IC/LSI/Image Sensors PDF(534KB)

Imaging
■ CMOS
CMOS CAMERA MODULES
Camera Modules
Module configuration: CMOS image sensor, CDS/AGC/10-bit ADC, timing generator, DSP, lens
Color filter: R, G, B primary color mosaic filters
Operating temperature: –20 to 60°C
Lens
1/2.4
type
Optical function
Model No.
OIS function,
auto focus function
RJ63GC600
21M
Auto focus function
RJ63GCE00
Video
performance
21M 24 fps
4K2K 30 fps
1 080p 60 fps
(Normal/HDR)
5 344
x
4 016
Horizontal
ConfiguF No.
viewing
ration
angle
(°)
F2.0
Outline
Supply
dimensions*2
Package*1
voltage
(D x W x H)
(V) TYP.
TYP. (mm)
64
RAW
3.0/2.5/
(Mipi, 4 lanes) 1.8/1.1
6 pcs.
F2.2
Output
signal
74.5
12.0 x 12.0
x 6.52
FPC type
10.6 x 10.8
x 5.125
*1 Contact a SHARP sales office regarding FPC type package.
*2 Height (H) includes the protruding lens section.
RJ63GC600
RJ63GCE00
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
CMOS Image Sensors/
CCDs
Optical Image
format format
Output
pixels
(H x V)
MAX.
7
Imaging
■ CMOS
Optical
format
1 type
2/3 type
8
CMOS IMAGE SENSORS FOR DIGITAL CAMERAS/
DIGITAL CAMCORDERS
Image Sensors for Digital Cameras/Digital Camcorders
Total
pixels
13 110 k
2 320 k
Color filter
Model No.
R, G, B primary
color mosaic
filters
RJ5DY1BA0LT
B/W
RJ5DY2BA0LT
R, G, B primary
color mosaic
filters
RJ52N1BA0LT
B/W
RJ52N2BA0LT
Video
performance
Resolution
Image pixels (H × V)
Pixel size
H × V (µm)
4K2K 60 fps
4 144 × 3 096
3.1 × 3.1
Sensitivity
(mV/Lux-sec) TYP.
Package
1 420
N-LCC120-R898
2 390
3 240
1 080p 120 fps
1 984 × 1 116
5.0 × 5.0
N-LCC120-R898A
6 080
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Imaging
PROGRESSIVE CCDs
High-Sensitivity Image Sensors for Security Usage
Optical
format
Total
pixels
CCDs
Model No.
RJ33B3AA0DT *2
350 k
RJ33B4AA0DT *2
RJ33B3AD0DT *2
RJ33B4AD0DT *2
B/W
Primary
color
VGA 200 fps
(2 ch output)
NTSC 650 TV lines
610 k
RJ3341AA0PB
PAL 650 TV lines
RJ33J3BA0DT
2 170 k
RJ33J4BA0DT
RJ33J3CA0DT *2
2 130 k
660 x 494
7.4 x 7.4
Primary
color
4 500
3 000
976 x 494
5.0 x 7.4
976 x 582
5.0 x 6.3
1 500
1 320 x 976
3.75 x 3.75
1 190
950
470
RJ33N4AA0LT *2
RJ33N3AD0LT *2
RJ31N4EA0DT *2
RJ31N3ED0DT *2
RJ31N3AA0DT
RJ31N4AA0DT
RJ31N3AD0DT
RJ31N4AD0DT
RJ31P4AA0DT *2
RJ31P3AD0DT *2
RJ31P4AD0DT *2
1 080p 50 fps
(2 ch output)
1 080p 25 fps
(1 ch output)
1 080p 50 fps
(2 ch output)
2M 25 fps
(1 ch output)
2M 50 fps
(2 ch output)
2.8M 17 fps
(1 ch output)
2.8M 30 fps
(2 ch output)
B/W
Primary
color
1 928 x 1 088
2.8 x 2.8
650
470
B/W
650
Primary
color
750
B/W
Primary
color
1 928 x 1 088
3.65 x 3.65
1 150
750
B/W
1 150
Primary
color
1 100
B/W
Primary
color
1 644 x 1 236
4.4 x 4.4
1 650
1 100
B/W
1 650
Primary
color
750
B/W
Primary
color
B/W
–125
P-DIP024-0400
–120
P-DIP016-0450
–120
P-DIP024-0400
–110
N-LCC040-R350B
790
RJ33N3AA0LT *2
1 080p 25 fps
(1 ch output)
Package
4 500
1 430
RJ31P3AA0DT *2
2 960 k
B/W
1.3M 30 fps
720p 30 fps
(1 ch output)
Smear ratio
(dB) TYP.
3 000
B/W
RJ31N4ED0DT *2
1/1.8
type
Complementary color
Complementary color
Primary
color
Sensitivity*1
(mV) TYP.
