INFINEON SPI21N10

Preliminary data
SPI21N10
SPP21N10,SPB21N10
SIPMOSī›š Power-Transistor
Product Summary
Feature
100
VDS
N-Channel
Enhancement mode
175°C operating temperature
Avalanche rated
P-TO262-3-1
V
R DS(on)
80
m
ID
21
A
P-TO263-3-2
P-TO220-3-1
dv/dt rated
Type
SPP21N10
Package
P-TO220-3-1
Ordering Code
Q67042-S4116
Marking
SPB21N10
P-TO263-3-2
Q67042-S4102
21N10
SPI21N10
P-TO262-3-1
Q67042-S4117
21N10
21N10
Maximum Ratings,at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current
ID
Value
Unit
A
TC=25°C
21
TC=100°C
15.0
ID puls
84
EAS
130
dv/dt
6
Gate source voltage
VGS
±20
V
Power dissipation
Ptot
90
W
-55... +175
°C
Pulsed drain current
TC=25°C
Avalanche energy, single pulse
ID =21 A , VDD =25V, RGS =25
Reverse diode dv/dt
mJ
kV/µs
IS =21A, VDS =80V, di/dt=200A/µs, Tjmax =175°C
TC=25°C
Operating and storage temperature
Tj , Tstg
IEC climatic category; DIN IEC 68-1
55/175/56
Page 1
2002-01-31
Preliminary data
SPI21N10
SPP21N10,SPB21N10
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
RthJC
-
-
1.7
Thermal resistance, junction - ambient, leaded
RthJA
-
-
62
SMD version, device on PCB:
RthJA
-
-
62
-
-
40
@ min. footprint
@ 6 cm 2 cooling area
F)
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
100
-
-
VGS(th)
2.1
3
4
Static Characteristics
Drain-source breakdown voltage
V
VGS =0V, ID =1mA
Gate threshold voltage, VGS = VDS
ID = 44 µA
Zero gate voltage drain current
µA
IDSS
VDS =100V, VGS=0V, Tj =25°C
-
0.01
1
VDS =100V, VGS=0V, Tj =125°C
-
1
100
IGSS
-
1
100
nA
RDS(on)
-
65
80
m
Gate-source leakage current
VGS =20V, VDS =0V
Drain-source on-state resistance
VGS =10V, ID =15.0A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2002-01-31
SPI21N10
SPP21N10,SPB21N10
Preliminary data
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
6.5
12.4
-
S
pF
Dynamic Characteristics
Transconductance
gfs
VDS 2*ID*RDS(on)max ,
ID =15.0A
Input capacitance
Ciss
VGS =0V, VDS=25V,
-
650
865
Output capacitance
Coss
f=1MHz
-
140
186
Reverse transfer capacitance
Crss
-
80
120
Turn-on delay time
td(on)
VDD =50V, VGS =10V,
-
10
15
Rise time
tr
ID =21A, RG =13
-
56
84
Turn-off delay time
td(off)
-
37
55
Fall time
tf
-
23
35
-
3.9
5.2
-
15.5
23.3
-
28.9
38.4
V(plateau) VDD =80V, ID=21A
-
6.2
-
V
IS
-
-
21
A
-
-
84
ns
Gate Charge Characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDD =80V, ID =21A
VDD =80V, ID =21A,
nC
VGS =0 to 10V
Gate plateau voltage
Reverse Diode
Inverse diode continuous
TC=25°C
forward current
Inverse diode direct current,
ISM
pulsed
Inverse diode forward voltage
VSD
VGS =0V, IF =21A
-
0.94
1.25
V
Reverse recovery time
trr
VR =50V, IF =lS ,
-
65
81.5
ns
Reverse recovery charge
Qrr
diF /dt=100A/µs
-
153
192
nC
Page 3
2002-01-31
SPI21N10
SPP21N10,SPB21N10
Preliminary data
1 Power dissipation
2 Drain current
Ptot = f (TC )
