PDF Data Sheet Rev. B

165 MHz, High Performance
HDMI Transmitter
ADV7513
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
APPLICATIONS
Gaming consoles
PCs
DVD players and recorders
Digital set-top boxes
A/V receivers
CEC CONTROLLER/
BUFFER
ADV7513
HDCP KEYS
SPDIF
I2S[3:0]
MCLK
CEC
CEC_CLK
AUDIO
DATA
CAPTURE
LRCLK
HDCP
ENCRYPTION
4:2:2
SCLK
D[23:0]
VSYNC
HSYNC
DE
CLK
VIDEO
DATA
CAPTURE
SCL
TX0+/TX0–
TX1+/TX1–
TMDS
OUTPUTS
TX2+/TX2–
HPD
INT
SDA
4:4:4
AND
COLOR
SPACE
CONVERTER
REGISTERS AND
CONFIGURATION
LOGIC
TXC+/TXC–
I2C
SLAVE
HDCP
AND EDID
MICROCONTROLLER
I2C
MASTER
DDCSDA
DDCSCL
10225-001
General
Incorporates HDMI v1.4 features, including
3D video support
165 MHz supports all video formats up to 1080p
and UXGA
Supports gamut metadata packet transmission
Integrated CEC buffer/controller
Compatible with DVI v1.0 and HDCP v1.4
Video/audio inputs accept logic levels from 1.8 V to 3.3 V
Digital video
3D video ready
Programmable, 2-way color space converter
Supports RGB, YCbCr, and DDR
Supports ITU-656-based embedded syncs
Automatic input video format timing detection (CEA-861-E)
Digital audio
Supports standard S/PDIF for stereo linear pulse code
modulation (LPCM) or compressed audio up to 192 kHz
High bit rate (HBR) audio
8-channel uncompressed LPCM I2S audio up to 192 kHz
Special features for easy system design
5 V tolerant I2C and Hot Plug™ detect (HPD) I/Os,
no extra device needed
No audio master clock needed for supporting S/PDIF
and I2S
On-chip MPU with I2C master performs HDCP operations
and EDID reading operations
On-chip MPU reports HDMI events through interrupts
and registers
Figure 1.
GENERAL DESCRIPTION
The ADV7513 is a 165 MHz, High-Definition Multimedia
Interface (HDMI®) transmitter that is ideal for DVD players/
recorders, digital set-top boxes, A/V receivers, gaming consoles,
and PCs.
The digital video interface contains an HDMI v1.4/DVI v1.0compatible transmitter and supports all HDTV formats. The
ADV7513 supports HDMI v1.4-specific features, including 3D
video. The ADV7513 also supports x.v.Color™, high bit rate (HBR)
audio, and the programmable auxiliary video information (AVI)
InfoFrame features. With the inclusion of HDCP, the ADV7513
allows the secure transmission of protected content as specified
by the HDCP v1.4 protocol.
The ADV7513 supports both S/PDIF and 8-channel I2S audio.
Its high fidelity 8-channel I2S interface can transmit either stereo
or 7.1 surround audio up to 768 kHz. The S/PDIF interface can
carry compressed audio, including Dolby® Digital, DTS®, and
THX®. Fabricated in an advanced CMOS process, the ADV7513
is provided in a 64-lead LQFP surface-mount plastic package
with exposed pad and is specified over the −25°C to +85°C
temperature range.
Rev. B
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2011–2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
ADV7513
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Absolute Maximum Ratings ............................................................5
Applications ....................................................................................... 1
Explanation of Test Levels ............................................................5
Functional Block Diagram .............................................................. 1
ESD Caution...................................................................................5
General Description ......................................................................... 1
Pin Configuration and Function Descriptions..............................6
Revision History ............................................................................... 2
Applications Information .................................................................8
Specifications..................................................................................... 3
Design Resources ..........................................................................8
Electrical Specifications ............................................................... 3
Outline Dimensions ..........................................................................9
Ordering Guide .............................................................................9
REVISION HISTORY
5/14—Rev. A to Rev. B
Change to Design Resources Section ............................................. 8
Changes to Ordering Guide ............................................................ 9
1/13—Rev. 0 to Rev. A
Updated Outline Dimensions ......................................................... 9
Changes to Ordering Guide ............................................................ 9
11/11—Revision 0: Initial Version
Rev. B | Page 2 of 12
Data Sheet
ADV7513
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
Table 1.