Primary
color
RJ31N3EA0DT *2
2 100 k
Pixel size
H x V (µm)
RJ33J4CA0DT *2
RJ33N4AD0LT *2
2 170 k
Resolution
Image pixels
(H x V)
B/W
RJ3331AA0PB
1 350 k
Color filter
Primary
color
VGA 120 fps
(1 ch output)
520 k
1/3
type
1/2
type
Video performance
1 940 x 1 460
3.69 x 3.69
1 150
750
CMOS Image Sensors/
CCDs
■ Progressive
–115
–120
P-DIP028-0566
–115
1 150
*1 The average G signal output voltage (the average output voltage in the case of the complementary color filter) when a 1,000-lux light source with a 90% reflector is
imaged by a lens of F4 at 1/30 sec (1/25 sec in the case of RJ3341AA0PB) frame accumulation.
*2 This model is the next-generation model. Light efficiency including the near-infrared light region has been drastically improved by our process technology.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
9
Imaging
PROGRESSIVE CCDs
★ Under
■ Progressive
Optical
format
Total
pixels
CCDs (cont'd)
Model No.
RJ32S3AA0DT
RJ32S4AA0DT
2/3
type
5 240 k
RJ32S3AD0DT
RJ32S4AD0DT
RJ32S3AF0DT *2
RJ32S4AF0DT *2
RJ3DT3AA0DT *2
RJ3DT4AA0DT *2
6 090 k
1/1
type
RJ3DT3AD0DT *2
RJ3DT4AD0DT *2
RJ3DT3AF0DT *2
RJ3DT4AF0DT *2
8 290 k
4/3
type
8 340 k
development
RJ3DV3AF0DT *2
RJ3DV4AF0DT *2
★RJ3EV3EF0DT *2
★RJ3EV4EF0DT *2
Video performance
5M 9 fps
(1 ch output)
5M 15 fps
(2 ch output)
5M 30 fps
(4 ch output)
6M 8 fps
(1 ch output)
6M 15 fps
(2 ch output)
6M 30 fps
(4 ch output)
8M 25 fps
(4 ch output)
8M 25 fps
(4 ch output)
Color filter
Resolution
Image pixels
(H x V)
Pixel size
H x V (µm)
Primary
color
B/W
Primary
color
B/W
800
2 456 x 2 058
3.45 x 3.45
530
800
B/W
1 750
2 758 x 2 208
4.54 x 4.54
1 150
1 750
Primary
color
1 150
B/W
1 750
Primary
color
B/W
Primary
color
B/W
–110
P-DIP064-1000
870
1 150
B/W
Package
P-DIP028-0566
580
2 456 x 2 056
Primary
color
Primary
color
Smear ratio
(dB) TYP.
530
B/W
Primary
color
Sensitivity*1
(mV) TYP.
3 320 x 2 496
3.88 x 3.88
3 848 x 2 168
5.14 x 5.14
750
1 100
1 500
2 250
–125
P-DIP064-1000
–120
–125
P-DIP064-1000B
*1 The average G signal output voltage when a 1,000-lux light source with a 90% reflector is imaged by a lens of F4 at 1/30 sec frame accumulation.
*2 This model is the next-generation model. Light efficiency including the near-infrared light region has been drastically improved by our process technology.
10
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Imaging
Total
pixels
CCDs
Standard
270 k
NTSC
320 k
PAL
410 k
NTSC
Color
470 k
PAL
520 k
NTSC
610 k
PAL
Model No.
Resolution
Horizontal
Image pixels
TV lines
(H x V)
RJ2315EA0PB
RJ2315FA0PB *2
RJ2325EA0PB
512 x 492
RJ2355DA0PB
RJ2365DA0PB
RJ2331BA0PB
RJ2341BA0PB
512 x 582
9.6 x 6.34
768 x 494
6.4 x 7.5
480
RJ2365EA0PB *2
RJ2331CA0PB*2
9.6 x 7.5
330
RJ2325FA0PB *2
RJ2355EA0PB *2
Pixel size
H x V (µm)
752 x 582
6.53 x 6.39
976 x 494
5.0 x 7.4
650
976 x 582
RJ2341CA0PB*2
5.0 x 6.3
Sensitivity*1
(mV) TYP.
Smear ratio
(dB) TYP.
Package
4 200
4 500
4 200
–140
4 500
2 700
3 000
2 700
–135
P-DIP016-0450
3 000
2 400
2 600
2 400
–125
2 600
CMOS Image Sensors/
CCDs
■ 1/3-type
1/3-TYPE CCDs / 1/4-TYPE CCDs
*1 The average output voltage measured when imaging a 90% reflector illuminated by a 1,000-lux light source through an optical system set at an f number of F4.0.
*2 This model is the next-generation model. Light efficiency including the near-infrared light region has been drastically improved by our process technology.
■ 1/4-type
Total
pixels
CCDs
Standard
270 k
NTSC
Model No.
Resolution
Horizontal
Image pixels
TV lines
(H x V)
RJ2411FA0PB
Pixel size
H x V (µm)
Sensitivity*1
TYP. (mV)
512 x 492
7.2 x 5.6
1 800
512 x 582
7.2 x 4.73
1 650
768 x 494
4.9 x 5.6
330
320 k
410 k
PAL
RJ2421FA0PB
NTSC
RJ2455DA0PB
Color
Smear ratio
TYP. (dB)
Package
–130
480
1 350
470 k
PAL
RJ2465DA0PB
752 x 582
5.0 x 4.77
520 k
NTSC
RJ2431AA0PB
976 x 494
3.75 x 5.56
610 k
PAL
RJ2441AA0PB
976 x 582
3.75 x 4.47
P-DIP014-0400A
–120
650
1 400
*1 The average output voltage measured when imaging a 90% reflector illuminated by a 1,000-lux light source through an optical system set at an f number of F4.0.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
11
Imaging
■ DSPs
for CCDs
Description
CDS/PGA/ADC
+
DSP
12
DSPs FOR CCDs
Model No.
