MPLAD6.5KP10A(e3) – MPLAD6.5KP48CA(e3) Available 6.5 kW, Unidirectional and Bidirectional TVS Protection Device High-Reliability screening available in reference to MIL-PRF-19500 DESCRIPTION These 6.5 kW rated transient voltage suppressors (TVS) in a surface mount PLAD package are provided with design features to minimize thermal resistance and cumulative heating. These devices have the ability to clamp dangerous high voltage, short term transients such as those produced by directed or radiated electrostatic discharge phenomena before entering sensitive component regions of a circuit design. Typical applications include lighting and automotive load dump protection. They are particularly effective at meeting the multi-stroke lightning standard RTCA DO-160, section 22 for aircraft design. This efficient low profile package design is offered in standoff voltage selections (VWM) of 10 volt to 48 volts in either unidirectional or bidirectional construction. This product addition expands High reliable PLAD product portfolio. For more information on PLAD products, broad range of TVS devices please visit our website. Tested in accordance with the requirements of AEC-Q101 Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • • • • • • • Available in both unidirectional and bidirectional construction (bidirectional with CA suffix). High reliability with wafer fabrication and assembly lot traceability. All parts surge tested. Low profile surface mount package. Optional upscreening is available with various screening and conformance inspection options based on MIL-PRF-19500. Refer to Hi-Rel Non-Hermetic Products brochure on our web site for more details on the screening options. Suppresses transients up to 6,500 W @ 10/1000 μs (see figure 1). Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020. 3σ lot norm screening performed on standby current (ID). RoHS compliant (2002/95/EC) devices available. Halogen free (IEC 61249-2-21) mini-PLAD (The cathode is the heatsink under the body of this device.) APPLICATIONS / BENEFITS • • • • • • • • • • • Protection from switching transients and induced RF. Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4. Secondary lightning protection per IEC 61000-4-5 with 42 ohms source impedance: Class 1,2,3,4,5: MPLAD6.5KP10A to 48CA Secondary lightning protection per IEC 61000-4-5 with 12 ohms source impedance: Class 1,2,3,4: MPLAD6.5KP10A to 48CA Secondary lightning protection per IEC 61000-4-5 with 2 ohms source impedance: Class 2,3: MPLAD6.5KP10A to 48CA Class 4: MPLAD6.5KP10A to 22CA Pin injection protection per RTCA/DO-160F for Waveform 4 (6.4/69 μs at 25 ºC)*: Level 1,2,3,4: MPLAD6.5KP10A to 48CA Level 5: MPLAD6.5KP10A to 43CA Pin injection protection per RTCA/DO-160F for Waveform 5A (40/120 μs at 25 ºC)*: Level 1 and 2: MPLAD6.5KP10A to 48CA Level 3: MPLAD6.5KP10A to 36CA Level 4: MPLAD6.5KP10A to 12CA IPP rating of 40.1 amps to 383 amps. VWM rating of 10 volts to 48 volts. V(BR)(min) range of 11.1 volts to 53.3 volts. VC(MAX) rating of 17 volts to 77.4 volts MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com *See MicroNote 132 for further temperature derating selection. RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 1 of 6 MPLAD6.5KP10A(e3) – MPLAD6.5KP48CA(e3) o MAXIMUM RATINGS @ 25 C unless otherwise specified Parameters/Test Conditions Junction and Storage Temperature (1) Thermal Resistance Junction-to-Ambient Thermal Resistance Junction-to-Case Peak Pulse Power @ 10/1000 µs (2) Value Unit -55 to +150 50 1.5 6,500 ºC/W ºC/W ºC/W W Unidirectional Bidirectional tclamping (0 volts to V(BR) min) Forward Clamping Voltage @ 300 Amps (3) Forward Surge Current Solder Temperature @ 10 s (5) Rated Average Power dissipation Notes: 1. 2. 3. 4. 