MSMBG2K3.0 – MSMBG2K5.0, MSMBJ2K3.0 – MSMBJ2K5.0 Screening in reference to MIL-PRF-19500 available 2 kW Surface Mount Transient Voltage Suppressor Available DESCRIPTION The MSMBG(J)2K3.0 – MSMBG(J)2K5.0 series of surface mount 2.0 kilowatt transient voltage suppressors provide a selection of standoff voltages (V WM ) from 3.0 to 5.0 volts. These highreliability controlled devices feature unidirectional construction. The SMBG Gull-wing design in the DO-215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO-214AA package is ideal for greater PC board mounting density. It is also available as RoHS compliant. DO-215AA (SMBG) Package Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • • • • High reliability upscreened devices with wafer fabrication and assembly lot traceability. All devices 100% surge tested. Suppresses transients up to 2 kW @ 8/20 µs. Other screening in reference to MIL-PRF-19500 is also available. Refer to MicroNote 129 for more details on the screening options. (See part nomenclature for all options.) Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B. 3σ lot norm screening performed on standby current I D . RoHS compliant versions available. DO-214AA (SMBJ) Package NOTE: All SMB series are equivalent to prior SMS package identifications. APPLICATIONS / BENEFITS • • • • • Voltage and reverse standby (leakage) current lowest available. Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc. Protection from switching transients & induced RF. Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD and EFT protection respectively. Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance for class 1. MAXIMUM RATINGS @ 25 ºC unless otherwise stated Parameters/Test Conditions Symbol Value T J and T STG -65 to +150 8/20 us 10/1000us P PP 2000 300 W @ T L < 25 ºC @ T A = 25 ºC PD 5 (2) 1.38 W Junction and Storage Temperature Peak Pulse Power Dissipation Off-State Power Dissipation (1) (3) Solder Temperature @ 10 s C <100 ps 1.2 V T SP 260 Notes: 1. With impulse repetition rate (duty factor) of 0.01 maximum (also Figure 1 and 4). 2. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see last page). 3. Peak impulse of 8.3 ms half-sine wave. RF01019, Rev. B (2/11/13) o VF T clamping (0 volts to V (BR) min) Forward Voltage @ 30 A Unit ©2013 Microsemi Corporation o C MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 6 MSMBG2K3.0 – MSMBG2K5.0, MSMBJ2K3.0 – MSMBJ2K5.0 MECHANICAL and PACKAGING • • • • • • • CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements. TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method 2026. MARKING: Part number. POLARITY: Cathode end banded. TAPE & REEL option: Standard per EIA-296 (add “TR” suffix to part number). Consult factory for quantities. WEIGHT: 0.1 grams (approximate). See package dimensions on last page. PART NOMENCLATURE M SM B G 2K 3.0 (e3) Reliability Level* M MA MX MXL *(see MicroNote 129) RoHS Compliance e3 = RoHS Compliant Blank = non-RoHS Compliant Stand-Off Voltage (V WM ) (see Electrical Characteristics table) Surface Mount Package 2 kW Transient Suppression Package Size Lead Form G = Gull-Wing J = J-Bend SYMBOLS & DEFINITIONS Definition Symbol VW M PPP V (BR) ID IPP VC I ( BR) Working Peak (Standoff) Voltage - The maximum peak voltage that can be applied over the operating temperature range. This is also referred to as standoff voltage. Peak Pulse Power - Rated random recurring peak impulse power dissipation. Breakdown Voltage - The minimum voltage the device will exhibit at a specified current. Standby Current - The current at the rated standoff voltage (V WM ). Peak Pulse Current - The peak current during the impulse. Clamping Voltage - Clamping voltage at I PP (Peak Pulse Current) at the specified pulse conditions (typically shown as maximum value). Breakdown Current – The current used for measuring breakdown voltage V (BR) . ELECTRICAL CHARACTERISTICS @ 25 ºC PART NUMBER Gull-Wing MSMBG2K3.0 MSMBG2K3.3 MSMBG2K4.0 MSMBG2K4.5 MSMBG2K5.0 J-Bend MSMBJ2K3.0 MSMBJ2K3.3 MSMBJ2K4.0 MSMBJ2K4.5 MSMBJ2K5.0 RF01019, Rev. B (2/11/13) BREAKDOWN VOLTAGE Minimum BREAKDOWN CURRENT RATED STANDOFF VOLTAGE MAX STANDBY CURRENT MAX CLAMPING VOLTAGE PEAK PULSE CURRENT TEMPERATURE COEFFICIANT of V (BR) V (BR) I (BR) V WM I D @ V WM V C @ I PP I PP α V(BR) V mA V V A 4.3 4.6 5.0 5.4 5.9 50 50 50 50 50 3.0 3.3 4.0 4.5 5.0 µA 1500 700 400 50 5 5.4 5.8 6.3 6.6 7.6 10 10 10 10 10 % / oC +0/ -0.05 ±0.025 ±0.030 ±0.040 +0.050 ©2013 Microsemi Corporation Page 2 of 6 MSMBG2K3.0 – MSMBG2K5.0, MSMBJ2K3.0 – MSMBJ2K5.0 PPP – Peak Pulse Power - kW GRAPHS t w - Pulse Width - µs IPP – Peak Pulse Current – % Ipp FIGURE 1 Peak Pulse Power vs Pulse Time Test waveform parameters tr=8 µs, tp=20 µs FIGURE 2 Pulse Waveform for 8/20 µs Exponential Surge RF01019, Rev. B (2/11/13) ©2013 Microsemi Corporation Page 3 of 6 MSMBG2K3.0 – MSMBG2K5.0, MSMBJ2K3.0 – MSMBJ2K5.0 Pulse Current in Percent of IPP GRAPHS (continued) t – Time – ms Test waveform parameters: tr=10 µs, tp=1000µs Peak Pulse Power (PPP) or continuous Power in Percent of 25°C Ratio FIGURE 3 Pulse Waveform for 10/1000 Exponential Surge T L Lead Temperature °C FIGURE 4 Derating Curve RF01019, Rev. B (2/11/13) ©2013 Microsemi Corporation Page 4 of 6 MSMBG2K3.0 – MSMBG2K5.0, MSMBJ2K3.0 – MSMBJ2K5.0 PACKAGE DIMENSIONS SMBG (DO-215AA) Ltr A B C E F K Dimensions Inch Millimeters Min Max Min Max 0.077 0.083 1.96 2.10 0.160 0.180 4.06 4.57 0.130 0.155 3.30 3.94 0.077 0.104 1.95 2.65 0.235 0.255 5.97 6.48 0.015 0.030 0.381 0.762 SMBJ (DO-214AA) Ltr A B C D E L Dimensions Inch Millimeters Min Max Min Max 0.077 0.083 1.96 2.10 0.160 0.180 4.06 4.57 0.130 0.155 3.30 3.94 0.205 0.220 5.21 5.59 0.077 0.104 1.95 2.65 0.030 0.060 0.760 1.52 See pad layout on next page. RF01019, Rev. B (2/11/13) ©2013 Microsemi Corporation Page 5 of 6 MSMBG2K3.0 – MSMBG2K5.0, MSMBJ2K3.0 – MSMBJ2K5.0 PAD LAYOUT RF01019, Rev. B (2/11/13) Ltr A B C SMBG (DO-215AA) Inch Millimeters 0.320 8.13 0.085 2.16 0.110 2.79 Ltr A B C SMBJ (DO-214AA) Inch Millimeters 0.260 6.60 0.085 2.16 0.110 2.79 ©2013 Microsemi Corporation Page 6 of 6