LR36B16
Features
<CDS/PGA/ADC>
High-speed S/H circuit, high-gain PGA circuit, 12-bit ADC
<DSP>
75-ohm video amplifier, mechanical iris control function,
10-bit DAC, synchronous signal generation circuit,
CCD drive timing generator, AE control function,
AWB control function, LED light control function,
DWDR (gamma transition function),
For 270-k/320-k/410-k/470-k/
lens shading correction function,
520-k/610-kpixel CCDs
auto white blemish compensation function,
mirror image function,
OSD function (5 languages: En., Ch., Fr., Por., Sp.),
privacy mask function, highlight compensation,
motion detection function, 2D noise reduction,
high resolution function, AF detection value output,
NTSC/PAL analog output, Y/C analog output,
UYVY digital output (ITU-R BT656 compatible)
Package
P-HQFN072-1010
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Imaging
CCD PERIPHERAL ICs/LSIs
System Configuration Examples
•<Color
Security Camera System with Three-chip Configuration>
EEP ROM
Analog output for NTSC/PAL
CDS/PGA/12-bit ADC
+
DSP
LR36B16
V driver
Analog output for Y/C
Digital output for UYVY (ITU-R BT656 compatible)
Power
supply
voltage
3.3 V
Four-power-supply CCDs and peripheral ICs/LSIs
CCD
270 kpixels
320 kpixels
410 kpixels
1/3 type
470 kpixels
520 kpixels
610 kpixels
1/4 type
CDS/PGA/ADC + DSP + Video amplifier
CMOS Image Sensors/
CCDs
Four-power-supply
CCD
RJ2315EA0PB
RJ2315FA0PB
RJ2325EA0PB
RJ2325FA0PB
RJ2355DA0PB
RJ2355EA0PB
RJ2365DA0PB
RJ2365EA0PB
RJ2331BA0PB
RJ2331CA0PB
LR36B16
RJ2341BA0PB
RJ2341CA0PB
270 kpixels
RJ2411FA0PB
320 kpixels
RJ2421FA0PB
410 kpixels
RJ2455DA0PB
470 kpixels
RJ2465DA0PB
520 kpixels
RJ2431AA0PB
610 kpixels
RJ2441AA0PB
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
13
LSI
TOUCH PANEL SYSTEM
☆New
■ Touch Panel
Features
•
product
System
1. By adopting Sharp’s proprietary method, approximately eight times more sensitivity (comparison by Sharp)
has been achieved compared with the conventional sequential driving method.*
Capable of sensing a φ2 mm pen touch, multi-touch operation and touch operation using a glove.
2. Contributes to a thinner design of a touch panel display.
A thinner design is achievable because the design is insusceptible to the noise effect, which makes space for the sensor sheets and
the display modules unnecessary.
3. Common user interface from small to large screens allows for a reduction in software development cost.
** When
When comparing
comparing an
an S/N
S/N ratio
ratio of
of 3.58
3.58 determined
determined through
through the
the conventional
conventional sequential
sequential driving
driving method
method using
using pen-touch
pen-touch writing
writing on
on aa 20-inch
20-inch screen
screen with
with an
an S/N
S/N ratio
ratio of
of 30.65
determined
through
Sharp’s
proprietary
parallelparallel
drivingdriving
methodmethod
(measured
by Sharp).
30.65 determined
through
Sharp’s
proprietary
(measured
by Sharp).
•System Configuration
Touch
panel,
7 to 10
inches
Touch
panel,
10 to 15.6
inches
Touch panel,
20 to 32 inches
LR388K5
LR388K4
LR0G964
LR0G967
☆LR0G969
HOST
HOST
HOST
HOST
HOST
Touch
panel,
up to 5
inches
Touch panel,
above 32 inches
Product lines
•Application Examples
Interactive whiteboard
Table computer
Smart TV
PC monitor
Digital signage
Tablet
Notebook PC
Smartphone
eBook
Multiple people can input on the screen
simultaneously, which makes it more
useful on educational sites.
Multi-touch UI on a large screen
for browsing or layout editing.
Pen touch input
is possible.
Operation with a glove
is possible.
14
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
☆New
■ Touch
Model No.
