PDF Data Sheet Rev. D

FEATURES
FUNCTIONAL BLOCK DIAGRAM
Output frequency: <1 MHz to 1 GHz
Start-up frequency accuracy: <±100 ppm (determined by
VCXO reference accuracy)
Zero delay operation
Input-to-output edge timing: <150 ps
14 outputs: configurable LVPECL, LVDS, HSTL, and LVCMOS
14 dedicated output dividers with jitter-free adjustable delay
Adjustable delay: 63 resolution steps of ½ period of VCO
output divider
Output-to-output skew: <50 ps
Duty cycle correction for odd divider settings
Automatic synchronization of all outputs on power-up
Absolute output jitter: <200 fs at 122.88 MHz
Integration range: 12 kHz to 20 MHz
Distribution phase noise floor: −160 dBc/Hz
Digital lock detect
Nonvolatile EEPROM stores configuration settings
SPI- and I²C-compatible serial control port
Dual PLL architecture
PLL1
Low bandwidth for reference input clock cleanup with
external VCXO
Phase detector rate up to130 MHz
Redundant reference inputs
Automatic and manual reference switchover modes
Revertive and nonrevertive switching
Loss of reference detection with holdover mode
Low noise LVCMOS output from VCXO used for RF/IF
synthesizers
PLL2
Phase detector rate up to 259 MHz
Integrated low noise VCO
APPLICATIONS
LTE and multicarrier GSM base stations
Wireless and broadband infrastructure
Medical instrumentation
Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs
Low jitter, low phase noise clock distribution
Clock generation and translation for SONET, 10Ge, 10G FC,
and other 10 Gbps protocols
Forward error correction (G.710)
High performance wireless transceivers
ATE and high performance instrumentation
Rev. D
OSC_IN, OSC_IN
REFA,
REFA
REFB,
REFB
AD9523
PLL1
OUT0,
OUT0
PLL2
OUT1,
OUT1
REF_TEST
SCLK/SCL
SDIO/SDA
SDO
CONTROL
INTERFACE
(SPI AND I2C)
OUT12,
OUT12
ZERO
DELAY
OUT13,
OUT13
14-CLOCK
DISTRIBUTION
EEPROM
ZD_IN, ZD_IN
08439-001
Data Sheet
Jitter Cleaner and Clock Generator with
14 Differential or 29 LVCMOS Outputs
AD9523
Figure 1.
GENERAL DESCRIPTION
The AD9523 provides a low power, multi-output, clock distribution
function with low jitter performance, along with an on-chip PLL
and VCO. The on-chip VCO tunes from 3.6 GHz to 4.0 GHz.
The AD9523 is designed to support the clock requirements for long
term evolution (LTE) and multicarrier GSM base station designs.
It relies on an external VCXO to provide the reference jitter cleanup
to achieve the restrictive low phase noise requirements necessary
for acceptable data converter SNR performance.
The input receivers, oscillator, and zero delay receiver provide
both single-ended and differential operation. When connected
to a recovered system reference clock and a VCXO, the device
generates 14 low noise outputs with a range of 1 MHz to 1 GHz,
and one dedicated buffered output from the input PLL (PLL1).
The frequency and phase of one clock output relative to another
clock output can be varied by means of a divider phase select
function that serves as a jitter-free coarse timing adjustment in
increments that are equal to half the period of the signal coming
out of the VCO.
An in-package EEPROM can be programmed through the serial
interface to store user-defined register settings for power-up and
chip reset.
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2010–2015 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
AD9523
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation ...................................................................... 19
Applications ....................................................................................... 1
Detailed Block Diagram ............................................................ 19
Functional Block Diagram .............................................................. 1
Overview ..................................................................................... 19
General Description ......................................................................... 1
Component Blocks—Input PLL (PLL1).................................. 20
Revision History ............................................................................... 3
Component Blocks—Output PLL (PLL2) .............................. 22
Specifications..................................................................................... 4
Clock Distribution ..................................................................... 24
Conditions ..................................................................................... 4
Zero Delay Operation ................................................................ 26
Supply Current .............................................................................. 4
Lock Detect ................................................................................. 26
Power Dissipation ......................................................................... 5
Reset Modes ................................................................................ 26
REFA, REFA, REFB, REFB, OSC_IN, OSC_IN, and ZD_IN,
ZD_IN Input Characteristics ...................................................... 5
Power-Down Mode .................................................................... 27
OSC_CTRL Output Characteristics .......................................... 6
Serial Control Port ......................................................................... 28
REF_TEST Input Characteristics ............................................... 6
SPI/I²C Port Selection................................................................ 28
PLL1 Characteristics .................................................................... 6
I²C Serial Port Operation .......................................................... 28
PLL1 Output Characteristics ...................................................... 6
SPI Serial Port Operation .......................................................... 31
Distribution Output Characteristics (OUT0, OUT0 to
OUT13, OUT13) .......................................................................... 7
SPI Instruction Word (16 Bits) ................................................. 32
Timing Alignment Characteristics ............................................ 8
EEPROM Operations ..................................................................... 35
Jitter and Noise Characteristics .................................................. 8
Writing to the EEPROM ........................................................... 35
PLL2 Characteristics .................................................................... 8
Reading from the EEPROM ..................................................... 35
Logic Input Pins—PD, EEPROM_SEL, REF_SEL, RESET,
SYNC .............................................................................................. 9
Programming the EEPROM Buffer Segment ......................... 36
Status Output Pins—STATUS1, STATUS0 ............................... 9
Serial Control Port—SPI Mode .................................................. 9
Serial Control Port—I²C Mode ................................................ 10
Absolute Maximum Ratings .......................................................... 11
Thermal Resistance .................................................................... 11
ESD Caution ................................................................................ 11
Pin Configuration and Function Descriptions ........................... 12
Typical Performance Characteristics ........................................... 15
Input/Output Termination Recommendations .......................... 17
Terminology .................................................................................... 18
Power Supply Sequencing ......................................................... 27
SPI MSB/LSB First Transfers .................................................... 32
Device Initialization Flow Charts................................................. 38
Power Dissipation and Thermal Considerations ....................... 41
Clock Speed and Driver Mode ................................................. 41
Evaluation of Operating Conditions........................................ 41
Thermally Enhanced Package Mounting Guidelines ............ 42
Control Registers ............................................................................ 43
Control Register Map ................................................................ 43
Control Register Map Bit Descriptions ................................... 48
Outline Dimensions ....................................................................... 60
Ordering Guide .......................................................................... 60
Rev. D | Page 2 of 60
Data Sheet
AD9523
REVISION HISTORY
9/15—Rev. C to Rev. D
Changes to Features Section ............................................................ 1
Changes to Table 7 ............................................................................ 6
Changes to Table 12 .......................................................................... 8
Added Operating Temperature Range Parameter and Junction
Temperature Parameter, Table 17 ..................................................11
Changes to Figure 21 ......................................................................17
Changes to Figure 22 and Overview Section ...............................19
Changes to PLL1 Reference Clock Inputs Section and PLL1
Loop Filter Section ..........................................................................20
Added OSC_IN Input Section .......................................................20
Changes to PLL2 General Description Section ...........................22
Changes to VCO and VCO Calibration Section .........................23
Changes to Zero Delay Operation Section ..................................26
Added Power Supply Sequencing Section ...................................27
Deleted Figure 32; Renumbered Sequentially .............................29
Changes to SPI Instruction Word (16 Bits) Section ...................32
Changes to Writing to the EEPROM Section and Reading from
the EEPROM Section ......................................................................35
Changes to Programming the EEPROM Buffer Segment
Section ..............................................................................................36
Added Device Initialization Flow Charts Section, Figure 44, and
Figure 45; Renumbered Sequentially ............................................38
Changes to Table 31 ........................................................................44
Changes to Table 40 ........................................................................49
Changes to Table 47 ........................................................................52
2/13—Rev. B to Rev. C
Deleted VDD1.8_PLL2................................................. Throughout
Changes to Data Sheet Title ............................................................. 1
Added TJ of 115°C, Table 1 .............................................................. 4
Changed VDD3_PLL1, Supply Voltage for PLL1 Typical
Parameter from 22 mA to 37 mA and Changed VDD3_PLL1,
Supply Voltage for PLL1 Maximum Parameter from 25.2 mA to
43 mA, Table 2 ................................................................................... 4
Changes to Table 3 ............................................................................ 5
Added PLL1 Characteristics Section and Table 7; Renumbered
Sequentially ........................................................................................ 6
Changes to Table 9 Summary Statement ........................................ 7
Changes to Pin 7 Description, Table 19 .......................................13
Changed Pin 69 from VDD1.8_PLL2 to NC, Table 19 ..............15
Changes to Figure 23 ......................................................................21
Changes to Clock Distribution Synchronization Section ..........25
Changes to Figure 29 ......................................................................26
Added Reset Modes Section and Lock Detect Section ..............26
Added Power-Down Mode Section ..............................................27
Changes to Pin Descriptions Section and Read Section ............ 31
Added Figure 38; Renumbered Sequentially ............................... 33
Changes to Register Section Definition Group Section ............ 36
Changes to Power Dissipation and Thermal Considerations
Section .............................................................................................. 38
Changes to Table 31 ........................................................................ 40
Changes to Bits[1:0] Description, Table 40 and Bit 2
Description, Table 41 ...................................................................... 46
Changes to Bits[7:6] Description, Table 42 ................................. 47
Changes to Bits[1:0] Description, Table 43 ................................. 48
Changes to Bit 4, Bits [3:2] Descriptions, Table 47 ..................... 49
Changed Bit 6 Name from Status PLL2 Feedback Clock to Status
PLL1 Feedback Clock, Table 54 ...................................................... 52
3/11—Rev. A to Rev. B
Added Table Summary, Table 8 ....................................................... 7
Changes to EEPROM Operations Section and Writing to the
EEPROM Section ............................................................................ 34
Changes to 0x01A, Bits[4:3], Table 30 .......................................... 39
Changes to Bits[4:3], Table 40 ....................................................... 46
Changes to Table 47, Bit 1 .............................................................. 48
11/10—Rev. 0 to Rev. A
Change to General Description....................................................... 1
Changes to Table Summary, Table 1 ............................................... 3
Change to Input High Voltage and Input Low Voltage
Parameters and Added Input Threshold Voltage Parameter,
Table 4 ................................................................................................. 4
Change to Junction Temperature Rating, Table 16; Changes
to Thermal Resistance Section ...................................................... 11
Changes to Table 18 ........................................................................ 12
Added Figure 14, Renumbered Sequentially ............................... 16
Edits to Figure 15, Figure 17, and Figure 19 ................................ 17
Changes to VCO Calibration Section........................................... 22
Changed Output Mode Heading to Multimode Output
Drivers; Changes to Multimode Output Drivers Section;
Added Figure 26 .............................................................................. 23
Added Power Dissipation and Thermal Considerations
Section; Added Table 29, Renumbered Sequentially .................. 35
Changes to Table 34, Table 35, Table 36, and Table 38 ............... 43
Changes to Address 0x192, Table 50 ............................................ 48
Changes to Table 52 ........................................................................ 49
Changes to Table 54 ........................................................................ 50
7/10—Revision 0: Initial Version
Rev. D | Page 3 of 60
AD9523
Data Sheet
SPECIFICATIONS
fVCXO = 122.88 MHz single ended, REFA and REFB on differential at 30.72 MHz, fVCO = 3932.16 MHz, doubler is off, channel control low
power mode off, divider phase = 1, unless otherwise noted. Typical is given for VDD = 3.3 V ± 5% and TA = 25°C, unless otherwise noted.
