TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3002 Series SP3002 Series 0.85pF Rail Clamp Array RoHS Pb GREEN The SP3002 has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features I/O 1 I/O 4 GND VCC I/O 2 I/O 3 I/O 1 1 NC 2 I/O 2 3 Gnd 6 I/O 4 5 V CC 4 I/O 3 Functional Block Diagram I/O2 t-PXMFBLBHFDVSSFOUPG 0.5μA (MAX) at 5V t&4%QSPUFDUJPOPG ±12kV contact discharge, ±15kV air discharge, (IEC61000-4-2) t4NBMMQBDLBHJOHPQUJPOT saves board space t&'5QSPUFDUJPO IEC61000-4-4, 40A (5/50ns) uDFN-6 (1.6x1.6x0.5mm) SC70-6 and SOT23-6 t-PXDBQBDJUBODFPG 0.85 pF (TYP) per I/O t-JHIUOJOH1SPUFDUJPO IEC61000-4-5, 4.5A (8/20μs) Applications I/O4 VCC t$PNQVUFS1FSJQIFSBMT t/FUXPSL)BSEXBSF1PSUT t.PCJMF1IPOFT t5FTU&RVJQNFOU t1%"T t.FEJDBM&RVJQNFOU t%JHJUBM$BNFSBT Application Example I/O1 GND I/O3 +5V D2+ D2+ Gnd D2- D26 5 4 SP300x-04 1 2 3 D1+ D1+ Gnd D1HDMI or DVI Connector D1HDMI or DVI Interface IC D0+ D0+ Gnd D0- D06 5 4 SP300x-04 1 2 3 Clk+ Clk+ Gnd Clk- ClkGnd A single 4 channel SP300x-04 device can be used to protect four of the data lines in a HDMI/DVI interface. Two (2) SP300x-04 devices provide protection for the main data lines. Low voltage ASIC HDMI/DVI drivers can also be protected with the SP300x-04, the +VCC pins on the SP300x-04 can be substituted with a suitable bypass capacitor or in some backdrive applications the +VCC of the SP300x-04 can be floated or NC. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 89 Revision: April 14, 2011 SP3002 Series SP3002 Description TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3002 Series Thermal Information Absolute Maximum Ratings Symbol IPP Parameter Parameter Value Units Peak Current (tp=8/20μs) 4.5 A Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Rating Units -65 to 150 °C 150 °C 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Max Units Reverse Standoff Voltage Parameter VRWM IR ≤ 1μA 6.0 V Reverse Leakage Current ILEAK VR=5V 0.5 μA Clamp Voltage1 VC ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-GND 1 Diode Capacitance CI/O-I/O Min Typ IPP=1A, tp=8/20μs, Fwd 9.5 11.0 V IPP=2A, tp=8/20μs, Fwd 10.6 13.0 V IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±15 kV Reverse Bias=0V 0.95 1.1 1.25 pF Reverse Bias=1.65V 0.7 0.85 1.0 pF Reverse Bias=0V 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GND Capacitance vs. Bias Voltage 1.50 0 1.40 I/O Capacitance (pF) Insertion Loss [dB] 1.30 -5 -10 -15 1.20 VCC = Float 1.10 1.00 VCC = 3.3V 0.90 0.80 VCC = 5V 0.70 0.60 0.50 -20 1.E+06 1.E+07 1.E+08 1.E+09 0.0 1.E+10 SP3002 Series 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) Frequency [Hz] 90 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3002 Series Capacitance vs. Frequency Product Characteristics Lead Plating SC70 & SOT23: Matte Tin uDFN: Pre-Plated Frame 1.6E-12 Capacitance [F] 1.4E-12 Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 SP3002 2E-12 1.8E-12 1.2E-12 1E-12 8E-13 6E-13 4E-13 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Soldering Parameters Reflow Condition Pb – Free assembly tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds +0/-5 Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 250 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Temperature