Panel System / System LSIs
Function
LR388K5
Touch panel controller for small-size
screens (up to 5 inches)
LR388K4
Touch panel controller for tablets
(7 to 10 inches)
■ Touch
Model No.
product
Features
• 10-finger multi-touch detection
• Scanning speed: 120 Hz
• Capable of sensing a φ2 mm pen touch
• I2C/SPI interface
• 10-finger multi-touch detection
• Scanning speed: 240 Hz
• Capable of sensing a φ2 mm pen touch
• USB/I2C/SPI interface
• Built-in palm cancellation feature
Supply voltage
(V)
Package
I/O: 1.62 to 3.6
Analog: 2.7 to 3.6
P-VFBGA96P-0606
Core: 1.2±0.12
I/O: 3.3±0.3
Analog: 3.3±0.3
P-VFBGA360P-0613
Supply voltage
(V)
Outline dimensions
(W × D)
(mm)
5
74 × 46
5
60 × 80
5
130 × 100 (Main)
220 × 100 (AFE)
System LSIs
LSI
TOUCH PANEL SYSTEM / SYSTEM LSIs /
TOUCH PANEL SYSTEM / TOUCH PANELCONTROLLER MODULE
Panel System / Touch Panel Controller Module
Function
LR0G964
Touch panel controller module
for midium-size screens
(10 to 15.6 inches)
LR0G967
Touch panel controller module
for midium-size screens
(15 to 32 inches)
☆LR0G969
Touch panel controller module
for large-size screens
(Over 32 inches)
Features
• 10-finger multi-touch detection
• Scanning speed: 240 Hz
• Capable of sensing a φ2 mm pen touch
• Built-in palm cancellation feature
• USB interface
• Built-in power supply circuit
• 10-finger multi-touch detection
• Scanning speed: 240 Hz
• Capable of sensing a φ2 mm pen touch
• Built-in palm cancellation feature
• USB interface
• Built-in power supply circuit
• 50-finger multi-touch detection
• Scanning speed: 240 Hz
• Capable of sensing a φ2 mm pen touch
• Built-in palm cancellation feature
• USB interface
• Built-in power supply circuit
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
15
LSI
CSP
■ CSP
(Chip Size Package)
•CSP
The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the
bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package
technology will greatly help in the design of compact mobile equipment, such as mobile phones and
digital cameras.
● Compact
FBGA (CSP)
and lightweight
Ability to create a near-chip size and lighter-weight package in comparison with conventional plastic packages.
● High
reliability
Comparable high reliability with that of conventional plastic packages.
● Mountability
Conventional mounting system is available for CSP. SOP and QFP can be mounted together with CSP.
Terminal pitch
0.8 mm
0.65 mm
0.5 mm
0.4 mm
Maximum terminal counts
352 (16 mm x 16 mm)
352 (16 mm x 16 mm)
372 (16 mm x 16 mm)
264 (10 mm x 10 mm)
Nominal dimensions
5 mm x 5 mm to 10 mm x 10 mm
6 mm x 6 mm to 16 mm x 16 mm
Gold wire
IC
Mold resin
Packages
Features
Package height
0.8 mm to 1.5 mm (MAX.)
Cross
section
example
Substrate
Cu pattern
Solder ball
Terminal pitch : 0.8 mm
0.65 mm
0.5 mm
0.4 mm
Diameter : 0.45 mm
0.4 mm
0.3 mm
0.25 mm
CSP
• Wafer-level
The wafer-level CSP (WL-CSP) is a kind of chip-size package which is manufactured by assembling directly onto the finished wafer.
● Compact
and thinner size
It makes it possible to create an almost IC-size and lighter-weight package.
● Mountability
Features
The conventional CSP mounting system can be also used in that of wafer-level CSP, which facilitates chip
mounting more than bare-chip mounting does. It can be mounted together with other existing packages and
passive components.
Chip size*
4 mm x 4 mm
3.5 mm x 3.5 mm
3 mm x 3 mm
Pad pitch
0.5 mm
0.4 mm
0.5 mm
0.4 mm
0.5 mm
0.4 mm
Maximum terminal counts
49 (7 x 7)
81 (9 x 9)
36 (6 x 6)
49 (7 x 7)
25 (5 x 5)
36 (6 x 6)
* Rectangular chip form is also available.
Cu pattern
IC
Cross
section
example
Package height
0.5 mm to 1 mm (MAX.)
Passivation layer
Solder ball
23
LSI
■ SiP
•
SiP
(System in Package)
System in Package is SHARP’s original high-density mounting technology that achieves high-density memory capacity and multiple
functions by stacking multiple ICs or multiple packages. The System in Package technology means chip-stacked package technology
that can achieve up to 5-chip mounting by stacking ICs in a single package. The System in Package technology contributes to higher
functionality of applications, such as mobile phones and digital cameras, as well as to reduction in size and weight.
Chip Stacked CSP
● Wide
variety of lineup
It is possible to provide a wide lineup of stacked CSPs, including 2-chip, 3-chip, 4-chip and 5-chip stacked
CSPs, to respond to customer needs.
● Compact
and thinner size
Encapsulating multiple ICs into an existing plastic package contributes to decreasing the mounting area. In
addition, SHARP’s wafer thinning technology makes it possible to achieve 1.4 mm (MAX.) package height.
● Multiple
Features
functions
Multiple ICs of different sizes and functions, such as logic LSIs and memories, can be incorporated in a
single package, making possible multiple functions.
● Same-size
IC stacking technology
SHARP's stacking technology enables stacking of multiple same-size ICs, contributing to higher memory
density.
(4-chip stacked CSP)
When using a SHARP four-chip stacked CSP, the mounting area and weight of a package can be
decreased by half in comparison with using two 2-chip stacked CSPs, or a 3-chip stacked CSP and a
conventional CSP.