Minimum and maximum values are given over the full VDD and TA (−40°C to +85°C) variation, as listed in Table 1.
CONDITIONS
Table 1.
Parameter
SUPPLY VOLTAGE
VDD3_PLL1, Supply Voltage for PLL1
VDD3_PLL2, Supply Voltage for PLL2
VDD3_REF, Supply Voltage Clock Output Drivers Reference
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers
VDD1.8_OUT[x:y],1 Supply Voltage Clock Dividers
TEMPERATURE
Ambient Temperature Range, TA
Junction Temperature, TJ
1
Min
Typ
Max
3.3
3.3
3.3
3.3
1.8
−40
+25
+85
115
Unit
Test Conditions/Comments
V
V
V
V
V
3.3 V ± 5%
3.3 V ± 5%
3.3 V ± 5%
3.3 V ± 5%
1.8 V ± 5%
°C
°C
x and y are the pair of differential outputs that share the same power supply. For example, VDD3_OUT[0:1] is Supply Voltage Clock Output OUT0, OUT0 (Pin 68 and Pin 67,
respectively) and Supply Voltage Clock Output OUT1, OUT1 (Pin 65 and Pin 64, respectively).
SUPPLY CURRENT
Table 2.
Parameter
SUPPLIES OTHER THAN CLOCK OUTPUT DRIVERS
VDD3_PLL1, Supply Voltage for PLL1
VDD3_PLL2, Supply Voltage for PLL2
VDD3_REF, Supply Voltage Clock Output Drivers Reference
LVPECL Mode
Typ
Max
Unit
Test Conditions/Comments
37
67
43
77.7
mA
mA
Decreases by 9 mA typical if REFB is turned off
5
6
mA
LVDS Mode
4
4.8
mA
HSTL Mode
3
3.6
mA
CMOS Mode
3
3.6
mA
3.5
4.2
mA
Only one output driver turned on; for each
additional output that is turned on, the
current increments by 1.2 mA maximum
Only one output driver turned on; for each
additional output that is turned on, the
current increments by 1.2 mA maximum
Values are independent of the number of
outputs turned on
Values are independent of the number of
outputs turned on
Current for each divider: f = 245.76 MHz
16
17.4
mA
f = 61.44 MHz
5
6.2
mA
f = 245.76 MHz
17
18.9
mA
f = 122.88 MHz
21
24.0
mA
f = 122.88 MHz
14
16.3
mA
f = 122.88 MHz
2
2.4
mA
f = 15.36 MHz, 10 pF load
VDD1.8_OUT[x:y],1 Supply Voltage Clock Dividers2
CLOCK OUTPUT DRIVERS
LVDS Mode, 7 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers
LVDS Mode, 3.5 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers
LVPECL Mode
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers
HSTL Mode, 16 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers
HSTL Mode, 8 mA
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers
CMOS Mode (Single-Ended)
VDD3_OUT[x:y],1 Supply Voltage Clock Output Drivers
Min
x and y are the pair of differential outputs that share the same power supply. For example, VDD3_OUT[0:1] is Supply Voltage Clock Output OUT0, OUT0 (Pin 68 and Pin 67,
respectively) and Supply Voltage Clock Output OUT1, OUT1 (Pin 65 and Pin 64, respectively).
2
The current for Pin 63 (VDD1_OUT[0:3]) is 2× that of the other VDD11.8_OUT[x:y] pairs.
1
Rev. D | Page 4 of 60
Data Sheet
AD9523
POWER DISSIPATION
Table 3.
Parameter
POWER DISSIPATION
Typical Configuration
Min
PD, Power-Down
INCREMENTAL POWER DISSIPATION
Low Power Typical Configuration
Output Distribution, Driver On
LVDS
LVPECL
HSTL
CMOS
Typ
Max
Unit
876
970
mW
101
132.2
mW
389
450
mW
15.3
47.8
50.1
40.2
43.7
6.6
9.9
9.9
18.4
55.4
54.9
46.3
50.3
7.9
11.9
11.9
mW
mW
mW
mW
mW
mW
mW
mW
Test Conditions/Comments
Does not include power dissipated in termination resistors
Clock distribution outputs running as follows: seven LVPECL
outputs at 122.88 MHz, three LVDS outputs (3.5 mA) at
61.44 MHz, three LVDS outputs (3.5 mA) at 245.76 MHz,
one CMOS 10 pF load at 122.88 MHz, and one differential input
reference at 30.72 MHz; fVCXO = 122.88 MHz, fVCO = 3932.16 MHz;
PLL2 BW = 530 kHz, doubler is off
PD pin pulled low, with typical configuration conditions
Absolute total power with clock distribution; one LVPECL output
running at 122.88 MHz; one differential input reference at
30.72 MHz; fVCXO = 122.88 MHz, fVCO = 3932.16 MHz; doubler is off
Incremental power increase (OUT1) from low power typical
Single 3.5 mA LVDS output at 245.76 MHz
Single 7 mA LVDS output at 61.44 MHz
Single LVPECL output at 122.88 MHz
Single 8 mA HSTL output at 122.88 MHz
Single 16 mA HSTL output at 122.88 MHz
Single 3.3 V CMOS output at 15.36 MHz
Dual complementary 3.3 V CMOS output at 122.88 MHz
Dual in-phase 3.3 V CMOS output at 122.88 MHz
REFA, REFA, REFB, REFB, OSC_IN, OSC_IN, AND ZD_IN, ZD_IN INPUT CHARACTERISTICS
Table 4.
Parameter
DIFFERENTIAL MODE
Input Frequency Range
Input Slew Rate (OSC_IN)
Common-Mode Internally
Generated Input Voltage
Input Common-Mode Range
Differential Input Voltage,
Sensitivity Frequency < 250 MHz
Differential Input Voltage,
Sensitivity Frequency > 250 MHz
Differential Input Resistance
Differential Input Capacitance
Duty Cycle
Pulse Width Low
Pulse Width High
CMOS MODE SINGLE-ENDED INPUT
Input Frequency Range
Input High Voltage
Input Low Voltage
Input Threshold Voltage
Input Capacitance
Duty Cycle
Pulse Width Low
Pulse Width High
Min
400
0.6
Typ
0.7
1.025
100
Max
Unit
Test Conditions/Comments
400
MHz
V/µs
V
Minimum limit imposed for jitter performance
0.8
1.475
200
V
mV p-p
mV p-p
4.8
1
For dc-coupled LVDS (maximum swing)
Capacitive coupling required; can accommodate single-ended
input by ac grounding of unused input; the instantaneous
voltage on either pin must not exceed the 1.8 V dc supply rails
Capacitive coupling required; can accommodate single-ended
input by ac grounding of unused input; the instantaneous
voltage on either pin must not exceed the 1.8 V dc supply rails
kΩ
pF
Duty cycle bounds are set by pulse width high and pulse width low
1
1
ns
ns
250
1.0
MHz
V
V
V
1
pF
1.62
0.52
When ac coupling to the input receiver, the user must dc bias the
input to 1 V; the single-ended CMOS input is 3.3 V compatible
Duty cycle bounds are set by pulse width high and pulse width low
1.6
1.6
ns
ns
Rev. D | Page 5 of 60
AD9523
Data Sheet
OSC_CTRL OUTPUT CHARACTERISTICS
Table 5.
Parameter
OUTPUT VOLTAGE
High
Low
Min
Typ
Max
Unit
Test Conditions/Comments
V
mV
RLOAD > 20 kΩ
150
Max
Unit
Test Conditions/Comments
250
MHz
V
0.8
V
Max
Unit
dBc/Hz
VDD3_PLL1 − 0.15
REF_TEST INPUT CHARACTERISTICS
Table 6.
Parameter
REF_TEST INPUT
Input Frequency Range
Input High Voltage
Min
Typ
2.0
Input Low Voltage
PLL1 CHARACTERISTICS
Table 7.
Parameter
PLL1 FIGURE OF MERIT (FOM)
MAXIMUM PFD FREQUENCY
Antibacklash Pulse Width
Min
Typ
−226
Test Conditions/Comments
High is the initial PLL1 antibacklash pulse
width setting. The user must program
Register 0x019[4] = 1b to enable SPI
control of the antibacklash pulse width to
the setting defined in Register 0x019[3:2]
and Table 40.
Minimum
Low
High
Maximum
130
90
65
45
MHz
MHz
MHz
MHz
Max
Unit
MHz
ps
%
PLL1 OUTPUT CHARACTERISTICS
Table 8.
Parameter1
MAXIMUM OUTPUT FREQUENCY
Rise/Fall Time (20% to 80%)
Duty Cycle
OUTPUT VOLTAGE HIGH
Min
45
Typ
250
387
50
665
55
VDD3_PLL1 − 0.25
VDD3_PLL1 − 0.1
V
V
OUTPUT VOLTAGE LOW
0.2
0.1
1
CMOS driver strength = strong (see Table 52).
Rev. D | Page 6 of 60
V
V
Test Conditions/Comments
15 pF load
f = 250 MHz
Output driver static
Load current = 10 mA
Load current = 1 mA
Output driver static
Load current = 10 mA
Load current = 1 mA
Data Sheet
AD9523
DISTRIBUTION OUTPUT CHARACTERISTICS (OUT0, OUT0 TO OUT13, OUT13)
Duty cycle performance is specified with the invert divider bit set to 1, and the divider phase bits set to 0.5. (For example, for Channel 0,
0x190[7] = 1 and 0x192[7:2] = 1.) Output Voltage Reference VDD in Table 9 refers to the 3.3 VDD3_OUT[x:y] supply.
Table 9.
