DATA SHEET HIGH FREQUENCY SMD type antennas for BT/802.11b/g application 2.45 GHz Product specification – Oct 12, 2004 V.4 size 5.3 × 2.0 Phycomp Product specification High Frequency SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 FEATURES DESCRIPTION • Designed for 2.45 GHz ISM-band This 2.45 GHz ceramic multilayer antenna has been designed to meet the requirements of the BluetoothTM(1) and IEEE 802.11b/g wireless communications protocol. It consists of a rectangular block of low-dielectric ceramic material and is fabricated in a water-based non-toxic process. The antenna is capable of providing good connectivity using near 50 Ω microstrip directly onto the PC board. • Simplifies antenna circuitry • NiSn lead-free terminations • Suitable for wave and reflow soldering • Supplied in tape on reel. APPLICATIONS • Telecommunications Notes • Computing (PCs, printers, PDAs) 1. • Wireless office data communications including WLAN Bluetooth is a trademark owned by Telefonieaktiebolaget L M Ericsson, Sweden. • Consumer electronics (wireless headphones). QUICK REFERENCE DATA DESCRIPTION VALUE Centre frequency 2.45 GHz 0 type/01type/02 type/03 type/Default/04 type/05 type Bandwidth ＞100 MHz Gain 4 dBi max. (depends on the special environment) VSWR 2.5 max. (depends on the special environment) Polarization Linear Azimuth beam width Omni-directional Impedance 50 Ω Power dissipation 1W Operating temperature −55 to +85 °C Terminations NiSn Resistance to soldering heat 260 °C for 10 seconds 2004 Oct 12 Rev.4 2 www.yageo.com Phycomp Product specification SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 High Frequency MECHANICAL DATA W W C L C T F F IWA0001 For dimensions see Table 1. Fig.1. Component outline. Physical dimensions Table 1 Antenna dimensions SYMBOL DETAILS DIMENSIONS (mm) L − 5.3 ±0.20 W − 2.0 ±0.20 T − 1.3 ±0.20 F feed termination 2.0 ±0.20 C − 0.4 ±0.25 2004 Oct 12 Rev.4 3 www.yageo.com Phycomp Product specification SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 High Frequency ELECTRICAL CHARACTERISTICS DESCRIPTION VALUE Centre frequency 2.45 GHz 0 type/01type/02 type/03 type/Default/04 type/05 type Bandwidth ＞100 MHz Gain 4 dBi max. (depends on the special environment) VSWR 2.5 max. (depends on the special environment) Polarization Linear Azimuth beam width Omni-directional Impedance 50 Ω Power dissipation 1W Operating temperature −55 to +85 °C Terminations NiSn Resistance to soldering heat 260 °C for 10 s Weight 0.05 g/piece FOOTPRINT DIMENSIONS L C C W F Antenna L1 IWA0002 For dimensions see Table 2. Fig.2. Recommend dimensions of solder Physical dimensions Table 2 The dimensions of antenna appearance SYMBOL DETAILS DIMENSIONS (mm) L − 5.5 ±0.2 W − 2.2 ±0.2 F feed pad 2.2 ±0.2 C − 0.5 ±0.25 L1 − 4.3 ±0.5 2004 Oct 12 Rev.4 4 www.yageo.com Phycomp Product specification High Frequency SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 IWA0005 IWA0004 SWR Γ (dB) 10.0 0 9.0 5 8.0 10 7.0 15 6.0 20 5.0 25 4.0 30 1 2 35 3.0 1 2 2.0 40 1.0 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 f (GHz) 45 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 f (GHz) Marker data: Marker data: 1: SWR= 2.5; f= 2.30 GHz 1: Γ= −10 dB; f= 2.33 GHz 2: SWR= 2.5; f= 2.70 GHz 2: Γ= −10 dB; f= 2.60 GHz Pre-tuning reference only,after-tuning performance is depending on customer installation. Fig.3 2004 Oct 12 Rev.4 The measurements of typical SWR and return loss on the special environment . 