INFINEON HYB25D256800CF-6

D a t a S h e e t , Rev. 1.6, D e c . 2 0 0 4
HYB25D256[40/80/16]0CE(L)
HYB25D256[40/80/16]0C[T/C/F]
256 Mbit Double-Data-Rate SDRAM
Memory Products
N e v e r
s t o p
t h i n k i n g .
Edition 2004-12
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
D a t a S h e e t , Rev. 1.6, D e c . 2 0 0 4
HYB25D256[40/80/16]0CE(L)
HYB25D256[40/80/16]0C[T/C/F]
256 Mbit Double-Data-Rate SDRAM
Memory Products
N e v e r
s t o p
t h i n k i n g .
HYB25D256[40/80/16]0CE(L), HYB25D256[40/80/16]0C[T/C/F]
Revision History:
Rev. 1.6
2004-12
Previous Version:
Rev. 1.5
2004-11
19,20,21
editorial change
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Template: mp_a4_v1.0_2003-04-25.fm
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Table of Contents
1
1.1
1.2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3
3.1
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.3
3.3.1
3.3.2
3.4
3.5
3.5.1
3.5.2
3.5.3
3.5.4
3.5.5
3.5.6
3.6
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mode Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Burst Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Burst Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Extended Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DLL Enable/Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Drive Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bank/Row Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Clock Frequency Change . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Simplified State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
22
22
23
24
24
25
25
26
26
26
27
30
30
31
41
55
56
60
61
4
4.1
4.2
4.3
4.4
4.5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Weak Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IDD Current Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
62
62
64
66
68
75
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write Command: Data Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read Command: Data Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Initialization and Mode Register Set Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power: Power Down Mode Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refresh: Auto Refresh Mode Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refresh: Self Refresh Mode Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read: Without Auto Precharge Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read: With Auto Precharge Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read: Bank Read Access Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write: Without Auto Precharge Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write: With Auto Precharge Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write: Bank Write Access Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write: DM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
77
77
78
79
80
81
82
83
84
85
86
87
88
89
6
System Characteristics for DDR SDRAMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
7
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Data Sheet
5
Rev. 1.6, 2004-12
08012003-8754-PAQX
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Figure 19
Figure 20
Figure 21
Figure 22
Figure 23
Figure 24
Figure 25
Figure 26
Figure 27
Figure 28
Figure 29
Figure 30
Figure 31
Figure 32
Figure 33
Figure 34
Figure 35
Figure 36
Figure 37
Figure 38
Figure 39
Figure 40
Figure 41
Figure 42
Figure 43
Figure 44
Figure 45
Figure 46
Figure 47
Figure 48
Figure 49
Figure 50
Figure 51
Figure 52
Figure 53
Data Sheet
Pin Configuration P-TFBGA-60-9 Top View, see the balls throught the package . . . . . . . . . . . . .
Pin Configuration P-TSOPII-66-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram 16 Mbit × 4 I/O × 4 Internal Memory Banks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram 8 Mbit × 8 I/O × 4 Internal Memory Banks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram 4 Mbit × 16 I/O × 4 Internal Memory Banks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Required CAS Latencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Activating a Specific Row in a Specific Bank . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
tRCD and tRRD Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read Burst: CAS Latencies (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Consecutive Read Bursts: CAS Latencies (Burst Length = 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . .
Non-Consecutive Read Bursts: CAS Latencies (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . .
Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8) . . . . . . . . . . . . . . . . . . . . . . .
Terminating a Read Burst: CAS Latencies (Burst Length = 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read to Write: CAS Latencies (Burst Length = 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read to Precharge: CAS Latencies (Burst Length = 4 or 8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write Burst (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write to Write (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write to Write: Max. DQSS, Non-Consecutive (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . .
Random Write Cycles (Burst Length = 2, 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write to Read: Non-Interrupting (CAS Latency = 2; Burst Length = 4). . . . . . . . . . . . . . . . . . . . . .
Write to Read: Interrupting (CAS Latency = 2; Burst Length = 8). . . . . . . . . . . . . . . . . . . . . . . . . .
Write to Read: Min. DQSS, Odd Number of Data (3-bit Write), Interrupting (CL2; BL8) . . . . . . . .
Write to Read: Nominal DQSS, Interrupting (CAS Latency = 2; Burst Length = 8) . . . . . . . . . . . .
Write to Precharge: Non-Interrupting (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write to Precharge: Interrupting (Burst Length = 4 or 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write to Precharge: Minimum DQSS, Odd Number of Data (1-bit Write), Interrupting (BL 4 or 8).
Write to Precharge: Nominal DQSS (2-bit Write), Interrupting (Burst Length = 4 or 8) . . . . . . . . .
Precharge Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock frequency change in pre charge power down mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Simplified State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal Strength Pull-down Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal Strength Pull-up Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Weak Strength Pull-down Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Weak Strength Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Output Load Circuit Diagram / Timing Reference Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Input (Write), Timing Burst Length = 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Output (Read), Timing Burst Length = 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Initialize and Mode Register Sets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Auto Refresh Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Self Refresh Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read without Auto Precharge (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Read with Auto Precharge (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bank Read Access (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write without Auto Precharge (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write with Auto Precharge (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bank Write Access (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Write DM Operation (Burst Length = 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pullup slew rate test load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pulldown slew rate test load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
17
18
19
20
21
25
30
30
33
34
35
36
37
38
39
40
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
60
61
64
64
66
66
68
77
78
79
80
81
82
83
84
85
86
87
88
89
91
91
Rev. 1.6, 2004-12
08012003-8754-PAQX
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
List of Figures
Figure 54
Figure 55
Data Sheet
Package Outline of P-TFBGA-60-12 (non-green/green) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Package Outline of P-TSOPII-66-1 (non-green/green). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
7
Rev. 1.6, 2004-12
08012003-8754-PAQX
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 9
Table 8
Table 11
Table 10
Table 12
Table 13
Table 14
Table 15
Table 16
Table 18
Table 17
Table 19
Table 20
Table 21
Table 22
Table 23
Table 24
Table 25
Table 26
Table 27
Table 28
Table 29
Table 30
Table 31
Table 32
Data Sheet
Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information for Lead Containing Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Ordering Information for Lead free (RoHS Compliant) Products . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Pin Configuration of DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations for Pin Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Abbreviations for Buffer Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Burst Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Truth Table 1b: DM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Truth Table 1a: Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Truth Table 3: Current State Bank n - Command to Bank n (same bank) . . . . . . . . . . . . . . . . . . . 57
Truth Table 2: Clock Enable (CKE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Truth Table 4: Current State Bank n - Command to Bank m (different bank). . . . . . . . . . . . . . . . . 59
Truth Table 5: Concurrent Auto Precharge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Input and Output Capacitances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Electrical Characteristics and DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Evaluation Conditions for I/O Driver Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Normal Strength Pull-down and Pull-up Currents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Weak Strength Driver Pull-down and Pull-up Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
AC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
AC Timing - Absolute Specifications for PC3200 and PC2700 . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
AC Timing - Absolute Specifications for PC2700 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
IDD Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
IDD Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Input Slew Rate for DQ, DQS, and DM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Input Setup & Hold Time Derating for Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Input/Output Setup and Hold TIme Derating for Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Input/Output Setup and Hold Derating for Rise/Fall Delta Slew Rate. . . . . . . . . . . . . . . . . . . . . . . 90
Output Slew Rate Characteristrics (×4, ×8 Devices only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Output Slew Rate Characteristics (×16 Devices only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Output Slew Rate Matching Ratio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
TFBGA Common Package Properties (non-green/green) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
8
Rev. 1.6, 2004-12
08012003-8754-PAQX
256 Mbit Double-Data-Rate SDRAM
DDR SDRAM
1
Overview
1.1
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
HYB25D256[40/80/16]0CE(L)
HYB25D256[40/80/16]0C[T/C/F]
Double data rate architecture: two data transfers per clock cycle
Bidirectional data strobe (DQS) is transmitted and received with data, to be used in capturing data at the
receiver
DQS is edge-aligned with data for reads and is center-aligned with data for writes
Differential clock inputs (CK and CK)
Four internal banks for concurrent operation
Data mask (DM) for write data
DLL aligns DQ and DQS transitions with CK transitions
Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
Burst Lengths: 2, 4, or 8
CAS Latency: 1.5 (DDR200 only), 2, 2.5, 3
Auto Precharge option for each burst access
Auto Refresh and Self Refresh Modes
RAS-lockout supported tRAP=tRCD
7.8 µs Maximum Average Periodic Refresh Interval
2.5 V (SSTL_2 compatible) I/O
VDDQ = 2.5 V ± 0.2 V (DDR200, DDR266, DDR333); VDDQ = 2.6 V ± 0.1 V (DDR400)
VDD = 2.5 V ± 0.2 V (DDR200, DDR266, DDR333); VDD = 2.6 V ± 0.1 V (DDR400)
P-TFBGA-60-12 package with 3 depopulated rows (8 × 12 mm2)
P-TSOPII-66 package
Lead- and halogene-free = green product
Table 1
Performance
Part Number Speed Code
Speed Grade
max. Clock Frequency
–5
–6
–7
Unit
Component
DDR400B
DDR333
DDR266A
—
Module
PC3200-3033
PC2700–2533
PC2100-2033
—
166
—
MHz
166
143
MHz
133
133
MHz
@CL3
@CL2.5
@CL2
Data Sheet
fCK3 200
fCK2.5 166
fCK2 133
9
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Overview
1.2
Description
The 256 Mbit Double-Data-Rate SDRAM is a high-speed CMOS, dynamic random-access memory containing
268,435,456 bits. It is internally configured as a quad-bank DRAM.
The 256 Mbit Double-Data-Rate SDRAM uses a double-data-rate architecture to achieve high-speed operation.
The double data rate architecture is essentially a 2n prefetch architecture with an interface designed to transfer
two data words per clock cycle at the I/O pins. A single read or write access for the
256 Mbit Double-Data-Rate SDRAM effectively consists of a single 2n-bit wide, one clock cycle data transfer at
the internal DRAM core and two corresponding n-bit wide, one-half-clock-cycle data transfers at the I/O pins.
A bidirectional data strobe (DQS) is transmitted externally, along with data, for use in data capture at the receiver.
DQS is a strobe transmitted by the DDR SDRAM during Reads and by the memory controller during Writes. DQS
is edge-aligned with data for Reads and center-aligned with data for Writes.
The 256 Mbit Double-Data-Rate SDRAM operates from a differential clock (CK and CK; the crossing of CK going
HIGH and CK going LOW is referred to as the positive edge of CK). Commands (address and control signals) are
registered at every positive edge of CK. Input data is registered on both edges of DQS, and output data is
referenced to both edges of DQS, as well as to both edges of CK.Read and write accesses to the DDR SDRAM
are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a
programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a
Read or Write command. The address bits registered coincident with the Active command are used to select the
bank and row to be accessed. The address bits registered coincident with the Read or Write command are used
to select the bank and the starting column location for the burst access.
The DDR SDRAM provides for programmable Read or Write burst lengths of 2, 4 or 8 locations. An Auto
Precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst
access. As with standard SDRAMs, the pipelined, multibank architecture of DDR SDRAMs allows for concurrent
operation, thereby providing high effective bandwidth by hiding row precharge and activation time.
An auto refresh mode is provided along with a power-saving power-down mode. All inputs are compatible with the
JEDEC Standard for SSTL_2. All outputs are SSTL_2, Class II compatible.
Note: The functionality described and the timing specifications included in this data sheet are for the DLL Enabled
mode of operation.
Table 2
Ordering Information for Lead Containing Products
Product Type2)
Org. CAS-RCD-RP Clock
Latencies
(MHz)
CAS-RCD-RP Clock
Latencies
(MHz)
Speed
Package
HYB25D256800CT–5
×8
P-TSOPII-66
HYB25D256160CT–5
×16
HYB25D256800CT–6
×8
3-3-3
200
2.5-3-3
166
DDR400B
2.5-3-3
166
2-3-3
133
DDR333
HYB25D256800CT(L)–6 ×8
HYB25D256160CT–6
×16
HYB25D256400CT–7
×4
HYB25D256400CC–5
×4
HYB25D256800CC–5
×8
HYB25D256160CC–5
×16
HYB25D256400CC–6
×4
HYB25D256800CC–6
×8
HYB25D256160CC–6
×16
Data Sheet
143
DDR266A
3-3-3
200
2.5-3-3
166
DDR400B
2.5-3-3
166
2-3-3
133
DDR333
10
P-TFBGA-60
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Overview
Table 3
Ordering Information for Lead free (RoHS1) Compliant) Products
Product Type2)
Org.
CAS-RCD-RP Clock
Latencies
(MHz)
CAS-RCD-RP Clock Speed
Latencies
(MHz)
Package
HYB25D256800CE–5A
×8
2.5-3-3
200
2-3-3
133
DDR400A
P-TSOPII-66
HYB25D256160CE–5A
×16
HYB25D256800CE–5
×8
3-3-3
200
2.5-3-3
166
DDR400B
HYB25D256160CE–5
×16
HYB25D256800CE–6
×8
2.5-3-3
166
2-3-3
133
DDR333
HYB25D256800CE(L)–6 ×8
HYB25D256160CE–6
×16
HYB25D256400CE–7
×4
HYB25D256800CF–6
×8
143
2.5-3-3
DDR266A
166
2-3-3
133
DDR333
P-TFBGA-60
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic
equipment as defined in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January
2003. These substances include mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls and
polybrominated biphenyl ethers.
2) HYB: designator for memory components
25D: DDR SDRAMs at VDDQ = 2.5 V
256: 256-Mbit density
400/800/160: Product variations ×4, ×8 and ×16
C: Die revision C
L: low power (available on request)
T/E/F/C: Package type TSOP(contains Lead), TSOP(Lead & Halone free), FBGA(Lead & Halone free) and FBGA (contains
Lead)
Data Sheet
11
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
2
Pin Configuration
The pin configuration of a DDR SDRAM is listed by function in Table 4 (60 pins). The abbreviations used in the
Pin#/Buffer# column are explained in Table 5 and Table 6 respectively. The pin numbering for FBGA is depicted
in Figure 1 and that of the TSOP package in Figure 2
Table 4
Pin Configuration of DDR SDRAM
Ball#/Pin#
Name
Pin
Type
Buffer
Type
Function
CK
I
SSTL
Clock Signal
Clock Signals
G2, 45
Note: CK and CK are differential clock inputs. All address and
control input signals are sampled on the crossing of the
positive edge of CK and negative edge of CK. Output (read)
data is referenced to the crossings of CK and CK (both
directions of crossing).
G3, 46
CK
I
SSTL
Complementary Clock Signal
H3, 44
CKE
I
SSTL
Clock Enable Rank
Note: CKE HIGH activates, and CKE Low deactivates, internal
clock signals and device input buffers and output drivers.
Taking CKE Low provides Precharge Power-Down and Self
Refresh operation (all banks idle), or Active Power-Down
(row Active in any bank). CKE is synchronous for power
down entry and exit, and for self refresh entry. CKE is
asynchronous for self refresh exit. CKE must be maintained
high throughout read and write accesses. Input buffers,
excluding CK, CK and CKE are disabled during powerdown. Input buffers, excluding CKE, are disabled during self
refresh. CKE is an SSTL_2 input, but will detect an
LVCMOS LOW level after VDD is applied on first power up.
After VREF has become stable during the power on and
initialization sequence, it must be mantained for proper
operation of the CKE receiver. For proper self-refresh entry
and exit, VREF must be mantained to this input.
Control Signals
H7, 23
RAS
I
SSTL
Row Address Strobe
G8, 22
CAS
I
SSTL
Column Address Strobe
G7, 21
WE
I
SSTL
Write Enable
H8, 24
CS
I
SSTL
Chip Select
Note: All commands are masked when CS is registered HIGH. CS
provides for external bank selection on systems with
multiple banks. CS is considered part of the command code.
The standard pinout includes one CS pin.
Address Signals
J8, 26
BA0
I
SSTL
Bank Address Bus 2:0
J7, 27
BA1
I
SSTL
Note: BA0 and BA1 define to which bank an Active, Read, Write
or Precharge command is being applied. BA0 and BA1 also
determines if the mode register or extended mode register
is to be accessed during a MRS or EMRS cycle.
Data Sheet
12
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
Table 4
Pin Configuration of DDR SDRAM
Ball#/Pin#
Name
Pin
Type
Buffer
Type
Function
K7, 29
A0
I
SSTL
Address Bus 11:0
L8, 30
A1
I
SSTL
L7, 31
A2
I
SSTL
M8, 32
A3
I
SSTL
M2, 35
A4
I
SSTL
L3, 36
A5
I
SSTL
L2, 37
A6
I
SSTL
K3, 38
A7
I
SSTL
Note: Provide the row address for Active commands, and the
column address and Auto Precharge bit for Read/Write
commands, to select one location out of the memory array
in the respective bank. A10 is sampled during a Precharge
command to determine whether the Precharge applies to
one bank (A10 LOW) or all banks (A10 HIGH). If only one
bank is to be precharged, the bank is selected by BA0, BA1.
