R567 - Reliability Data

RELIABILITY DATA
LTC2936 / LTC2937 / LTC2943 / LTC2945 / LTC2955 / LTC2960
11/24/2015
• OPERATING LIFE TEST
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
DFN/QFN
SSOP/TSSOP
NEWEST
DATE CODE
391
1146
77
1136
468
(6)
• HIGHLY ACCELERATED STRESS TEST AT +131°C/85%RH
PACKAGE
TYPE
SAMPLE
SIZE
OLDEST
DATE CODE
DFN/QFN
233
0111
233
(6)
• PRESSURE COOKER TEST AT 15 PSIG, +121°C
PACKAGE
TYPE
SAMPLE
SIZE
DFN/QFN
SOIC/SOT/MSOP
9,329
50
9,379
(6)
• TEMP CYCLE FROM -65°C to +150°C
PACKAGE
TYPE
SAMPLE
SIZE
SAMPLE
SIZE
NEWEST
DATE CODE
0649
1118
1124
1118
OLDEST
DATE CODE
NEWEST
DATE CODE
OLDEST
DATE CODE
351.00
77.00
428.00
K DEVICE
HOURS (5)
AT +85°C
0748
NEWEST
DATE CODE
9,361
0639
49
1118
9,410
(6)
• THERMAL SHOCK FROM -65°C to +150°C
PACKAGE
TYPE
1325
1136
OLDEST
DATE CODE
DFN/QFN
SOIC/SOT/MSOP
K DEVICE
HOURS (1)
AT +125°C
451.20
451.20
K DEVICE
HOURS
426.22
1.20
427.42
K DEVICE
CYCLES
1124
1118
NEWEST
DATE CODE
2,008.10
4.90
2,013.00
K DEVICE
CYCLES
NUMBER
OF (2)
FAILURES
0
0
0
NUMBER
OF
FAILURES
0
0
NUMBER
OF
FAILURES
0
0
0
NUMBER
OF
FAILURES
0
0
0
NUMBER
OF
FAILURES
DFN/QFN
SOIC/SOT/MSOP
10,260
0639
1211
2,722.50
0
49
1118
1118
4.90
0
10,309
2,727.40
0
(1) Assumes Activation Energy = 0.7 Electron Volts
(2) Failure Rate Equivalent to +55°C, 60% Confidence Level = 27.58 FITS
(3) Mean Time Between Failures in Years = 4139
(4) Environmental data presented for same Process and Package Technology. Mechanical tests preceeded by
J-STD-020 Preconditioning.
(5) Assumes 20X Acceleration from 85°C to +130°C
Note: 1 FIT = 1 Failure in One Billion Hours.
Form: 00-03-6209B. R567
Rev 4