AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL ALERT 1. TITLE TOTAL IONIZING DOSE (TID) RADIATION TESTING ON A 512K X 32BIT (16MB) SRAM M/S MICROCIRCUIT 4. MANUFACTURER NAME AND ADDRESS AEROFLEX COLORADO SPRINGS INC., DOING BUSINESS AS COBHAM SEMICONDUCTOR SOLUTIONS 9. LDC START 10. LDC END 1010 1411 3. DATE (Year, Month, Date) 2015,Mar, 05 5. MANUFACTURER POINT OF CONTACT NAME Lin-Chi Huang 6. MANUFACTURER POINT OF CONTACT TELEPHONE (719) 594-8294 7. MANUFACTURER POINT OF CONTACT EMAIL [email protected] 11. PRODUCT IDENTIFICATION 12. BASE PART CODE WC04, WC05, QS09-QS17 See Page 2 13. SMD NUMBER 14. DEVICE TYPE DESIGNATOR See Page 2 See Page 2 15. RHA LEVELS 16. QML LEVEL 100 Krad(Si) Q and V 17. NON QML LEVEL 18. SUSPECT ☐ COUNTERFEIT? NO Not Applicable 4350 CENTENNIAL BOULEVARD COLORADO SPRINGS, COLORADO 80907-3486 8. CAGE CODE 65342 11. BLANK 2. DOCUMENT NUMBER SPO-2015-AL-0001 19. PROBLEM DESCRIPTION / DISCUSSION / EFFECT An internal review determined Total Ionizing Dose (TID) testing bias circuit was limiting current when performing radiation testing to 100 krad(Si) per MIL-STD-883, M1019, Condition A. As a result of this finding, samples from previously delivered wafer lots were retested without current limiting to the bias circuit. The retested samples failed post TID functional and parametric tests at 100 krad(Si) per MIL-STD883, M1019, Condition A. Limited sample testing was conducted at 50 krad(Si) TID per MIL-STD-883, M1019, Condition A, to verify compliance to the lower radiation level using the improved bias setup. One wafer lot successfully passed a 22 unit sample test. Also, 2 piece samples from four different previously manufactured wafer lots successfully passed at 50 krad(Si). This testing indicates that all delivered wafers lots may meet a TID of 50 krad(Si) per MILSTD-883, M1019, Condition A, This product is offered as a monolithic single die device and as a multichip module (MCM). The part numbers for all of the affected delivered product are listed on page 2 of this ADEPT. 20. ACTION TAKEN / PLANNED The TID bias circuit was modified to prevent current limiting. An engineering validation review of bias current measurements and post electrical test data was added after each TID test. All wafer lots are being retested to verify meeting 50 krad(Si) per MIL-STD-883, M1019, Condition A. All customers are being contacted to address affected shipments. 21. DISPOSITIONARY RECOMMENDATION: 22. ADEPT REPRESENTATIVE Lin-Chi Huang ADEPT ALERT FORM USE AS IS 23. ☐ SIGNATURE CONTACT MANUFACTURER ☒ REMOVE & REPLACE ☐ CHECK & USE AS IS 24. DATE ☐ 06 Mar 2015 SPO-2015-AL-0001 Page 2 Affected part number SMD part number 5962R0626103VXA Generic Part number UT8ER512K32S-21WCA 5962R0626106QXC UT8ER512K32S-21WWC 5962R0626106VXA UT8ER512K32S-21WWA 5962R1020401QXC UT8ER4M32M-25XFC 5962R1020501VXC UR8R1M39-21XFC 5962R1020601QXC UR8R2M39-22XFC 5962R1020602QXC UR8R2M39-22XFC 5962R1020601VXC UR8R2M39-22XFC 5962R1020701QXC UT8R4M39-25XFC 5962R1020702QXC UT8R4M39-25XFC 5962R1020201VXC UT8ER1M32M-21XFC 5962R1020202QXC UT8ER1M32S-21XFC ADEPT ALERT FORM