The address inputs also provide the op-code during a Mode
Register Set command.
K2, 39
A8
I
SSTL
J3, 40
A9
I
SSTL
K8, 28
A10
I
SSTL
AP
I
SSTL
J2, 41
A11
I
SSTL
H2, 42
A12
I
SSTL
Address Signal 12
Note: 256 Mbit or larger dies
F9, 17
NC
NC
—
Note: 128 Mbit or smaller dies
A13
I
SSTL
Address Signal 13
Note: 1 Gbit based dies
NC
NC
—
Note: 512 Mbit or smaller dies
Data Signal 3:0
Data Signals ×4 organization
B7, 5
DQ0
I/O
SSTL
D7, 11
DQ1
I/O
SSTL
D3, 56
DQ2
I/O
SSTL
B3, 62
DQ3
I/O
SSTL
Data Strobe ×4 organisation
E3, 51
DQS
I/O
SSTL
Data Strobe
Note: Output with read data, input with write data. Edge-aligned
with read data, centered in write data. Used to capture write
data.
Data Mask ×4 organization
F3, 47
DM
I
SSTL
Data Mask:
Note: DM is an input mask signal for write data. Input data is
masked when DM is sampled HIGH coincident with that
input data during a Write access. DM is sampled on both
edges of DQS. Although DM pins are input only, the DM
loading matches the DQ and DQS loading.
Data Sheet
13
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
Table 4
Ball#/Pin#
Pin Configuration of DDR SDRAM
Name
Pin
Type
Buffer
Type
Function
Data Signal 7:0
Data Signals ×8 organization
A8, 2
DQ0
I/O
SSTL
B7, 5
DQ1
I/O
SSTL
C7, 8
DQ2
I/O
SSTL
D7, 11
DQ3
I/O
SSTL
D3, 56
DQ4
I/O
SSTL
C3, 59
DQ5
I/O
SSTL
B3, 62
DQ6
I/O
SSTL
A2, 65
DQ7
I/O
SSTL
Data Strobe ×8 organisation
E3, 51
DQS
I/O
SSTL
Data Strobe
Note: Output with read data, input with write data. Edge-aligned
with read data, centered in write data. Used to capture write
data.
Data Mask ×8 organization
F3, 47
DM
I
SSTL
Data Mask
Note: DM is an input mask signal for write data. Input data is
masked when DM is sampled HIGH coincident with that
input data during a Write access. DM is sampled on both
edges of DQS. Although DM pins are input only, the DM
loading matches the DQ and DQS loading.
Data Signals ×16 organization
A8, 2
DQ0
I/O
SSTL
B9, 4
DQ1
I/O
SSTL
B7, 5
DQ2
I/O
SSTL
C9, 7
DQ3
I/O
SSTL
C7, 8
DQ4
I/O
SSTL
D9, 10
DQ5
I/O
SSTL
D7, 11
DQ6
I/O
SSTL
E9, 13
DQ7
I/O
SSTL
E1, 54
DQ8
I/O
SSTL
D3, 56
DQ9
I/O
SSTL
D1, 57
DQ10
I/O
SSTL
C3, 59
DQ11
I/O
SSTL
C1, 60
DQ12
I/O
SSTL
B3, 62
DQ13
I/O
SSTL
B1, 63
DQ14
I/O
SSTL
A2, 65
DQ15
I/O
SSTL
Data Signal 15:0
Data Strobe ×16 organization
E3, 51
UDQS
I/O
SSTL
Data Strobe Upper Byte
E7, 16
LDQS
I/O
SSTL
Data Strobe Lower Byte
Data Mask ×16 organization
Data Sheet
14
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
Table 4
Pin Configuration of DDR SDRAM
Ball#/Pin#
Name
Pin
Type
Buffer
Type
Function
F3, 47
UDM
I
SSTL
Data Mask Upper Byte
F7, 20
LDM
I
SSTL
Data Mask Lower Byte
VREF
VDDQ
AI
—
I/O Reference Voltage
PWR
—
I/O Driver Power Supply
A7, F8, M3,
M7, 1, 18, 33
VDD
PWR
—
Power Supply
A1, B8, C2,
D8, E2, 6, 12,
52, 58, 64
VSSQ
PWR
—
Power Supply
F2, 34
VSS
PWR
—
Power Supply
NC
NC
—
Not Connected
Power Supplies
F1, 49
A9, B2, C8,
D2, E8, 3, 9,
15, 55, 61
Not Connected
A2, 65
Note: ×4 organization
A8, 2
NC
NC
—
Not Connected
Note: ×4 organization
B1, 63
NC
NC
—
Not Connected
Note: ×8 and ×4 organisation
B9, 4
NC
NC
—
Not Connected
C1, 60
NC
NC
—
Not Connected
Note: ×8 and ×4 organization
Note: ×8 and ×4 organization
C3, 59
NC
NC
—
Not Connected
Note: ×4 organization
C7, 8
NC
NC
—
Not Connected
Note: ×4 organization
C9, 7
NC
NC
—
Not Connected
Note: ×8 and ×4 organization
D1, 57
NC
NC
—
Not Connected
Note: ×8 and ×4 organization
D9, 10
NC
NC
—
Not Connected
Note: ×8 and ×4 organization
E1, 54
NC
NC
—
Not Connected
Note: ×8 and ×4 organization
E7, 16
NC
NC
—
E9, 13
NC
NC
—
Not Connected
Note: ×8 and ×4 organization
Not Connected
Note: ×8 and ×4 organization
F7, 20
NC
NC
—
Not Connected
Note: ×8 and ×4 organization
Data Sheet
15
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
Table 4
Ball#/Pin#
Pin Configuration of DDR SDRAM
Name
F9, 14, 17, 19, NC
25,43, 50, 53
Table 5
Pin
Type
Buffer
Type
Function
NC
—
Not Connected
Note: ×16,×8 and ×4 organization
Abbreviations for Pin Type
Abbreviation
Description
I
Standard input-only pin. Digital levels.
O
Output. Digital levels.
I/O
I/O is a bidirectional input/output signal.
AI
Input. Analog levels.
PWR
Power
GND
Ground
NC
Not Connected
Table 6
Abbreviation
Abbreviations for Buffer Type
Description
SSTL
Serial Stub Terminated Logic (SSTL2)
LV-CMOS
Low Voltage CMOS
CMOS
OD
Data Sheet
CMOS Levels
Open Drain. The corresponding pin has 2 operational states, active low and tristate, and
allows multiple devices to share as a wire-OR.
16
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
, 9
9
9
9
9
9
9
9
9
9
9
9
, 9
9
9
9
[
[
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
, 9
9
[
Figure 1
Data Sheet
Pin Configuration P-TFBGA-60-9 Top View, see the balls throught the package
17
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
!"!#!
!"!#!
!"!#!
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
Figure 2
Data Sheet
Pin Configuration P-TSOPII-66-1
18
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
Drivers
Receivers
Read Latch
Bank0
Row-Address Latch
& Decoder
Row-Address MUX
Bank Control Logic
Refresh Counter
Address Register
Figure 3
Data Sheet
Block Diagram 16 Mbit × 4 I/O × 4 Internal Memory Banks
19
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
Drivers
Receivers
Read Latch
Bank0
Row-Address Latch
& Decoder
Row-Address MUX
Bank Control Logic
Refresh Counter
Address Register
Figure 4
Data Sheet
Block Diagram 8 Mbit × 8 I/O × 4 Internal Memory Banks
20
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Pin Configuration
Drivers
Receivers
Read Latch
Bank0
Row-Address Latch
& Decoder
Row-Address MUX
Bank Control Logic
Refresh Counter
Address Register
Figure 5
Data Sheet
Block Diagram 4 Mbit × 16 I/O × 4 Internal Memory Banks
21
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3
Functional Description
The 256 Mbit Double-Data-Rate SDRAM is a high-speed CMOS, dynamic random-access memory containing
268,435,456 bits. The 256 Mbit Double-Data-Rate SDRAM is internally configured as a quad-bank DRAM.
The 256 Mbit Double-Data-Rate SDRAM uses a double-data-rate architecture to achieve high-speed operation.
The double-data-rate architecture is essentially a 2n prefetch architecture, with an interface designed to transfer
two data words per clock cycle at the I/O pins. A single read or write access for the
256 Mbit Double-Data-Rate SDRAM consists of a single 2n-bit wide, one clock cycle data transfer at the internal
DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins.
Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and
continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration
of an Active command, which is then followed by a Read or Write command. The address bits registered
coincident with the Active command are used to select the bank and row to be accessed (BA0, BA1 select the
bank; A0-A12 select the row). The address bits registered coincident with the Read or Write command are used
to select the starting column location for the burst access.
Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide detailed information
covering device initialization, register definition, command descriptions and device operation.
3.1
Initialization
DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than
those specified may result in undefined operation. The following criteria must be met:
No power sequencing is specified during power up or power down given the following criteria:
•
•
•
•
•
•
VDD and VDDQ are driven from a single power converter output
VTT meets the specification
A minimum resistance of 42 Ω limits the input current from the VTT supply into any pin and VREF tracks VDDQ/2
or the following relationship must be followed:
VDDQ is driven after or with VDD such that VDDQ < VDD + 0.3 V
VTT is driven after or with VDDQ such that VTT < VDDQ + 0.3 V
VREF is driven after or with VDDQ such that VREF < VDDQ + 0.3 V
The DQ and DQS outputs are in the High-Z state, where they remain until driven in normal operation (by a read
access). After all power supply and reference voltages are stable, and the clock is stable, the DDR SDRAM
requires a 200 µs delay prior to applying an executable command.
Once the 200 µs delay has been satisfied, a Deselect or NOP command should be applied, and CKE should be
brought HIGH. Following the NOP command, a Precharge ALL command should be applied. Next a Mode
Register Set command should be issued for the Extended Mode Register, to enable the DLL, then a Mode
Register Set command should be issued for the Mode Register, to reset the DLL, and to program the operating
parameters. 200 clock cycles are required between the DLL reset and any executable command. During the
200 cycles of clock for DLL locking, a Deselect or NOP command must be applied. After the 200 clock cycles, a
Precharge ALL command should be applied, placing the device in the “all banks idle” state.
Once in the idle state, two AUTO REFRESH cycles must be performed. Additionally, a Mode Register Set
command for the Mode Register, with the reset DLL bit deactivated (i.e. to program operating parameters without
resetting the DLL) must be performed. Following these cycles, the DDR SDRAM is ready for normal operation.
Data Sheet
22
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.2
Mode Register Definition
The Mode Register is used to define the specific mode of operation of the DDR SDRAM. This definition includes
the selection of a burst length, a burst type, a CAS latency, and an operating mode. The Mode Register is
programmed via the Mode Register Set command (with BA0 = 0 and BA1 = 0) and retains the stored information
until it is programmed again or the device loses power (except for bit A8, which is self-clearing).
Mode Register bits A0-A2 specify the burst length, A3 specifies the type of burst (sequential or interleaved), A4A6 specify the CAS latency, and A7-A12 specify the operating mode.
The Mode Register must be loaded when all banks are idle, and the controller must wait the specified time before
initiating the subsequent operation. Violating either of these requirements results in unspecified operation.
MR
Mode Register Definition
BA1
BA0
0
0
A12
(BA[1:0] = 00B)
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
OPERATING MODE
CL
BT
BL
w
w
w
w
reg. addr
Field
Bits
Type1) Description
BL
[2:0]
w
A0
Burst Length
Number of sequential bits per DQ related to one read/write command; see
Chapter 3.2.1.
Note: All other bit combinations are RESERVED.
001 2
010 4
011 8
BT
3
Burst Type
See Table 7 for internal address sequence of low order address bits; see
Chapter 3.2.2.
0
Sequential
1
Interleaved
CL
[6:4]
CAS Latency
Number of full clocks from read command to first data valid window; see Chapter 3.2.3.
Note: All other bit combinations are RESERVED.
010 2
011 3
101 1.5
Note: DDR200 components only
110 2.5
MODE [12:7]
Operating Mode
See Chapter 3.2.4.
Note: All other bit combinations are RESERVED.
000000
000010
Normal Operation without DLL Reset
Normal Operation with DLL Reset
1) w = write only register bit
Data Sheet
23
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.2.1
Burst Length
Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable. The
burst length determines the maximum number of column locations that can be accessed for a given Read or Write
command. Burst lengths of 2, 4, or 8 locations are available for both the sequential and the interleaved burst types.
Reserved states should not be used, as unknown operation or incompatibility with future versions may result.
When a Read or Write command is issued, a block of columns equal to the burst length is effectively selected. All
accesses for that burst take place within this block, meaning that the burst wraps within the block if a boundary is
reached. The block is uniquely selected by A1-Ai when the burst length is set to two, by A2-Ai when the burst
length is set to four and by A3-Ai when the burst length is set to eight (where Ai is the most significant column
address bit for a given configuration). The remaining (least significant) address bit(s) is (are) used to select the
starting location within the block. The programmed burst length applies to both Read and Write bursts.
3.2.2
Burst Type
Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the
burst type and is selected via bit A3. The ordering of accesses within a burst is determined by the burst length, the
burst type and the starting column address, as shown in Table 7.
Table 7
Burst
Length
Burst Definition
Starting Column Address
A2
A1
A0
Type = Sequential
Type = Interleaved
0
0-1
0-1
1
1-0
1-0
0
0
0-1-2-3
0-1-2-3
0
1
1-2-3-0
1-0-3-2
1
0
2-3-0-1
2-3-0-1
1
1
3-0-1-2
3-2-1-0
0
0
0
0-1-2-3-4-5-6-7
0-1-2-3-4-5-6-7
0
0
1
1-2-3-4-5-6-7-0
1-0-3-2-5-4-7-6
0
1
0
2-3-4-5-6-7-0-1
2-3-0-1-6-7-4-5
0
1
1
3-4-5-6-7-0-1-2
3-2-1-0-7-6-5-4
1
0
0
4-5-6-7-0-1-2-3
4-5-6-7-0-1-2-3
1
0
1
5-6-7-0-1-2-3-4
5-4-7-6-1-0-3-2
1
1
0
6-7-0-1-2-3-4-5
6-7-4-5-2-3-0-1
1
1
1
7-0-1-2-3-4-5-6
7-6-5-4-3-2-1-0
2
4
8
Order of Accesses Within a Burst
Notes
1. For a burst length of two, A1-Ai selects the two-data-element block; A0 selects the first access within the block.
2. For a burst length of four, A2-Ai selects the four-data-element block; A0-A1 selects the first access within the
block.
3. For a burst length of eight, A3-Ai selects the eight-data- element block; A0-A2 selects the first access within
the block.
4. Whenever a boundary of the block is reached within a given sequence above, the following access wraps
within the block.
Data Sheet
24
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.2.3
Read Latency
The Read latency, or CAS latency, is the delay, in clock cycles, between the registration of a Read command and
the availability of the first burst of output data. The latency can be programmed 2, 2.5 and 3 clocks. CAS latency
of 1.5 is supported for DDR200 components only.
If a Read command is registered at clock edge n, and the latency is m clocks, the data is available nominally
coincident with clock edge n + m (see Figure 6).
Reserved states should not be used as unknown operation or incompatibility with future versions may result.
3.2.4
Operating Mode
The normal operating mode is selected by issuing a Mode Register Set Command with bits A7-A12 set to zero,
and bits A0-A6 set to the desired values. A DLL reset is initiated by issuing a Mode Register Set command with
bits A7 and A9-A12 each set to zero, bit A8 set to one, and bits A0-A6 set to the desired values. A Mode Register
Set command issued to reset the DLL should always be followed by a Mode Register Set command to select
normal operating mode.
All other combinations of values for A7-A12 are reserved for future use and/or test modes. Test modes and
reserved states should not be used as unknown operation or incompatibility with future versions may result.
CAS Latency = 2, BL = 4
CK
CK
Command
Read
NOP
NOP
NOP
NOP
NOP
CL=2
DQS
DQ
CAS Latency = 2.5, BL = 4
CK
CK
Command
Read
NOP
NOP
NOP
NOP
NOP
CL=2.5
DQS
DQ
Don’t Care
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 6
Data Sheet
Required CAS Latencies
25
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.3
Extended Mode Register
The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional
functions include DLL enable/disable, and output drive strength selection (optional). These functions are controlled
via the bits shown in the Extended Mode Register Definition. The Extended Mode Register is programmed via the
Mode Register Set command (with BA0 = 1 and BA1 = 0) and retains the stored information until it is programmed
again or the device loses power. The Extended Mode Register must be loaded when all banks are idle, and the
controller must wait the specified time before initiating any subsequent operation. Violating either of these
requirements result in unspecified operation.
EMR
Extended Mode Register Definition
BA1
BA0
0
1
A12
A11
A10
(BA[1:0] = 01B)
A9
A8
A1
A0
Operating Mode
DS
DLL
w
w
w
reg. addr
A7
A6
A5
A4
Field
Bits
Type1)
Description
DLL
0
w
DLL Status
See Chapter 3.3.1.
