GP2AP002S00F

GP2AP002S00F
GP2AP002S00F
Proximity Sensor
■Description
■Agency approvals/Compliance
GP2AP002S00F provide a digital detection system
integrated into one package the light emitting element
and a light receiving element.
So small package size, it is easy to mount on the
equipment.
1. Compliant with RoHS directive (2002/95/EC)
■Applications
1. Mobile phone
2. Smartphone, Tablet
3. Digital single-lens reflex camera
■Features
1. Disparities in detecting distance results are greatly
reduced using a built-in circuit for reduction of
light-detecting sensitivity disparities
2.Compact size(4.0 × 2.0 × 1.25t mm)
3.Built-in LED for simple optical design
4.I2C output type
Notice
The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: OP13009EN
1
GP2AP002S00F
■ Schematic Internal Block Diagram
Vcc
Output buffer
AMP
LEDA
Synchronized
Signal Detection
●
●
Vout
●
LED driver
LEDC
●
Vio
2
IC
Interface
Oscillator
SDA
SCL
Power on Reset
GND
Sheet No.: OP13009EN
2
GP2AP002S00F
■Outline Dimensions
1)
area: Au plating
2) Unspecified tolerance shall be 0.2.
3) Adhesion of resin to the terminal area shall be allowed Max. 0.2mm.
Sheet No.: OP13009EN
3
GP2AP002S00F
■Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply voltage
LED supply voltage
Vcc
VLED
-0.3 to 3.8
-0.3 to 3.8
V
V
LED peak forward current
ILED
mA
Logic I/O supply voltage
Vio
SDA/SCL pull-up voltage
-
°C
°C
Operating temperature
Topr
300
-0.3 to Vcc+0.3 and
3.8V or less
Vio-0.3 to Vio+0.3 and
3.8V or less
-25 to +85
Storage temperature
Soldering temperature
Tstg
Tsol
-40 to +85
260
V
V
Ta=25°C (unless otherwise specified)
Remarks
Cf: Refer to the page 7, Directions for
power-line connection
Cf: Refer to the page 7, Directions for
power-line connection
°C
peak temperature duration:10sec
■Recommended Operating Conditions
Parameter
Symbol
Operating condition
Unit
Supply voltage
LED supply voltage
Vcc
VLED
2.4 to 3.6
2.4 to 3.6
V
V
Operating temperature
Topr
-25 to 85
°C
Logic I/O supply voltage
SCL, SDA input low level
Vio
VIL
1.65 to Vcc
-0.3 to 0.2×Vio
V
V
SCL, SDA input high level
VIH
0.8×Vio to Vio+0.3
V
Ta=25°C (unless otherwise specified)
Remarks
■Electrical and Optical Characteristics
Parameter
operating mode
Current consumption
shutdown mode
LED peak current
Peak emission wavelength
Ta=25°C ,Vcc=3.3V, VLED=3.3V RLED=6.8Ω (unless otherwise specified)
Symbol Min.
Typ.
Max. Unit
Remarks
No detection object, Ev=0 lx.
ICC
240
600
*1, except for LED and driver
uA
No input signal.
ICC-S
1.0
*1, except for LED and driver
ILED
170
mA
λp
940
nm
Vout terminal High level output voltage
Vout terminal Low level output voltage
VOH
VOL
Response time (H→L)
tpHL
-
-
50
ms *2
Response time (L→H)
Rise time
tpLH
tr
-
1
50
-
ms
μs *2, CL=15pF
tf
-
1
-
μs
Maximum detection distance
Lon
25
65
-
mm
Minimum no detection distance
Wake up time
Loff
tsdw
-
78
-
150
100
mm
ms *4
Maximum acceptable illuminance
SCL clock frequency
Ev
SCL
3000
4
-
400
lx *5
kHz
Fall time
Vio-0.5 Vio-0.3 Vio+0.3
0.5
V
V
IOH=0.3mA,*2
IOL=1mA, *2
*3, Detection object:
KODAK Gray Card (r = 0.18)
Operation mode B1
*1. Current consumption through VLED terminal (including LED and its driver output) depends on
actual environment and situations. (See attached document【1】1-1)
Sheet No.: OP13009EN
4
GP2AP002S00F
*2. Parameters defined for Vout output waveform specifications
With detection object
State of the object
to be detected
tpHL
Without detection object
tpLH
tr
tf
VOH
90%
Vout output
(at normal output mode)
50%
10%
VOL
*3. Detection distance
KODAK
Gray Card
d
GP2AP002S00F
GP2AP002S00F output example vs. distance characteristics (operation mode B1)
Mimimum No Detection Distance
Maximum Detection Distance
VO value
detection→
←no detection
1
0
0
20
40
60
80
100
120
140
160
180
200
Distance, d (mm)
Sheet No.: OP13009EN
5
GP2AP002S00F
*4. Wake up time, tsdw, is defined as a delay of the 1st LED emission after issuing the I2C write command to release
GP2AP002S00F from the shutdown mode. Note that there should be no external light noise sources in this
particular examination. Also, by definition, it does not matter where reflective object is, but it is recommended
that the object should be placed at d << Lon because VO is initialized to 0 and the next expected change is 0 to 1.