Parameter
DIGITAL INPUTS
Data Inputs, Video and Audio, CEC_CLK
Input Voltage, High
Input Voltage, Low
Input Capacitance
CEC_CLK Frequency 2
CEC_CLK Accuracy
DDC I2C Lines (DDCSDA, DDCSCL)
Input Voltage, High
Input Voltage, Low
I2C Lines (SDA, SCL)
Input Voltage, High
Input Voltage, Low
CEC Pin
Input Voltage, High
Input Voltage, Low
Output Voltage, High
Output Voltage, Low
HPD Pin
Input Voltage, High
Input Voltage, Low
THERMAL CHARACTERISTICS
Thermal Resistance
Junction-to-Case
Junction-to-Ambient
Ambient Temperature
DC SPECIFICATIONS
Input Leakage Current
POWER SUPPLY
1.8 V Supply Voltage (DVDD, AVDD,
PVDD, BGVDD)
3.3 V Supply Voltage (DVDD_3V)
Power-Down Current
Transmitter Total Power 3
At 1.8 V
At 3.3 V
AC SPECIFICATIONS
TMDS Output Clock Frequency
TMDS Output Clock Duty Cycle
Input Video Clock Frequency
Input Video Data Setup Time 4
Input Video Data Hold Time4
TMDS Differential Swing
Differential Output Timing
Low-to-High Transition Time
High-to-Low Transition Time
VSYNC and HSYNC Delay
From DE Falling Edge
Symbol
Temp
Test
Level 1
VIH
VIL
Full
Full
25°C
Full
Full
VI
VI
VIII
VIII
VIII
3
−2
VIH
VIL
Full
Full
IV
IV
VIH
VIL
Full
Full
VIH
VIL
VOH
VOL
Max
Unit
3.5
+0.7
1.5
100
+2
V
V
pF
MHz
%
1.4
−0.3
5.5
+0.7
V
V
VI
VI
1.4
−0.3
5.5
+0.7
V
V
Full
Full
Full
Full
VI
VI
VI
VI
2.0
−0.3
2.5
−0.3
5.5
+0.8
3.63
+0.6
V
V
V
V
VIH
VIL
Full
Full
VI
VI
1.3
−0.3
5.5
+0.8
V
V
θJC
θJA
Full
Full
Full
V
V
V
−25
+85
°C/W
°C/W
°C
25°C
VI
−1
+1
µA
Full
IV
1.71
1.8
1.90
V
Full
25°C
IV
IV
3.15
3.3
3.45
300
V
µA
Full
Full
VI
VI
256
1
mW
mW
25°C
25°C
Full
Full
Full
25°C
IV
IV
IV
IV
IV
VII
165
52
165
1.8
1.3
800
1100
MHz
%
MHz
ns
ns
mV
25°C
25°C
VII
VII
75
75
95
95
ps
ps
25°C
IV
1
UI 5
IIL
tVSU
tVHLD
Rev. B | Page 3 of 12
Min
Typ
1.35
−0.3
1.0
12
20
43
+25
20
48
1200
ADV7513
Parameter
To DE Rising Edge
AUDIO AC TIMING
SCLK Duty Cycle
N/2 Is an Even Number
N/2 Is an Odd Number
I2S[3:0], S/PDIF Setup Time
I2S[3:0], S/PDIF Hold Time
LRCLK Setup Time
LRCLK Hold Time
I2C INTERFACE
SCL Clock Frequency
SDA Setup Time
SDA Hold Time
Setup Time for Start Condition
Hold Time for Start Condition
Setup Time for Stop Condition
Data Sheet
Temp
25°C
Test
Level 1
IV
Min
Typ
1
Max
Unit
UI5
IV
IV
IV
IV
IV
IV
40
49
2
2
2
2
50
50
60
51
tASU
tAHLD
tASU
tAHLD
Full
Full
Full
Full
Full
Full
%
%
ns
ns
ns
ns
Full
Full
Full
Full
Full
Full
400
tDSU
tDHO
tSTASU
tSTAH
tSTOSU
kHz
ns
ns
µs
µs
µs
Symbol
100
100
0.6
0.6
0.6
See the Explanation of Test Levels section.
