2508051527Y0 ROHS

Fair-Rite P/N 2508051527Y0
Y Chip Bead Material Grade
Nominal Chemical Composition
Wt of core (g)=
Ferrite -Compound
Fe2O3
ZnO
NiO
CuO
MnO
CAS Number
wt %
1309-37-1
1314-13-2
1313-99-1
1317-38-0
1344-43-0
65
17
9
6
3
0.008
0.0052
0.0014
0.0007
0.0005
0.0002
Compound Weight (g)
Breakdown of Y Chip
Bead Material Grade
Wt of termination (g)=
Termination Plating Elements
Sn
Ni
Ag
CAS Number
wt %
7440-31-5
7440-02-0
7440-22-4
14.3
6.9
78.8
0.002
0.00029
0.00014
0.00158
Supporting notes:
1. P/N
2508051527Y0 consists of:
a core Y Chip Bead Material Grade
b Termination Plating
SnNiAg
2.
3.
4.
5.
Moisture Sensitivity Level (MSL)= 1
Max Reflow Temp= 260 degC
Max Time at Max Reflow Temp= 40 sec
RoHS 6/6 Compliant Terminations/ Wire are
backwards compatible with standard Soldering
Processes
6. RoHS Conversion Date= 1/1/2005
7. RoHS Compliance Marking is
Contained on Shipping Labels
Element Weight (g)
Breakdown of Pb- Free
Termination Plating
Calculated Maximum Levels of RoHS Restricted Substances Present in Y Chip Bead Material Grade
Wt of core (g)=
Impurity
Substance
Cr+6
Cd
Hg
Pb
PBB
PBDE
2508051527Y0 RoHS.xls
RoHS Threshold
(ppm):
1000
100
1000
1000
1000
1000
ppm
ND
ND
ND
ND
ND
ND
0.008
NOT DETECTED
NOT DETECTED
NOT DETECTED
NOT DETECTED
NOT DETECTED
NOT DETECTED
RoHS Impurity
Substance Weight (g)
Breakdown of Y Chip
Bead Material Grade
Fair-Rite Products Corp.
Compiled by Rich Eckmann
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