Material Content Data Sheet Sales Product Name SAK-XC878-13FFA 5V AC MA# MA001414114 Package PG-LQFP-64-5 Issued 14. October 2015 Weight* 374.14 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 10.632 2.84 0.172 0.05 458 0.743 0.20 1987 3.431 0.92 110.016 29.41 30.58 294052 305667 2.078 0.56 0.56 5553 5553 1.194 0.32 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.84 28416 28416 9170 3190 32.228 8.61 205.307 54.87 63.80 548749 638080 4.169 1.11 1.11 11143 11143 1.663 0.44 0.44 4445 4445 0.626 0.17 1.879 0.50 86141 1674 0.67 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5022 6696 1000000