Fair-Rite P/N 2506031007H0 H Chip Bead Material Grade Nominal Chemical Composition Wt of core (g)= Ferrite -Compound Fe2O3 NiO ZnO CuO Co3O4 MnO CAS Number wt % 1309-37-1 1313-99-1 1314-13-2 1317-38-0 1308-06-1 1344-43-0 60 23 8 5 3 1 0.0048 0.00288 0.00110 0.00038 0.00024 0.00014 0.00005 Compound Weight (g) Breakdown of H Chip Bead Material Grade Wt of termination (g)= Termination Plating Elements Sn Ni Ag CAS Number wt % 7440-31-5 7440-02-0 7440-22-4 14.3 6.9 78.8 0.0012 0.00017 0.00008 0.00095 Supporting notes: 1. P/N 2506031007H0 consists of: a core H Chip Bead Material Grade b Termination Plating SnNiAg 2. 3. 4. 5. Moisture Sensitivity Level (MSL)= 1 Max Reflow Temp= 260 degC Max Time at Max Reflow Temp= 40 sec RoHS 6/6 Compliant Terminations/ Wire are backwards compatible with standard Soldering Processes 6. RoHS Conversion Date= 1/1/2005 7. RoHS Compliance Marking is Contained on Shipping Labels Element Weight (g) Breakdown of Pb- Free Termination Plating Calculated Maximum Levels of RoHS Restricted Substances Present in H Chip Bead Material Grade Wt of core (g)= Impurity Substance Cr+6 Cd Hg Pb PBB PBDE 2506031007H0 RoHS RoHS Threshold (ppm): 1000 100 1000 1000 1000 1000 ppm 0.00 0.00 0.00 0.00 0.00 0.00 0.0048 0 0 0 0 0 0 RoHS Impurity Substance Weight (g) Breakdown of H Chip Bead Material Grade Fair-Rite Products Corp. Compiled by Rich Eckmann