4-Port Router Packaging (5/08)

8
7
6
5
4
3
1
2
Pin1 indicator
Pattern is vendor’s option
826.772
506.000
446.000
D
D
VSS
VDD1
VDDCQ
VSS
3.386
VDD1
7.559
VDDCQ
4.000
3.780
3.559
4ptSPW_die
C
C
VSS
VDD1
VDDCQ
VDDCQ
VSS
VDD1
22.636
B
B
17.386
38.386
60.000
20.000
10.000
40.000
50.000
3.000
752.000
31.500
45.000
35.000
30.000
10
10
6
10
10
6
112.000
10
6
10
NOTES:
6
6
6
6
Top
not used
10mils
10
L1
Tier 2
6mils
Sig1
L2
Tier 1
10mils
Sig2
L3
Tier1sub
10mils
VDD IO
L4
D/A
Seal Ring10mils
6mils
VSS
VSS
VSS
L5
10mils
VDD C
L6
6mils
VSS A
L7
10mils
VDD A
L8
L9
6mils
6mils
Sig3
VSS
L10
L11
6mils
6mils
Sig4
VDD IO
L12
10mils
VSS
DESIGN NOTES:
1. PACKAGE MATERIAL: OPAQUE 90% MINIMUM ALUMINA CERAMIC.
1. DRAWING UNITS ARE IN MILS
Stack-Up
2. ALL EXPOSED METAL AREAS MUST BE GOLD PLATED 100
2. PACKAGE OUTLINE IS 21X21MM
A
TO 225 MICROINCHES THICK OVER ELECTROPLATED NICKEL
3. DIE SIZE IS 446 MILS SQUARE
UNDERCOATING 100 TO 350 MICROINCHES THICK PER
4. DIE BOND PAD PITCH IS 3.78 UM MIN
5. STANDARD ROUTING TRACE WIDTH IS ~4 MILS
MIL-PRF-38535.
A
6. VIA SIZES ARE 4 MILS AND 8 MILS
3. THE SEAL RING MUST BE ELECTRICALLY CONNECTED TO VSS.
4. SEE UTMC SPEC. 40-7150-XX FOR FURTHER REQUIREMENTS.
5. PIN 1 ID MUST BE GOLD PLATED. NO ALPHANUMERIC FIGURES
DRAWING UNITS ARE IN MILS.
7. LGA PAD/OPENING SIZE IS 31.5 MILS
TITLE
UNLESS OTHERWISE SPECIFIED:
8. LAYOUT WILL REQUIRE LENGTH MATCHING AND
ALL DIMENSIONS ARE IN INCHES.
255 LGA PACKAGE
CONTROLLED IMPEDANCE TRACES.
TOLERANCES:
0.506 SQ. CAVITY 21x21mm BODY
9. ROUTING AND STACK-UP PLANS WILL BE PROVIDED.
ALLOWED. MAY BE CONNECTED TO VSS FOR PLATING OPTIONAL.
DETAIL DRAWING
10. CONNECT FIDUCIALS TO VSS.
6. BONDFINGER NUMBERS, LETTERS, AND I.D. ARE FOR REFERENCE
11. TYPICAL BONDFINGERS ARE 4 MILS WIDE, 3.56 MILS GAP.
DRAWING DATE
ONLY.
REV
DWG.#/DOC. CTRL.#
40-72018-YY
PRELIM
26 FEB 2008
SCALE
8
7
6
5
4
3
2
CAD
SIZE
D
SHEET
1
1
OF
1
L1-Tier2
L2-Tier1
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