0
Enabled
1
Disabled
DS
1
Drive Strength
See Chapter 3.3.2, Chapter 4.2 and Chapter 4.3.
0
Normal
1
Weak
MODE
[12:2]
Operating Mode
A3
A2
Note: All other bit combinations are RESERVED.
00000000000Normal Operation
1) w = write only register bit
3.3.1
DLL Enable/Disable
The DLL must be enabled for normal operation. DLL enable is required during power up initialization, and upon
returning to normal operation after having disabled the DLL for the purpose of debug or evaluation. The DLL is
automatically disabled when entering self refresh operation and is automatically re-enabled upon exit of self
refresh operation. Any time the DLL is enabled, 200 clock cycles must occur before a Read command can be
issued. This is the reason 200 clock cycles must occur before issuing a Read or Write command upon exit of self
refresh operation.
3.3.2
Output Drive Strength
The normal drive strength for all outputs is specified to be SSTL_2, Class II. In addition this design version
supports a weak driver mode for lighter load and/or point-to-point environments which can be activated during
mode register set. I-V curves for the normal and weak drive strength are included in this document.
Data Sheet
26
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.4
Commands
Deselect
The Deselect function prevents new commands from being executed by the DDR SDRAM. The DDR SDRAM is
effectively deselected. Operations already in progress are not affected.
No Operation (NOP)
The No Operation (NOP) command is used to perform a NOP to a DDR SDRAM. This prevents unwanted
commands from being registered during idle or wait states. Operations already in progress are not affected.
Mode Register Set
The mode registers are loaded via inputs A0-A12, BA0 and BA1. See mode register descriptions in Chapter 3.2.
The Mode Register Set command can only be issued when all banks are idle and no bursts are in progress. A
subsequent executable command cannot be issued until tMRD is met.
Active
The Active command is used to open (or activate) a row in a particular bank for a subsequent access. The value
on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A12 selects the row. This row
remains active (or open) for accesses until a Precharge (or Read or Write with Auto Precharge) is issued to that
bank. A Precharge (or Read or Write with Auto Precharge) command must be issued and completed before
opening a different row in the same bank.
Read
The Read command is used to initiate a burst read access to an active (open) row. The value on the BA0, BA1
inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 8, j = don’t care] for x16, [i = 9,
j = don’t care] for x8 and [i = 9, j = 11] for x4) selects the starting column location. The value on input A10
determines whether or not Auto Precharge is used. If Auto Precharge is selected, the row being accessed is
precharged at the end of the Read burst; if Auto Precharge is not selected, the row remains open for subsequent
accesses.
Write
The Write command is used to initiate a burst write access to an active (open) row. The value on the BA0, BA1
inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 9, j = don’t care] for x8; where
[i = 9, j = 11] for x4) selects the starting column location. The value on input A10 determines whether or not Auto
Precharge is used. If Auto Precharge is selected, the row being accessed is precharged at the end of the Write
burst; if Auto Precharge is not selected, the row remains open for subsequent accesses. Input data appearing on
the DQs is written to the memory array subject to the DM input logic level appearing coincident with the data. If a
given DM signal is registered low, the corresponding data is written to memory; if the DM signal is registered high,
the corresponding data inputs are ignored, and a Write is not executed to that byte/column location.
Precharge
The Precharge command is used to deactivate (close) the open row in a particular bank or the open row(s) in all
banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the Precharge
command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where
only one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as “Don’t
Care”. Once a bank has been precharged, it is in the idle state and must be activated prior to any Read or Write
commands being issued to that bank. A precharge command is treated as a NOP if there is no open row in that
bank, or if the previously open row is already in the process of precharging.
Data Sheet
27
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Auto Precharge
Auto Precharge is a feature which performs the same individual-bank precharge functions described above, but
without requiring an explicit command. This is accomplished by using A10 to enable Auto Precharge in conjunction
with a specific Read or Write command. A precharge of the bank/row that is addressed with the Read or Write
command is automatically performed upon completion of the Read or Write burst. Auto Precharge is nonpersistent
in that it is either enabled or disabled for each individual Read or Write command. Auto Precharge ensures that
the precharge is initiated at the earliest valid stage within a burst. The user must not issue another command to
the same bank until the precharge (tRP) is completed. This is determined as if an explicit Precharge command was
issued at the earliest possible time, as described for each burst type in Chapter 3.5.
Burst Terminate
The Burst Terminate command is used to truncate read bursts (with Auto Precharge disabled). The most recently
registered Read command prior to the Burst Terminate command is truncated, as shown in Chapter 3.5.
Auto Refresh
Auto Refresh is used during normal operation of the DDR SDRAM and is analogous to CAS Before RAS (CBR)
Refresh in previous DRAM types. This command is nonpersistent, so it must be issued each time a refresh is
required.
The refresh addressing is generated by the internal refresh controller. This makes the address bits “Don’t Care”
during an Auto Refresh command. The 256 Mbit Double-Data-Rate SDRAM requires Auto Refresh cycles at an
average periodic interval of 7.8 µs (maximum).
To allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute refresh
interval is provided. A maximum of eight Auto Refresh commands can be posted in the system, meaning that the
maximum absolute interval between any Auto Refresh command and the next Auto Refresh command is
9 × 7.8 µs (70.2 µs). This maximum absolute interval is short enough to allow for DLL updates internal to the
DDR SDRAM to be restricted to Auto Refresh cycles, without allowing too much drift in tAC between updates.
Self Refresh
The Self Refresh command can be used to retain data in the DDR SDRAM, even if the rest of the system is
powered down. When in the self refresh mode, the DDR SDRAM retains data without external clocking. The Self
Refresh command is initiated as an Auto Refresh command coincident with CKE transitioning low. The DLL is
automatically disabled upon entering Self Refresh, and is automatically enabled upon exiting Self Refresh
(200 clock cycles must then occur before a Read command can be issued). Input signals except CKE (low) are
“Don’t Care” during Self Refresh operation.Since CKE is an SSTL_2 input , VREF must be maintained during SELF
REFRESH.
The procedure for exiting self refresh requires a sequence of commands. CK (and CK) must be stable prior to CKE
returning high. Once CKE is high, the SDRAM must have NOP commands issued for tXSNR because time is
required for the completion of any internal refresh in progress. A simple algorithm for meeting both refresh and
DLL requirements is to apply NOPs for 200 clock cycles before applying any other command.
Data Sheet
28
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Table 8
Truth Table 1a: Commands
Name (Function)
CS
RAS CAS WE Address
MNE
Notes
Deselect (NOP)
H
X
X
X
X
NOP
1)2)
No Operation (NOP)
L
H
H
H
X
NOP
1)2)
Active (Select Bank And Activate Row)
L
L
H
H
Bank/Row ACT
1)3)
Read (Select Bank And Column, And Start Read Burst)
L
H
L
H
Bank/Col
Read
1)4)
Write (Select Bank And Column, And Start Write Burst)
L
H
L
L
Bank/Col
Write
1)4)
Burst Terminate
L
H
H
L
X
BST
1)5)
Precharge (Deactivate Row In Bank Or Banks)
L
L
H
L
Code
PRE
1)6)
Auto Refresh Or Self Refresh (Enter Self Refresh Mode)
L
L
L
H
X
AR/SR
1)7)8)
Mode Register Set
L
L
L
L
Op-Code
MRS
1)9)
1) CKE is HIGH for all commands shown except Self Refresh.
VREF must be maintained during Self Refresh operation
2) Deselect and NOP are functionally interchangeable.
3) BA0-BA1 provide bank address and A0-A12 provide row address.
4) BA0, BA1 provide bank address; A0-Ai provide column address (where i = 8 for x16, i = 9 for x8 and 9, 11 for x4);
A10 HIGH enables the Auto Precharge feature (nonpersistent), A10 LOW disables the Auto Precharge feature.
5) Applies only to read bursts with Auto Precharge disabled; this command is undefined (and should not be used) for read
bursts with Auto Precharge enabled or for write bursts.
6) A10 LOW: BA0, BA1 determine which bank is precharged.
A10 HIGH: all banks are precharged and BA0, BA1 are “Don’t Care”.
7) This command is Auto Refresh if CKE is HIGH; Self Refresh if CKE is LOW.
8) Internal refresh counter controls row and bank addressing; all inputs and I/Os are “Don’t Care” except for CKE.
9) BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode Register; BA0 = 1,
BA1 = 0 selects Extended Mode Register; other combinations of BA0-BA1 are reserved; A0-A12 provide the op-code to
be written to the selected Mode Register).
Table 9
Truth Table 1b: DM Operation
Name (Function)
DM
DQs
Notes
Write Enable
L
Valid
1)
Write Inhibit
H
X
1)
1) Used to mask write data; provided coincident with the corresponding data.
Data Sheet
29
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.5
Operations
3.5.1
Bank/Row Activation
Before any Read or Write commands can be issued to a bank within the DDR SDRAM, a row in that bank must
be “opened” (activated). This is accomplished via the Active command and addresses A0-A12, BA0 and BA1 (see
Figure 7), which decode and select both the bank and the row to be activated. After opening a row (issuing an
Active command), a Read or Write command may be issued to that row, subject to the tRCD specification. A
subsequent Active command to a different row in the same bank can only be issued after the previous active row
has been “closed” (precharged). The minimum time interval between successive Active commands to the same
bank is defined by tRC. A subsequent Active command to another bank can be issued while the first bank is being
accessed, which results in a reduction of total row-access overhead. The minimum time interval between
successive Active commands to different banks is defined by tRRD.
CK
CK
HIGH
CKE
CS
RAS
CAS
WE
Figure 7
A0-A12
RA
BA0, BA1
BA
RA = row address.
BA = bank address.
Don’t Care
Activating a Specific Row in a Specific Bank
CK
CK
NOP
ACT
NOP
ACT
A0-A12
ROW
ROW
COL
BA0, BA1
BA x
BA y
BA y
tRRD
NOP
RD/WR
Command
NOP
NOP
tRCD
Don’t Care
Figure 8
Data Sheet
tRCD and tRRD Definition
30
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.5.2
Reads
Subsequent to programming the mode register with CAS latency, burst type, and burst length, Read bursts are
initiated with a Read command, as shown on Figure 9.
The starting column and bank addresses are provided with the Read command and Auto Precharge is either
enabled or disabled for that burst access. If Auto Precharge is enabled, the row that is accessed starts precharge
at the completion of the burst, provided tRAS has been satisfied. For the generic Read commands used in the
following illustrations, Auto Precharge is disabled.
Data Sheet
31
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
During Read bursts, the valid data-out element from the starting column address is available following the CAS
latency after the Read command. Each subsequent data-out element is valid nominally at the next positive or
negative clock edge (i.e. at the next crossing of CK and CK). Figure 10 shows general timing for each supported
CAS latency setting. DQS is driven by the DDR SDRAM along with output data. The initial low state on DQS is
known as the read preamble; the low state coincident with the last data-out element is known as the read
postamble. Upon completion of a burst, assuming no other commands have been initiated, the DQs goes High-Z.
Data from any Read burst may be concatenated with or truncated with data from a subsequent Read command.
In either case, a continuous flow of data can be maintained. The first data element from the new burst follows either
the last element of a completed burst or the last desired data element of a longer burst which is being truncated.
The new Read command should be issued x cycles after the first Read command, where x equals the number of
desired data element pairs (pairs are required by the 2n prefetch architecture). This is shown on Figure 11. A
Read command can be initiated on any clock cycle following a previous Read command. Nonconsecutive Read
data is illustrated on Figure 12. Full-speed Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8)
within a page (or pages) can be performed as shown on Figure 13.Data from any Read burst may be truncated
with a Burst Terminate command, as shown on Figure 14. The Burst Terminate latency is equal to the read (CAS)
latency, i.e. the Burst Terminate command should be issued x cycles after the Read command, where x equals
the number of desired data element pairs.
Data from any Read burst must be completed or truncated before a subsequent Write command can be issued. If
truncation is necessary, the Burst Terminate command must be used, as shown on Figure 15. The example is
shown for tDQSS(min). The tDQSS(max) case, not shown here, has a longer bus idle time. tDQSS(min) and tDQSS(max) are
defined in Chapter 3.5.3.
A Read burst may be followed by, or truncated with, a Precharge command to the same bank (provided that Auto
Precharge was not activated). The Precharge command should be issued x cycles after the Read command,
where x equals the number of desired data element pairs (pairs are required by the 2n prefetch architecture). This
is shown on Figure 16 for Read latencies of 2 and 2.5. Following the Precharge command, a subsequent
command to the same bank cannot be issued until tRP is met. Note that part of the row precharge time is hidden
during the access of the last data elements.
In the case of a Read being executed to completion, a Precharge command issued at the optimum time (as
described above) provides the same operation that would result from the same Read burst with Auto Precharge
enabled. The disadvantage of the Precharge command is that it requires that the command and address busses
be available at the appropriate time to issue the command. The advantage of the Precharge command is that it
can be used to truncate bursts.
Data Sheet
32
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CK
CK
CKE
HIGH
CS
RAS
CAS
WE
x4: A0-A9, A11
x8: A0-A9
x16: A0-A8
CA
EN AP
A10
DIS AP
BA0, BA1
CA = column address
BA = bank address
EN AP = enable Auto Precharge
DIS AP = disable Auto Precharge
BA
Don’t Care
Figure 9
Data Sheet
Read Command
33
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CAS Latency = 2
CK
CK
Command
Address
Read
NOP
NOP
NOP
NOP
NOP
BA a,COL n
CL=2
DQS
DQ
DOa-n
CAS Latency = 2.5
CK
CK
Command
Address
Read
NOP
NOP
NOP
NOP
NOP
BA a,COL n
CL=2.5
DQS
DQ
DOa-n
DO a-n = data out from bank a, column n.
3 subsequent elements of data out appear in the programmed order following DO a-n.
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 10
Data Sheet
Don’t Care
Read Burst: CAS Latencies (Burst Length = 4)
34
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CAS Latency = 2
CK
CK
Command
Address
Read
NOP
Read
BAa, COL n
NOP
NOP
NOP
BAa, COL b
CL=2
DQS
DQ
DOa-b
DOa-n
CAS Latency = 2.5
CK
CK
Command
Address
Read
NOP
Read
BAa, COL n
NOP
NOP
NOP
BAa,COL b
CL=2.5
DQS
DQ
DOa- n
DO a-n (or a-b) = data out from bank a, column n (or bank a, column b).
When burst length = 4, the bursts are concatenated.
When burst length = 8, the second burst interrupts the first.
3 subsequent elements of data out appear in the programmed order following DO a-n.
3 (or 7) subsequent elements of data out appear in the programmed order following DO a-b.
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 11
Data Sheet
DOa- b
Don’t Care
Consecutive Read Bursts: CAS Latencies (Burst Length = 4 or 8)
35
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CAS Latency = 2
CK
CK
Read
Command
Address
NOP
NOP
Read
BAa, COL n
NOP
NOP
BAa, COL b
CL=2
DQS
DO a-n
DQ
DOa- b
CAS Latency = 2.5
CK
CK
Command
Address
Read
NOP
NOP
Read
BAa, COL n
NOP
NOP
NOP
BAa, COL b
CL=2.5
DQS
DQ
DO a-n
DO a-n (or a-b) = data out from bank a, column n (or bank a, column b).
3 subsequent elements of data out appear in the programmed order following DO a-n (and following DO a-b).
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 12
Data Sheet
DOa- b
Don’t Care
Non-Consecutive Read Bursts: CAS Latencies (Burst Length = 4)
36
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CAS Latency = 2
CK
CK
Command
Address
Read
Read
Read
Read
NOP
BAa, COL n
BAa, COL x
BAa, COL b
BAa, COL g
NOP
CL=2
DQS
DQ
DOa-n
DOa-n’
DOa-x
DOa-x’
DOa-b
DOa-b’
DOa-g
CAS Latency = 2.5
CK
CK
Command
Address
Read
Read
Read
Read
BAa, COL n
BAa, COL x
BAa, COL b
BAa, COL g
NOP
NOP
CL=2.5
DQS
DQ
DOa-n
DOa-n’
DOa-x
DO a-n, etc. = data out from bank a, column n etc.
n' etc. = odd or even complement of n, etc. (i.e., column address LSB inverted).
Reads are to active rows in any banks.
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 13
Data Sheet
DOa-x’
DOa-b
DOa-b’
Don’t Care
Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8)
37
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CAS Latency = 2
CK
CK
Command
Address
Read
NOP
BST
NOP
NOP
NOP
BAa, COL n
CL=2
DQS
DQ
DOa-n
No further output data after this point.
DQS tristated.
CAS Latency = 2.5
CK
CK
Command
Address
Read
NOP
BST
NOP
NOP
NOP
BAa, COL n
CL=2.5
DQS
DQ
DOa-n
No further output data after this point.
