SPO-2014-PCN-0001

AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL
PRODUCT CHANGE NOTICE
1. TITLE
2. DOCUMENT NUMBER
MICROCIRCUIT, DIGITAL-LINEAR, OCTAL 400 MBPS
BUS LVDS REPEATER, MONOLITHIC SILICON
THETA-JC AND POWER DISSIPATION UPDATE
SPO-2014-PCN-0001
4. MANUFACTURER NAME AND ADDRESS
5. MANUFACTURER POINT OF CONTACT NAME
AEROFLEX COLORADO SPRINGS, INC.
Jennifer Larsen
4350 CENTENNIAL BOULEVARD
COLORADO SPRINGS, COLORADO 80907-3486
6. MANUFACTURER POINT OF CONTACT TELEPHONE
3. DATE (Year, Month, Date)
2014, February, 28
719-594-8000
7. MANUFACTURER POINT OF CONTACT EMAIL
[email protected]
8. CAGE CODE
9. EFFECTIVE DATE
10. PRODUCT IDENTIFICATION CODE
11. BASE PART
65342
2014, February, 28
WD17 & WD18
UT54LVDM328
13. SMD NUMBER
14. DEVICE TYPE DESIGNATOR
5962-01536
01
15. RHA LEVELS
16. QML LEVEL
NON, R, F, G, and H
Q and V
17. NON QML LEVEL
18. BLANK
12. BLANK
PROTO and HIREL
19. PRODUCT CHANGE
This notification serves to inform our customers of the update to the power dissipation
(PD) and thermal resistance junction-to-case (ϴJC). Aeroflex Colorado Springs has
performed analysis that more accurately represent the PD and ϴJC parameters.
Per MIL-STD-883, Method 1012.1, Section 3.4.1, PD = (TJ(max) – TC(max) ) / ϴJC.
The SMD will update to reflect the following changes:
Parameter
ϴJC
PD
OLD
22°C/W
800mW
NEW
15°C/W
1.667W
The effective result of this change is the device has better thermal impedance than previously
reported. The lower ϴJC permits the user application to reliably dissipate more power.
20. DISPOSITIONARY RECOMMENDATION:
21. ADEPT REPRESENTATIVE
CHECK &
☒
USE AS IS
22. SIGNATURE
CONTACT
MANUFACTURER
Timothy L. Meade
ADEPT PA FORM
☐
REMOVE &
REPLACE
☐
CORRECT &
☐
USE AS SPECIFIED
23. DATE
28 February, 2014
REVISON DATE: 2/27/2013
REVISION: A