Parameter
LVPECL MODE
Maximum Output Frequency
Rise Time/Fall Time (20% to 80%)
Duty Cycle
Differential Output Voltage Magnitude
Common-Mode Output Voltage
SCALED HSTL MODE, 16 mA
Maximum Output Frequency
Rise Time/Fall Time (20% to 80%)
Duty Cycle
Differential Output Voltage Magnitude
Min
Typ
Max
Unit
Test Conditions/Comments
47
43
40
643
VDD − 1.5
1
117
50
48
49
775
VDD − 1.4
147
52
52
54
924
VDD − 1.25
GHz
ps
%
%
%
mV
V
Minimum VCO/maximum dividers
100 Ω termination across output pair
f < 500 MHz
f = 500 MHz to 800 MHz
f = 800 MHz to 1 GHz
Voltage across pins, output driver static
Output driver static
47
44
40
1.3
1
112
50
48
49
1.6
141
52
51
54
1.7
GHz
ps
%
%
%
V
Minimum VCO/maximum dividers
100 Ω termination across output pair
f < 500 MHz
f = 500 MHz to 800 MHz
f = 800 MHz to 1 GHz
Voltage across pins, output driver static;
nominal supply
Change in output swing vs. VDD3_OUT[x:y]
(ΔVOD/ΔVDD3)
Supply Sensitivity
Common-Mode Output Voltage
LVDS MODE, 3.5 mA
Maximum Output Frequency
Rise Time/Fall Time (20% to 80%)
Duty Cycle
Differential Output Voltage Magnitude
Balanced
Unbalanced
Common-Mode Output Voltage
Common-Mode Difference
Short-Circuit Output Current
CMOS MODE
Maximum Output Frequency
Rise Time/Fall Time (20% to 80%)
Duty Cycle
Output Voltage High
0.6
mV/mV
VDD − 1.76
VDD − 1.6
VDD − 1.42
V
48
43
41
1
138
51
49
49
161
53
53
55
GHz
ps
%
%
%
247
454
50
mV
mV
1.125
1.375
50
V
mV
3.5
24
mA
250
387
50
665
55
MHz
ps
%
45
VDD − 0.25
VDD − 0.1
V
V
Output Voltage Low
0.2
0.1
Rev. D | Page 7 of 60
V
V
100 Ω termination across output pair
f < 500 MHz
f = 500 MHz to 800 MHz
f = 800 MHz to 1 GHz
Voltage across pins; output driver static
Absolute difference between voltage
magnitude of normal pin and inverted pin
Output driver static
Voltage difference between output pins;
output driver static
Output driver static
15 pF load
f = 250 MHz
Output driver static
Load current = 10 mA
Load current = 1 mA
Output driver static
Load current = 10 mA
Load current = 1 mA
AD9523
Data Sheet
TIMING ALIGNMENT CHARACTERISTICS
Table 10.
Parameter
OUTPUT TIMING SKEW
Between Outputs in Same Group1
LVPECL, HSTL, and LVDS
Between LVPECL, HSTL, and LVDS
Outputs
CMOS
Between CMOS Outputs
Mean Delta Between Groups1
Adjustable Delay
Resolution Step
Zero Delay
Between Input Clock Edge on REFA or
REFB to ZD_IN Input Clock Edge,
External Zero Delay Mode
1
Min
Typ
Max
Unit
30
183
ps
100
50
300
ps
Single-ended true phase high-Z mode
63
Steps
ps
Resolution step; for example, 8 × 0.5/1 GHz
½ period of 1 GHz
500
ps
PLL1 settings: PFD = 7.68 MHz, ICP = 63.5 µA, RZERO = 10 kΩ,
antibacklash pulse width is at maximum, BW = 40 Hz, REFA
and ZD_IN are set to differential mode
0
500
150
Test Conditions/Comments
Delay off on all outputs; maximum deviation between rising
edges of outputs; all outputs are on, unless otherwise noted
There are three groups of outputs. They are as follows: the top outputs group: OUT0, OUT1, OUT2, OUT3; the right outputs group: OUT4, OUT5, OUT6, OUT7, OUT8,
OUT9; and the bottom outputs group: OUT10, OUT11, OUT12, OUT13.
JITTER AND NOISE CHARACTERISTICS
Table 11.
Parameter
OUTPUT ABSOLUTE RMS TIME JITTER
Min
Typ
Max
Unit
Test Conditions/Comments
Application example based on a typical setup (see Table 3);
f = 122.88 MHz
fs
fs
fs
fs
fs
Integrated BW = 200 kHz to 5 MHz
Integrated BW = 200 kHz to 10 MHz
Integrated BW = 12 kHz to 20 MHz
Integrated BW = 10 kHz to 61 MHz
Integrated BW = 1 kHz to 61 MHz
LVPECL Mode, HSTL Mode, LVDS Mode
125
136
169
212
223
PLL2 CHARACTERISTICS
Table 12.
Parameter
VCO (ON CHIP)
Frequency Range
Gain
PLL2 FIGURE OF MERIT (FOM)
MAXIMUM PFD FREQUENCY
Antibacklash Pulse Width
Minimum
Low
High
Maximum
Min
Typ
3600
Max
Unit
4000
MHz
MHz/V
dBc/Hz
45
−226
Test Conditions/Comments
High is the initial PLL2 antibacklash pulse
width setting. The user must program
Register 0x0F2[4] = 1b to enable SPI control of
the antibacklash pulse width to the setting
defined in Register 0x0F2[3:2] and Table 47.
259
200
135
80
Rev. D | Page 8 of 60
MHz
MHz
MHz
MHz
Data Sheet
AD9523
LOGIC INPUT PINS—PD, EEPROM_SEL, REF_SEL, RESET, SYNC
Table 13.
Parameter
VOLTAGE
Input High
Input Low
INPUT LOW CURRENT
CAPACITANCE
RESET TIMING
Pulse Width Low
Inactive to Start of Register Programming
SYNC TIMING
Pulse Width Low
Min
Typ
Max
Unit
±80
0.8
±250
V
V
µA
2.0
3
Test Conditions/Comments
The minus sign indicates that, due to the
internal pull-up resistor, current is flowing
out of the AD9523
pF
50
100
ns
ns
1.5
ns
High speed clock is CLK input signal
Max
Unit
Test Conditions/Comments
0.4
V
V
STATUS OUTPUT PINS—STATUS1, STATUS0
Table 14.
Parameter
VOLTAGE
Output High
Output Low
Min
Typ
2.94
SERIAL CONTROL PORT—SPI MODE
Table 15.
Parameter
CS (INPUT)
Voltage
Input Logic 1
Input Logic 0
Current
Input Logic 1
Input Logic 0
Input Capacitance
SCLK (INPUT) IN SPI MODE
Voltage
Input Logic 1
Input Logic 0
Current
Input Logic 1
Input Logic 0
Input Capacitance
SDIO (WHEN INPUT IS IN BIDIRECTIONAL MODE)
Voltage
Input Logic 1
Input Logic 0
Current
Input Logic 1
Input Logic 0
Input Capacitance
Min
Typ
Max
Unit
2.0
0.8
V
V
30
−110
µA
µA
2
pF
Test Conditions/Comments
CS has an internal 40 kΩ pull-up resistor
The minus sign indicates that, due to the
internal pull-up resistor, current is flowing out
of the AD9523
SCLK has an internal 40 kΩ pull-down resistor
in SPI mode but not in I2C mode
2.0
0.8
V
V
240
1
2
µA
µA
pF
2.0
0.8
V
V
1
1
2
µA
µA
pF
Rev. D | Page 9 of 60
AD9523
Parameter
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage
Output Logic 0 Voltage
TIMING
Clock Rate (SCLK, 1/tSCLK)
Pulse Width High, tHIGH
Pulse Width Low, tLOW
SDIO to SCLK Setup, tDS
SCLK to SDIO Hold, tDH
SCLK to Valid SDIO and SDO, tDV
CS to SCLK Setup, tS
CS to SCLK Setup and Hold, tS, tC
CS Minimum Pulse Width High, tPWH
Data Sheet
Min
Typ
Max
Unit
0.4
V
V
2.7
25
8
12
3.3
0
14
10
0
6
Test Conditions/Comments
MHz
ns
ns
ns
ns
ns
ns
ns
ns
SERIAL CONTROL PORT—I²C MODE
VDD = VDD3_REF, unless otherwise noted.
Table 16.
Parameter
SDA, SCL (WHEN INPUTTING DATA)
Input Logic 1 Voltage
Input Logic 0 Voltage
Input Current with an Input Voltage Between
0.1 × VDD and 0.9 × VDD
Hysteresis of Schmitt Trigger Inputs
Pulse Width of Spikes That Must Be
Suppressed by the Input Filter, tSPIKE
SDA (WHEN OUTPUTTING DATA)
Output Logic 0 Voltage at 3 mA Sink Current
Output Fall Time from VIHMIN to VILMAX with
a Bus Capacitance from 10 pF to 400 pF
TIMING
Clock Rate (SCL, fI2C)
Bus Free Time Between a Stop and Start
Condition, tIDLE
Setup Time for a Repeated Start Condition, tSET;
Min
Typ
Max
Unit
0.3 × VDD
+10
V
V
µA
50
V
ns
0.4
250
V
ns
0.7 × VDD
−10
0.015 × VDD
20 + 0.1 CB1
Test Conditions/Comments
Note that all I2C timing values are referred to
VIHMIN (0.3 × VDD) and VILMAX levels (0.7 × VDD)
1.3
400
kHz
µs
0.6
µs
Hold Time (Repeated) Start Condition, tHLD; STR
0.6
µs
Setup Time for Stop Condition, tSET; STP
Low Period of the SCL Clock, tLOW
High Period of the SCL Clock, tHIGH
SCL, SDA Rise Time, tRISE
SCL, SDA Fall Time, tFALL
Data Setup Time, tSET; DAT
Data Hold Time, tHLD; DAT
0.6
1.3
0.6
20 + 0.1 CB1
20 + 0.1 CB1
100
100
880
µs
µs
µs
ns
ns
ns
ns
400
pF
STR
Capacitive Load for Each Bus Line, CB1
1
2
300
300
After this period, the first clock pulse is
generated
This is a minor deviation from the original I²C
specification of 0 ns minimum2
CB is the capacitance of one bus line in picofarads (pF).
According to the original I2C specification, an I2C master must also provide a minimum hold time of 300 ns for the SDA signal to bridge the undefined region of the SCL
falling edge.
Rev. D | Page 10 of 60
Data Sheet
AD9523
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 17.