(5-chip stacked CSP)
Gold wire
IC
Mold resin
Cross
section
example
Package height
1.4 mm (MAX.)*
1.6 mm (MAX.)*
Cu pattern
Substrate
Diameter : 0.45 mm
0.30 mm
24
Solder ball
Terminal pitch : 0.8 mm
0.5 mm
* At 0.8 mm terminal pitch
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LSI
SiP
•Chip Stacked TSOP/QFP*/VQFN/HQFN
● Decreased
mounting area
By encapsulating two identical or different types of ICs into a single conventional plastic package, the
mounting area of the package can be decreased.
Features
● Multiple
functions
Thanks to the incorporation of different sizes and functions of multiple ICs, such as logic LSIs and
memories, the functionality increases.
● Higher
memory density
When incorporating two identical memory ICs into a single package, memory density doubles on the
same mounting area.
(TSOP, QFP*)
(Hamburger type)
(Turtle stack type)
Cross
section
example
Gold wire
IC
Gold wire
Packages
IC
(HQFN)
(VQFN)
Gold wire
Mold resin
Gold wire
Package height
1.0 mm (MAX.)
Mold resin
Package height
1.0 mm (MAX.)
* Including TQFP and LQFP.
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
25
LSI
PACKAGE LINEUP
■ Package
Lineup
•Surface-Mount Type
Package
type
Appearance
(Package material)
Package code
No. of terminals
Package depth & width
Terminal pitch Nominal dimensions
(D x W) x
mm
mm
(seated height [MAX.]) mm
P-LFBGA048-0606
P-TFBGA048-0608
48
P-TFBGA048-0808
P-TFBGA056-0808
56
P-TFBGA060-0811
60 (48)*
P-TFBGA064-0811
64
P-TFBGA072-0811
P-LFBGA072-0811
81
P-LFBGA085-0811
85
P-LFBGA087-0811
87
P-LFBGA088-0912
FBGA
(CSP)
D
W
(Plastic)
6.0 x 6.0 x (1.4)
6x 8
6.0 x 8.0 x (1.2)
8x 8
8.0 x 8.0 x (1.2)
8 x 11
72 (64)*
P-TFBGA081-0808
P-LFBGA088-0811
6x 6
8.0 x 11.0 x (1.2)
8.0 x 11.0 x (1.4) / (1.6)
88
8x 8
8.0 x 8.0 x (1.2)
8 x 11
8.0 x 11.0 x (1.4) / (1.6)
9 x 12
9.0 x 12.0 x (1.4) / (1.6)
8 x 11
8.0 x 11.0 x (1.4) / (1.6)
P-LFBGA090-0811
90
P-TFBGA096-1010
96
P-LFBGA107-0912
107
P-TFBGA111-1010
111
P-TFBGA112-1010
112
P-LFBGA115-0914
115
9 x 14
9.0 x 14.0 x (1.4) / (1.6)
P-LFBGA116-1010
116
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
P-LFBGA130-1013
130
10 x 13
10.0 x 13.0 x (1.4) / (1.6)
P-TFBGA144-1111
144
11 x 11
11.0 x 11.0 x (1.2)
P-TFBGA160-1212
160
12.0 x 12.0 x (1.2)
P-LFBGA168-1212
168
12.0 x 12.0 x (1.4) / (1.6)
P-TFBGA180-1212
180
P-TFBGA184-1212
184
P-TFBGA240-1414
240
P-LFBGA280-1616
280
P-LFBGA352-1616
352
0.8
10 x 10
10.0 x 10.0 x (1.2)
9 x 12
9.0 x 12.0 x (1.4) / (1.6)
10 x 10
10.0 x 10.0 x (1.2)
12 x 12
12.0 x 12.0 x (1.2)
14 x 14
14.0 x 14.0 x (1.2)
16 x 16
16.0 x 16.0 x (1.5)
6.0 x 6.0 x (1.2)
P-TFBGA064-0606
64
6x 6
P-LFBGA140-0909
140
9x 9
9.0 x 9.0 x (1.4)
P-LFBGA160-1010
160
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
P-TFBGA180-1313
180
P-LFBGA192-1010
192
P-LFBGA208-1212
208
P-LFBGA224-1313
224
P-TFBGA260-1313
260
0.65
13 x 13
13.0 x 13.0 x (1.2)
10 x 10
10.0 x 10.0 x (1.4) / (1.6)
12 x 12
12.0 x 12.0 x (1.4) / (1.6)
13 x 13
13.0 x 13.0 x (1.4) / (1.6)
13.0 x 13.0 x (1.2)
* Figures in brackets indicate available terminal counts.