DQS tristated.
DO a-n = data out from bank a, column n.
Cases shown are bursts of 8 terminated after 4 data elements.
3 subsequent elements of data out appear in the programmed order following DO a-n.
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 14
Data Sheet
Don’t Care
Terminating a Read Burst: CAS Latencies (Burst Length = 8)
38
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CAS Latency = 2
CK
CK
Command
Address
Read
BST
NOP
BAa, COL n
Write
NOP
NOP
BAa, COL b
CL=2
tDQSS (min)
DQS
DQ
DI a-b
DOa-n
DM
CAS Latency = 2.5
CK
CK
Command
Address
Read
BST
NOP
NOP
BAa, COL n
Write
NOP
BAa, COL b
CL=2.5
tDQSS (min)
DQS
DQ
DOa-n
Dla-b
DM
DO a-n = data out from bank a, column n
.DI a-b = data in to bank a, column b
1 subsequent elements of data out appear in the programmed order following DO a-n.
Data In elements are applied following Dl a-b in the programmed order, according to burst length.
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 15
Data Sheet
Don’t Care
Read to Write: CAS Latencies (Burst Length = 4 or 8)
39
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CAS Latency = 2
CK
CK
Command
Read
NOP
PRE
NOP
NOP
ACT
tRP
Address
BA a or all
BA a, COL n
BA a, ROW
CL=2
DQS
DQ
DOa-n
CAS Latency = 2.5
CK
CK
Command
Read
NOP
PRE
NOP
NOP
ACT
tRP
Address
BA a or all
BA a, COL n
BA a, ROW
CL=2.5
DQS
DQ
DOa-n
DO a-n = data out from bank a, column n.
Cases shown are either uninterrupted bursts of 4 or interrupted bursts of 8.
3 subsequent elements of data out appear in the programmed order following DO a-n.
Shown with nominal tAC, tDQSCK, and tDQSQ.
Figure 16
Data Sheet
Don’t Care
Read to Precharge: CAS Latencies (Burst Length = 4 or 8)
40
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.5.3
Writes
Write bursts are initiated with a Write command, as shown in Figure 17.
The starting column and bank addresses are provided with the Write command, and Auto Precharge is either
enabled or disabled for that access. If Auto Precharge is enabled, the row being accessed is precharged at the
completion of the burst. For the generic Write commands used in the following illustrations, Auto Precharge is
disabled.
During Write bursts, the first valid data-in element is registered on the first rising edge of DQS following the write
command, and subsequent data elements are registered on successive edges of DQS. The Low state on DQS
between the Write command and the first rising edge is known as the write preamble; the Low state on DQS
following the last data-in element is known as the write postamble. The time between the Write command and the
first corresponding rising edge of DQS (tDQSS) is specified with a relatively wide range (from 75% to 125% of one
clock cycle), so most of the Write diagrams that follow are drawn for the two extreme cases (i.e. tDQSS(min) and
tDQSS(max)). Figure 18 shows the two extremes of tDQSS for a burst of four. Upon completion of a burst, assuming
no other commands have been initiated, the DQs and DQS enters High-Z and any additional input data is ignored.
Data for any Write burst may be concatenated with or truncated with a subsequent Write command. In either case,
a continuous flow of input data can be maintained. The new Write command can be issued on any positive edge
of clock following the previous Write command. The first data element from the new burst is applied after either
the last element of a completed burst or the last desired data element of a longer burst which is being truncated.
The new Write command should be issued x cycles after the first Write command, where x equals the number of
desired data element pairs (pairs are required by the 2n prefetch architecture). Figure 19 shows concatenated
bursts of 4. An example of non-consecutive Writes is shown in Figure 20. Full-speed random write accesses
within a page or pages can be performed as shown in Figure 21. Data for any Write burst may be followed by a
subsequent Read command. To follow a Write without truncating the write burst, tWTR (Write to Read) should be
met as shown in Figure 22.
Data for any Write burst may be truncated by a subsequent Read command, as shown in Figure 23 to Figure 25.
Note that only the data-in pairs that are registered prior to the tWTR period are written to the internal array, and any
subsequent data-in must be masked with DM, as shown in the diagrams noted previously.
Data for any Write burst may be followed by a subsequent Precharge command. To follow a Write without
truncating the write burst, tWR should be met as shown in Figure 26.
Data for any Write burst may be truncated by a subsequent Precharge command, as shown in Figure 27 to
Figure 29. Note that only the data-in pairs that are registered prior to the tWR period are written to the internal array,
and any subsequent data in should be masked with DM. Following the Precharge command, a subsequent
command to the same bank cannot be issued until tRP is met.
In the case of a Write burst being executed to completion, a Precharge command issued at the optimum time (as
described above) provides the same operation that would result from the same burst with Auto Precharge. The
disadvantage of the Precharge command is that it requires that the command and address busses be available at
the appropriate time to issue the command. The advantage of the Precharge command is that it can be used to
truncate bursts.
Data Sheet
41
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
CK
CK
CKE
HIGH
CS
RAS
CAS
WE
x4: A0-A9, A11
x8: A0-A9
x16: A0-A8
CA
EN AP
A10
DIS AP
BA0, BA1
CA = column address
BA = bank address
EN AP = enable Auto Precharge
DIS AP = disable Auto Precharge
BA
Don’t Care
Figure 17
Data Sheet
Write Command
42
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Maximum DQSS
T1
T2
T3
T4
CK
CK
Command
Address
Write
NOP
NOP
NOP
BA a, COL b
tDQSS (max)
DQS
DQ
Dla-b
DM
Minimum DQSS
T1
T2
T3
T4
CK
CK
Command
Address
Write
NOP
NOP
NOP
BA a, COL b
tDQSS (min)
DQS
Dla-b
DQ
DM
DI a-b = data in for bank a, column b.
3 subsequent elements of data in are applied in the programmed order following DI a-b.
A non-interrupted burst is shown.
A10 is Low with the Write command (Auto Precharge is disabled).
Don’t Care
Figure 18
Data Sheet
Write Burst (Burst Length = 4)
43
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Maximum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Address
Write
NOP
Write
BAa, COL b
NOP
NOP
NOP
BAa, COL n
tDQSS (max)
DQS
DQ
DI a-b
DI a-n
DM
Minimum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Address
Write
NOP
BA, COL b
Write
NOP
NOP
NOP
BA, COL n
tDQSS (min)
DQS
DQ
DI a-b
DI a-n
DM
DI a-b = data in for bank a, column b, etc.
3 subsequent elements of data in are applied in the programmed order following DI a-b.
3 subsequent elements of data in are applied in the programmed order following DI a-n.
A non-interrupted burst is shown.
Each Write command may be to any bank.
Figure 19
Data Sheet
Don’t Care
Write to Write (Burst Length = 4)
44
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
T1
T2
T3
T4
T5
CK
CK
Command
Address
Write
NOP
NOP
BAa, COL b
Write
NOP
BAa, COL n
tDQSS (max)
DQS
DQ
DI a-b
DI a-n
DM
DI a-b, etc. = data in for bank a, column b, etc.
3 subsequent elements of data in are applied in the programmed order following DI a-b.
3 subsequent elements of data in are applied in the programmed order following DI a-n.
A non-interrupted burst is shown.
Each Write command may be to any bank.
Figure 20
Data Sheet
Don’t Care
Write to Write: Max. DQSS, Non-Consecutive (Burst Length = 4)
45
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Maximum DQSS
T1
T2
T3
T4
T5
CK
CK
Command
Address
Write
Write
BAa, COL b
Write
BAa, COL x
Write
BAa, COL n
Write
BAa, COL a
BAa, COL g
tDQSS (max)
DQS
DQ
DI a-b
DI a-b’
DI a-x
DI a-x’
DI a-n
DI a-n’
DI a-a
DI a-a’
DM
Minimum DQSS
T1
T2
T3
T4
T5
CK
CK
Command
Address
Write
Write
BAa, COL b
Write
BAa, COL x
Write
BAa, COL n
Write
BAa, COL a
BAa, COL g
tDQSS (min)
DQS
DQ
DI a-b
DI a-b’
DI a-x
DI a-x’
DI a-n
DI a-n’
DI a-a
DI a-a’
DI a-g
DM
DI a-b, etc. = data in for bank a, column b, etc.
b', etc. = odd or even complement of b, etc. (i.e., column address LSB inverted).
Each Write command may be to any bank.
Figure 21
Data Sheet
Don’t Care
Random Write Cycles (Burst Length = 2, 4 or 8)
46
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Maximum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
Read
NOP
tWTR
Address
BAa, COL b
BAa, COL n
CL = 2
tDQSS (max)
DQS
DQ
DI a-b
DM
Minimum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
Read
NOP
tWTR
Address
BAa, COL n
BAa, COL b
CL = 2
tDQSS (min)
DQS
DQ
DI a-b
DM
DI a-b = data in for bank a, column b.
3 subsequent elements of data in are applied in the programmed order following DI a-b.
A non-interrupted burst is shown.
tWTR is referenced from the first positive CK edge after the last data in pair.
A10 is Low with the Write command (Auto Precharge is disabled).
The Read and Write commands may be to any bank.
Figure 22
Data Sheet
Don’t Care
Write to Read: Non-Interrupting (CAS Latency = 2; Burst Length = 4)
47
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Maximum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
Read
NOP
tWTR
Address
BAa, COL n
BAa, COL b
CL = 2
tDQSS (max)
DQS
DQ
DIa- b
1
DM
1
Minimum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
Read
NOP
tWTR
Address
BAa, COL n
BAa, COL b
CL = 2
tDQSS (min)
DQS
DQ
DI a-b
1
DM
1
DI a-b = data in for bank a, column b.
An interrupted burst is shown, 4 data elements are written.
3 subsequent elements of data in are applied in the programmed order following DI a-b.
tWTR is referenced from the first positive CK edge after the last data in pair.
The Read command masks the last 2 data elements in the burst.
A10 is Low with the Write command (Auto Precharge is disabled).
The Read and Write commands are not necessarily to the same bank.
1 = These bits are incorrectly written into the memory array if DM is low.
Figure 23
Data Sheet
Don’t Care
Write to Read: Interrupting (CAS Latency = 2; Burst Length = 8)
48
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
Read
NOP
tWTR
Address
BAa, COL n
BAa, COL b
CL = 2
tDQSS (min)
DQS
DQ
DI a-b
DM
1
2
2
DI a-b = data in for bank a, column b.
An interrupted burst is shown, 3 data elements are written.
2 subsequent elements of data in are applied in the programmed order following DI a-b.
tWTR is referenced from the first positive CK edge after the last desired data in pair (not the last desired data in element)
The Read command masks the last 2 data elements in the burst.
A10 is Low with the Write command (Auto Precharge is disabled).
The Read and Write commands are not necessarily to the same bank.
1 = This bit is correctly written into the memory array if DM is low.
Don’t Care
2 = These bits are incorrectly written into the memory array if DM is low.
Figure 24
Data Sheet
Write to Read: Min. DQSS, Odd Number of Data (3-bit Write), Interrupting (CL2; BL8)
49
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
Read
NOP
tWTR
Address
BAa, COL n
BAa, COL b
CL = 2
tDQSS (nom)
DQS
DQ
DI a-b
DM
1
1
DI a-b = data in for bank a, column b.
An interrupted burst is shown, 4 data elements are written.
3 subsequent elements of data in are applied in the programmed order following DI a-b.
tWTR is referenced from the first positive CK edge after the last desired data in pair.
The Read command masks the last 2 data elements in the burst.
A10 is Low with the Write command (Auto Precharge is disabled).
The Read and Write commands are not necessarily to the same bank.
1 = These bits are incorrectly written into the memory array if DM is low.
Figure 25
Data Sheet
Don’t Care
Write to Read: Nominal DQSS, Interrupting (CAS Latency = 2; Burst Length = 8)
50
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Maximum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
NOP
PRE
tWR
Address
BA (a or all)
BA a, COL b
tRP
tDQSS (max)
DQS
DQ
DI a-b
DM
Minimum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
NOP
PRE
tWR
Address
BA (a or all)
BA a, COL b
tRP
tDQSS (min)
DQS
DQ
DI a-b
DM
DI a-b = data in for bank a, column b.
3 subsequent elements of data in are applied in the programmed order following DI a-b.
A non-interrupted burst is shown.
tWR is referenced from the first positive CK edge after the last data in pair.
A10 is Low with the Write command (Auto Precharge is disabled).
Figure 26
Data Sheet
Don’t Care
Write to Precharge: Non-Interrupting (Burst Length = 4)
51
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Maximum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
PRE
NOP
tWR
Address
BA (a or all)
BA a, COL b
tDQSS (max)
tRP
2
DQS
DQ
DI a-b
3
DM
1
3
1
Minimum DQSS
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
PRE
NOP
tWR
Address
BA a, COL b
BA (a or all)
tDQSS (min)
tRP
2
DQS
DQ
DM
DI a-b
3
3
1
1
DI a-b = data in for bank a, column b.
An interrupted burst is shown, 2 data elements are written.
1 subsequent element of data in is applied in the programmed order following DI a-b.
tWR is referenced from the first positive CK edge after the last desired data in pair.
The Precharge command masks the last 2 data elements in the burst, for burst length = 8.
A10 is Low with the Write command (Auto Precharge is disabled).
1 = Can be don't care for programmed burst length of 4.
2 = For programmed burst length of 4, DQS becomes don't care at this point.
3 = These bits are incorrectly written into the memory array if DM is low.
Figure 27
Data Sheet
Don’t Care
Write to Precharge: Interrupting (Burst Length = 4 or 8)
52
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
PRE
NOP
tWR
Address
BA (a or all)
BA a, COL b
tDQSS (min)
tRP
2
DQS
DQ
DM
DI a-b
3
4
4
1
1
DI a-b = data in for bank a, column b.
An interrupted burst is shown, 1 data element is written.
tWR is referenced from the first positive CK edge after the last desired data in pair.
The Precharge command masks the last 2 data elements in the burst.
A10 is Low with the Write command (Auto Precharge is disabled).
1 = Can be don't care for programmed burst length of 4.
2 = For programmed burst length of 4, DQS becomes don't care at this point.
3 = This bit is correctly written into the memory array if DM is low.
4 = These bits are incorrectly written into the memory array if DM is low.
Figure 28
Data Sheet
Don’t Care
Write to Precharge: Minimum DQSS, Odd Number of Data (1-bit Write), Interrupting (BL 4 or 8)
53
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
T1
T2
T3
T4
T5
T6
CK
CK
Command
Write
NOP
NOP
NOP
PRE
NOP
tWR
Address
BA a, COL b
BA (a or all)
tDQSS (nom)
tRP
2
DQS
DQ
DM
DI a-b
3
3
1
1
DI a-b = Data In for bank a, column b.
An interrupted burst is shown, 2 data elements are written.
1 subsequent element of data in is applied in the programmed order following DI a-b.
tWR is referenced from the first positive CK edge after the last desired data in pair.
The Precharge command masks the last 2 data elements in the burst.
A10 is Low with the Write command (Auto Precharge is disabled).
1 = Can be don't care for programmed burst length of 4.
2 = For programmed burst length of 4, DQS becomes don't care at this point.
3 = These bits are incorrectly written into the memory array if DM is low.
Figure 29
Data Sheet
Don’t Care
Write to Precharge: Nominal DQSS (2-bit Write), Interrupting (Burst Length = 4 or 8)
54
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.5.4
Precharge
The Precharge command is used to deactivate the open row in a particular bank or the open row in all banks. The
bank(s) will be available for a subsequent row access some specified time (tRP) after the Precharge command is
issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank
is to be precharged, inputs BA0, BA1 select the bank. When all banks are to be precharged, inputs BA0, BA1 are
treated as “Don’t Care”. Once a bank has been precharged, it is in the idle state and must be activated prior to any
Read or Write commands being issued to that bank.
CK
CK
CKE
HIGH
CS
RAS
CAS
WE
A0-A9, A11, A12
All Banks
A10
BA0, BA1
One Bank
BA
BA = bank address
(if A10 is Low, otherwise Don’t Care).
Don’t Care
Figure 30
Data Sheet
Precharge Command
55
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.5.5
Power-Down
Power-down is entered when CKE is registered LOW (no accesses can be in progress). If power-down occurs
when all banks are idle, this mode is referred to as precharge power-down; if power-down occurs when there is a
row active in any bank, this mode is referred to as active power-down. Entering power-down deactivates the input
and output buffers, excluding CK, CK and CKE. The DLL is still running in Power Down mode, so for maximum
power savings, the user has the option of disabling the DLL prior to entering Power-down. In that case, the DLL
must be enabled after exiting power-down, and 200 clock cycles must occur before a Read command can be
issued. In power-down mode, CKE Low and a stable clock signal must be maintained at the inputs of the
DDR SDRAM, and all other input signals are “Don’t Care”. However, power-down duration is limited by the refresh
requirements of the device, so in most applications, the self refresh mode is preferred over the DLL-disabled
power-down mode.
