movement.
4.
Use solder paste with fine particles: powder particle size 20-45 µm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3.
Standard tolerance of ± 0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
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Recommendation on PCB assembly
3.5
ESDA13P70-1U1M
Reflow profile
Figure 17. ST ECOPACK® recommended soldering reflow profile for PCB mounting
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Minimize air convection currents in the reflow oven to avoid component movement.
DocID028170 Rev 1
ESDA13P70-1U1M
4
Ordering information
Ordering information
Figure 18. Ordering information scheme
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Table 4. Ordering information
Order code
Marking
Weight
Base qty
Delivery mode
ESDA13P70-1U1M
G(1)
2.4 mg
8000
Tape and reel
1. The marking can be rotated by multiples of 90° to differentiate assembly location
5
Revision history
Table 5. Document revision history
Date
Revision
03-Nov-2015
1
Changes
Initial release.
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ESDA13P70-1U1M
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