26
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LSI
PACKAGE LINEUP
•Surface-Mount Type (cont’d)
Appearance
(Package material)
Package code
No. of terminals
P-VFBGA057-0505
57
P-VFBGA075-0505
75
P-TFBGA064-0606
64
P-TFBGA068-0606
68
P-VFBGA081-0606
81
P-TFBGA084-0606
84
Package depth & width
Terminal pitch Nominal dimensions
(D x W) x
mm
mm
(seated height [MAX.]) mm
5x 5
6.0 x 6.0 x (1.1)
6x 6
6.0 x 6.0 x (0.9)
7.0 x 7.0 x (0.9)
100
P-TFBGA100-0707
P-VFBGA108-0707
P-TFBGA108-0707
P-VFBGA120-0707
P-TFBGA120-0707
7.0 x 7.0 x (1.1)
7.0 x 7.0 x (0.9)
108
7x 7
132
P-TFBGA133-0808
133
7.0 x 7.0 x (1.1)
8.0 x 8.0 x (1.1)
8x 8
P-VFBGA144-0808
FBGA
(CSP)
144
D
W
P-VFBGA171-0811
P-LFBGA171-0811
P-VFBGA176-0909
P-TFBGA176-0909
P-TFBGA180-0909
P-TFBGA188-0909
P-VFBGA188-1111
P-VFBGA208-1010
P-TFBGA208-1010
P-TFBGA245-1010
P-LFBGA245-1010
(Plastic)
8.0 x 8.0 x (0.9)
8.0 x 8.0 x (1.3) / (1.5)
0.5
8 x 11
8.0 x 11.0 x (1.3)
152
8x 8
8.0 x 8.0 x (1.1)
171
8 x 11
P-LFBGA144-0811
P-TFBGA152-0808
7.0 x 7.0 x (1.1)
7.0 x 7.0 x (0.9)
120
P-TFBGA132-0707
P-LFBGA144-0808
6.0 x 6.0 x (0.9)
6.0 x 6.0 x (1.1)
P-VFBGA100-0606
P-VFBGA100-0707
5.0 x 5.0 x (0.9)
9x 9
180
188
11 x 11
10 x 10
245
P-WFBGA144-0606
144
P-WFBGA121-0606
121
P-WFBGA145-0606
145
P-TFBGA168-0707
168
P-TFBGA204-0808
204
P-WFBGA205-0808
205
P-WFBGA261-0808
261
9.0 x 9.0 x (1.1)
11.0 x 11.0 x (0.9)
10.0 x 10.0 x (0.9)
208
424
8.0 x 11.0 x (0.9)
8.0 x 11.0 x (1.3) / (1.5)
9.0 x 9.0 x (0.9)
176
P-FBGA424-1414
Packages
Package
type
10.0 x 10.0 x (1.1)
10.0 x 10.0 x (1.3)
14 x 14
14.0 x 14.0 x (1.8)
6.0 x 6.0 x (0.75)
6x 6
0.4
7x 7
6.0 x 6.0 x (0.8)
7.0 x 7.0 x (1.0)
8.0 x 8.0 x (1.0)
8x 8
8.0 x 8.0 x (0.8)
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
27
LSI
PACKAGE LINEUP
•Surface-Mount Type (cont’d)
Package
type
Appearance
(Package material)
No. of terminals
P-TFBGAXXX-0606
to 36
6x 6
6.0 x 6.0 x (1.2)
P-TFBGAXXX-0707
to 49
7x 7
7.0 x 7.0 x (1.2)
P-TFBGAXXX-0808
to 81
8x 8
8.0 x 8.0 x (1.2)
P-TFBGAXXX-0909
to 100
9x 9
9.0 x 9.0 x (1.2)
P-TFBGAXXX-1010
to 121
10 x 10
10.0 x 10.0 x (1.2)
P-TFBGAXXX-1111
to 144
11 x 11
11.0 x 11.0 x (1.2)
P-TFBGAXXX-1212
to 196
12 x 12
12.0 x 12.0 x (1.2)
P-TFBGAXXX-1313
to 216
13 x 13
13.0 x 13.0 x (1.2)
14 x 14
14.0 x 14.0 x (1.2)
15 x 15
15.0 x 15.0 x (1.2)
P-TFBGAXXX-1414
P-TFBGAXXX-1515
FBGA
(CSP)
D
W
(Plastic)
PBGA
(BGA)
D
W
(Plastic)
Package depth & width
Terminal pitch Nominal dimensions
(D x W) x
mm
mm
(seated height [MAX.]) mm
Package code
0.8
to 240
P-TFBGAXXX-1616
to 352
16 x 16
16.0 x 16.0 x (1.2)
P-TFBGAXXX-0606
to 49
6x 6
6.0 x 6.0 x (1.2)
P-TFBGAXXX-0707
to 81
7x 7
7.0 x 7.0 x (1.2)
P-TFBGAXXX-0808
to 121
8x 8
8.0 x 8.0 x (1.2)
P-TFBGAXXX-0909
to 144
9x 9
9.0 x 9.0 x (1.2)
P-TFBGAXXX-1010