12 MHz crystal oscillator for default register settings.
3
1080p, 24-bit typical random pattern.
4
The video data setup and hold times are measured at 0.9 V. The relationship between the clock and data is programmable in 400 ps steps.
5
UI is the unit interval.
1
2
Rev. B | Page 4 of 12
Data Sheet
ADV7513
ABSOLUTE MAXIMUM RATINGS
EXPLANATION OF TEST LEVELS
Table 2.
Parameter
Digital Inputs (SDA, SCL, DDCSDA, DDCSCL,
HPD, PD)
Audio/Video Digital Inputs (D[23:0], MCLK,
CLK, LRCLK, CEC, CEC_CLK, SPDIF, I2S[3:0],
SCLK, HSYNC, DE, VSYNC)
Digital Output Current
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Maximum Case Temperature
Rating
−0.3 V to +5.5 V
I.
100% production tested.
II.
100% production tested at 25°C and sample tested at
specified temperatures.
III.
Sample tested only.
IV.
Parameter is guaranteed by design and characterization
testing.
V.
Parameter is a typical value only.
VI.
100% production tested at 25°C; guaranteed by design
and characterization testing.
VII.
Limits defined by HDMI specification; guaranteed by
design and characterization testing.
VIII.
Parameter is guaranteed by design.
−0.3 V to +3.63 V
20 mA
−40°C to +100°C
−65°C to +150°C
150°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. B | Page 5 of 12
ADV7513
Data Sheet
D11
D10
D9
DVDD
D8
CLK
D7
D5
D6
D4
D2
D3
D1
D0
HSYNC
DE
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
DVDD 1
48
D12
47
D13
SPDIF 3
46
D14
MCLK 4
45
D15
I2S0 5
44
D16
I2S1 6
43
D17
I2S2 7
42
D18
41
D19
40
D20
LRCLK 10
39
D21
DVDD 11
38
D22
PVDD 12
37
D23
BGVDD 13
36
SDA
R_EXT 14
35
SCL
AVDD 15
34
DDCSDA
HPD 16
33
DDCSCL
VSYNC
PIN 1
2
ADV7513
I2S3 8
TOP VIEW
(Not to Scale)
SCLK 9
NOTES
1. THE EXPOSED PAD IS THE ELECTRICAL GROUND FOR THE PART AND MUST
BE SOLDERED TO THE PCB.
10225-002
DVDD
CEC_CLK
CEC
DVDD_3V
INT
TX2–
TX2+
AVDD
TX1–
TX1+
PD
TX0+
TX0–
AVDD
TXC–
TXC+
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1, 11, 31, 51
2
3
4
5
6
7
8
9
10
12
13
14
15, 19, 25
16
17, 18
Mnemonic
DVDD
VSYNC
SPDIF
MCLK
I2S0
I2S1
I2S2
I2S3
SCLK
LRCLK
PVDD
BGVDD
R_EXT
AVDD
HPD
TXC−, TXC+
20, 21
TX0−, TX0+
22
23, 24
PD
TX1−, TX1+
26, 27
TX2−, TX2+
Type
Power
Input
Input
Input
Input
Input
Input
Input
Input
Input
Power
Power
Input
Power
Input
Differential
output
Differential
output
Input
Differential
output
Differential
output
Description
1.8 V Power Supply. These pins should be filtered and as quiet as possible.
Vertical Synchronization Input.
S/PDIF (Sony/Philips Digital Interface) Audio Input.
Audio Reference Clock Input.
I2S Channel 0 Audio Data Input.