TP time to peak temperature Time °C 91 Revision: April 14, 2011 SP3002 Series TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3002 Series Package Dimensions — SC70-6 Package Pins JEDEC e e 6 5 4 E 2 1 SC70-6 6 MO-203 Issue A Millimeters Inches Min Max Min Max 0.80 1.10 0.031 0.043 0.00 0.10 0.000 0.004 0.70 1.00 0.028 0.039 0.15 0.30 0.006 0.012 0.08 0.25 0.003 0.010 1.85 2.25 0.073 0.089 1.15 1.35 0.045 0.053 0.65 BSC 0.026 BSC 2.00 2.40 0.079 0.094 0.26 0.46 0.010 0.018 HE 3 A A1 A2 B c D E e HE L B D A2 A A1 C Solder Pad Layout L Package Dimensions — SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-203 Issue A Millimeters Min Inches Min Max Notes A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 Ref e1 1.9 Ref 0.0748 Ref L 0.100 N a Recommended Solder Pad Layout Max 0.600 0.004 10º 0º 6 0º 0.023 6 4,5 6 10º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. M P R O SP3002 Series 92 Revision: April 14, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3002 Series Package Dimensions — uDFN (1.6x1.6x0.5mm) Bottom View Top View 0.05 C L 6 5 Millimeters 4 4 6 5 2 Max Min Max 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 A3 E2 1 Min A 0.05 C E Pin 1 Index Area 3 2 3 B 1 Pin 1 chamfer 0.10 x 45’ ℮ Side View 0.05 C A1 Inches Symbol A3 0.127 Ref b 0.20 0.30 0.008 0.012 D 1.50 1.70 0.060 0.067 D2 1.05 1.30 0.042 0.052 E 1.50 1.70 0.060 0.067 E2 0.40 0.65 0.016 e A Seating plane 0.002 0.005 Ref L 0.50 Ref 0.25 0.026 0.020 Ref 0.40 0.010 0.016 C b 0.10 M C A B 0.05 M C Ordering Information Part Numbering System SP3002-04XTG Silicon Protection Array (SPATM) Family of TVS Diode Arrays G= Green T= Tape & Reel Package H = SOT23-6 J = SC70-6 U = uDFN-6 Series Number of Channels -04 = 4 channel Part Number Package Marking Min. Order Qty. SP3002-04HTG SOT23-6 EX4 3000 SP3002-04JTG SC70-6 EX4 3000 SP3002-04UTG uDFN-6 (1.6x1.6x0.5mm) EX4 3000 Part Marking System E X4 EX4 Product Series Number of Channels E = SP3002 series Assembly Site (varies) ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 93 Revision: April 14, 2011 SP3002 Series SP3002 D uDFN (1.6x1.6x0.5mm) D2 A TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3002 Series Embossed Carrier Tape & Reel Specification — SC70-6 Millimetres Symbol Inches Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 10P0 40.0+/- 0.20 1.574+/-0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 Max 0.318 0.010 Max Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 4.0mm 1.5mm DIA. HOLE ACCESS HOLE 14.4mm 1.75mm 2.0mm CL 8mm 4.0mm 13mm GENERAL INFORMATION SOT-23 (8mm POCKET PITCH) 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. 60mm 180mm 8.4mm USER DIRECTION OF FEED PIN 1 D Embossed Carrier Tape & Reel Specification — uDFN-6 (1.6x1.6x0.5mm) Symbol t W E P2 1.65 1.85 0.06 0.07 3.55 0.14 0.14 D1 1.00 1.25 0.04 B0 F 94 Revision: April 14, 2011 1.50 MIN 3.90 0.05 0.06 MIN 4.10 40.0+/- 0.20 0.15 0.16 1.57+/-0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.78 1.88 0.07 0.07 B0 1.78 1.88 0.07 0.07 K0 0.84 0.94 0.03 0.04 t K0 SP3002 Series Max 3.45 10P0 A0 Min F D P0 Inches Max E P0 D1 Millimetres Min 0.25 TYP 0.01 TYP ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.