to 196
10 x 10
10.0 x 10.0 x (1.2)
P-TFBGAXXX-1111
to 224
11 x 11
11.0 x 11.0 x (1.2)
P-TFBGAXXX-1212
to 256
12 x 12
12.0 x 12.0 x (1.2)
P-TFBGAXXX-1313
to 272
13 x 13
13.0 x 13.0 x (1.2)
P-TFBGAXXX-1414
to 304
14 x 14
14.0 x 14.0 x (1.2)
P-TFBGAXXX-1515
to 320
15 x 15
15.0 x 15.0 x (1.2)
P-TFBGAXXX-1616
to 352
16 x 16
16.0 x 16.0 x (1.2)
P-TFBGAXXX-0606
to 100
6x 6
6.0 x 6.0 x (1.1)
P-TFBGAXXX-0707
to 132
7x 7
7.0 x 7.0 x (1.1)
P-TFBGAXXX-0808
to 164
8x 8
8.0 x 8.0 x (1.1)
P-TFBGAXXX-0909
to 192
9x 9
9.0 x 9.0 x (1.1)
P-TFBGAXXX-1010
to 216
10 x 10
10.0 x 10.0 x (1.1)
P-TFBGAXXX-1111
to 244
11 x 11
11.0 x 11.0 x (1.1)
P-TFBGAXXX-1212
to 268
12 x 12
12.0 x 12.0 x (1.1)
P-TFBGAXXX-1313
to 296
13 x 13
13.0 x 13.0 x (1.1)
P-TFBGAXXX-1414
to 320
14 x 14
14.0 x 14.0 x (1.1)
P-TFBGAXXX-1515
to 348
15 x 15
15.0 x 15.0 x (1.1)
P-TFBGAXXX-1616
to 372
16 x 16
16.0 x 16.0 x (1.1)
P-TFBGAXXX-0505
to 100
5x 5
5.0 x 5.0 x (1.0)
P-TFBGAXXX-0606
to 144
6x 6
6.0 x 6.0 x (1.0)
P-TFBGAXXX-0707
to 168
7x 7
7.0 x 7.0 x (1.0)
P-TFBGAXXX-0808
to 204
8x 8
8.0 x 8.0 x (1.0)
P-TFBGAXXX-0909
to 228
9x 9
9.0 x 9.0 x (1.0)
P-TFBGAXXX-1010
to 264
10 x 10
10.0 x 10.0 x (1.0)
1.0
21 x 21
21.0 x 21.0 x (2.2)
1.27
35 x 35
35.0 x 35.0 x (2.63)
P-BGA0356-2121
356
P-BGA0476-3535
476
P-BGA0528-3535
528
0.65
0.5
0.4
XXX: Terminal counts
BGA is a trademark of Motorola Nippon Ltd.
28
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LSI
PACKAGE LINEUP
Package
type
Appearance
(Package material)
W
Package code
P-TSOP048-1220
No. of
terminals
48
TSOP
Package depth & width
Lead frame material
(D x W) x
Alloy42
Copper alloy
(seated height [MAX.]) mm
12 x 20
12.0 x 18.4 x (1.2)
14.0 x 18.4 x (1.2)
0.5
(Plastic)
D
QFP
W
LQFP
D
TQFP
(Plastic)
VQFN
Terminal pitch Nominal dimensions
mm (mil)
mm (mil)
W
D
HQFN*
(Plastic)
P-TSOP056-1420
56
14 x 20
P-QFP048-0707
48
7x 7
P-QFP072-1010
72
P-LQFP080-1212
80
P-LQFP100-1414
100
P-TQFP048-0707
48
P-TQFP100-1414
100
P-TQFP128-1414
128
P-VQFN020-0404
20
P-VQFN024-0404
24
P-VQFN028-0505
28
P-VQFN032-0505
32
P-VQFN036-0606
0.5
0.5
0.5
0.4
7.0 x 7.0 x (1.65)
○
○
○
○
○
○
10 x 10
10.0 x 10.0 x (1.8)
○
–
12 x 12
12.0 x 12.0 x (1.7)
○
–
14 x 14
14.0 x 14.0 x (1.7)
○
–
7x 7
7.0 x 7.0 x (1.2)
○
–
○
–
14 x 14
4x 4
14.0 x 14.0 x (1.2)
4.2 x 4.2 x (1.0)
○
–
–
○
–
○
–
○
–
○
5x 5
5.2 x 5.2 x (1.0)
36
6x 6
6.2 x 6.2 x (1.0)
–
○
P-VQFN048-0707
48
7x 7
7.2 x 7.2 x (1.0)
–
○
P-VQFN036-0505
36
5x 5
5.2 x 5.2 x (1.0)
–
○
P-VQFN052-0707
52
7x 7
7.2 x 7.2 x (1.0)
–
○
P-HQFN020-0404
20
4.0 x 4.0 x (1.0)
–
○
4.0 x 4.0 x (0.85)
–
○
4.2 x 4.2 x (1.0)
–
○
5x 5
5.0 x 5.0 x (1.0)
–
○
7x 7
7.2 x 7.2 x (1.0)
–
○
P-HQFN024-0404
24
P-HQFN028-0505
28
P-HQFN052-0707
52
* HQFN is a higher heat dissipation package of VQFN.