Parameter
VDD3_PLL1, VDD3_PLL2, VDD3_REF,
VDD3_OUT, LDO_VCO to GND
REFA, REFA, REFIN, REFB, REFB to GND
SCLK/SCL, SDIO/SDA, SDO, CS to GND
OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,
OUT3, OUT3, OUT4, OUT4, OUT5,
OUT5, OUT6, OUT6, OUT7, OUT7,
OUT8, OUT8, OUT9, OUT9, OUT10,
OUT10, OUT11, OUT11, OUT12,
OUT12, OUT13, OUT13 to GND
SYNC, RESET, PD to GND
STATUS0, STATUS1 to GND
SP0, SP1, EEPROM_SEL to GND
VDD1.8_OUT, LDO_PLL1, LDO_PLL2 to
GND
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (10 sec)
Rating
−0.3 V to +3.6 V
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
Table 18. Thermal Resistance
Package
Type
72-Lead LFCSP,
10 mm ×
10 mm
Airflow
Velocity
(m/sec)
0
1.0
2.5
θJA1, 2
21.3
20.1
18.1
θJC1, 3
1.7
θJB1, 4
12.6
ΨJT1, 2
0.1
0.2
0.3
Unit
°C/W
°C/W
°C/W
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
1
2
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +3.6 V
2V
For information about power dissipation, refer to the Power
Dissipation and Thermal Considerations section.
−40°C to +85°C
115°C
−65°C to +150°C
300°C
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. D | Page 11 of 60
AD9523
Data Sheet
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
PLL1_OUT
ZD_IN
ZD_IN
NC
OUT0
OUT0
VDD3_OUT[0:1]
OUT1
OUT1
VDD1.8_OUT[0:3]
OUT2
OUT2
VDD3_OUT[2:3]
OUT3
OUT3
EEPROM_SEL
STATUS0/SP0
STATUS1/SP1
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
PIN 1
INDICATOR
AD9523
(TOP VIEW)
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
VDD1.8_OUT[4:5]
OUT4
OUT4
VDD3_OUT[4:5]
OUT5
OUT5
VDD1.8_OUT[6:7]
OUT6
OUT6
VDD3_OUT[6:7]
OUT7
OUT7
VDD1.8_OUT[8:9]
OUT8
OUT8
VDD3_OUT[8:9]
OUT9
OUT9
NOTES
1. PINS LABELED NC CAN BE ALLOWED TO FLOAT, BUT IT IS BETTER TO CONNECT THESE PINS TO GROUND.
AVOID ROUTING HIGH SPEED SIGNALS THROUGH THESE PINS BECAUSE NOISE COUPLING MAY RESULT.
ON EXISTING PCB DESIGNS, IT ISACCEPTABLE TO LEAVE PIN 69 CONNECTED TO 1.8V SUPPLY.
2. THE EXPOSED PADDLE IS THE GROUND CONNECTION ON THE CHIP. IT MUST BE SOLDERED TO THE
ANALOG GROUND OF THE PCB TO ENSURE PROPER FUNCTIONALITY AND HEAT DISSIPATION, NOISE, AND
MECHANICAL STRENGTH BENEFITS.
08439-002
RESET
CS
SCLK/SCL
SDIO/SDA
SDO
REF_TEST
OUT13
OUT13
VDD3_OUT[12:13]
OUT12
OUT12
VDD1.8_OUT[12:13]
OUT11
OUT11
VDD3_OUT[10:11]
OUT10
OUT10
VDD1.8_OUT[10:11]
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
LDO_PLL1
VDD3_PLL1
REFA
REFA
REFB
REFB
LF1_EXT_CAP
OSC_CTRL
OSC_IN
OSC_IN
LF2_EXT_CAP
LDO_PLL2
VDD3_PLL2
LDO_VCO
PD
REF_SEL
SYNC
VDD3_REF
Figure 2. Pin Configuration
Table 19. Pin Function Descriptions
Pin
No.
1
Mnemonic
LDO_PLL1
Type1
P/O
2
3
VDD3_PLL1
REFA
P
I
4
REFA
I
5
REFB
I
6
REFB
I
7
8
9
LF1_EXT_CAP
OSC_CTRL
OSC_IN
O
O
I
10
OSC_IN
I
11
LF2_EXT_CAP
O
Description
1.8 V Internal LDO Regulator Decoupling Pin for PLL1. Connect a 0.47 µF decoupling capacitor from
this pin to ground. Note that, for best performance, the LDO bypass capacitor must be placed in
close proximity to the device.
3.3 V Supply PLL1. Use the same supply as VCXO.
Reference Clock Input A. Along with REFA, this pin is the differential input for the PLL reference.
Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
Complementary Reference Clock Input A. Along with REFA, this pin is the differential input for the
PLL reference. Alternatively, this pin can be programmed as a single-ended 3.3V CMOS input.
Reference Clock Input B. Along with REFB, this pin is the differential input for the PLL reference.
Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
Complementary Reference Clock Input B. Along with REFB, this pin is the differential input for the PLL
reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
PLL1 External Loop Filter Capacitor. Connect a loop filter capacitor to this pin and to ground.
Oscillator Control Voltage. Connect this pin to the voltage control pin of the external oscillator.
PLL1 Oscillator Input. Along with OSC_IN, this pin is the differential input for the PLL reference.
Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
Complementary PLL1 Oscillator Input. Along with OSC_IN, this pin is the differential input for the PLL
reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
PLL2 External Loop Filter Capacitor Connection. Connect a capacitor to this pin and LDO_VCO.
Rev. D | Page 12 of 60
Data Sheet
AD9523
Pin
No.
12
Mnemonic
LDO_PLL2
Type1
P/O
13
14
VDD3_PLL2
LDO_VCO
P
P/O
15
16
17
PD
REF_SEL
SYNC
I
I
I
18
19
VDD3_REF
RESET
P
I
20
21
CS
SCLK/SCL
I
I
22
23
SDIO/SDA
SDO
I/O
O
24
25
REF_TEST
OUT13
I
O
26
OUT13
O
27
28
VDD3_OUT[12:13]
OUT12
P
O
29
OUT12
O
30
31
VDD1.8_OUT[12:13]
OUT11
P
O
32
OUT11
O
33
34
VDD3_OUT[10:11]
OUT10
P
O
35
OUT10
O
36
37
VDD1.8_OUT[10:11]
OUT9
P
O
38
OUT9
O
39
40
VDD3_OUT[8:9]
OUT8
P
O
41
OUT8
O
42
43
VDD1.8_OUT[8:9]
OUT7
P
O
44
OUT7
O
45
VDD3_OUT[6:7]
P
Description
LDO Decoupling Pin for PLL2 1.8 V Internal Regulator. Connect a 0.47 µF decoupling capacitor from
this pin to ground. Note that for best performance, the LDO bypass capacitor must be placed in close
proximity to the device.
3.3 V Supply for PLL2.
2.5 V LDO Internal Regulator Decoupling Pin for VCO. Connect a 0.47 µF decoupling capacitor from
this pin to ground. Note that, for best performance, the LDO bypass capacitor must be placed in
close proximity to the device.
Chip Power-Down, Active Low. This pin has an internal 40 kΩ pull-up resistor.
Reference Input Select. This pin has an internal 40 kΩ pull-down resistor.
Manual Synchronization. This pin initiates a manual synchronization and has an internal 40 kΩ pull-up
resistor.
3.3 V Supply for Output Clock Drivers Reference.
Digital Input, Active Low. Resets internal logic to default states. This pin has an internal 40 kΩ pull-up
resistor.
Serial Control Port Chip Select, Active Low. This pin has an internal 40 kΩ pull-up resistor.
Serial Control Port Clock Signal for SPI Mode (SCLK) or I2C Mode (SCL). Data clock for serial programming. This pin has an internal 40 kΩ pull-down resistor in SPI mode but is high impedance in I²C mode.
Serial Control Port Bidirectional Serial Data In/Data Out for SPI Mode (SDIO) or I²C Mode (SDA).
Serial Data Output. Use this pin to read data in 4-wire mode (high impedance in 3-wire mode). There
is no internal pull-up/pull-down resistor on this pin.
Test Input to PLL1 Phase Detector.
Complementary Square Wave Clocking Output 13. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 13. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
3.3 V Supply for Output 12 and Output 13 Clock Drivers.
Complementary Square Wave Clocking Output 12. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 12. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
1.8 V Supply for Output 12 and Output 13 Clock Dividers.
Complementary Square Wave Clocking Output 11. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 11. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
3.3 V Supply for Output 10 and Output 11 Clock Drivers.
Complementary Square Wave Clocking Output 10. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 10. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
1.8 V Supply for Output 10 and Output 11 Clock Dividers.
Complementary Square Wave Clocking Output 9. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 9. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
3.3 V Supply for Output 8 and Output 9 Clock Drivers.
Complementary Square Wave Clocking Output 8. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 8. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
1.8 V Supply for Output 8 and Output 9 Clock Dividers.
Complementary Square Wave Clocking Output 7. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 7. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
3.3 V Supply for Output 6 and Supply Output 7 Clock Drivers.
Rev. D | Page 13 of 60
AD9523
Data Sheet
Pin
No.
46
Mnemonic
OUT6
Type1
O
47
OUT6
O
48
49
VDD1.8_OUT[6:7]
OUT5
P
O
50
OUT5
O
51
52
VDD3_OUT[4:5]
OUT4
P
O
53
OUT4
O
54
55
VDD1.8_OUT[4:5]
STATUS1/SP1
P
I/O
56
STATUS0/SP0
I/O
57
EEPROM_SEL
I
58
OUT3
O
59
OUT3
O
60
61
VDD3_OUT[2:3]
OUT2
P
O
62
OUT2
O
63
64
VDD1.8_OUT[0:3]
OUT1
P
O
65
OUT1
O
66
67
VDD3_OUT[0:1]
OUT0
P
O
68
OUT0
O
69
70
NC
ZD_IN
P
I
71
ZD_IN
I
72
PLL1_OUT
O
EP
EP, GND
GND
1
Description
Complementary Square Wave Clocking Output 6. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 6. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
1.8 V Supply for Output 6 and Output 7 Clock Dividers.
Complementary Square Wave Clocking Output 5. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 5. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
3.3 V Supply for Output 4 and Output 5 Clock Drivers.
Complementary Square Wave Clocking Output 4. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 4. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
1.8 V Supply for Output 4 and Output 5 Clock Dividers.
Lock Detect and Other Status Signals (STATUS1)/I2C Address (SP1). This pin has an internal 40 kΩ pulldown resistor.
Lock Detect and Other Status Signals (STATUS0)/I2C Address (SP0). This pin has an internal 40 kΩ pulldown resistor.
EEPROM Select. Setting this pin high selects the register values stored in the internal EEPROM to be
loaded at reset and/or power-up. Setting this pin low causes the AD9523 to load the hard-coded
default register values at power-up/reset. This pin has an internal 40 kΩ pull-down resistor.