I2S Channel 1 Audio Data Input.
I2S Channel 2 Audio Data Input.
I2S Channel 3 Audio Data Input.
I2S Audio Clock Input.
Left/Right Channel Signal Input.
1.8 V PLL Power Supply.
1.8 V Band Gap Power Supply.
This pin sets the internal reference currents.
1.8 V Power Supply for TMDS Outputs.
Hot Plug Detect Signal Input.
Differential TMDS Clock Output.
Differential TMDS Output Channel 0.
Power-Down Control and I2C Address Selection.
Differential TMDS Output Channel 1.
Differential TMDS Output Channel 2.
Rev. B | Page 6 of 12
Data Sheet
Pin No.
28
29
30
32
33
34
35
36
37 to 50, 52,
54 to 62
53
63
64
ADV7513
Mnemonic
INT
DVDD_3V
CEC
CEC_CLK
DDCSCL
DDCSDA
SCL
SDA
D[23:0]
Type
Output
Power
Input/output
Input
Control
Control
Control
Control
Input
Description
Interrupt Signal Output.
3.3 V Power Supply.
CEC Data Signal.
CEC Clock (Oscillator from 3 MHz to 100 MHz).
Serial Port Data Clock to Sink.
Serial Port Data Input/Output to Sink.
Serial Port Data Clock Input.
Serial Port Data Input/Output.
Video Data Inputs.
CLK
DE
HSYNC
EPAD
Input
Input
Input
Power
Video Input Clock.
Data Enable Signal for Digital Video.
Horizontal Synchronization Input.
The exposed pad is the electrical ground for the part and must be soldered to the PCB.
Rev. B | Page 7 of 12
ADV7513
Data Sheet
APPLICATIONS INFORMATION
DESIGN RESOURCES
•
Evaluation kits, reference design schematics, hardware and software guides, and other support documentation are available under
a nondisclosure agreement (NDA). For more information, contact
your local Analog Devices, Inc., sales office at www.analog.com/sales.
•
Other references include the following:
•
EIA/CEA-861-E—this technical specification document
describes audio and video InfoFrames, as well as the E-EDID
structure for HDMI. It is available from the Consumer
Electronics Association (CEA).
Rev. B | Page 8 of 12
High-Definition Multimedia Interface Specification
Version 1.4, a defining document for HDMI v1.4, and the
HDMI Compliance Test Specification (CTS) Version 1.3a are
available from HDMI Licensing, LLC.
High-Bandwidth Digital Content Protection System
Revision 1.4, the defining technical specification document
for HDCP Revision 1.4, is available from Digital Content
Protection, LLC.
Data Sheet
ADV7513
OUTLINE DIMENSIONS
1.60
MAX
49
64
64
49
48
1
1.00 REF
SEATING
PLANE
10.20
10.00 SQ
9.80
48
1
PIN 1
EXPOSED
PAD
5.30
5.20 SQ
5.10
7.50
REF SQ
BOTTOM VIEW
TOP VIEW
1.45
1.40
1.35
0.15
0.10
0.05
0.20
0.15
0.09
(PINS UP)
(PINS DOWN)
16
33
32
17
16
33
17
32
VIEW A
0.08
COPLANARITY
7°
0°
0.50
LEAD PITCH
0.27
0.22
0.17
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BCD-HD
06-27-2012-B
0.75
0.60
0.45
12.20
12.00 SQ
11.80
Figure 3. 64-Lead Low Profile Quad Flat Package [LQFP_EP]
(SW-64-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADV7513BSWZ
1
Temperature Range
−25°C to +85°C
Package Description
64-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
Z = RoHS Compliant Part.
Rev. B | Page 9 of 12
Package Option
SW-64-2
ADV7513
Data Sheet
NOTES
Rev. B | Page 10 of 12
Data Sheet
ADV7513
NOTES
Rev. B | Page 11 of 12
ADV7513
Data Sheet
NOTES
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
HDMI, the HDMI Logo, and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.
©2011–2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10225-0-5/14(B)
Rev. B | Page 12 of 12