5 www.yageo.com Phycomp Product specification SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 High Frequency −180° −180° −90° −270° −90° 0° −270° IWA0058 XY plane YZ plane 0° XZ plane −180° −90° −270° Fig.4 0° Vertical Horizontal −90° −180° −40 −30 −20 −10 XY −180° −180° dBi −270° −90° 0 −40 −30 −20 −10 XZ 0° The definitions of X-Y-Z plane and angle for radiation pattern −40 −30 −20 −10 0 −270° dBi dBi −270° −90° 0 YZ 0° 0° IWA0006 For antenna gain value see Table 3. Fig.5 Table 3 Radiation pattern measurements Max. and avg. antenna gain value of radiation pattern Plane XY (dBi) XZ(dBi) YZ (dBi) Vertical Pol. (max.) −3.8 2.6 −1.8 Vertical Pol. (avg.) −8.4 −1.6 −9.7 Horizontal Pol. (max.) 4.0 −1.9 2.7 Horizontal Pol. (avg.) −2.2 −8.4 −2.1 Total gain (max.) 4.0 2.7 2.7 Total gain (avg.) −1.9 −1.3 −1.9 2004 Oct 12 Rev.4 6 www.yageo.com Phycomp Product specification High Frequency SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 ORDERING INFORMATION Components may be ordered by using either a Phycomp’s unique 12NC or the simple 17-digit clear text code (Yageo part number) 12NC ORDERING CODE EXAMPLE: 4311 153 00245 4 3 X X 1 5 3 0 0 2 X X Family 43 antenna Centre frequency 245 2.45 GHz Default 200 2.00 GHz 00type 210 2.10 GHz 01type 220 2.20 GHz 02type 230 2.30 GHz 03type 240 2.40 GHz 04type 250 2.50 GHz 05type Packing 11 reel: ∅180 mm; 7", blister, 1000 pcs 13 bulk, 1000 pcs Tolerance 00 at 100 MHz Impedance Bandwidth Material 1 high-frequency material Size 5.3 x 2.0 x 1.3 mm 53 IWA0008 Yageo part number EXAMPLE: CAN4311153002451K DESCRIPTION CODE Family CAN43 = antenna products Packing 11 = 180 mm/7” blister Materials 1 = high frequency materials Size 53 = 5.3 × 2.0 × 1.3 mm Tolerance Working 00 = large than 100 MHz Frequency(1) 245 = 2.45 GHz (Default) 200 = 2.0 GHz (00 type) 210 = 2.1 GHz (01 type) 220 = 2.2 GHz (02 type) 230 = 2.3 GHz (03 type) 240 = 2.4 GHz (04 type) 250 = 2.5 GHz (05 type) Packing type 1K = 1,000 pcs per reel Notes 1. Depends on the special environment. 2004 Oct 12 Rev.4 7 www.yageo.com Phycomp Product specification SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 High Frequency TESTS AND REQUIREMENTS Table 4 Test procedures and requirements IEC 384-10/ CECC32 100 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS 4.4 mounting the antenna may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapour phase soldering) or conductive adhesive no visible damage 4.5 visual inspection and dimension check any applicable method using × 10 magnification in accordance with specification (chip off 4 mm) 4.8 adhesion a force of 3 N applied for 10 s to the line joining the terminations and in a plane parallel to the substrate 4.9 bond strength of plating on end face mounted in accordance with CECC 32 100, paragraph 4.4 no visible damage conditions: bending 0.5 mm at a rate of 1 mm/s; radius jig: 340 mm; 2 mm warp on FR4 board of 90 mm length no visible damage resistance to soldering heat 260 ±5 °C for 10 ±5 s in a static solder bath the terminations should be well tinned after recovery; central frequency changed to ±6% resistance to leaching at 260 ±5 °C for 30 ±1 s in a static solder bath using visual enlargement of × 10, dissolution of the terminations should not exceed 10% solderability zero hour test, and test after storage (20 to 24 