Complementary Square Wave Clocking Output 3. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 3. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
3.3 V Supply for Output 2 and Output 3 Clock Drivers.
Complementary Square Wave Clocking Output 2. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 2. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
1.8 V Supply for Output 0, Output 1, Output 2, and Output 3 Clock Dividers.
Complementary Square Wave Clocking Output 1. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 1. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
3.3 V Supply for Output 0 and Output 1 Clock Drivers.
Complementary Square Wave Clocking Output 0. This pin can be configured as one side of
a differential LVPECL/LVDS/HSTL output or as a single-ended CMOS output.
Square Wave Clocking Output 0. This pin can be configured as one side of a differential LVPECL/
LVDS/HSTL output or as a single-ended CMOS output.
This pin is not connected internally (see Figure 2).
External Zero Delay Clock Input. Along with ZD_IN, this pin is the differential input for the PLL
reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
Complementary External Zero Delay Clock Input. Along with ZD_IN, this pin is the differential input
for the PLL reference. Alternatively, this pin can be programmed as a single-ended 3.3 V CMOS input.
Single-Ended CMOS Output from PLL1. This pin has settings for weak and strong in Register 0x1BA[4]
(see Table 52).
Exposed Paddle. The exposed paddle is the ground connection on the chip. It must be soldered to
the analog ground of the PCB to ensure proper functionality and heat dissipation, noise, and
mechanical strength benefits.
P is power, I is input, O is output, I/O is input/output, P/O is power/output, and GND is ground.
Rev. D | Page 14 of 60
Data Sheet
AD9523
TYPICAL PERFORMANCE CHARACTERISTICS
fVCXO = 122.88 MHz, REFA differential at 30.72 MHz, fVCO = 3686.4 MHz, and doubler is off, unless otherwise noted.
60
35
50
30
25
40
CURRENT (mA)
CURRENT (mA)
HSTL = 16mA
20pF
30
HSTL = 8mA
20
10pF
2pF
20
15
10
10
0
0
200
400
600
800
1000
08439-006
08439-003
5
0
0
1200
100
FREQUENCY (MHz)
400
500
600
Figure 6. VDD3_OUT[x:y] Current (Typical) vs. Frequency;
CMOS Mode, 20 pF, 10 pF, and 2 pF Load
45
3.5
40
DIFFERENTIAL SWING (V p-p)
3.0
35
LVDS = 7mA
30
25
20
15
LVDS = 3.5mA
10
0
0
200
400
600
800
1000
2.5
2.0
HSTL = 8mA
1.5
1.0
0.5
08439-004
5
HSTL = 16mA
08439-007
CURRENT (mA)
300
FREQUENCY (MHz)
Figure 3. VDD3_OUT[x:y] Current (Typical) vs. Frequency;
HSTL Mode, 16 mA and 8 mA
0
0
1200
200
Figure 4. VDD3_OUT[x:y] Current (Typical) vs. Frequency;
LVDS Mode, 7 mA and 3.5 mA
40
1.4
DIFFERENTIAL SWING (V p-p)
1.6
35
30
25
20
15
10
0
600
400
800
FREQUENCY (MHz)
800
1000
1200
1000
1.2
1.0
0.8
0.6
0.4
08439-008
0.2
08439-005
5
200
600
Figure 7. Differential Voltage Swing vs. Frequency;
HSTL Mode, 16 mA and 8 mA
45
0
400
FREQUENCY (MHz)
FREQUENCY (MHz)
CURRENT (mA)
200
0
0
1200
200
400
600
800
1000
FREQUENCY (MHz)
Figure 8. Differential Voltage Swing vs. Frequency,
LVPECL Mode
Figure 5. VDD3_OUT[x:y] Current (Typical) vs. Frequency,
LVPECL Mode
Rev. D | Page 15 of 60
1200
AD9523
Data Sheet
1.4
–70
LVDS = 7mA
PHASE NOISE (dBc/Hz)
0.8
LVDS = 3.5mA
0.6
0.4
1
–100
–110
2
–120
–130
3
4
5
–140
–150
08439-009
0.2
0
0
200
400
600
800
1000
–160
–170
100
1200
1k
10k
7
8
100k
1M
10M
FREQUENCY (Hz)
FREQUENCY (MHz)
Figure 12. Phase Noise, Output = 184.32 MHz
(VCXO = 122.88 MHz, Crystek VCXO CVHD-950)
Figure 9. Differential Voltage Swing vs. Frequency;
LVDS Mode, 7 mA and 3.5 mA
4.0
–70
2pF
1:
2:
3:
4:
5:
6:
7:
8:
x:
–80
3.5
1
–90
PHASE NOISE (dBc/Hz)
10pF
2.5
20pF
2.0
1.5
1.0
–100
–110
–120
3
–140
08439-010
0
0
100
200
300
400
500
2
–130
–150
0.5
100Hz, –89.0260dBc/Hz
1kHz, –116.9949dBc/Hz
8kHz, –129.5198dBc/Hz
16kHz, –133.3916dBc/Hz
100kHz, –137.7680dBc/Hz
1MHz, –148.3519dBc/Hz
10MHz, –158.3307dBc/Hz
40MHz, 159.1629–dBc/Hz
START 12kHz
STOP 80MHz
CENTER 40.006MHz
SPAN 79.988MHz
–160
4
5
NOISE:
ANALYSIS RANGE X: BAND MARKER
ANALYSIS RANGE Y: BAND MARKER
INTG NOISE: –78.8099dBc/39.99MHz
RMS NOISE: 162.189µRAD
9.29276mdeg
RMS JITTER: 210.069fsec
RESIDUAL FM: 2.27638kHz
–170
100
600
1k
10k
100k
6
7
1M
8
08439-016
3.0
AMPLITUDE (V)
6
NOISE:
ANALYSIS RANGE X: BAND MARKER
ANALYSIS RANGE Y: BAND MARKER
INTG NOISE: –75.94595dBc/39.99MHz
RMS NOISE: 225.539µRAD
12.9224mdeg
RMS JITTER: 194.746fsec
RESIDUAL FM: 2.81623kHz
10M
FREQUENCY (Hz)
FREQUENCY (MHz)
Figure 13. Phase Noise, Output = 122.88 MHz
(VCXO = 122.88 MHz, Crystek VCXO CVHD-950; Doubler Is Off)
Figure 10. Amplitude vs. Frequency and Capacitive Load;
CMOS Mode, 2 pF, 10 pF, and 20 pF
1
08439-013
1
CH1 200mV
2.5ns/DIV
40.0GS/s
A CH1
CH1 500mV Ω
104mV
Figure 11. Output Waveform (Differential), LVPECL at 122.88 MHz
2.5ns/DIV
40.0GS/s
A CH1
80mV
08439-049
DIFFERENTIAL SWING (V p-p)
–90
1.0
100Hz, –85.0688dBc/Hz
1kHz, –113.3955dBc/Hz
8kHz, –125.8719dBc/Hz
16kHz, –129.5942dBc/Hz
100kHz, –134.5017dBc/Hz
1MHz, –145.2872dBc/Hz
10MHz, –156.2706dBc/Hz
40MHz, –157.4153dBc/Hz
START 12kHz
STOP 80MHz
CENTER 40.006MHz
SPAN 79.988MHz
08439-015
1.2
1:
2:
3:
4:
5:
6:
7:
8:
x:
–80
Figure 14. Output Waveform (Differential), HSTL at 16 mA, 122.88 MHz
Rev. D | Page 16 of 60
Data Sheet
AD9523
INPUT/OUTPUT TERMINATION RECOMMENDATIONS
100Ω
HIGH
IMPEDANCE
INPUT
HSTL
OUTPUT
DOWNSTREAM
DEVICE
0.1µF
100Ω
HIGH
IMPEDANCE
INPUT
DOWNSTREAM
DEVICE
0.1µF
Figure 15. AC-Coupled LVDS Output Driver
Figure 19. AC-Coupled HSTL Output Driver
AD9523
AD9523
100Ω
HIGH
IMPEDANCE DOWNSTREAM
DEVICE
INPUT
HSTL
OUTPUT
100Ω
HIGH
IMPEDANCE DOWNSTREAM
DEVICE
INPUT
08439-047
08439-143
LVDS
OUTPUT
0.1µF
08439-046
LVDS
OUTPUT
AD9523
0.1µF
08439-142
AD9523
Figure 20. DC-Coupled HSTL Output Driver
0.1µF
LVPECLCOMPATIBLE
OUTPUT
100Ω
HIGH
IMPEDANCE
INPUT
DOWNSTREAM
DEVICE
0.1µF
0.1µF
1RESISTOR
VALUE DEPENDS UPON
REQUIRED TERMINATION OF SOURCE.
Figure 21. REF, OSC_IN, and Zero Delay Input Differential Mode
Figure 17. AC-Coupled LVPECL Output Driver
AD9523
100Ω
HIGH
IMPEDANCE DOWNSTREAM
DEVICE
INPUT
08439-045
LVPECLCOMPATIBLE
OUTPUT
SELF BIASED
REF, OSC_IN,
ZERO DELAY
INPUTS
100Ω
(OPTIONAL1)
0.1µF
08439-044
AD9523
AD9523
08439-048
Figure 16. DC-Coupled LVDS Output Driver
Figure 18. DC-Coupled LVPECL Output Driver
Rev. D | Page 17 of 60
AD9523
Data Sheet
TERMINOLOGY
Phase Jitter and Phase Noise
An ideal sine wave can be thought of as having a continuous
and even progression of phase with time from 0° to 360° for
each cycle. Actual signals, however, display a certain amount
of variation from ideal phase progression over time. This
phenomenon is called phase jitter. Although many causes can
contribute to phase jitter, one major cause is random noise,
which is characterized statistically as being Gaussian (normal)
in distribution.
This phase jitter leads to a spreading out of the energy of the
sine wave in the frequency domain, producing a continuous
power spectrum. This power spectrum is usually reported as a
series of values whose units are dBc/Hz at a given offset in
frequency from the sine wave (carrier). The value is a ratio
(expressed in decibels) of the power contained within a 1 Hz
bandwidth with respect to the power at the carrier frequency.
For each measurement, the offset from the carrier frequency is
also given.
It is meaningful to integrate the total power contained within
some interval of offset frequencies (for example, 10 kHz to
10 MHz). This is called the integrated phase noise over that
frequency offset interval and can be readily related to the time
jitter due to the phase noise within that offset frequency interval.
Phase noise has a detrimental effect on the performance of ADCs,
DACs, and RF mixers. It lowers the achievable dynamic range of
the converters and mixers, although they are affected in somewhat
different ways.
