Cobham RAD Solutions Comprehensive radiation effects test and support January 2016 The most important thing we build is trust Quick-Turn Prototype IC Assembly Cobham RAD Solutions (formerly Aeroflex RAD) offers the following services: Quick-Turn Prototype IC Assembly in ceramic, etched out plastic, COB and flip chip. Quick-Turn Prototype IC Assembly Capabilities Die / Package Thinning and Die Extraction / Repackaging n Dicing, Die Visual and Die Attach n – Wafer Dicing (up to 12inch wafers) n – Visual Inspection (50-500X) – Conductive and non-conductive epoxy die attach n Die backside thinning Package backside thinning to 35μm ±5μm thickness n Die extraction and re-bonding n PC board design – Silver Glass and Eutectic die attach Quality – Flip Chip n DLA Lab Suitability for radiation and screening test methods listed n ISO 9001:2008 Certification Wirebond, Encapsulation and Marking – Gold and Aluminum Wirebond (to 35μm pitch) – Epoxy, Solder, and Glass Frit Lid Seal – Dam and Fill (Plastic Encapsulation) • Plastic Equivalent Devices • COB Glob Top – Package Ink Marking or Laser Marking n Package Options – Multi-chip / Stacked Modules, Chip‑OnBoard (COB) and Custom Substrates – Ceramic Packages Including: BGA, PGA, J-Lead, Flat Pack, QFP, Sidebraze, CERDIP and others – Etched Cavity Plastic Packages Including: J-Lead, QFP, SOIC, TSSOP, QFN /MLF and others Comprehensive radiation effects experience For further information please contact: ~36,000 sq feet GTRI compliant test facility Cobham RAD Solutions 5030 Centennial Blvd. Colorado Springs, Colorado 80919 USA Tel:1-719-531-0800 [email protected] www.aeroflex.com/RAD www.cobham.com