*5. Test set-up for “Maximum Acceptable Illuminance” measurement
GP2AP002S00F
Light source A
Emitter/Detector surface
Illuminance should be measured and evaluated at Emitter/Detector surface of GP2AP002S00F.
The maximum acceptable illuminance, Ev, is a maximum level of illuminance at which GP2AP002S00F
should keep its sensing result, VO, as "0" (no detection) as long as no reflective objects exist. However,
GP2AP002S00F may start to exhibit false detection with external light noise beyond this level.
See attached document【1】1-10 for more details.
■Supplement
●This product is built-in photodiode.
●Compliance with each regulation
1) The RoHS directive(2002/95/EC)
This product complies with the RoHS directive(2002/95/EC) .
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls(PBB)
and polybrominated diphenyl ethers(PBDE)
2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic
Information Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Toxic and hazardous substances
Hexavalent Polybrominated Polybrominated
Category
Lead
Mercury Cadmium
chromium
biphenyls
diphenyl ethers
(Pb)
(Hg)
(Cd)
(Cr6+)
(PBB)
(PBDE)
Proximity sensor
✓
✓
✓
✓
✓
✓
✓: indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ/T 11363-2006 standard .
●This product shall not contain the following materials.
Also, the following materials shall not be used in the production process for this product.
Materials for ODS : CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform)
●Brominated flame retardants
Specific brominated flame retardants such as the PBB and PBDE are not used in this device at all.
●Product mass : Approx . 0.017 g
●Country of origin : China
●Packing : Refer to the attached sheet, Page 11.
●Moisture level: MSL3
Sheet No.: OP13009EN
6
GP2AP002S00F
■Notes
●Before the circuit design
In circuit designing, make allowance for the degradation of the light emitting diode output that results from long
continuous operation. (50% degradation/5 years)
●Please take proper methods to prevent ESD. The IC built in GP2AP002S00F is ESD-sensitive because it is fabricated
by sub-micron CMOS process. For example, in handling GP2AP002S00F, human body and soldering iron etc. should
be grounded.
●As it takes at most 100ms to let GP2AP002S00F go to active operation from shut-down mode, please take this delay
into system design consideration. Also, if the host system relies on the actual value of this delay, e.g. to do frequent
software shutdown, please thoroughly make sure that the operation be successful in any realistic situation.
●Regarding to prevention of malfunction
To prevent GP2AP002S00F from faulty operation due to external light noise sources, do not set the detection surface
to these sources directly. Under very unlikely situation, GP2AP002S00F output may fall into malfunction
(See attached document 【1】1-10 for more detail). It can be reset by letting GP2AP002S00F go shutdown once,
and then activating GP2AP002S00F again. In case of this, take it into consideration, in software implementation, to
prepare a method to reset GP2AP002S00F. Also, if some other electronic components are placed close to this device,
faulty operation may occur. (The light reflection caused by the other components may slip into the photo-detecting
portion of the device and may cause faulty operation.)
●Directions for power-line connection
Avoid that GP2AP002S00F’s SDA/SCL terminals are pulled-up to the other power line than GP2AP002S00F’s Vio
terminal even if they are in the same operating voltage. See also 10) Recommended external circuit. For example,
when you shut down GP2AP002S00F by letting Vcc and Vio terminals go to GND level (instead of using software
shutdown function), and if GP2AP002S00F’s SDA/SCL terminals are still pulled-up to another active power line,
these terminals will draw significant currents from a pull-up resister through internal ESD devices and the SCL and
SDA lines are pulled-down, which causes system error (I2C bus error).
Also, when you consider reducing total current consumption of the I 2C devices by turning off the power line(s), avoid
that one of the Vcc and Vio terminals of GP2AP002S00F is turned off and the other is kept on. It never shuts down
GP2AP002S00F’s current consumption, but possibly yields excessive current between these power lines.
Please consider making use of “software shutdown” function. However, when you do have to turn off one of these
power lines (Vcc, Vio, SDA/SCL pull-up level), all of them in GP2AP002S00F should be turned off for the purpose of
choking GP2AP002S00F’s current consumption regardless of the register setting for the software shutdown function.
●Directions for I2C-bus interface
GP2AP002S00F is equipped with a 7-bit address as a slave device on the I2C bus interface. Through the SDA and SCL
terminals, GP2AP002S00F’s registers can be set up, and also GP2AP002S00F’s sensing result can be read out.
However, the read format specified for GP2AP002S00F is a proprietary one that differs from the normal read format
(immediately after the first byte) or the combined format shown in the I 2C-bus specification version 2.1, January 2000.
For more details to let GP2AP002S00F operate properly, see attached document【1】1-2, I2C-bus interface, and 【2】
recommended operation mode / register setting procedure.
●After being mounted and soldered, if GP2AP002S00F is deformed by external force or impact, e.g. something falls
onto the device, it may result in defective implementation such as lift-off of the terminals. Careful handling should be
taken.