5. Symbol TJ and TSTG RӨJA RӨJC PPP (3) TA = 25 °C TC = 100 °C <100 <5 2.5 400 260 (1) 2.5 (4) 33.3 VFS IFSM TSP PM(AV) ps ns V A ºC W W When mounted on FR4 PC board with recommended mounting pad (see pad layout). Also see figures 1 and 2. With impulse repetition rate (duty factor) of 0.05% or less. At 8.3 ms half-sine wave (unidirectional devices only). Case temperature controlled on heat sink as specified. See MicroNote 134 for derating PPP when also applying steady-state power. MECHANICAL and PACKAGING • • • • • CASE: Epoxy, meets UL94V-0. TERMINALS: Tin/lead or matte-tin (fully RoHS compliant) plating. MARKING: Part number. DELIVERY option: Tape and reel (13 inch). See Package Dimensions on last page. PART NOMENCLATURE M PLAD 6.5K P 7.0 CA Reliability Level* M MA MX MXL *(see Hi-Rel Non-Hermetic Product Portfolio) RoHS Compliance e3 = RoHS compliant Blank = non-RoHS compliant Polarity A = Unidirectional CA = Bidirectional Package Designation Reverse Standoff Voltage PPP Rating (W) RF01083, Rev B (24/6/15) (e3) Plastic ©2015 Microsemi Corporation Page 2 of 6 MPLAD6.5KP10A(e3) – MPLAD6.5KP48CA(e3) SYMBOLS & DEFINITIONS Definition Symbol I(BR) ID IPP V(BR) VC VWM αV(BR) Breakdown Current: The current used for measuring breakdown voltage V(BR). Standby Current: The current at the rated standoff voltage VWM. Peak Impulse Current: The peak current during the impulse. Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Clamping Voltage: Clamping voltage at IPP (peak pulse current) at the specified pulse conditions (typically shown as maximum value). Rated Working Standoff Voltage: The maximum peak voltage that can be applied over the operating temperature range. Temperature Coefficient of Breakdown Voltage: The change in breakdown voltage divided by change in temperature. ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise stated DEVICE* MPLAD6.5KP10A(e3) MPLAD6.5KP11A(e3) MPLAD6.5KP12A(e3) MPLAD6.5KP13A(e3) MPLAD6.5KP14A(e3) MPLAD6.5KP15A(e3) MPLAD6.5KP16A(e3) MPLAD6.5KP17A(e3) MPLAD6.5KP18A(e3) MPLAD6.5KP20A(e3) MPLAD6.5KP22A(e3) MPLAD6.5KP24A(e3) MPLAD6.5KP26A(e3) MPLAD6.5KP28A(e3) MPLAD6.5KP30A(e3) MPLAD6.5KP33A(e3) MPLAD6.5KP36A(e3) MPLAD6.5KP40A(e3) MPLAD6.5KP43A(e3) MPLAD6.5KP45A(e3) MPLAD6.5KP48A(e3) REVERSE STANDOFF VOLTAGE VWM Volts 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 BREAKDOWN VOLTAGE V(BR) V(BR) @ Volts 11.1 - 12.3 12.2 - 13.5 13.3 - 14.7 14.4 - 15.9 15.6 - 17.2 16.7 - 18.5 17.8 - 19.7 18.9 - 20.9 20.0 - 22.1 22.2 - 24.5 24.4 - 26.9 26.7 - 29.5 28.9 - 31.9 31.1 - 34.4 33.3 - 36.8 36.7 - 40.6 40.0 - 44.2 44.4 - 49.1 47.8 - 52.8 50.0 – 55.3 53.3 – 58.9 I(BR) mA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 MAXIMUM CLAMPING VOLTAGE MAXIMUM STANDBY CURRENT ID @ VWM µA MAXIMUM PEAK PULSE CURRENT (FIG. 2) IPP Amps MAXIMUM TEMPERATURE COEFFICIENT OF V(BR) αV(BR) mV/°C VC @ IPP Volts 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.5 48.4 53.3 58.1 64.5 69.4 72.7 77.4 15 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 383 358 327 302 280 267 250 236 223 202 183 167 154 143 135 123 111 101 93 89 85 9 10 11 12 13 15 16 18 19 22 24 27 29 30 35 38 40 45 49 51 54 * See part nomenclature for additional screening prefixes. RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 3 of 6 MPLAD6.5KP10A(e3) – MPLAD6.5KP48CA(e3) PPP – Peak Pulse Power – kW GRAPHS tp – Pulse Time – sec IPP Peak Pulse Current - % IPP FIGURE 1 Peak Pulse Power vs. Pulse Time (to 50% of exponentially decaying pulse) Test waveform parameters: tr = 10 µs, tp = 1000 µs FIGURE 2 Pulse Waveform RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 4 of 6 MPLAD6.5KP10A(e3) – MPLAD6.5KP48CA(e3) PPP Peak Pulse Power - % PPP GRAPHS (continued) TL Lead Temperature ºC FIGURE 3 Derating Curve RF01083, Rev B (24/6/15) ©2015 Microsemi Corporation Page 5 of 6 MPLAD6.5KP10A(e3) – MPLAD6.5KP48CA(e3) PACKAGE DIMENSIONS Ref. A1 A2 B C D G H J Dimensions Millimeters Max Min Max 0.355 8.61 9.02 0.295 7.09 7.49 0.135 3.02 3.43 0.454 11.13 11.53 0.110 2.39 2.79 0.080 1.63 2.03 0.040 0.61 1.02 0.012 0.20 0.30 Inch Min 0.339 0.279 0.119 0.438 0.094 0.064 0.024 0.008 PAD LAYOUT Ref. A B C D RF01083, Rev B (24/6/15) Inch Typical 0.357 0.117 0.080 0.033 ©2015 Microsemi Corporation Dimensions Millimeters Typical 9.08 2.97 2.03 0.84 Page 6 of 6