Time Jitter
Phase noise is a frequency domain phenomenon. In the time
domain, the same effect is exhibited as time jitter. When observing
a sine wave, the time of successive zero crossings varies. In a square
wave, the time jitter is a displacement of the edges from their
ideal (regular) times of occurrence. In both cases, the variations in
timing from the ideal are the time jitter. Because these variations
are random in nature, the time jitter is specified in seconds root
mean square (rms) or 1 sigma (Σ) of the Gaussian distribution.
Time jitter that occurs on a sampling clock for a DAC or an
ADC decreases the signal-to-noise ratio (SNR) and dynamic
range of the converter. A sampling clock with the lowest possible
jitter provides the highest performance from a given converter.
Additive Phase Noise
Additive phase noise is the amount of phase noise that can be
attributed to the device or subsystem being measured. The phase
noise of any external oscillators or clock sources is subtracted.
This makes it possible to predict the degree to which the device
impacts the total system phase noise when used in conjunction
with the various oscillators and clock sources, each of which
contributes its own phase noise to the total. In many cases, the
phase noise of one element dominates the system phase noise.
When there are multiple contributors to phase noise, the total is
the square root of the sum of squares of the individual contributors.
Additive Time Jitter
Additive time jitter is the amount of time jitter that can be
attributed to the device or subsystem being measured. The time
jitter of any external oscillators or clock sources is subtracted.
This makes it possible to predict the degree to which the device
impacts the total system time jitter when used in conjunction with
the various oscillators and clock sources, each of which contributes
its own time jitter to the total. In many cases, the time jitter of the
external oscillators and clock sources dominates the system time
jitter.
Rev. D | Page 18 of 60
Data Sheet
AD9523
THEORY OF OPERATION
DETAILED BLOCK DIAGRAM
VCXO
LDO_PLL1
LF1_EXT_CA P
PLL1_OUT
OSC_CTRL OSC_IN
STATUS0/ STATUS1/
SP0
SP1
LF2_EXT_CA P
LDO_VCO
STATUS MONITOR
LOCK DETECT/
SERIAL PORT
ADDRESS
REFA
REFA
÷R
SWITCHOVER
CONTROL
REF_SEL
REFB
REFB
REF_TEST
LOCK
DETECT
÷D1
LOOP
FILTER
LOCK
DETECT
÷R
P
F
D
SYNC
SIGNAL
3.6GHz
TO
4.0GHz
CHARGE
PUMP
×2
÷R
P
F
D
CHARGE
PUMP
LOOP
FILTER
VCO
÷M1
VDD1.8_OUT[x:y] VDD3_OUT[x:y]
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
÷D
Δt
EDGE
OUT13
OUT13
OUT12
OUT12
OUT11
OUT11
OUT10
OUT10
OUT9
OUT9
OUT8
OUT8
OUT7
OUT7
OUT6
OUT6
OUT5
OUT5
OUT4
OUT4
÷D
Δt
EDGE
OUT3
OUT3
÷D
Δt
EDGE
OUT2
OUT2
÷D
Δt
EDGE
OUT1
OUT1
÷D
Δt
EDGE
OUT0
OUT0
÷N1
÷N2
PLL2
PLL1
SDIO/SDA
SDO
SCLK/SCL
CS
RESET
PD
EEPROM_SEL
CONTROL
INTERFACE
(SPI AND I 2C)
EEPROM
TO SYNC
AD9523
LDO_PLL2
VDD3_PLL2
NC
SYNC
ZD_IN
ZD_IN
08439-020
VDD3_PLL1
Figure 22. Top Level Diagram
OVERVIEW
The AD9523 is a clock generator that employs integer-N-based
phase-locked loops (PLL). The device architecture consists of two
cascaded PLL stages. The first stage, PLL1, consists of an integer
division PLL that uses an external voltage-controlled crystal
oscillator (VCXO) of up to 250 MHz. PLL1 has a narrow-loop
bandwidth that provides initial jitter cleanup of the input reference
signal. The second stage, PLL2, is a frequency multiplying PLL
that translates the first stage output frequency to a range of 3.6 GHz
to 4.0 GHz. PLL2 incorporates an integer-based feedback divider
that enables integer frequency multiplication. Programmable
integer dividers (1 to 1024) follow PLL2, establishing a final
output frequency of 1 GHz or less.
The AD9523 includes reference signal processing blocks that
enable a smooth switching transition between two reference
inputs. This circuitry automatically detects the presence of the
reference input signals. If only one input is present, the device
uses it as the active reference. If both are present, one becomes
the active reference and the other becomes the backup reference.
If the active reference fails, the circuitry automatically switches
to the backup reference (if available), making it the new active
reference. A register setting determines what action to take if
the failed reference is once again available: either stay on
Reference B or revert to Reference A. If neither reference can
be used, the AD9523 supports a holdover mode. A reference
select pin (REF_SEL, Pin 16) is available to manually select
which input reference is active (see Table 43). The accuracy of
the holdover is dependent on the external VCXO frequency
stability at half supply voltage.
Any of the divider settings are programmable via the serial
programming port, enabling a wide range of input/output
frequency ratios under program control. The dividers also
include a programmable delay to adjust the timing of the output
signals, if required.
The 14 outputs are compatible with LVPECL, LVDS, HSTL, and
1.8 V CMOS logic levels (see the Input/Output Termination
Recommendations section). All differential output logic settings
require a single 100 Ω differential termination.
The loop filters of each PLL are integrated and programmable.
Only a single external capacitor for each of the two PLL loop
filters is required.
The AD9523 operates over the extended industrial temperature
range of −40°C to +85°C.
Rev. D | Page 19 of 60
AD9523
Data Sheet
COMPONENT BLOCKS—INPUT PLL (PLL1)
PLL1 General Description
Fundamentally, the input PLL (referred to as PLL1) consists of
a phase/frequency detector (PFD), charge pump, passive loop
filter, and an external VCXO operating in a closed loop.
PLL1 has the flexibility to operate with a loop bandwidth of
approximately 10 Hz to 100 Hz. This relatively narrow loop
bandwidth gives the AD9523 the ability to suppress jitter that
appears on the input references (REFA and REFB). The output
of PLL1 then becomes a low jitter phase-locked version of the
reference input system clock.
as well as such configuration parameters as input clock rate and
desired bandwidth. Normally, a 0.3 µF capacitor allows the loop
bandwidth to range from 10 Hz to 100 Hz and ensures loop
stability over the intended operating parameters of the device (see
Table 44 for RZERO values). The operating loop bandwidth (LBW)
of PLL1 can be used as a metric to estimate the time required for
the PLL to phase lock. In general, PLL1 is phase locked within
10 loop bandwidth time constants, τLBW, where τLBW = 1/LBW.
Therefore, PLL_TO (see Figure 44) equals 10 × τLBW.
LDO_PLL1
LF1_EXT_CAP
AD9523
PLL1 Reference Clock Inputs
The AD9523 features two separate PLL1 differential reference
clock inputs, REFA and REFB. These inputs can be configured
to operate in full differential mode or single-ended CMOS mode.
To operate either the REFA or the REFB inputs in 3.3 V CMOS
mode, set Register 0x01A[6:5] and Register 0x01B[1:0] (see
Table 41 and Table 40). The single-ended inputs can be driven
by either a dc-coupled CMOS level signal or an ac-coupled sine
wave or square wave.
The differential reference input receiver is powered down when
the differential reference input is not selected, or when the PLL
is powered down. The single-ended buffers power-down when
the PLL is powered down, when their respective individual powerdown registers are set, or when the differential receiver is selected.
The REFB R divider uses the same value as the REFA R divider
unless Register 0x01C[7], the enable REFB R divider independent
division control bit, is programmed as shown in Table 43.
CPOLE1
CPOLE2
OSC_CTRL
CHARGE
PUMP
1kΩ
RPOLE2
BUFFER
TO VCXO
VTUNE
INPUT
08439-022
In differential mode, these pins are internally self biased. If
REFA or REFB is driven single-ended in differential mode, the
unused side (REFA, REFB) should be decoupled via a suitable
capacitor to a quiet ground. Figure 21 shows the recommended
differential input termination to REFA or REFB. It is possible to
dc couple to these inputs, but the dc operation point should be
set as specified in the Specifications tables.
RZERO
0.3µF
Figure 23. PLL1 Loop Filter
Table 20. PLL1 Loop Filter Programmable Values
RZERO
(kΩ)
883
677
341
135
10
External
1
CPOLE1
(nF)
1.5 fixed
RPOLE2
(kΩ)
165 fixed
CPOLE2
(nF)
0.337 fixed
LF1_EXT_CAP1
(µF)
0.3
External loop filter capacitor.
An external RC low-pass filter should be used at the OSC_CTRL
output. The values shown in Figure 23 add an additional lowpass pole at ~530 Hz. This RC network filters the noise associated
with the OSC_CTRL buffer to achieve the best noise performance
at the 1 kHz offset region.
LF1_EXT_CAP
OSC_IN Input
The OSC_IN receiver is powered down when the PLL1 powerdown bit is set (Register 0x233[2] = 1b). When using the AD9523
in a mode of operation that bypasses PLL1, the PLL1 power-down
bit must be disabled (Register 0x233[2] = 0b).
REFA
REFA
DIVIDE-BY1, 2, ...1023
REFB
REFB
P
F
D
DIVIDE-BY1, 2, ...1023
3.3V CMOS
OR 1.8V
DIFFERENTIAL
REF_TEST
RZERO
SWITCHOVER
CONTROL
REF_SEL
CHARGE
PUMP
7 BITS,
0.5µA LSB
RPOLE2
CPOLE1
CPOLE2
VCXO
DIVIDE-BY1, 2, ...1023
DIVIDE-BY1, 2, ...63
Rev. D | Page 20 of 60
OSC_IN
1.8V LDO
AD9523
VDD3_PLL
LDO_PLL1
PLL1 Loop Filter
The PLL1 loop filter requires the connection of an external
capacitor from LF1_EXT_CAP (Pin 7) to ground. The value of
the external capacitor depends on the use of an external VCXO,
OSC_CTRL
Figure 24. Input PLL (PLL1) Block Diagram
08439-021
The OSC_IN receiver connects to the PLL1 feedback divider
and to the PLL2 PFD through an optional doubler. This input
receiver is identical to the PLL1 REFA and REFB receivers.
Control bits for this receiver are located in Register 0x01A[1:0].
Figure 21 shows the recommended differential input termination
to the OSC_IN receiver.
Data Sheet
AD9523
PLL1 Input Dividers
Automatic reference switchover can be set to work as follows:
Each reference input feeds a dedicated reference divider block.
The input dividers provide division of the reference frequency
in integer steps from 1 to 1023. They provide the bulk of the
frequency prescaling that is necessary to reduce the reference
frequency to accommodate the bandwidth that is typically
desired for PLL1.