●For soldering
Refer to the page 10
●For cleaning
Cleaning shall carry out as the below items to avoid keeping solvent, solder and flux on the device
(1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min or less
(2) Ultrasonic cleaning : Please don't carry out ultrasonic cleaning.
(3) The cleaning shall be carried out with solvent below.
Solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
Sheet No.: OP13009EN
7
GP2AP002S00F
●Recommended external circuit
(Top View)
Components
Recommended values
CX1
4.7uF (Ceramic)
CX2
0.1uF (Ceramic)
CX3
1.0uF (Ceramic)
CX4
10uF (Ceramic)
R1
RLED
Rp
1/20W
1/20W
1/20W
10 Ω
6.8Ω±1% (VCC=VLED=3.3V)
10k Ω (*)
Notes:
Place the capacitors CX1~CX4 as close as possible to the corresponding terminals. For CX1~CX3, at most
5mm or less is preferable. Depending on the level and/or frequency component(s) of the power supply
noise, CX’s and R1 listed above may not completely eliminate its influence. Therefore, to avoid
GP2AP002S00F's false detection which can be greatly influenced by the supply noises, please carefully
make sure that there is no problem with the actual electrical implementation.
Whenever considering to change VLED voltage, choose proper value for RLED so that the desired ILED is obtained.
SDA terminal (as output) and LEDA terminal are NMOS open-drain output. On the other hand, Vout terminal
is CMOS output, but it has no high-impedance state.
(*) To determine the appropriate value for Rp’s, see section 16 of The I 2C-Bus Specification.
Sheet No.: OP13009EN
8
GP2AP002S00F
●Foot pattern of PCB
Dimensions are shown for reference.
Top View
Mount center
1. Dimension in parenthesis are shown for reference.
2. Unit : mm
Pin
Pin name
Symbol
①
LED Anode
LEDA
②
LED Cathode
LEDC
③
Vcc
Vcc
④
Output
Vout
⑤
Ground
GND
⑥
Logic I/O Supply Voltage
Vio
⑦
I2C DATA BUS
SDA
⑧
2
I C CLOCK
SCL
●Recommendable size of solder creamed paste (Reference)
: Soldering paste area
* Dimension in parenthesis are shown for reference.
Unit : mm
Sheet No.: OP13009EN
9
GP2AP002S00F
■Precautions for Soldering
1. In case of solder reflow
Reflow is allowed only twice at the temperature and the time
within the temperature profile as shown in the figure below.
Reflow interval shall be within 7days under conditions, 10 to 30°C, 70%RH or less.
MAX
260°C
1~5°C/s
220°C
190°C
1~5°C/s
150°C
1~5°C/s
25°C
MAX10s
MAX120s
MAX50s
2. Other precautions
An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin.
Also avoid immersing the resin part in the soldering.
Even if within the temperature profile above, there is the possibility that the gold wire in package is broken
in case that the deformation of PCB gives the affection to lead pins.
Please use after confirmation the conditions fully actual solder reflow machine.
Sheet No.: OP13009EN
10
GP2AP002S00F
■Packing
Packing
Inner Packing
① Inner Packaging drawing
Caver tape
2,000pcs products
Carrier tape
②Inner packing material:・Reel(PPE) ・Carrier tape (PC) ・Caver tape(PET)
③Quantity :2,000pcs./Reel
Taping reel containing products
Outer Packaging
EIAJ C-3 Label
① Outer Packaging drawing
Silica gel
Humidity indicator
EIAJ C-3 Label
Aluminium laminated sack
Aluminium laminated sack
containing a taping reel
Cushioning material
Aluminium laminated bag with tape-reel (5 bags)
Packing case
Kraft tape
EIAJ C-3 Label
② Outer packing material: Packing case(Corrugated cardboard), Cushioning material (Urethane)
Aluminium laminated bag (Alumi-Polyethylene)
Humidity indicator card (paper), Label(paper), silica gel, craft tape
③ Quantity: 10,000pcs./box
④ The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated.
Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin
⑤ Regular packaged mass: Approximately 700g
Sheet No.: OP13009EN
11
GP2AP002S00F
■Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit
design or license any intellectual property rights. SHARP
takes no responsibility for any problems related to any
intellectual property right of a third party resulting from
the use of SHARP's devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection
with equipment that requires an extremely high level of
reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability.
Manufacturing locations are also subject to change without
notice.
· If the SHARP devices listed in this publication fall within
the scope of strategic products described in the Foreign
Exchange and Foreign Trade Law of Japan, it is necessary
to obtain approval to export such SHARP devices.
· Observe the following points when using any devices in
this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which does
not meet the conditions and absolute maximum ratings to
be used specified in the relevant specification sheet nor
meet the following conditions:
(i) The devices in this publication are designed for use in
general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP and
is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any use
of this publication may be made by a third party.
· Contact and consult with a SHARP representative if there
are any questions about the contents of this publication.
Sheet No.: OP13009EN
12