months) in original atmosphere; unmounted chips completely immersed for 2 ±0.5 s at 235 ±5 °C good tinning (≥ 75% covered) at terminations 4.10 4.11 20 (Tb) 20 (Ta) 2004 Oct 12 Rev.4 8 www.yageo.com Phycomp Product specification High Frequency IEC 60384-10/ CECC32 100 CLAUSE IEC 60384-2 TEST METHOD 4.12 4 (Na) 4.14 3 (Ca) 4.15 2004 Oct 12 Rev.4 SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 TEST PROCEDURE REQUIREMENTS rapid change of temperature −55 °C (30 minutes) to +85 °C (30 minutes); 100 cycles no visual damage; central frequency changed to ±6% damp heat 500 ±12 hours at 60 °C; 90 to 95% RH no visual damage; 2 hours recovery; central frequency changed to ±6% endurance 500 ±12 hours at 85 °C no visual damage; 2 hours recovery; central frequency changed to ±6% 9 www.yageo.com Phycomp Product specification High Frequency SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 PACKING Tape and reel specifications Tape and reel specifications are in accordance with “IEC 60286-3”. Basic dimensions are given in Fig. 6 and 7, and Table 5 and 6. Peel-off force Peel-off force of the blister tape is in accordance with “IEC 60286-3”; that is, at a peel-off speed of 300 ±10 mm/minute, 0.1 N to 1.3 N for 16 mm tape. The peel-off angle should be between 165° and 180° Blister tape ENVIRONMENTAL CONSIDERATIONS • Cover tape, carrier tape and reel do not contain environmentally harmful PVC materials. • Because the carrier tape is made of polycarbonate, a homogeneous material (mono-plastic), it is ideally suited for recycling. • Compared to other PVC-free materials polycarbonate shows excellent stiffness and very little deformation with temperature. Blister tape specifications P0 K0 D0 T P2 E F cover tape W B0 MBG516 A0 T1 T2 D1 P1 direction of unreeling Cumulative pitch error: 0.2 mm over 10 pitches. Cumulative tolerance over 10 holes: ±0.2 mm. K0: chosen so that the orientation of the component cannot change. For dimensions see Table 5. Fig.6 2004 Oct 12 Rev.4 Blister tape 10 www.yageo.com Phycomp Product specification High Frequency Table 5 SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 Dimensions of blister tape; see Fig. 6 SYMBOL DIMENSION TOLERANCE UNIT A0 nominal clearance; note 1 2.28 ±0.10 mm B0 nominal clearance; note 1 5.70 ±0.10 mm K0 nominal clearance; note 1 1.58 ±0.10 mm W 12.0 ±0.30 mm E 1.75 ±0.10 mm F 5.50 ±0.05 mm D0 1.50 ±0.10 mm D1 1.50 ±0.25 mm P0 4.0 ±0.10 mm P1 4.0 ±0.10 mm P2 2.0 ±0.05 mm T 0.229 ±0.02 mm Note 1. Possible product displacement in pocket. 2. P0 pitch tolerance over any 10 pitches is ±0.2 mm. 2004 Oct 12 Rev.4 11 www.yageo.com Phycomp Product specification High Frequency SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 Reel specifications W2 C W1 N A HBK039 Dimensions in mm. For reel dimension see Table 6 Fig.7 Table 6 Reel. Reel dimensions; see Fig.7 TAPE WIDTH (mm) A (mm) C (mm) N (mm) W1 (mm) W2 (mm) QUANTITY PER REEL (pcs) 12 ±0.3 180 ±1.0 19 ±2.0 58 ±2.0 12.4 ±2.0 18.4 ±2.0 1,000 2004 Oct 12 Rev.4 12 www.yageo.com Phycomp Product specification SMD type antennas for BT/802.11b/g application 2.45 GHz size 5.3 × 2.0 High Frequency REVISION HISTORY Revision Date Change Notification Description Rev.3 2004 July 15 - - Updated company logo Rev.4 2004 Oct 12 - - Add more types of central frequency products for customized layout.Eliminate standard demo board. 2004 Oct 12 Rev.4 13 www.yageo.com