The power-down state is synchronously exited when CKE is registered HIGH (along with a NOP or Deselect
command). A valid, executable command may be applied one clock cycle later.
CK
CK
tIS
CKE
Command
VALID
tIS
NOP
NOP
No column
access in
progress
Exit
power down
mode
Enter Power Down mode
(Burst Read or Write operation
must not be in progress)
Figure 31
Data Sheet
VALID
Don’t Care
Power Down
56
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Table 10
Truth Table 2: Clock Enable (CKE)
Current State CKE n-1
CKEn
Command n
Action n
Notes
Previous
Cycle
Current
Cycle
Self Refresh
L
L
X
Maintain Self-Refresh
1)
Self Refresh
L
H
Deselect or NOP
Exit Self-Refresh
2)
Power Down
L
L
X
Maintain Power-Down
–
Power Down
L
H
Deselect or NOP
Exit Power-Down
–
All Banks Idle
H
L
Deselect or NOP
Precharge Power-Down Entry –
All Banks Idle
H
L
AUTO REFRESH
Self Refresh Entry
–
Bank(s) Active H
L
Deselect or NOP
Active Power-Down Entry
–
H
H
See Table 11
–
–
1)
VREF must be maintained during Self Refresh operation
2) Deselect or NOP commands should be issued on any clock edges occurring during the Self Refresh Exit (tXSNR) period. A
minimum of 200 clock cycles are needed before applying a read command to allow the DLL to lock to the input clock.
Note:
1.
2.
3.
4.
CKEn is the logic state of CKE at clock edge n: CKE n-1 was the state of CKE at the previous clock edge.
Current state is the state of the DDR SDRAM immediately prior to clock edge n.
COMMAND n is the command registered at clock edge n, and ACTION n is a result of COMMAND n.
All states and sequences not shown are illegal or reserved.
Table 11
Truth Table 3: Current State Bank n - Command to Bank n (same bank)
Current State CS
RAS CAS WE
Command
Action
Notes
Any
H
X
X
X
Deselect
NOP. Continue previous operation.
1)2)3)4)5)6)
L
H
H
H
No Operation
NOP. Continue previous operation.
1) to 6)
L
L
H
H
Active
Select and activate row
1) to 6)
L
L
L
H
AUTO REFRESH
–
1) to 7)
L
L
L
L
MODE
REGISTER SET
–
1) to 7)
L
H
L
H
Read
Select column and start Read burst
1) to 6), 8)
L
H
L
L
Write
Select column and start Write burst
1) to 6), 8)
L
L
H
L
Precharge
Deactivate row in bank(s)
1) to 6), 9)
L
H
L
H
Read
Select column and start new Read
burst
1) to 6), 8)
L
L
H
L
Precharge
Truncate Read burst, start
Precharge
1) to 6), 9)
L
H
H
L
BURST
TERMINATE
BURST TERMINATE
1) to 6), 10)
L
H
L
H
Read
Select column and start Read burst
1) to 6), 8), 11)
L
H
L
L
Write
Select column and start Write burst
1) to 6), 8)
L
L
H
L
Precharge
Truncate Write burst, start Precharge
1) to 6), 9), 11)
Idle
Row Active
Read (Auto
Precharge
Disabled)
Write (Auto
Precharge
Disabled)
1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 10 and after tXSNR/tXSRD has been met (if the
previous state was self refresh).
2) This table is bank-specific, except where noted, i.e., the current state is for a specific bank and the commands shown are
those allowed to be issued to that bank when in that state. Exceptions are covered in the notes below.
Data Sheet
57
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3) Current state definitions:
Idle: The bank has been precharged, and tRP has been met.
Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register
accesses are in progress.
Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated.
Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated.
4) The following states must not be interrupted by a command issued to the same bank.
Precharging: Starts with registration of a Precharge command and ends when tRP is met. Once tRP is met, the bank is in
the idle state.
Row Activating: Starts with registration of an Active command and ends when tRCD is met. Once tRCD is met, the bank is in
the “row active” state.
Read w/Auto Precharge Enabled: Starts with registration of a Read command with Auto Precharge enabled and ends when
tRP has been met. Once tRP is met, the bank is in the idle state.
Write w/Auto Precharge Enabled: Starts with registration of a Write command with Auto Precharge enabled and ends when
tRP has been met. Once tRP is met, the bank is in the idle state.
Deselect or NOP commands, or allowable commands to the other bank should be issued on any clock edge occurring
during these states. Allowable commands to the other bank are determined by its current state and according to Table 12.
5) The following states must not be interrupted by any executable command; Deselect or NOP commands must be applied
on each positive clock edge during these states.
Refreshing: Starts with registration of an Auto Refresh command and ends when tRFC is met. Once tRFC is met, the
DDR SDRAM is in the “all banks idle” state.
Accessing Mode Register: Starts with registration of a Mode Register Set command and ends when tMRD has been met.
Once tMRD is met, the DDR SDRAM is in the “all banks idle” state.
Precharging All: Starts with registration of a Precharge All command and ends when tRP is met. Once tRP is met, all banks
is in the idle state.
6) All states and sequences not shown are illegal or reserved.
7) Not bank-specific; requires that all banks are idle.
8) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads
or Writes with Auto Precharge disabled.
9) May or may not be bank-specific; if all/any banks are to be precharged, all/any must be in a valid state for precharging.
10) Not bank-specific; BURST TERMINATE affects the most recent Read burst, regardless of bank.
11) Requires appropriate DM masking.
Data Sheet
58
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
Table 12
Truth Table 4: Current State Bank n - Command to Bank m (different bank)
Current State
CS
RAS CAS WE
Command
Action
Notes
Any
H
X
X
X
Deselect
NOP. Continue previous operation.
1)2)3)4)5)6)
L
H
H
H
No Operation
NOP. Continue previous operation.
1) to 6)
Idle
X
X
X
X
Any Command
Otherwise Allowed
to Bank m
–
1) to 6)
Row Activating,
Active, or
Precharging
L
L
H
H
Active
Select and activate row
1) to 6)
L
H
L
H
Read
Select column and start Read burst
1) to 7)
L
H
L
L
Write
Select column and start Write burst
1) to 7)
L
L
H
L
Precharge
–
1) to 6)
L
L
H
H
Active
Select and activate row
1) to 6)
L
H
L
H
Read
Select column and start new Read
burst
1) to 7)
L
L
H
L
Precharge
–
1) to 6)
L
L
H
H
Active
Select and activate row
1) to 6)
L
H
L
H
Read
Select column and start Read burst
1) to 8)
L
H
L
L
Write
Select column and start new Write
burst
1) to 7)
L
L
H
L
Precharge
–
1) to 6)
Read (With Auto L
Precharge)
L
L
H
H
Active
Select and activate row
1) to 6)
H
L
H
Read
Select column and start new Read
burst
1) to 7), 9)
L
H
L
L
Write
Select column and start Write burst
1) to 7), 9), 10)
L
L
H
L
Precharge
–
1) to 6)
Write (With Auto L
Precharge)
L
L
H
H
Active
Select and activate row
1) to 6)
H
L
H
Read
Select column and start Read burst
1) to 7), 9)
L
H
L
L
Write
Select column and start new Write
burst
1) to 7), 9)
L
L
H
L
Precharge
–
1) to 6)
Read (Auto
Precharge
Disabled)
Write (Auto
Precharge
Disabled)
1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 10: Clock Enable (CKE) and after tXSNR/tXSRD
has been met (if the previous state was self refresh).
2) This table describes alternate bank operation, except where noted, i.e., the current state is for bank n and the commands
shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is
allowable). Exceptions are covered in the notes below.
3) Current state definitions:
Idle: The bank has been precharged, and tRP has been met.
Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/accesses and no register
accesses are in progress.
Read: A Read burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated.
Write: A Write burst has been initiated, with Auto Precharge disabled, and has not yet terminated or been terminated.
Read with Auto Precharge Enabled: See 10).
Write with Auto Precharge Enabled: See 10).
4) AUTO REFRESH and Mode Register Set commands may only be issued when all banks are idle.
5) A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state
only.
6) All states and sequences not shown are illegal or reserved.
Data Sheet
59
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
7) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads
or Writes with Auto Precharge disabled.
8) Requires appropriate DM masking.
9) Concurrent Auto Precharge:
This device supports “Concurrent Auto Precharge”. When a read with auto precharge or a write with auto precharge is
enabled any command may follow to the other banks as long as that command does not interrupt the read or write data
transfer and all other limitations apply (e.g. contention between READ data and WRITE data must be avoided). The
minimum delay from a read or write command with auto precharge enable, to a command to a different banks is
summarized in Table 13.
10) A Write command may be applied after the completion of data output.
Table 13
Truth Table 5: Concurrent Auto Precharge
From Command
To Command (different bank)
Minimum Delay with Concurrent
Auto Precharge Support
Unit
WRITE w/AP
Read or Read w/AP
1 + (BL/2) + tWTR
Write to Write w/AP
BL/2
Precharge or Activate
1
Read or Read w/AP
BL/2
Write or Write w/AP
CL (rounded up) + BL/2
Precharge or Activate
1
tCK
tCK
tCK
tCK
tCK
tCK
Read w/AP
3.5.6
Input Clock Frequency Change
DDR SDRAM Input clock frequency cannot be changed during normal operation. Clock frequency change is only
permitted during Self Refresh or during Power Down. In the latter case the following conditions must be met:
DDR SDRAM must be in pre charged mode with CKE at logic Low level. After a minimum of 2 clocks after CKE
goes LOW, the clock frequency may change to any frequency between minimum and maximum operating
frequeny specified for the particular speed grade. During an input clock frequency change, CKE must be held
LOW. Once the input clock frequency is changed, a stable clock must be provided to DRAM before pre charge
power down mode may be exited. The DLL must be RESET via EMRS after pre charge power down exit. An
additional MRS command may need to be issued to appropriately set CL etc.. After the DLL relock time, the DRAM
is ready to operate with the new clock frequency.
(
(
(
(
(#
(#)
(*
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(*)
(*)
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+1"2;!5;E!72%78!";=%:!F%E;:
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Figure 32
Data Sheet
Clock frequency change in pre charge power down mode
60
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Functional Description
3.6
Simplified State Diagram
Power
Applied
Power
On
Self
Refresh
Precharge
PREALL
REFS
REFSX
MRS
EMRS
MRS
CKEH
Active
Power
Down
Auto
Refresh
REFA
Idle
CKEL
ACT
Precharge
Power
Down
CKEH
CKEL
Burst Stop
Row
Active
Write
Write A
Write
Read
Read A
Read
Read
Read A
Write A
PRE
Write
A
PRE
PRE
PRE
Read
A
Read
A
Precharge
PREALL
Automatic Sequence
Command Sequence
PREALL = Precharge All Banks
MRS = Mode Register Set
EMRS = Extended Mode Register Set
REFS = Enter Self Refresh
REFSX = Exit Self Refresh
REFA = Auto Refresh
Figure 33
Data Sheet
CKEL = Enter Power Down
CKEH = Exit Power Down
ACT = Active
Write A = Write with Autoprecharge
Read A = Read with Autoprecharge
PRE = Precharge
Simplified State Diagram
61
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
4
Electrical Characteristics
4.1
Operating Conditions
Table 14
Absolute Maximum Ratings
Parameter
Symbol
Voltage on I/O pins relative to VSS
VIN, VOUT
VIN
VDD
VDDQ
TA
TSTG
PD
IOUT
Values
Unit Note/ Test Condition
min. typ. max.
Voltage on inputs relative to VSS
Voltage on VDD supply relative to VSS
Voltage on VDDQ supply relative to VSS
Operating temperature (ambient)
Storage temperature (plastic)
Power dissipation (per SDRAM component)
Short circuit output current
–0.5 –
VDDQ+0.5 V
–
–1
–
+3.6
V
–
–1
–
+3.6
V
–
–1
–
+3.6
V
–
0
–
+70
°C
–
-55
–
+150
°C
–
–
1.5
–
W
–
–
50
–
mA
–
Attention: Permanent damage to the device may occur if “Absolute Maximum Ratings” are exceeded. This
is a stress rating only, and functional operation should be restricted to recommended operation
conditions. Exposure to absolute maximum rating conditions for extended periods of time may
affect device reliability and exceeding only one of the values may cause irreversible damage to
the integrated circuit.
Table 15
Input and Output Capacitances
Parameter
Input Capacitance: CK, CK
Delta Input Capacitance
Input Capacitance:
All other input-only pins
Delta Input Capacitance:
All other input-only pins
Symbol
CI1
CdI1
CI2
CdIO
Input/Output Capacitance: DQ, DQS, DM CIO
Delta Input/Output Capacitance:
DQ, DQS, DM
CdIO
Values
Unit
Note/
Test Condition
Min.
Typ.
Max.
1.5
—
2.5
pF
P-TFBGA-60-12 1)
2.0
—
3.0
pF
P-TSOPII-66 1)
—
—
0.25
pF
1)
1.5
—
2.5
pF
P-TFBGA-60-12 1)
2.0
—
3.0
pF
P-TSOPII-66 1)
—
—
0.5
pF
1)
3.5
—
4.5
pF
P-TFBGA-60-12
1)2)
4.0
—
5.0
pF
P-TSOPII-66 1)2)
—
—
0.5
pF
1)
1) These values are not subject to production test - verified by design/characterization and are tested on a sample base only.
VDDQ = VDD = 2.5 V ± 0.2 V, f = 100 MHz, TA = 25 ×C, VOUT(DC) = VDDQ/2, VOUT (Peak to Peak) 0.2 V. Unused pins
are tied to ground.
2) DM inputs are grouped with I/O pins reflecting the fact that they are matched in loading to DQ and DQS to facilitate trace
matching at the board level.
Data Sheet
62
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 16
Electrical Characteristics and DC Operating Conditions
Parameter
Symbol
VDD
Device Supply Voltage
VDD
Output Supply Voltage
VDDQ
Output Supply Voltage
VDDQ
Supply Voltage, I/O Supply VSS,
Voltage
VSSQ
VREF
Input Reference Voltage
Device Supply Voltage
I/O Termination Voltage
(System)
VTT
Input High (Logic1) Voltage VIH(DC)
Input Low (Logic0) Voltage VIL(DC)
Unit Note/Test Condition 1)
Values
Min.
Typ.
Max.
2.3
2.5
2.7
V
2.5
2.6
2.7
V
2.3
2.5
2.7
V
2.5
2.6
2.7
V
fCK ≤ 166 MHz
fCK > 166 MHz 2)
fCK ≤ 166 MHz 3)
fCK > 166 MHz 2)3)
0
V
—
0.51 ×
V
4)
VDDQ
VREF + 0.04 V
5)
0
0.49 ×
0.5 ×
VDDQ
VDDQ
VREF – 0.04
VREF + 0.15
8)
Input Voltage Level,
CK and CK Inputs
VIN(DC)
–0.3
VDDQ + 0.3 V
VREF – 0.15 V
VDDQ + 0.3 V
Input Differential Voltage,
CK and CK Inputs
VID(DC)
0.36
VDDQ + 0.6 V
8)6)
VI-Matching Pull-up
Current to Pull-down
Current
VIRatio
0.71
1.4
—
7)
Input Leakage Current
II
–2
2
µA
Any input 0 V ≤ VIN ≤ VDD;
All other pins not under test
= 0 V 8)9)
Output Leakage Current
IOZ
–5
5
µA
DQs are disabled;
0 V ≤ VOUT ≤ VDDQ
Output High Current,
Normal Strength Driver
IOH
—
–16.2
mA
VOUT = 1.95 V
Output Low
Current, Normal Strength
Driver
IOL
16.2
—
mA
VOUT = 0.35 V
–0.3
8)
8)
1) 0 °C ≤ TA ≤ 70 °C
2) DDR400 conditions apply for all clock frequencies above 166 MHz
3) Under all conditions, VDDQ must be less than or equal to VDD.
4) Peak to peak AC noise on VREF may not exceed ± 2% VREF (DC). VREF is also expected to track noise variations in VDDQ.
5) VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal
to VREF, and must track variations in the DC level of VREF.
6) VID is the magnitude of the difference between the input level on CK and the input level on CK.
7) The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire
temperature and voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the
maximum difference between pull-up and pull-down drivers due to process variation.
8) Inputs are not recognized as valid until VREF stabilizes.
9) Values are shown per component
Data Sheet
63
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
4.2
Normal Strength Pull-down and Pull-up Characteristics
1. The nominal pull-down V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the
inner bounding lines of the V-I curve.
2. The full variation in driver pull-down current from minimum to maximum process, temperature, and voltage lie
within the outer bounding lines of the V-I curve.
3. The nominal pull-up V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the inner
bounding lines of the V-I curve.
4. The full variation in driver pull-up current from minimum to maximum process, temperature, and voltage lie
within the outer bounding lines of the V-I curve.
