2506031217H0 ROHS

Fair-Rite P/N 2506031217H0
H Chip Bead Material Grade
Nominal Chemical Composition
Wt of core (g)=
Ferrite -Compound
Fe2O3
NiO
ZnO
CuO
Co3O4
MnO
CAS Number
wt %
1309-37-1
1313-99-1
1314-13-2
1317-38-0
1308-06-1
1344-43-0
60
23
8
5
3
1
0.0048
0.00288
0.00110
0.00038
0.00024
0.00014
0.00005
Compound Weight (g)
Breakdown of H Chip
Bead Material Grade
Wt of termination (g)=
Termination Plating Elements
Sn
Ni
Ag
CAS Number
wt %
7440-31-5
7440-02-0
7440-22-4
14.3
6.9
78.8
0.0012
0.00017
0.00008
0.00095
Supporting notes:
1. P/N
2506031217H0 consists of:
a core H Chip Bead Material Grade
b Termination Plating
SnNiAg
2.
3.
4.
5.
Moisture Sensitivity Level (MSL)= 1
Max Reflow Temp= 260 degC
Max Time at Max Reflow Temp= 40 sec
RoHS 6/6 Compliant Terminations/ Wire are
backwards compatible with standard Soldering
Processes
6. RoHS Conversion Date= 1/1/2005
7. RoHS Compliance Marking is
Contained on Shipping Labels
Element Weight (g)
Breakdown of Pb- Free
Termination Plating
Calculated Maximum Levels of RoHS Restricted Substances Present in H Chip Bead Material Grade
Wt of core (g)=
Impurity
Substance
Cr+6
Cd
Hg
Pb
PBB
PBDE
2506031217H0 RoHS
RoHS Threshold
(ppm):
1000
100
1000
1000
1000
1000
ppm
0.00
0.00
0.00
0.00
0.00
0.00
0.0048
0
0
0
0
0
0
RoHS Impurity Substance
Weight (g) Breakdown of
H Chip Bead Material
Grade
Fair-Rite Products Corp.
Compiled by Rich Eckmann
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