0.5
0.4
0.5
0.4
4x 4
Packages
•Surface-Mount Type (cont’d)
100 mil = 2.54 mm
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
29
Imaging
PACKAGE LINEUP
• For CCDs
Package
type
Appearance
(Package material)
W
DIP
D
Package code
No. of
terminals
Terminal pitch
mm
Nominal dimensions
mm (mil)
Package depth & width
(D x W) x
(seated height [TYP.]) mm
P-DIP014-0400A
14
1.27
10.16 (400)
10.0 x 10.0
P-DIP016-0450
16
1.27
11.43 (450)
11.4 x 12.2
P-DIP020-0500
20
1.27
12.2 (500)
12.0 x 13.8
P-DIP024-0400
24
0.80
10.16 (400)
10.0 x 10.0
P-DIP028-0566
28
1.11
14.4 (566)
14.2 x 16.0
64
1.00
25.48 (1 000)
36.1 x 25.4
P-SOP014-0400A
14
1.27
12 (470)
10.0 x 10.0 x (4.1)
P-SOP028-0400
28
0.69
10.16 (400)
10.0 x 10.0 x (3.5)
P-SOP032-0525
32
0.78
13.3 (525)
12.0 x 13.8 x (3.92)
0.65
8.9 (350)
8.3 x 8.9 x (1.52)
0.80
11.0 (433)
11.0 x 11.0 x (1.62)
P-DIP064-1000
(Plastic)
W
SOP
D
(Plastic)
W
P-DIP064-1000B
N-LCC040-R350 (B)
LCC
40
D
N-LCC040-S433A
(Ceramic)
100 mil = 2.54 mm
• For CMOSs
Package
type
Appearance
(Package material)
W
LCC
Package code
No. of
terminals
Terminal pitch
mm
Nominal dimensions
mm (mil)
Package depth & width
(D x W) x
(seated height [TYP.]) mm
120
0.65
22.8 (898)
20.0 x 22.8 x (2.67)
N-LCC120-R898
D
(Ceramic)
N-LCC120-R898A
100 mil = 2.54 mm
Nominal dimensions
FBGA (CSP)
PBGA (BGA)
VQFN
HQFN
SOP
SSOP
MFP
TSOP
DIP
LCC
QFP
LQFP
TQFP
FBGA : fine-pitch ball grid array package
MFP
PBGA : plastic ball grid array package
TSOP : thin small outline package
VQFN : very thin quad flat non-leaded package
SOP
QFP
HQFN : heat sink quad flat non-leaded package
: small outline package
SSOP : shrink small outline package
: mini flat package
: quad flat package
LQFP : low profile quad flat package
TQFP : thin quad flat package
DIP
: dual inline package
LCC
: leadless chip carrier
Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd.
30
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
REG
PACKAGE LINEUP
• Lead-Inserting Type Packages [For regulators: PQ series]
Appearance
(Package material)
Package type
No. of
terminals
Terminal pitch
mm
Outline dimensions
(Width x Thickness x Height) mm
Lead frame
material
4
2.54
10.2 (MAX.) x 4.5 x 29.1*2
Cu
4
2.54
10.2 (MAX.) x 4.5 x 29.1*2
Cu
5
(1.7)*1
10.2 (MAX.) x 4.5 x 24.6*2
Cu
5
(1.7)*1
10.2 (MAX.) x 4.5 x 24.6*2
Cu
5
(1.7)*1
10.2 (MAX.) x 4.5 x 24.6*2
Cu
A
TO-220
(Plastic)
B
TO-220
(Full mold)
(Plastic)
(Plastic)
D
TO-220
[Lead forming type]
(Plastic)
Packages
TO-220
(Full mold)
[Lead forming type]
C
E
TO-220
[Lead forming type]
(Plastic)
*1 The figure in parentheses indicates reference value.
*2 Including lead length
•Surface-Mount Type Packages [For regulators/LED drivers: PQ series]
Appearance
(Package material)
Package type
No. of
terminals
Terminal pitch
mm
Outline dimensions
(Width x Height x Thickness) mm
Lead frame
material
5
(Heat sink included)
(1.27)*1
6.6 (MAX.) x 9.7 (MAX.)*2 x 2.1
Cu
8
1.27
5 x 6.2*2 x 1.55*2
Cu
6
1.5
4.5 x 4.3*2 x 1.5
Cu
F
SC-63
(Plastic)
SOP-8
(Plastic)
SOT-89
(Plastic)
*1 The figure in parentheses indicates reference value.
*2 Including lead length
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
31
REG
PACKAGE LINEUP
•Surface-Mount Type Packages [For regulators/LED drivers: PQ series] (cont’d)
Package type
Appearance
(Package material)
SOT-23-6
No. of
terminals
Terminal pitch
mm
Outline dimensions
(Width x Height x Thickness) mm
Lead frame
material
6
0.95
2.9 x 2.8*2 x 1.3
Cu
6
0.95
2.9 x 2.8*2 x 1.3
Cu
6
(0.95)*1
(3.4)*1 x 3.3*2 x 1.4 (MAX.)
Cu
5
(0.95)*1
(2.9)*1 x 2.8*2 x 1.3 (MAX.)
Cu
9
(Including radiating fin)
1.0
5.0 x 4.5 x 0.75 (MAX.)
Cu
(Plastic)
SOT-23-6W
(Plastic)
SOT-23-L
(Plastic)
SOT-23-5
(Plastic)
USB-8
*1 The figure in parentheses indicates reference value.
*2 Including lead length
32
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in
equipment using any SHARP devices shown in catalogs, data books, etc.
Except where specially indicated, models listed on this page comply with the RoHS Directive*. For details, please contact SHARP.
*RoHS Directive: Prohibits use of lead, cadmium, hexavalent chromium, mercury and specific brominated flame retardants
(PBBs and PBDEs), with certain exceptions.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.