•
PLL1 Reference Switchover
The reference monitor verifies the presence/absence of the
prescaled REFA and REFB signals (that is, after division by the
input dividers). The status of the reference monitor guides the
activity of the switchover control logic. The AD9523 supports
automatic and manual PLL reference clock switching between
REFA (the REFA and REFA pins) and REFB (the REFB and
REFB pins). This feature supports networking and infrastructure
applications that require redundant references.
There are several configurable modes of reference switchover.
Manual reference switchover is achieved either via a
programming register setting or by using the REF_SEL pin.
Automatic reference switchover occurs when REFA disappears
and there is a reference on REFB.
•
Nonrevertive: stay on REFB. Switch from REFA to REFB
when REFA disappears, but do not switch back to REFA
if it reappears. If REFB disappears, then go back to REFA.
Revert to REFA: switch from REFA to REFB when REFA
disappears. Return to REFA from REFB when REFA returns.
See Table 43 for the PLL1 miscellaneous control register bit settings.
PLL1 Holdover
In the absence of both input references, the device enters
holdover mode. Holdover is a secondary function that is
provided by PLL1. Because PLL1 has an external VCXO
available as a frequency source, it continues to operate in the
absence of the input reference signals. When the device
switches to holdover, the charge pump tristates. The device
continues operating in this mode until a reference signal
becomes available. Then the device exits holdover mode,
and PLL1 resynchronizes with the active reference. In addition
to tristate, the charge pump can be forced to VCC/2 during
holdover (see Table 43, Register 0x01C[6]).
Rev. D | Page 21 of 60
AD9523
Data Sheet
COMPONENT BLOCKS—OUTPUT PLL (PLL2)
Input 2× Frequency Multiplier
PLL2 General Description
The 2× frequency multiplier provides the option to double
the frequency at the PLL2 input. This allows the user to take
advantage of a higher frequency at the input to the PLL (PFD)
and, thus, allows for reduced in-band phase noise and greater
separation between the frequency generated by the PLL and the
modulation spur associated with PFD. However, increased
reference spur separation results in harmonic spurs introduced
by the frequency multiplier that increase as the duty cycle
deviates from 50% at the OSC_IN inputs. Therefore, beneficial
use of the frequency multiplier is application-specific. Typically,
a VCXO with proper interfacing has a duty cycle that is
approximately 50% at the OSC_IN inputs. Note that the
maximum output frequency of the 2× frequency multipliers
must not exceed the maximum PFD rate that is specified in
Table 12.
The output PLL (referred to as PLL2) consists of an optional
input reference doubler, phase/frequency detector (PFD),
a partially integrated analog loop filter (see Figure 25), an
integrated voltage controlled oscillator (VCO), and a feedback
divider. The VCO produces a nominal 3.8 GHz signal with an
output divider that is capable of division ratios of 4 to 11.
The PFD of the output PLL drives a charge pump that increases,
decreases, or holds constant the charge stored on the loop filter
capacitors (both internal and external). The stored charge results
in a voltage that sets the output frequency of the VCO. The
feedback loop of the PLL causes the VCO control voltage to
vary in a way that phase locks the PFD input signals. The gain
of PLL2 is proportional to the current delivered by the charge
pump. The loop filter bandwidth is chosen to reduce noise
contributions from PLL sources that could degrade phase noise
requirements.
PLL2 Feedback Divider
PLL2 has a feedback divider (N divider) that enables it to provide
integer frequency up-conversion. The PLL2 N divider is a
combination of a prescaler (P) and two counters, A and B.
The total divider value is
The output PLL has a VCO with multiple bands spanning a
range of 3.6 GHz to 4.0 GHz. However, the actual operating
frequency within a particular band depends on the control
voltage that appears on the loop filter capacitor. The control
voltage causes the VCO output frequency to vary linearly within
the selected band. This frequency variability allows the control
loop of the output PLL to synchronize the VCO output signal
with the reference signal applied to the PFD. Typically, the
device automatically selects the appropriate band as part of
its calibration process (invoked via the VCO control register
at Address 0x0F3). The VCO is designed to operate over
temperature extremes including when the VCO is calibrated
at one temperature extreme and operated within another.
N = (P × B) + A
where P = 4.
The feedback divider is a dual modulus prescaler architecture,
with a nonprogrammable P that is equal to 4. The value of the
B counter can be from 4 to 63, and the value of the A counter can
be from 0 to 3. However, due to the architecture of the divider,
there are constraints, as listed in Table 46.
LF2_EXT_CAP
PLL1_OUT
VDD3_PLL2
LDO_VCO
LDO_PLL2
AD9523
LDO
LDO
RZERO
PLL_1.8V
CPOLE1
PFD
×2
CHARGE PUMP
8 BITS, 3.5µA LSB
CPOLE2
RPOLE2
A/B
COUNTERS
DIVIDE BY
4, 5, 6, ...11
TO DIST/
RESYNC
DIVIDE-BY-4
PRESCALER
N DIVIDER
Figure 25. Output PLL (PLL2) Block Diagram
Rev. D | Page 22 of 60
08439-023
DIVIDE BY
1, 2, 4, 8, 16
Data Sheet
AD9523
PLL2 Loop Filter
VCO and VCO Calibration
The PLL2 loop filter requires the connection of an external
capacitor from LF2_EXT_CAP (Pin 11) to LDO_VCO (Pin 14),
as illustrated in Figure 25. The value of the external capacitor
depends on the operating mode and the desired phase noise
performance. For example, a loop bandwidth of approximately
500 kHz produces the lowest integrated jitter. A lower bandwidth
produces lower phase noise at 1 MHz but increases the total
integrated jitter.
The AD9523 on-chip VCO must be manually calibrated to
ensure proper operation over process and temperature. A VCO
calibration is accomplished by transitioning the calibrate VCO
bit (Register 0x0F3[1]) from 0 to 1 (this bit is not self clearing).
The setting can be performed as part of the initial setup before
executing the IO_UPDATE bit (Register 0x234[1] = 1b). A
readback bit, VCO calibration in progress (Register 0x22D[0]),
indicates when a VCO calibration is in progress by returning a
logic true (Register 0x22D[1] = 1b). If the EEPROM is in use,
setting the calibrate VCO bit to 1 before saving the register
settings to the EEPROM ensures that the VCO calibrates
automatically after the EEPROM has loaded. After calibration,
it is recommended to initiate a distribution sync (see the Clock
Distribution Synchronization section).
Table 21. PLL2 Loop Filter Programmable Values
RZERO
(Ω)
3250
3000
2750
2500
2250
2100
2000
1850
1
CPOLE1
(pF)
48
40
32
24
16
8
0
RPOLE2
(Ω)
900
450
300
225
CPOLE2
(pF)
Fixed at 16
LF2_EXT_CAP1
(pF)
Typical at 1000
Note that the calibrate VCO bit defaults to 0. This bit must
change from 0 to 1 to initiate a calibration sequence. Therefore,
any subsequent calibrations require the following sequence:
1.
2.
3.
4.
External loop filter capacitor.
VCO Divider
The VCO divider provides frequency division between the
internal VCO and the clock distribution. The VCO divider can
be set to divide by 4, 5, 6, 7, 8, 9, 10, or 11.
Register 0x0F3[1] = 0b (calibrate VCO bit)
Register 0x234[0] = 1b (IO_UPDATE bit)
Register 0x0F3[1] = 1b (calibrate VCO bit)
Register 0x234[0] =1b (IO_UPDATE bit)
VCO calibration is controlled by a calibration controller that
runs off the OSC_IN input clock. The calibration requires that
PLL2 be set up properly to lock the PLL2 loop and that the
OSC_IN clock be present.
During power-up or reset, the distribution section is automatically
held in sync until the first VCO calibration is finished. Therefore,
no outputs can occur until VCO calibration is complete and
PLL2 is locked. This default functionality can be overwritten
using Register 0x0F3[4].
Initiate a VCO calibration under the following conditions:
•
•
Rev. D | Page 23 of 60
After changing any of the PLL2 B counter and A counter
settings or after a change in the PLL2 reference clock
frequency. This means that a VCO calibration should be
initiated any time that a PLL2 register or reference clock
changes such that a different VCO frequency is the result.
Whenever system calibration is desired. The VCO is designed
to operate properly over extremes of temperature even
when it is first calibrated at the opposite extreme. However,
a VCO calibration can be initiated at any time, if desired.
AD9523
Data Sheet
CLOCK DISTRIBUTION
The clock distribution block provides an integrated solution for
generating multiple clock outputs based on frequency dividing
the PLL2 VCO divider output. The distribution output consists
of 14 channels (OUT0 to OUT13). Each of the output channels
has a dedicated divider and output driver, as shown in Figure 27.
The AD9523 also has the capability to route the VCXO output
to four of the outputs (OUT0 to OUT3).
Clock Dividers
The output clock distribution dividers are referred to as D0 to
D13, corresponding to output channels OUT0 through OUT13,
respectively. Each divider is programmable with 10 bits of division
depth that is equal to 1 to 1024. Dividers have duty cycle correction
to always give a 50% duty cycle, even for odd divides.
In addition to the four mode bits, each of the 14 Channel 0 to
Channel 13 control registers includes the following control bits:
•
Invert divider output. Enables the user to choose between
normal polarity and inverted polarity. Normal polarity is
the default state. Inverted polarity reverses the representation
of Logic 0 and Logic 1, regardless of the logic family.
Ignore sync. Makes the divider ignore the SYNC signal
from any source.
Power down channel. Powers down the entire channel.
Lower power mode.
Driver mode.
Channel divider.
Divider phase.
•
•
•
•
•
•
VDD3_OUT[x:y]
Output Power-Down
1.25V LVDS
VDD – 1.3V LVPECL
Each of the output channels offers independent control of the
power-down functionality via the Channel 0 to Channel 13
control registers (see Table 51). Each output channel has a
dedicated power-down bit for powering down the output driver.
However, if all 14 outputs are powered down, the entire
distribution output enters a deep sleep mode. Although each
channel has a channel power-down control signal, it may
sometimes be desirable to power down an output driver while
maintaining the divider’s synchronization with the other
channel dividers. This is accomplished by placing the output
in tristate mode (this works in CMOS mode, as well).
HSTL
50Ω ENABLED
CM
COMMON-MODE
CIRCUIT
P
N
CM
–
+
100Ω LOAD
N
P
Multimode Output Drivers
•
•
•
Logic family and pin functionality
Output drive strength
Output polarity
50Ω HSTL
ENABLED
08439-031
3.5mA/8mA
LVDS/LVPECL
ENABLED
The user has independent control of the operating mode of each of
the fourteen output channels via the Channel 0 to Channel 13
control registers (see Table 51). The operating mode control
includes the following:
Figure 26. Multimode Driver
Clock Distribution Synchronization
The four least significant bits (LSBs) of each of the 14 Channel 0
to Channel 13 control registers comprise the driver mode bits. The
mode value selects the desired logic family and pin functionality
of an output channel, as listed in Table 51. This driver design
allows a common 100 Ω external resistor for all the different
driver modes of operation that are illustrated in Figure 26.