5. The full variation in the ratio of the maximum to minimum pull-up and pull-down current does not exceed 1.7,
for device drain to source voltages from 0.1 to 1.0.
6. The full variation in the ratio of the nominal pull-up to pull-down current should be unity ±10%, for device drain
to source voltages from 0.1 to 1.0 V.
140
Maximum
IOUT (mA)
120
100
Nominal High
80
60
Nominal Low
40
Minimum
20
0
Figure 34
0
0.5
1
1.5
VDDQ - VOUT (V)
2
2.5
Normal Strength Pull-down Characteristics
0
-20
Minimum
IOUT (mA)
-40
Nominal Low
-60
-80
-100
-120
-140
Nominal High
-160
Maximum
0
Figure 35
Data Sheet
0.5
1
1.5
VDDQ - VOUT (V)
2
2.5
Normal Strength Pull-up Characteristics
64
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 17
Normal Strength Pull-down and Pull-up Currents
Voltage (V)
Pulldown Current (mA)
Pullup Current (mA)
Nominal
Low
Nominal
High
Min.
Max.
Nominal
Low
Nominal
High
Min.
Max.
0.1
6.0
6.8
4.6
9.6
-6.1
-7.6
-4.6
-10.0
0.2
12.2
13.5
9.2
18.2
-12.2
-14.5
-9.2
-20.0
0.3
18.1
20.1
13.8
26.0
-18.1
-21.2
-13.8
-29.8
0.4
24.1
26.6
18.4
33.9
-24.0
-27.7
-18.4
-38.8
0.5
29.8
33.0
23.0
41.8
-29.8
-34.1
-23.0
-46.8
0.6
34.6
39.1
27.7
49.4
-34.3
-40.5
-27.7
-54.4
0.7
39.4
44.2
32.2
56.8
-38.1
-46.9
-32.2
-61.8
0.8
43.7
49.8
36.8
63.2
-41.1
-53.1
-36.0
-69.5
0.9
47.5
55.2
39.6
69.9
-43.8
-59.4
-38.2
-77.3
1.0
51.3
60.3
42.6
76.3
-46.0
-65.5
-38.7
-85.2
1.1
54.1
65.2
44.8
82.5
-47.8
-71.6
-39.0
-93.0
1.2
56.2
69.9
46.2
88.3
-49.2
-77.6
-39.2
-100.6
1.3
57.9
74.2
47.1
93.8
-50.0
-83.6
-39.4
-108.1
1.4
59.3
78.4
47.4
99.1
-50.5
-89.7
-39.6
-115.5
1.5
60.1
82.3
47.7
103.8
-50.7
-95.5
-39.9
-123.0
1.6
60.5
85.9
48.0
108.4
-51.0
-101.3
-40.1
-130.4
1.7
61.0
89.1
48.4
112.1
-51.1
-107.1
-40.2
-136.7
1.8
61.5
92.2
48.9
115.9
-51.3
-112.4
-40.3
-144.2
1.9
62.0
95.3
49.1
119.6
-51.5
-118.7
-40.4
-150.5
2.0
62.5
97.2
49.4
123.3
-51.6
-124.0
-40.5
-156.9
2.1
62.9
99.1
49.6
126.5
-51.8
-129.3
-40.6
-163.2
2.2
63.3
100.9
49.8
129.5
-52.0
-134.6
-40.7
-169.6
2.3
63.8
101.9
49.9
132.4
-52.2
-139.9
-40.8
-176.0
2.4
64.1
102.8
50.0
135.0
-52.3
-145.2
-40.9
-181.3
2.5
64.6
103.8
50.2
137.3
-52.5
-150.5
-41.0
-187.6
2.6
64.8
104.6
50.4
139.2
-52.7
-155.3
-41.1
-192.9
2.7
65.0
105.4
50.5
140.8
-52.8
-160.1
-41.2
-198.2
Table 18
Evaluation Conditions for I/O Driver Characteristics
Parameter
Nominal
Minimum
Maximum
Operating Temperature
25 °C
0 °C
70 °C
VDD/VDDQ
2.5 V
2.3 V
2.7 V
Process Corner
typical
slow-slow
fast-fast
Data Sheet
65
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
4.3
Weak Strength Pull-down and Pull-up Characteristics
1. The weak pull-down V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the inner
bounding lines of the V-I curve.
2. The weak pull-up V-I curve for DDR SDRAM devices is expected, but not guaranteed, to lie within the inner
bounding lines of the V-I curve.
3. The full variation in driver pull-up current from minimum to maximum process, temperature, and voltage lie
within the outer bounding lines of the V-I curve.
4. The full variation in the ratio of the maximum to minimum pull-up and pull-down current does not exceed 1.7,
for device drain to source voltages from 0.1 to 1.0.
5. The full variation in the ratio of the nominal pull-up to pull-down current should be unity ±10%, for device drain
to source voltages from 0.1 to 1.0 V.
8
0
M
a
x
im
u
m
7
0
Io
u
t[m
A
]
6
0
T
y
p
ic
a
lh
ig
h
5
0
T
y
p
ic
a
llo
w
4
0
3
0
M
in
im
u
m
2
0
1
0
0
0
,0
0
,5
1
,0
1
,5
2
,0
2
,5
V
o
u
t[V
]
Figure 36
Weak Strength Pull-down Characteristics
0
,0
0
,0
-1
0
,0
0
,5
1
,0
1
,5
2
,5
M
in
im
u
m
-2
0
,0
Io
u
t[V
]
2
,0
-3
0
,0
T
y
p
ic
a
llo
w
-4
0
,0
-5
0
,0
T
y
p
ic
a
lh
ig
h
-6
0
,0
-7
0
,0
M
a
x
im
u
m
-8
0
,0
V
o
u
t[V
]
Figure 37
Data Sheet
Weak Strength Pull-up Characteristics
66
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 19
Weak Strength Driver Pull-down and Pull-up Characteristics
Voltage (V)
Pulldown Current (mA)
Pullup Current (mA)
Nominal
Low
Nominal
High
Min.
Max.
Nominal
Low
Nominal
High
Min.
Max.
0.1
3.4
3.8
2.6
5.0
-3.5
-4.3
-2.6
-5.0
0.2
6.9
7.6
5.2
9.9
-6.9
-8.2
-5.2
-9.9
0.3
10.3
11.4
7.8
14.6
-10.3
-12.0
-7.8
-14.6
0.4
13.6
15.1
10.4
19.2
-13.6
-15.7
-10.4
-19.2
0.5
16.9
18.7
13.0
23.6
-16.9
-19.3
-13.0
-23.6
0.6
19.6
22.1
15.7
28.0
-19.4
-22.9
-15.7
-28.0
0.7
22.3
25.0
18.2
32.2
-21.5
-26.5
-18.2
-32.2
0.8
24.7
28.2
20.8
35.8
-23.3
-30.1
-20.4
-35.8
0.9
26.9
31.3
22.4
39.5
-24.8
-33.6
-21.6
-39.5
1.0
29.0
34.1
24.1
43.2
-26.0
-37.1
-21.9
-43.2
1.1
30.6
36.9
25.4
46.7
-27.1
-40.3
-22.1
-46.7
1.2
31.8
39.5
26.2
50.0
-27.8
-43.1
-22.2
-50.0
1.3
32.8
42.0
26.6
53.1
-28.3
-45.8
-22.3
-53.1
1.4
33.5
44.4
26.8
56.1
-28.6
-48.4
-22.4
-56.1
1.5
34.0
46.6
27.0
58.7
-28.7
-50.7
-22.6
-58.7
1.6
34.3
48.6
27.2
61.4
-28.9
-52.9
-22.7
-61.4
1.7
34.5
50.5
27.4
63.5
-28.9
-55.0
-22.7
-63.5
1.8
34.8
52.2
27.7
65.6
-29.0
-56.8
-22.8
-65.6
1.9
35.1
53.9
27.8
67.7
-29.2
-58.7
-22.9
-67.7
2.0
35.4
55.0
28.0
69.8
-29.2
-60.0
-22.9
-69.8
2.1
35.6
56.1
28.1
71.6
-29.3
-61.2
-23.0
-71.6
2.2
35.8
57.1
28.2
73.3
-29.5
-62.4
-23.0
-73.3
2.3
36.1
57.7
28.3
74.9
-29.5
-63.1
-23.1
-74.9
2.4
36.3
58.2
28.3
76.4
-29.6
-63.8
-23.2
-76.4
2.5
36.5
58.7
28.4
77.7
-29.7
-64.4
-23.2
-77.7
2.6
36.7
59.2
28.5
78.8
-29.8
-65.1
-23.3
-78.8
2.7
36.8
59.6
28.6
79.7
-29.9
-65.8
-23.3
-79.7
Data Sheet
67
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
4.4
AC Characteristics
(Notes 1-5 apply to the following Tables; Electrical Characteristics and DC Operating Conditions, AC Operating
Conditions, IDD Specifications and Conditions, and Electrical Characteristics and AC Timing.)
Notes
1. All voltages referenced to VSS.
2. Tests for AC timing, IDD, and electrical, AC and DC characteristics, may be conducted at nominal reference/
supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage
range specified.
3. Figure 38 represents the timing reference load used in defining the relevant timing parameters of the part. It
is not intended to be either a precise representation of the typical system environment nor a depiction of the
actual load presented by a production tester. System designers will use IBIS or other simulation tools to
correlate the timing reference load to a system environment. Manufacturers will correlate to their production
test conditions (generally a coaxial transmission line terminated at the tester electronics).
4. AC timing and IDD tests may use a VIL to VIH swing of up to 1.5 V in the test environment, but input timing is
still referenced to VREF (or to the crossing point for CK, CK), and parameter specifications are guaranteed for
the specified AC input levels under normal use conditions. The minimum slew rate for the input signals is 1 V/
ns in the range between VIL(AC) and VIH(AC).
5. The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e. the receiver effectively
switches as a result of the signal crossing the AC input level, and remains in that state as long as the signal
does not ring back above (below) the DC input LOW (HIGH) level).
6. For System Characteristics like Setup & Holdtime Derating for Slew Rate, I/O Delta Rise/Fall Derating, DDR
SDRAM Slew Rate Standards, Overshoot & Undershoot specification and Clamp V-I characteristics see the
latest JEDEC specification for DDR components.
VTT
50 Ω
Output
(VOUT)
Timing Reference Point
30 pF
Figure 38
Data Sheet
AC Output Load Circuit Diagram / Timing Reference Load
68
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 20
AC Operating Conditions1)
Parameter
Symbol
Values
Min.
Input High (Logic 1) Voltage, DQ, DQS and DM Signals
Input Low (Logic 0) Voltage, DQ, DQS and DM Signals
Input Differential Voltage, CK and CK Inputs
Input Closing Point Voltage, CK and CK Inputs
VIH(AC)
VIL(AC)
VID(AC)
VIX(AC)
Unit Note/
Test
Condition
Max.
VREF + 0.31 —
—
VREF – 0.31
0.7
VDDQ + 0.6
0.5 × VDDQ 0.5 × VDDQ
– 0.2
V
2)3)
V
2)3)
V
2)3)4)
V
2)3)5)
+ 0.2
1) VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR200 - DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V (DDR400);
0 °C ≤ TA ≤ 70 °C
2) Input slew rate = 1 V/ns.
3) Inputs are not recognized as valid until VREF stabilizes.
4) VID is the magnitude of the difference between the input level on CK and the input level on CK.
5) The value of VIX is expected to equal 0.5 × VDDQ of the transmitting device and must track variations in the DC level of the
same.
Table 21
AC Timing - Absolute Specifications for PC3200 and PC2700
Parameter
Symbol –5
–6
DDR400B
Unit Note/ Test
Condition 1)
DDR333
Min.
Max.
Min.
Max.
DQ output access time from
CK/CK
tAC
–0.5
+0.5
–0.7
+0.7
ns
2)3)4)5)
CK high-level width
tCH
tCK
0.45
0.55
0.45
0.55
tCK
2)3)4)5)
5
8
6
12
ns
CL = 3.0
6
12
6
12
ns
7.5
12
7.5
12
ns
0.45
0.55
0.45
0.55
tCK
tCK
2)3)4)5)
Clock cycle time
tCL
Auto precharge write recovery tDAL
CK low-level width
+ precharge time
(tWR/tCK)+(tRP/tCK)
2)3)4)5)
CL = 2.5
2)3)4)5)
CL = 2.0
2)3)4)5)
2)3)4)5)6)
tDH
tDIPW
0.4
—
0.45
—
ns
2)3)4)5)
1.75
—
1.75
—
ns
2)3)4)5)6)
DQS output access time from
CK/CK
tDQSCK
–0.6
+0.6
–0.6
+0.6
ns
2)3)4)5)
DQS input low (high) pulse
width (write cycle)
tDQSL,H 0.35
—
0.35
—
tCK
2)3)4)5)
DQS-DQ skew (DQS and
associated DQ signals)
tDQSQ
—
+0.40
—
+0.40
ns
—
+0.40
—
+0.45
ns
DQ and DM input hold time
DQ and DM input pulse width
(each input)
TFBGA
2)3)4)5)
TSOPII
2)3)4)5)
Write command to 1st DQS
latching transition
tDQSS
0.72
1.25
0.75
1.25
tCK
2)3)4)5)
DQ and DM input setup time
tDS
0.4
—
0.45
—
ns
2)3)4)5)
Data Sheet
69
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 21
AC Timing - Absolute Specifications for PC3200 and PC2700
Parameter
Symbol –5
–6
DDR400B
Unit Note/ Test
Condition 1)
DDR333
Min.
Max.
Min.
Max.
DQS falling edge hold time
from CK (write cycle)
tDSH
0.2
—
0.2
—
tCK
2)3)4)5)
DQS falling edge to CK setup
time (write cycle)
tDSS
0.2
—
0.2
—
tCK
2)3)4)5)
tHP
Data-out high-impedance time tHZ
Clock Half Period
min. (tCL, tCH) —
min. (tCL, tCH) —
ns
2)3)4)5)
—
+0.7
–0.7
+0.7
ns
2)3)4)5)7)
0.6
—
0.75
—
ns
fast slew rate
0.7
—
0.8
—
ns
slow slew
rate3)4)5)6)8)
from CK/CK
Address and control input hold tIH
time
3)4)5)6)8)
Control and Addr. input pulse
width (each input)
tIPW
2.2
—
2.2
—
ns
2)3)4)5)9)
Address and control input
setup time
tIS
0.6
—
0.75
—
ns
fast slew rate
0.7
—
0.8
—
ns
slow slew
rate3)4)5)6)8)
3)4)5)6)8)
Data-out low-impedance time
from CK/CK
tLZ
–0.7
+0.70
–0.70
+0.70
ns
2)3)4)5)7)
Mode register set command
cycle time
tMRD
2
—
2
—
tCK
2)3)4)5)
DQ/DQS output hold time
tQH
tQHS
tHP –tQHS
—
tHP –tQHS
—
ns
2)3)4)5)
—
+0.50
—
+0.50
ns
—
+0.50
—
+0.55
ns
tRCD
—
tRCD
—
ns
2)3)4)5)
40
70E+3
42
70E+3 ns
2)3)4)5)
Data hold skew factor
Active to Autoprecharge delay tRAP
Active to Precharge command tRAS
TFBGA
2)3)4)5)
TSOPII
2)3)4)5)
Active to Active/Auto-refresh
command period
tRC
55
—
60
—
ns
2)3)4)5)
Active to Read or Write delay
tRCD
tREFI
15
—
18
—
ns
2)3)4)5)
—
7.8
—
7.8
µs
2)3)4)5)8)
tRFC
70
—
72
—
ns
2)3)4)5)
15
—
18
—
ns
2)3)4)5)
0.9
1.1
0.9
1.1
2)3)4)5)
0.40
0.60
0.40
0.60
tCK
tCK
10
—
12
—
ns
2)3)4)5)
0.25
—
0.25
—
tCK
2)3)4)5)
0
—
0
—
ns
2)3)4)5)10)
Average Periodic Refresh
Interval
Auto-refresh to Active/Autorefresh command period
tRP
Read preamble
tRPRE
Read postamble
tRPST
Active bank A to Active bank B tRRD
Precharge command period
2)3)4)5)
command
Write preamble
Write preamble setup time
Data Sheet
tWPRE
tWPRES
70
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 21
AC Timing - Absolute Specifications for PC3200 and PC2700
Parameter
Symbol –5
–6
DDR400B
tWPST
Write recovery time
tWR
Internal write to read command tWTR
Write postamble
Unit Note/ Test
Condition 1)
DDR333
Min.
Max.
Min.
Max.
0.40
0.60
0.40
0.60
tCK
2)3)4)5)11)
15
—
15
—
ns
2)3)4)5)
2
—
1
—
tCK
2)3)4)5)
delay
Exit self-refresh to non-read
command
tXSNR
75
—
75
—
ns
2)3)4)5)
Exit self-refresh to read
command
tXSRD
200
—
200
—
tCK
2)3)4)5)
1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V
(DDR400)
2) Input slew rate ≥ 1 V/ns for DDR400, DDR333
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference
level for signals other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT.
6) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock
cycle time.
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/
ns, measured between VIH(ac) and VIL(ac).
9) These parameters guarantee device timing, but they are not necessarily tested on each device.
10) The specific requirement is that DQS be valid (HIGH,LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specificationsof the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW at this time, depending on tDQSS.
11) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
Table 22
AC Timing - Absolute Specifications for PC2700
Parameter
Symbol –7
Unit
Note/Test
Condition 1)
DDR266A
DQ output access time from CK/CK
CK high-level width
Clock cycle time
CK low-level width
Auto precharge write recovery + precharge
time
DQ and DM input hold time
DQ and DM input pulse width (each input)
Data Sheet
Min.
Max.
–0.75
+0.75
ns
2)3)4)5)
0.45
0.55
tCK
2)3)4)5)
7.5
12
ns
CL = 3.03)4)5)
7.5
12
ns
CL = 2.52)3)4)5)
7.5
12
ns
CL = 2.02)3)4)5)
tCL
tDAL
0.45
0.55
2)3)4)5)
(tWR/tCK)+(tRP/tCK) —
tCK
tCK
tDH
tDIPW
0.5
—
ns
2)3)4)5)
1.75
—
ns
2)3)4)5)6)
tAC
tCH
tCK
71
2)3)4)5)6)
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 22
AC Timing - Absolute Specifications for PC2700 (cont’d)
Parameter
Symbol –7
Unit
Note/Test
Condition 1)
+0.75
ns
2)3)4)5)
—
tCK
2)3)4)5)
+0.5
ns
FBGA2)3)4)5)
DDR266A
Min.
tDQSCK –0.75
DQS input low (high) pulse width (write cycle) tDQSL,H 0.35
DQS-DQ skew (DQS and associated DQ
tDQSQ —
DQS output access time from CK/CK
Max.
signals)
—
+0.5
ns
TSOPII 2)3)4)5)
Write command to 1st DQS latching transition tDQSS
DQ and DM input setup time
tDS
0.75
1.25
tCK
2)3)4)5)
0.5
—
ns
2)3)4)5)
DQS falling edge hold time from CK (write
cycle)
tDSH
0.2
—
tCK
2)3)4)5)
DQS falling edge to CK setup time (write
cycle)
tDSS
0.2
—
tCK
2)3)4)5)
Clock Half Period
tHP
tHZ
tIH
min. (tCL, tCH)
—
ns
2)3)4)5)
–0.75
+0.75
ns
2)3)4)5)7)
0.9
—
ns
fast slew rate
1.0
—
ns
slow slew rate
Data-out high-impedance time from CK/CK
Address and control input hold time
3)4)5)6)8)
3)4)5)6)8)
Control and Addr. input pulse width (each
input)
tIPW
2.2
—
ns
2)3)4)5)9)
Address and control input setup time
tIS
0.9
—
ns
fast slew rate
1.0
—
ns
slow slew rate
–0.75
+0.75
ns
2)3)4)5)7)
2
—
tCK
2)3)4)5)
ns
2)3)4)5)
Data-out low-impedance time from CK/CK
Mode register set command cycle time
DQ/DQS output hold time
Data hold skew factor
Active to Read w/AP delay
Active to Precharge command
Active to Active/Auto-refresh command
period
Active to Read or Write delay
Average Periodic Refresh Interval
Auto-refresh to Active/Auto-refresh
command period
Precharge command period
Read preamble
Read postamble
Active bank A to Active bank B command
Write preamble
Write preamble setup time
Data Sheet
tLZ
tMRD
tQH
tQHS
tHP – tQHS
3)4)5)6)8)
3)4)5)6)8)
—
0.75
ns
FBGA2)3)4)5)
—
0.75
ns
TSOPII2)3)4)5)
tRAP
tRAS
tRC
tRCD
—
ns
2)3)4)5)
45
120E+3
ns
2)3)4)5)
65
—
ns
2)3)4)5)
tRCD
tREFI
tRFC
20
—
ns
2)3)4)5)
7.8
—
µs
2)3)4)5)10)
75
—
ns
2)3)4)5)
tRP
tRPRE
tRPST
tRRD
tWPRE
tWPRES
20
—
ns
2)3)4)5)
2)3)4)5)
0.9
1.1
0.4
0.6
tCK
tCK
15
—
ns
2)3)4)5)
0.25
—
tCK
2)3)4)5)
0
—
ns
2)3)4)5)11)
72
2)3)4)5)
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 22
AC Timing - Absolute Specifications for PC2700 (cont’d)
Parameter
Symbol –7
Unit
Note/Test
Condition 1)
DDR266A
Write postamble
Write recovery time
Internal write to read command delay
Exit self-refresh to non-read command
Exit self-refresh to read command
tWPST
tWR
tWTR
tXSNR
tXSRD
Min.
Max.
0.4
—
tCK
2)3)4)5)12)
15
—
ns
2)3)4)5)
1
—
tCK
2)3)4)5)
ns
2)3)4)5)13)
tCK
2)3)4)5)
75
200
—
1) VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V ; 0 °C ≤ TA ≤ 70 °C
2) Input slew rate ≥ 1 V/ns
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference
level for signals other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT.
6) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock
cycle time.
7) tHZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred
to a specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/
ns, measured between VIH(ac) and VIL(ac).
9) These parameters guarantee device timing, but they are not necessarily tested on each device.
10) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
11) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge.
A valid transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were
previously in progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress,
DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS.
12) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but
system performance (bus turnaround) degrades accordingly.
13) In all circumstances, tXSNR can be satisfied using tXSNR = tRFC,min + 1 × tCK
Data Sheet
73
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
Table 23
IDD Conditions
Parameter
Symbol
Operating Current: one bank; active/ precharge; tRC = tRCMIN; tCK = tCKMIN;
DQ, DM, and DQS inputs changing once per clock cycle; address and control inputs changing once
every two clock cycles.
IDD0
Operating Current: one bank; active/read/precharge; Burst = 4;
Refer to the following page for detailed test conditions.
IDD1
Precharge Power-Down Standby Current: all banks idle; power-down mode; CKE ≤ VILMAX; tCK =
IDD2P
tCKMIN
Precharge Floating Standby Current: CS ≥ VIHMIN, all banks idle;
IDD2F
CKE ≥ VIHMIN; tCK = tCKMIN, address and other control inputs changing once per clock cycle, VIN = VREF
for DQ, DQS and DM.
Precharge Quiet Standby Current:
CS ≥ VIHMIN, all banks idle; CKE ≥ VIHMIN; tCK = tCKMIN, address and other control inputs stable
at ≥ VIHMIN or ≤ VILMAX; VIN = VREF for DQ, DQS and DM.
IDD2Q
Active Power-Down Standby Current: one bank active; power-down mode;
CKE ≤ VILMAX; tCK = tCKMIN; VIN = VREF for DQ, DQS and DM.
IDD3P
Active Standby Current: one bank active; CS ≥ VIHMIN; CKE ≥ VIHMIN; tRC = tRASMAX; tCK = tCKMIN; IDD3N
DQ, DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per
clock cycle.
Operating Current: one bank active; Burst = 2; reads; continuous burst; address and control inputs
IDD4R
changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 2 for DDR200
and DDR266A, CL = 3 for DDR333; tCK = tCKMIN; IOUT = 0 mA
Operating Current: one bank active; Burst = 2; writes; continuous burst; address and control inputs IDD4W
changing once per clock cycle; 50% of data outputs changing on every clock edge; CL = 2 for DDR200
and DDR266A, CL = 3 for DDR333; tCK = tCKMIN
Auto-Refresh Current: tRC = tRFCMIN, burst refresh
Self-Refresh Current: CKE ≤ 0.2 V; external clock on; tCK = tCKMIN
Operating Current: four bank; four bank interleaving with BL = 4; Refer to the following page for
detailed test conditions.
Data Sheet
74
IDD5
IDD6
IDD7
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
IDD Specification
Table 24
Symbol –5
DDR400B
IDD0
IDD1
IDD2P
IDD2F
IDD2Q
IDD3P
IDD3N
IDD4R
IDD4W
IDD5
IDD6
IDD7
–6
–7
DDR333
DDR266A
Unit Note/Test Condition1)
Typ.
Max.
Typ.
Max.
Typ.
Max.
70
90
60
75
50
65
mA
×4/×8 2)3)
75
90
65
75
55
65
mA
×16 3)
80
100
70
85
65
75
mA
×4/×8 3)
95
110
80
95
70
85
mA
×16 3)
4
5
4
5
3
4
mA
3)
30
36
25
30
20
24
mA
3)
20
28
17
24
15
21
mA
3)
13
18
11
15
9
13
mA
3)
38
45
32
38
28
36
mA
3)
43
54
36
45
30
40
mA
×16 3)
85
100
70
85
60
70
mA
×4/×8 3)
100
120
85
100
70
85
mA
×16 3)
90
105
75
90
65
75
mA
×4/×8 3)
100
130
90
110
75
90
mA
×16 3)
140
190
120
160
100
140
mA
3)
1.4
2.8
1.4
2.8
1.4
2.8
mA
4)
—
—
1.0
1.1
—
—
mA
low power 5)
210
250
180
215
140
170
mA
×4/×8 3)
210
250
180
215
140
170
mA
×16 3)
1) Test conditions for typical values: VDD = 2.5 V (DDR333), VDD = 2.6 V (DDR400), TA = 25 °C, test conditions for maximum
values: VDD = 2.7 V, TA = 10 °C
2) IDD specifications are tested after the device is properly initialized and measured at 133 MHz for DDR266, 166 MHz for
DDR333, and 200 MHz for DDR400.
3) Input slew rate = 1 V/ns.
4) Enables on-chip refresh and address counters.
5) Low power available on request
4.5
IDD Current Measurement Conditions
Legend: A = Activate, R = Read, RA = Read with Autoprecharge, P = Precharge, N = NOP or DESELECT
IDD1: Operating Current: One Bank Operation
1. General test condition
a) Only one bank is accessed with tRC,MIN.
b) Burst Mode, Address and Control inputs are changing once per NOP and DESELECT cycle.
c) 50% of data changing at every transfer
d) IOUT = 0 mA.
2. Timing patterns
a) DDR266A (133 MHz, CL = 2): tCK = 7.5 ns, BL = 4, tRCD = 3 × tCK, tRC = 9 × tCK, tRAS = 5 × tCK
Setup: A0 N N R0 N P0 N N N
Read: A0 N N R0 N P0 N NN - repeat the same timing with random address changing
Data Sheet
75
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Electrical Characteristics
b) DDR333B (166 MHz, CL = 2.5): tCK = 6 ns, BL = 4, tRCD = 3 × tCK, tRC = 9 × tCK, tRAS = 5 × tCK
Setup: A0 N N R0 N P0 N N N
Read: A0 N N R0 N P0 N N N - repeat the same timing with random address changing
c) DDR400B (200 MHz, CL = 3): tCK = 5 ns, BL = 4, tRCD = 3 × tCK, tRC = 11 × tCK, tRAS = 8 × tCK
Setup:A0 N N R0 N N N N P0 N N
Read: A0 N N R0 N N N N P0 N N -repeat the same timing with random address changing
IDD7: Operating Current: Four Bank Operation
1. General test condition
a) Four banks are being interleaved with tRCMIN.
b) Burst Mode, Address and Control inputs on NOP edge are not changing.
c) 50% of data changing at every transfer
d) IOUT = 0 mA.
2. Timing patterns
a) DDR266A (133 MHz, CL = 2): tCK = 7.5 ns, BL = 4, tRRD = 2 × tCK, tRCD = 3 × tCK, tRAS = 5 × tCK
Setup: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3
Read: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3 - repeat the same timing with random address changing
b) DDR333B (166 MHz, CL = 2.5): tCK = 6 ns, BL = 4, tRRD = 2 × tCK, tRCD = 3 × tCK, tRAS = 5 × tCK
Setup: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3
Read: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3 - repeat the same timing with random address changing
c) DDR400B (200 MHz, CL = 3): tCK = 5 ns, BL = 4, tRRD = 2 × tCK, tRCD = 3 *× tCK, tRAS = 8 × tCK
Setup: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3 N
Read: A0 N A1 RA0 A2 RA1 A3 RA2 N RA3 N - repeat the same timing with random address
Data Sheet
76
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
5
Timing Diagrams
The timing diagrams in this chapter give an overview of possible and recommended command sequences.
5.1
Write Command: Data Input Timing
Figure 39 shows DQS versus DQ and DM Timing during write burst.
tDQSL
tDQSH
DQS
tDH
tDS
DI n
DQ
tDH
tDS
DM
DI n = Data In for column n.
3 subsequent elements of data in are applied in programmed order following DI n.
Figure 39
Data Sheet
Don’t Care
Data Input (Write), Timing Burst Length = 4
77
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
5.2
Read Command: Data Output Timing
Figure 40 shows DQS versus DQ Timing during read burst.
DQS
tDQSQ max
tQH
DQ
tQH (Data output hold time from DQS)
tDQSQ and tQH are only shown once and are shown referenced to different edges of DQS, only for clarify of illustration.
t.DQSQ and tQH both apply to each of the four relevant edges of DQS.
tDQSQ max. is used to determine the worst case setup time for controller data capture.
tQH is used to determine the worst case hold time for controller data capture.
Figure 40
Data Sheet
Data Output (Read), Timing Burst Length = 4
78
Rev. 1.6, 2004-12
Figure 41
Data Sheet
79
High-Z
High-Z
200µs
Power-up:
VDD and CK
stable
LVCMOS LOW LEVEL
Don’t Care
DQ
DQS
BA0, BA1
A10
A0-A9, A11
DM
Command
CKE
CK
CK
VREF
tVTD
tIH
tIH
NOP
tIS
tIS
tCH
tIH
PRE
tIS
tCL
tIH
tIH
tIH
BA1=L
BA0=H
tIS
CODE
tIS
CODE
tIS
EMRS
tMRD
Extended Mode
Register Set
ALL BANKS
tCK
tIH
tRP
ALL BANKS
tIS
PRE
Load Mode
Register, Reset DLL
BA1=L
BA0=L
CODE
CODE
MRS
tMRD
AR
tRFC
AR
BA1=L
BA0=L
CODE
CODE
MRS
tMRD
Load Mode
Register
(with A8 = L)
tRFC
200 cycles of CK**
The two Autorefresh commands may be moved to follow the first MRS,
but precede the second Precharge All command.
** tMRD is required before any command can be applied and
200 cycles of CK are required before a Read command can be applied.
* VTT is not applied directly to the device, however tVTD must be
greater than or equal to zero to avoid device latchup.
BA
RA
RA
ACT
5.3
VTT (System*)
VDDQ
VDD
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Initialization and Mode Register Set Command
Figure 41 shows the timing diagram for initialization and Mode Register Sets.
Initialize and Mode Register Sets
Rev. 1.6, 2004-12
Figure 42
Data Sheet
80
tIH
tIH
VALID
tIS
VALID*
tIS
tIH
NOP
Enter Power
Down Mode
tIS
tCH
tCL
No column accesses are allowed to be in progress at the time power down is entered.
* = If this command is a Precharge (or if the device is already in the idle state) then the power down mode
shown is Precharge power down. If this command is an Active (or if at least one row is already active), then
the power down mode shown is Active power down.
DM
DQ
DQS
ADDR
Command
CKE
tIS
tCK
NOP
Exit Power
Down Mode
tIS
Don’t Care
VALID
VALID
5.4
CK
CK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Power: Power Down Mode Command
Figure 42 shows the timing diagram for Power Down Mode.
Power Down Mode
Rev. 1.6, 2004-12
Figure 43
Data Sheet
NOP
AR
NOP
AR
NOP
NOP
ACT
81
tIH
BANK(S)
tIS
ONE BANK
PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address; AR = Autorefresh.
NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
DM, DQ, and DQS signals are all don't care/high-Z for operations shown.
DM
DQ
DQS
BA0, BA1
A10
Don’t Care
BA
RA
RA
ALL BANKS
NOP
VALID
tRFC
A9, A11,A12
PRE
VALID
tRFC
RA
NOP
tIH
tIH
tCL
A0-A8
Command
tIS
tIS
tCK
tRP
5.5
CKE
CK
CK
tCH
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Refresh: Auto Refresh Mode Command
Figure 43 shows the timing diagram for Auto Refresh Mode.
Auto Refresh Mode
Rev. 1.6, 2004-12
Figure 44
Data Sheet
82
DM
DQ
DQS
ADDR
Command
NOP
tIH
tIH
tIS
AR
Enter Self
Refresh Mode
tCL
* = Device must be in the all banks idle state before entering Self Refresh Mode.
