AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM Datasheet

AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
High Current Density Standard Avalanche
Surface Mount Rectifiers
FEATURES
®
eSMP Series
• Very low profile - typical height of 1.1 mm
Available
• Ideal for automated placement
• Glass passivated pallet chip junction
K
• Controlled avalanche characteristics
• Low leakage current
1
• High forward surge capability
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
2
TO-277A (SMPC)
K
Cathode
• AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
Anode 1
Anode 2
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
MECHANICAL DATA
IF(AV)
3.0 A
VRRM
200 V, 400 V, 600 V, 800 V,
1000 V
IFSM
70 A
EAS
20 mJ
VF at IF = 3 A
0.90 V
TJ max.
175 °C
Package
TO-277A (SMPC)
Diode variations
Single die
Case: TO-277A (SMPC)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3 - halogen-free, RoHS-compliant and
AEC-Q101 qualified
Base P/NHM3_X - halogen-free, RoHS-compliant and
AEC-Q101 qualified 
(“_X” denotes revision code e.g. A, B,.....)
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
TYPICAL APPLICATIONS
For use in general purpose rectification of power supplies,
inverters, converters and freewheeling diodes for consumer,
automotive and telecommunication.
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
Max. repetitive peak reverse voltage
VRRM
Max. DC forward current (fig. 1)
Peak forward surge current 10 ms single half
sine-wave superimposed on rated load
Non-repetitive avalanche energy 
at TJ = 25 °C
IAS = 2.5 A max.
IAS = 1.0 A typical
Operating junction and storage temperature range
AS3PD
AS3PG
AS3PJ
AS3PK
AS3PM
AS3D
AS3G
AS3J
AS3K
AS3M
200
400
600
800
1000
IF
(1)
3.0
IF
(2)
2.1
IFSM
70
EAS
TJ, TSTG
20
30
-55 to +175
UNIT
V
A
A
mJ
°C
Notes
(1) Mounted on 10 mm x 10 mm pad areas, 1 oz. FR4 PCB
(2) Free air, mounted on recommended copper pad area
Revision: 27-Jul-15
Document Number: 88837
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
IF = 1.5 A
IF = 3.0 A
Instantaneous forward voltage
IF = 1.5 A
IF = 3.0 A
Reverse current
rated VR
Typical reverse recovery time
Typical junction capacitance per diode
SYMBOL
TA = 25 °C
VF (1)
TA = 125 °C
TA = 25 °C
TA = 125 °C
IR (2)
TYP.
MAX.
0.92
-
1.00
1.10
0.81
-
0.90
0.95
0.28
10
62
150
UNIT
V
μA
IF = 0.5 A, IR = 1.0 A,
Irr = 0.25 A
trr
1.2
-
μs
4.0 V, 1 MHz
CJ
37
-
pF
AS3PM
UNIT
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width  40 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
AS3PD
AS3PG
RJA (1)
Typical thermal resistance
RJM
AS3PJ
AS3PK
80
(2)
°C/W
5
Notes
(1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance R
JA - junction to ambient
(2) Units mounted on PCB with 10 mm x 10 mm copper pad areas, 1 oz. FR4 PCB; R
JM - junction to mount
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
AS3PJ-M3/86A
0.10
86A
1500
7" diameter plastic tape and reel
AS3PJ-M3/87A
0.10
87A
6500
13" diameter plastic tape and reel
AS3PJHM3/86A (1)
0.10
86A
1500
7" diameter plastic tape and reel
AS3PJHM3/87A (1)
0.10
87A
6500
13" diameter plastic tape and reel
AS3PJHM3_A/H (1)
0.10
H
1500
7" diameter plastic tape and reel
0.10
I
6500
13" diameter plastic tape and reel
AS3PJHM3_A/I
(1)
DELIVERY MODE
Note
(1) AEC-Q101 qualified
Revision: 27-Jul-15
Document Number: 88837
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
1000
3.5
Instantaneous Reverse Current (μA)
TM = 160 °C
DC Forward Current (A)
3.0
2.5
TA = 25 °C
2.0
1.5
1.0
TM Measured
at the Cathode Band Terminal
0.5
0
TA = 175 °C
100
TA = 125 °C
10
TA = 75 °C
1
TA = 25 °C
0.1
0.01
0
25
50
75
100
125
150
10
175
20
Fig. 1 - Maximum Forward Current Derating Curve
60
70
80
90
100
1000
3.2
Junction Capacitance (pF)
D = 0.3
D = 0.2
D = 0.1
2.8
D = 1.0
2.4
2.0
1.6
T
1.2
0.8
D = tp/T
0.4
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
100
10
tp
1
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.1
1
10
100
Reverse Voltage (V)
Average Forward Current (A)
Fig. 2 - Forward Power Loss Characteristics
Fig. 5 - Typical Junction Capacitance
100
100
TA = 175 °C
10
TA = 125 °C
TA = 75 °C
TA = 25 °C
0.1
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Instantaneous Forward Voltage (V)
Fig. 3 - Typical Instantaneous Forward Characteristics
Transient Thermal Impedance (°C/W)
Instantaneous Forward Current (A)
50
D = 0.8
D = 0.5
3.6
1
40
Fig. 4 - Typical Reverse Leakage Characteristics
4.0
Average Power Loss (W)
30
Percent of Rated Peak Reverse Voltage (%)
Mount Temperature (°C)
Junction to Ambient
10
1
0.01
0.1
1
10
100
t - Pulse Duration (s)
Fig. 6 - Typical Transient Thermal Impedance
Revision: 27-Jul-15
Document Number: 88837
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
TO-277A (SMPC)
0.187 (4.75)
0.175 (4.45)
0.016 (0.40)
0.006 (0.15)
K
0.262 (6.65)
0.250 (6.35)
0.242 (6.15)
0.238 (6.05)
2
1
0.047 (1.20)
0.039 (1.00)
0.171 (4.35)
0.167 (4.25)
0.146 (3.70)
0.134 (3.40)
Mounting Pad Layout
0.087 (2.20)
0.075 (1.90)
0.189 (4.80)
MIN.
0.189 (4.80)
0.173 (4.40)
0.186 (4.72)
MIN.
0.268
(6.80)
0.155 (3.94)
NOM.
0.030 (0.75) NOM.
0.049 (1.24)
0.037 (0.94)
0.050 (1.27)
MIN.
0.084 (2.13) NOM.
0.053 (1.35)
0.041 (1.05)
0.041
(1.04)
0.055 (1.40)
MIN.
Conform to JEDEC® TO-277A
Revision: 27-Jul-15
Document Number: 88837
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000
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