ID = f (TC )
parameter: VGS 10 V
100
SPP21N10
24
SPP21N10
A
W
20
80
18
16
ID
Ptot
70
60
14
50
12
40
10
8
30
6
20
4
10
0
0
2
20
40
60
80
0
0
100 120 140 160 °C 190
20
40
60
80
100 120 140 160 °C 190
TC
TC
3 Safe operating area
4 Transient thermal impedance
ID = f ( VDS )
ZthJC = f (tp )
parameter : D = 0 , TC = 25 °C
10
2 SPP21N10
parameter : D = tp /T
10 1
tp = 6.8µs
SPP21N10
K/W
10 µs
A
10 0
DS
(on
)
ID
=V
DS
10 1
Z thJC
/I
D
100 µs
10 -1
R
1 ms
D = 0.50
10 ms
10
10
-2
0.20
0
0.10
DC
0.05
10 -3
0.02
single pulse
0.01
10 -1 -1
10
10
0
10
1
10
2
V
10
3
10 -4 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
VDS
Page 4
2002-01-31
SPI21N10
SPP21N10,SPB21N10
Preliminary data
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (VDS ); Tj=25°C
RDS(on) = f (ID )
parameter: tp = 80 µs
parameter: VGS
50
e
260
m
d
VGS[V]=
a= 5.6
b= 6.0
c= 7.0
d= 8.0
e= 10.0
220
200
RDS(on)
A
c
ID
d
c
b
a
30
180
160
140
120
20
100
b
e
80
a
60
10
VGS[V]=
a= 5.6
b= 6.0
40
20
0
0
5
10
0
0
20
V
5
10
15
c= 7.0
d= 8.0
e= 10.0
20
25
30
35
40
A
50
ID
VDS
7 Typ. transfer characteristics
8 Typ. forward transconductance
ID= f ( VGS ); VDS 2 x ID x RDS(on)max
parameter: tp = 80 µs
gfs = f(ID ); Tj=25°C
parameter: gfs
30
14
S
A
12
11
10
ID
g fs
20
9
8
15
7
6
5
10
4
3
5
2
1
0
2
3
4
5
6
0
0
8
V
4
8
12
16
24
A
ID
VGS
Page 5
2002-01-31
SPI21N10
SPP21N10,SPB21N10
Preliminary data
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
RDS(on) = f (Tj )
VGS(th) = f (Tj)
parameter : ID = 15.0 A, VGS = 10 V
parameter: VGS = VDS
340
SPP21N10
4
m
V
VGS(th)
RDS(on)
280
240
200
ID =0.25mA
3
160
2.5
120
98%
80
typ
2
ID =44µA
40
0
-60
-20
20
60
100
140
°C
1.5
-65
200
-35
-5
25
55
85
115
Tj
°C
175
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (VDS)
IF = f (VSD )
parameter: VGS =0V, f=1 MHz
parameter: Tj , tp = 80 µs
10
4
10 2
pF
SPP21N10
A
Ciss
10 1
C
IF
10 3
Coss
10 2
10 0
Tj = 25 °C typ
Crss
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)
10 1
0
5
10
15
20
25
30
V
40
10 -1
0
0.4
0.8
1.2
1.6
2
2.4 V
3
VSD
VDS
Page 6
2002-01-31
SPI21N10
SPP21N10,SPB21N10
Preliminary data
13 Typ. avalanche energy
14 Typ. gate charge
EAS = f (Tj )
VGS = f (QGate )
par.: ID = 21 A , VDD = 25 V, RGS = 25 parameter: ID = 21 A pulsed
16
140
SPP21N10
mJ
V
120
110
12
VGS
EAS
100
90
0,2 VDS max
10
0,8 VDS max
80
8
70
60
6
50
40
4
30
20
2
10
0
25
45
65
85
105
125
145
°C
185
0
0
5
10
15
20
25
30
35
40 nC
50
QGate
Tj
15 Drain-source breakdown voltage
V(BR)DSS = f (Tj )
SPP21N10
120
V (BR)DSS
V
114
112
110
108
106
104
102
100
98
96
94
92
90
-60
-20
20
60
100
140
°C
200
Tj
Page 7
2002-01-31
Preliminary data
SPI21N10
SPP21N10,SPB21N10
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
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The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 8
2002-01-31