** = tXSNR is required before any non-read command can be applied, and tXSRD (200 cycles of CK).
are required before a Read command can be applied.
tIS
tIS
tCH
tCK
NOP
Exit Self
Refresh Mode
tXSRD, tXSRN
tIS
200 cycles
tIS
tIH
Don’t Care
VALID
VALID
5.6
CKE
CK
CK
tRP*
Clock must be stable before exiting Self Refresh Mode
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Refresh: Self Refresh Mode Command
Figure 44 shows the timing diagram for Self Refresh Mode.
Self Refresh Mode
Rev. 1.6, 2004-12
Figure 45
Data Sheet
83
Case 2:
tAC/tDQSCK = max
Case 1:
tAC/tDQSCK = min
NOP
tIH
tIH
tIH
tIH
tIH
BA x
tIS
DIS AP
tIS
COL n
tIS
Read
CL=2
PRE
tLZ (max)
tLZ (max)
tRPRE
DO n
tAC (max)
DO n
tAC (min)
BA x*
ONE BANK
ALL BANKS
tLZ (min)
tRPRE
NOP
tCL
NOP
tDQSCK (max)
NOP commands are shown for ease of illustration; other commands may be valid at these times.
DIS AP = Disable Auto Precharge.
* = Don't care if A10 is High at this point.
PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address.
BA x
RA
RA
ACT
tHZ (max)
tRPST
tHZ (min)
tIH
NOP
tDQSCK (min)
tRPST
tRP
3 subsequent elements of data out are provided in the programmed order following DO n.
DO n = data out from column n.
DQ
DQS
DQ
DQS
DM
BA0, BA1
A10
A0-A9, A11, A12
Command
tIS
tIS
tCH
NOP
VALID
NOP
VALID
Don’t Care
NOP
VALID
5.7
CKE
CK
CK
tCK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Read: Without Auto Precharge Command
Figure 45 shows the timing diagram for Read without Auto Precharge.
Read without Auto Precharge (Burst Length = 4)
Rev. 1.6, 2004-12
Figure 46
Data Sheet
84
Case 2:
tAC/tDQSCK = max
Case 1:
tAC/tDQSCK = min
DQ
DQS
DQ
DQS
DM
BA0, BA1
A10
A0-A9, A11, A12
Command
tIH
tIH
tIH
tIH
tIH
BA x
tIS
EN AP
tIS
COL n
tIS
Read
DO n
tAC (max)
DO n
tAC (min)
NOP
tLZ (max)
tRPRE
tLZ (max)
CL=2
tLZ (min)
tLZ (min)
tRPRE
NOP
tCL
NOP
BA x
RA
RA
ACT
tDQSCK (max)
tHZ (max)
tRPST
tHZ (min)
tIH
NOP
tDQSCK (min)
tRPST
tRP
NOP
VALID
DO n = data out from column n.
3 subsequent elements of data out are provided in the programmed order following DO n.
EN AP = enable Auto Precharge.
ACT = active; RA = row address.
NOP commands are shown for ease of illustration; other commands may be valid at these times.
NOP
tIS
tIS
tCH
NOP
VALID
Don’t Care
NOP
VALID
5.8
CKE
CK
CK
tCK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Read: With Auto Precharge Command
Figure 46 shows the timing diagram for Read with Auto Precharge.
Read with Auto Precharge (Burst Length = 4)
Rev. 1.6, 2004-12
Figure 47
Data Sheet
85
DQ
DQS
DQ
BA x
tIH
tRCD
NOP
tIH
tRAS
BA x
DIS AP
tIS
COL n
Read
tCL
tRC
CL=2
tLZ (max)
DO n
tAC (max)
DO n
tAC (min)
BA x*
ONE BANK
tLZ (max)
tRPRE
tLZ (min)
PRE
ALL BANKS
tLZ (min)
tRPRE
NOP
DO n = data out from column n.
3 subsequent elements of data out are provided in the programmed order following DO n.
DIS AP = disable Auto Precharge.
* = Don't care if A10 is High at this point.
PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address.
NOP commands are shown for ease of illustration; other commands may be valid at these times.
Case 2:
tAC/tDQSCK = max
Case 1:
tAC/tDQSCK = min
DQS
DM
BA0, BA1
tIS
RA
tIH
A10
tIS
ACT
RA
NOP
tIH
tIH
A0-A9, A11, A12
Command
tIS
tIS
tCH
NOP
BA x
RA
RA
ACT
tHZ (max)
tHZ (min)
tRPST
tDQSCK (max)
tDQSCK (min)
tRPST
tRP
NOP
Don’t Care
NOP
VALID
5.9
CKE
CK
CK
tCK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Read: Bank Read Access Command
Figure 47 shows the timing diagram for Read Bank Read Access.
Bank Read Access (Burst Length = 4)
Rev. 1.6, 2004-12
Figure 48
Data Sheet
86
DM
DQ
DQS
BA0, BA1
A10
A0-A9, A11, A12
Command
CKE
tIH
tIH
tIH
tIH
tWPRES
tDQSS
tIH
BA x
tIS
DIS AP
tIS
COL n
tIS
Write
DIn
tDQSH
tWPRE
NOP
tDQSL
tCL
NOP
tWPST
tDSH
NOP
tIH
NOP
tWR
PRE
BA x*
ONE BANK
ALL BANKS
tDQSS = min.
DIn = Data in for column n.
3 subsequent elements of data in are applied in the programmed order following DIn.
DIS AP = Disable Auto Precharge.
* = Don't care if A10 is High at this point.
PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address.
NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
NOP
tIS
tIS
tCH
NOP
VALID
tRP
NOP
Don’t Care
BA
RA
RA
ACT
5.10
CK
CK
tCK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Write: Without Auto Precharge Command
Figure 48 shows the timing diagram for Write without Auto Precharge.
Write without Auto Precharge (Burst Length = 4)
Rev. 1.6, 2004-12
Figure 49
Data Sheet
87
DM
DQ
DQS
BA0, BA1
A10
A0-A9, A11, A12
Command
CKE
tIH
tIH
tWPRE
tWPRES
tDQSS
tIH
BA x
tIS
EN AP
tIS
COL n
tIS
Write
DIn
tDQSH
NOP
tDQSL
tCL
NOP
tWPST
tDSH
NOP
NOP
VALID
tWR
DIn = Data in for column n.
3 subsequent elements of data in are applied in the programmed order following DIn.
EN AP = Enable Auto Precharge.
ACT = Active; RA = Row address; BA = Bank address.
NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
tDQSS = min.
tIH
tIH
NOP
tIS
tIS
tCH
NOP
VALID
tDAL
NOP
VALID
tRP
NOP
Don’t Care
BA
RA
RA
ACT
5.11
CK
CK
tCK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Write: With Auto Precharge Command
Figure 49 shows the timing diagram for Write with Auto Precharge.
Write with Auto Precharge (Burst Length = 4)
Rev. 1.6, 2004-12
Figure 50
Data Sheet
tIH
88
DM
DQ
DQS
BA0, BA1
tIH
tIH
tRCD
NOP
tIH
tWPRES
BA x
tDQSS
DIS AP
tIS
Col n
Write
tCL
DIn
tDSH
tDQSL
tWPRE
tDQSH
NOP
tRAS
NOP
tWPST
NOP
tDQSS = min.
DI n = data in for column n.
3 subsequent elements of data in are applied in the programmed order following DI n.
DIS AP = Disable Auto Precharge.
* = don't care if A10 is High at this point.
PRE = Precharge; ACT = Active; RA = Row address.
NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
BA x
tIS
RA
A10
tIS
ACT
RA
NOP
tIS
tIH
A0-A9, A11, A12
Command
CKE
tIS
tCH
tWR
NOP
BA x
ONE BANK
ALL BANKS
PRE
Don’t Care
NOP
VALID
5.12
CK
CK
tCK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Write: Bank Write Access Command
Figure 50 shows the timing diagram for Bank Write Access.
Bank Write Access (Burst Length = 4)
Rev. 1.6, 2004-12
Figure 51
Data Sheet
89
DM
DQ
DQS
BA0, BA1
A10
A0-A9, A11, A12
Command
tIH
tIH
tIH
tIH
tIH
tWPRES
BA x
tIS
tDQSS
DIS AP
tIS
COL n
tIS
Write
DIn
tDQSH
NOP
tDQSL
tCL
NOP
tWPST
tDSH
NOP
tWR
NOP
BA x*
ONE BANK
ALL BANKS
PRE
NOP
VALID
DI n = data in for column n.
3 subsequent elements of data in are applied in the programmed order following DI n (the second element of the 4 is masked).
DIS AP = Disable Auto Precharge.
* = Don't care if A10 is High at this point.
PRE = Precharge; ACT = Active; RA = Row address; BA = Bank address.
NOP commands are shown for ease of illustration; other valid commands may be possible at these times.
tDQSS = min.
NOP
tIS
tIS
tCH
tRP
NOP
Don’t Care
BA
RA
RA
ACT
5.13
CKE
CK
CK
tCK
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Timing Diagrams
Write: DM Operation
Figure 51 shows the timing diagram for DM Operation.
Write DM Operation (Burst Length = 4)
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
System Characteristics for DDR SDRAMs
6
System Characteristics for DDR SDRAMs
The following specification parameters are required in systems using DDR400, DDR333 & DDR266 devices to
ensure proper system performance. These characteristics are for system simulation purposes and are not subject
to production test - verified by design/characterization.
Table 25
Input Slew Rate for DQ, DQS, and DM
AC Characteristics
Symbol
DDR400
Parameter
DDR266
Units Notes
Min. Max. Min. Max. Min. Max.
DM/DQS inout slew rate measured berween DCSLEW 0.5
VIH(DC), VIL (DC), and VIL(DC), VIH (DC)
1)
DDR333
4.0
0.5
4.0
0.5
4.0
V/ns
1)2)
Pullup slew rate is characterized under the test conditions as shown in Figure 52.
2) DQS, DM, amd DQ input slew rate is specified to prevent doble clocking of data and preserve setup and hold times. Signal
transitions through the DC region must be monotonic.
Table 26
Input Setup & Hold Time Derating for Slew Rate
Input Slew Rate
∆tIS
tIH
Units
Notes
0.5 V/ns
0
0
ps
1)
0.4 V/ns
+50
0
ps
0.3 V/ns
+100
0
ps
1) A derating factor will be used to increase tIS and tIH in the case where the input slew rate is below 0.5 V/ns as shown in
Table 26. The input slew rate is based on the lesser of the slew rates determined by either VIH (AC) to VIL (AC) or VIH (DC)
to VIL (DC), similarly for rising transitions. Aderating factor applies to speed bins DDR200, DDR266, and DDR333.
Table 27
Input/Output Setup and Hold TIme Derating for Slew Rate
I/O Input Slew Rate
∆tDS
tDH
Units
Notes
1)
0.5 ns/V
0
0
ps
0.4 ns/V
+75
+75
ps
0.3 ns/V
+100
+100
ps
1) Table 27 is used to increase tDS and tDH in the case where the I/O slew rate is below 0.5 V/ns. The I/O slew rate is based
on the lesser of the AV – AC slew rate and the DC – DC slew rate. The input slew rate is based on the lesser of the slew
rates determined by either VIH (AC) to VIL (AC) or VIH (DC) to VIL (DC), and similarly for rising transitions. A derating factor
applies to speed bins DDR200, DDR266 and DDR333.
Table 28
Input/Output Setup and Hold Derating for Rise/Fall Delta Slew Rate
Delta Slew Rate
∆tDS
tDH
Units
Notes
1)
±0.0 ns/V
0
0
ps
±0.25 ns/V
+50
+50
ps
±0.5 ns/V
+100
+100
ps
1) A derating factor will be used to increase tDS and tDH in the case where DQ, DM and DQS slew rates differ, as shown in
Figure 27 & Figure 28. Input slew rate is based on the larger of AC – AC delta rise, fall rate and DC – DC delta rise, fall
rate. Input slew rate is based on the lesser of the slew rates determined by either VIH (AC) to VIL (AC) or VIH (DC) to VIL
(DC), similarly for rising transitions.
The delta rise/fall rate is calculated as:{1/(Slew Rate1)} – {1/(Slew Rate2)}
For example: If Slew Rate 1 is 0.5 V/ns and Slew Rate 2 is 0.4 V/ns, then the delta rise, fall rate is –0.5 ns/V. Using the
table given, this would result in the need for an increase in tDS and tDH of 100 ps. A derating factor applies to speed bins
DDR200, DDR266, and DDR333.
Data Sheet
90
Rev. 1.6, 2004-12
08012003-8754-PAQX
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
System Characteristics for DDR SDRAMs
Table 29
Output Slew Rate Characteristrics (×4, ×8 Devices only)
Slew Rate Characteristic
Typical Range (V/ns) Minimum (V/ns)
Maximum (V/ns) Notes
Pullup Slew Rate
1.2 – 2.5
1.0
4.5
1)2)3)4)5)6)
Pulldown Slew Rate
1.2 – 2.5
1.0
4.5
2)3)4)5)7)
Table 30
Output Slew Rate Characteristics (×16 Devices only)
Slew Rate Characteristic
Typical Range (V/ns)
Minimum (V/ns)
Maximum(V/ns)
Notes
Pullup Slew Rate
1.2 – 2.5
0.7
5.0
1)2)3)4)5)6)
Pulldown Slew Rate
1.2 – 2.5
0.7
5.0
2)3)4)5)7)
1) Pullup slew rate is characterizted under the test conditions as shown in Figure 52
2) Pullup slew rate is measured between (VDDQ/2 – 320 mV ± 250 mV)
Pulldown slew rate is measured between (VDDQ/2 + 320 mV ± 250mV)
Pullup and Pulldown slew rate conditions are to be met for any pattern of data, including all outputs switching and only one
output switching.Example: For typical slew rate, DQ0 is switching.For minimum slew rate, all DQ bits are switchiung worst
case pattern. For maximum slew rate, only one DQ is switching from either high to low, or low to high the remainig DQ bits
remain the same as previous state.
3) Evaluation conditions: Typical: 25 °C (T Ambient), VDDQ = nominal, typical process.Minimum: 70 °C (T Ambient),
minimum, slow – slow process. Maximum: 0 °C (T Ambient), VDDQ = maximum, fast – fast process
VDDQ =
4) Verified under typical conditions for qualification purposes.
5) TSOP II package devices only.
6) Only intended for operation up to 266 Mbps per pin.
7) Pulldown slew rate is measured under the test conditions shown in Figure 53.
Table 31
Output Slew Rate Matching Ratio Characteristics
Slew Rate Characteristic
DDR266A
Parameter
Min. Max. Min. Max. Min.
Output SLew Rate Matching Ratio (Pullup to Pulldown) —
—
DDR266B
—
—
DDR200
0.71
Notes
Max.
1.4
1) 2)
1) The ratio of pullup slew rate to pulldown slew rate is specified for the same temperature and voltage, over the entire
temperature and voltage range. For a given output, it represents the maximum difference between pullup and pulldown
drivers due to process variation.
2) DQS, DM, and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times.
Signal transitions through the DC region must be monotonic
9''4
!
.6+F6+
(;9+!F%35+
Figure 52
Pullup slew rate test load
(;9+!F%35+
.6+F6+
!
9664
Figure 53
Data Sheet
Pulldown slew rate test load
91
Rev. 1.6, 2004-12
08012003-8754-PAQX
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Package Outlines
7
Package Outlines
There are two package types used for this product family each in lead-free and lead-containing assembly:
•
P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
Table 32
TFBGA Common Package Properties (non-green/green)
Description
Size
Units
Ball Size
0.460
mm
Recommended Landing Pad
0.350
mm
Recommended Solder Mask
0.450
mm
12
11 x 1 = 11
0.18 MAX.
1
B
3)
4)
A
5)
5)
8
8 x 0.8 = 6.4
1.8 MAX.
0.8
0.2
0.05 2)
1)
0.1 C
0.31 MIN.
1.2 MAX.
0.1 C
ø0.46 ±0.05
60x
ø0.15 M
A B
C
ø0.08 M
C SEATING PLANE
1.5 2)
2.24
4.25
1) A1 Marking Ballside
2) A1 Marking Chipside
3) Dummy Pads without Ball
4) Bad Unit Marking (BUM)
5) Middle of Packages Edges
Figure 54
Data Sheet
GPA09555
Package Outline of P-TFBGA-60-12 (non-green/green)
92
Rev. 1.6, 2004-12
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Package Outlines
Gage Plane
0.65 Basic
0.35 +0.1
-0.05
0.805 REF
10.16 ±0.13
0.25 Basic
1.20 MAX.
P-TSOPII: Plastic Thin Small Outline Package Type II
0.05 MIN.
•
0.1
Seating Plane
0.5 ±0.1
11.76 ±0.2
22.22 ±0.13
Lead 1
GPX09261
Figure 55
Data Sheet
Package Outline of P-TSOPII-66-1 (non-green/green)
93
Rev. 1.6, 2004-12
www.infineon.com
Published by Infineon Technologies AG