If the output channel is ac-coupled to the circuit to be clocked,
changing the mode varies the voltage swing to determine sensitivity
to the drive level. For example, in LVDS mode, a current of 3.5 mA
causes a 350 mV peak voltage. Likewise, in LVPECL mode, a
current of 8 mA causes an 800 mV peak voltage at the 100 Ω
load resistor. Using any termination other than those specified
in the Input/Output Termination Recommendations section
may results in damage or decrease end of life performance.
A block diagram of the clock distribution synchronization
functionality is shown in Figure 27. The synchronization
sequence begins with the primary synchronization signal,
which ultimately results in delivery of a synchronization strobe
to the clock distribution logic.
As indicated, the primary synchronization signal originates
from one of the following sources:
•
•
Direct synchronization source via the sync dividers bit (see
Register 0x232[0] in Table 55)
Device pin, SYNC (Pin 17)
An automatic synchronization of the divider is initiated the first
time that PLL2 locks after a power-up or reset event. Subsequent
lock/unlock events do not initiate a resynchronization of the
distribution dividers unless they are preceded by a power-down
or reset of the part. Both sources of the primary synchronization
signal are logic OR’d; therefore, any one of them can synchronize
the clock distribution output at any time.
Rev. D | Page 24 of 60
Data Sheet
AD9523
When using the sync dividers bit, the user first sets and then
clears the bit. The synchronization event is the clearing operation
(that is, the Logic 1 to Logic 0 transition of the bit). The dividers
are all automatically synchronized to each other when PLL2 is
ready. The dividers support programmable phase offsets from 0
to 63 steps, in half periods of the input clock (for example, the
VCO divider output clock). The phase offsets are incorporated
in the dividers through a preset for the first output clock period
of each divider. Phase offsets are sup-ported only by programming
the initial phase and divide value and then issuing a sync to the
distribution (automatically at startup or manually, if desired).
In normal operation, the phase offsets are already programmed
through the EEPROM or the SPI/I2C port before the AD9523
starts to provide outputs. Although the user cannot adjust the
phase offsets while the dividers are operating, it is possible to
adjust the phase of all the outputs together without powering
down PLL1 and PLL2. This is accomplished by programming
the new phase offset, using Register 0x192[7:2] (see Table 51)
and then issuing a divider sync signal by using the SYNC pin
or the sync dividers bit (Register 0x232[0]). All outputs that are
not programmed to ignore the sync are disabled temporarily
while the sync is active. Note that, if an output is used for the
zero delay path, it also disappears momentarily. However, this is
desirable because it ensures that all the synchronized outputs
have a deterministic phase relationship with respect to the zero
delay output and, therefore, also with respect to the input.
When using the SYNC pin (Pin 17), there are 11 VCO divider
output pipe line delays plus one period of the clock from the
rising edge of SYNC to the clock output. There is at least one
extra VCO divider period of uncertainty because the SYNC
signal and the VCO divider output are asynchronous.
OUTx
DIVIDE
OUT
DIVIDER
PHASE
DRIVER
OUTx
SYNC
VCO OUTPUT DIVIDER
FAN OUT
SYNC (PIN 17)
08439-025
SYNC
SYNC DIVIDERS BIT
Figure 27. Clock Output Synchronization Block Diagram
SYNC
VCO DIVIDER OUTPUT CLOCK
DIVIDE = 2, PHASE = 0
CONTROL
6 × 0.5 PERIODS
Figure 28. Clock Output Synchronization Timing Diagram
Rev. D | Page 25 of 60
08439-026
DIVIDE = 2, PHASE = 6
AD9523
Data Sheet
ZERO DELAY OPERATION
LOCK DETECT
Zero delay operation aligns the phase of the output clocks with
the phase of the external PLL reference input. The OUT0 output
is designed to be used as the output for zero delay. There are
two zero delay modes on the AD9523: internal and external
(see Figure 29). Note that the external delay mode provides better
matching than the internal delay mode because the output drivers
are included in the zero delay path.
The PLL1 and PLL2 lock detectors issue an unlock condition
when the frequency error is greater than the threshold of the
lock detector. When the PLL is unlocked, there is a random
phase between the reference clock and feedback clock. Due to
the random phase relationship that exists, the unlock condition
can take between 215 × TPFD cycles to 1 × TPFD cycles. A lock
condition always takes 216 × TPFD to lock, but can potentially
take 231 × TPFD cycles depending on how big the phase jump is
and when it occurs in relation to the lock detect restart.
ZD_IN
ZD_IN
OUT0
OUT0
RESET MODES
The AD9523 has a power-on reset (POR) and several other ways to
apply a reset condition to the chip.
ENB
FEEDBACK
DELAY
Power-On Reset
INTERNAL FB
During chip power-up, a power-on reset pulse is issued when
the 3.3 V supply reaches ~2.6 V (<2.8 V) and restores the chip
either to the setting stored in the EEPROM (EEPROM pin = 1)
or to the on-chip setting (EEPROM pin = 0). At power-on, the
AD9523 executes a sync operation, which brings the outputs
into phase alignment according to the default settings. The
output drivers are held in sync for the duration of the internally
generated power-up sync timer (~70 ms). The outputs begin to
toggle after this period.
REFA
REFA
PFD
AD9523
08439-027
REF
DELAY
Figure 29. Zero Delay Function
Internal Zero Delay Mode
The internal zero delay function of the AD9523 is achieved by
feeding the output of Channel Divider 0 back to the PLL1 N
divider. Register 0x01B[5] is used to select internal zero delay
mode (see Table 42). In the internal zero delay mode, the output
of Channel Divider 0 is routed back to the PLL1 (N divider)
through a mux. PLL1 synchronizes the phase/edge of the output
of Channel Divider 0 with the phase/edge of the reference input.
Reset via the RESET Pin
Because the channel dividers are synchronized to each other,
the outputs of the channel divider are synchronous with the
reference input.
RESET, a reset (an asynchronous hard reset is executed by briefly
pulling RESET low), restores the chip either to the setting stored
in the EEPROM (EEPROM pin = 1) or to the on-chip setting
(EEPROM pin = 0). A reset also executes a sync operation, which
brings the outputs into phase alignment according to the default
settings. When the EEPROM is inactive (EEPROM pin = 0), it
takes ~2 µs for the outputs to begin toggling after RESET is
issued. When the EEPROM is active (EEPROM pin = 1), it takes
~40 ms for the outputs to toggle after RESET is brought high.
External Zero Delay Mode
Reset via the Serial Port
The external zero delay function of the AD9523 is achieved by
feeding OUT0 back to the ZD_IN input and, ultimately, back to
the PLL1 N divider. In Figure 29, the change in signal routing
for external zero delay is external to the AD9523.
The serial port control register allows for a reset by setting Bit 2 and
Bit 5 in Register 0x000. When Bit 2 and Bit 5 are set, the chip enters
a reset mode and restores the chip either to the setting stored in the
EEPROM (EEPROM pin = 1) or to the on-chip setting (EEPROM
pin = 0), except for Register 0x000. Except for the self-clearing bits,
Bit 2 and Bit 5, Register 0x000 retains its previous value prior to
reset. During the internal reset, the outputs hold static. Bit 2 and
Bit 5 are self-clearing. However, the self-clearing operation does not
complete until an additional serial port SCLK cycle completes, and
the AD9523 is held in reset until Bit 2 and Bit 5 self-clear.
Register 0x01B[5] is used to select the external zero delay mode.
In external zero delay mode, OUT0 must be routed back to PLL1
(the N divider) through the ZD_IN and ZD_IN pins.
PLL1 synchronizes the phase/edge of the feedback output clock
with the phase/edge of the reference input. Because the channel
dividers are synchronized to each other, the clock outputs are
synchronous with the reference input. Both the reference path
delay and the feedback delay from ZD_IN are designed to have
the same propagation delay from the output drivers and PLL
components to minimize the phase offset between the clock
output and the reference input to achieve zero delay.
Reset to Settings in EEPROM when EEPROM Pin = 0 via the
Serial Port
The serial port control register allows the chip to be reset to settings
in the EEPROM when the EEPROM pin = 0 via Register 0xB02[1].
This bit is self-clearing. This bit does not have any effect when the
EEPROM pin = 1. It takes ~40 ms for the outputs to begin toggling
after the SOFT_EEPROM register is cleared.
Rev. D | Page 26 of 60
Data Sheet
AD9523
POWER-DOWN MODE
POWER SUPPLY SEQUENCING
Chip Power-Down via PD
The AD9523 has multiple power supply domains that operate
with 3.3 V, and the output supply domain that operates on 1.8 V.
To ensure proper device operation, bring the 1.8 V supplies high
and stable prior to or simultaneously with the 3.3 V supplies. It
is recommended to hold the RESET pin low while both supply
domains settle to ensure that the 3.3 V supplies do not lead the
1.8 V supplies.
Place the AD9523 into a power-down mode by pulling the PD pin
low. Power-down turns off most of the functions and currents
inside the AD9523. The chip remains in this power-down state
until PD is returned to a logic high state. When taken out of powerdown mode, the AD9523 returns to the settings programmed
into its registers prior to the power-down, unless the registers are
changed by new programming while the PD pin is held low.
Rev. D | Page 27 of 60
AD9523
Data Sheet
SERIAL CONTROL PORT
SPI/I²C PORT SELECTION
The AD9523 has two serial interfaces, SPI and I2C. Users can
select either the SPI or I2C depending on the states (logic high,
logic low) of the two logic level input pins, SP1 and SP0, when
power is applied or after a RESET (each pin has an internal
40 kΩ pull-down resistor). When both SP1 and SP0 are low, the
SPI interface is active. Otherwise, I2C is active with three
different I2C slave address settings (seven bits wide), as shown
in Table 22. The five MSBs of the slave address are hardware
coded as 11000, and the two LSBs are determined by the logic
levels of the SP1 and SP0 pins.
Abbreviation
S
Sr
P
A
A
W
R
Definition
Start
Repeated start
Stop
Acknowledge
No acknowledge
Write
Read
One pulse on the SCL clock line is generated for each data bit
that is transferred.
The data on the SDA line must not change during the high period
of the clock. The state of the data line can change only when the
clock on the SCL line is low.
DATA LINE
STABLE;
DATA VALID
CHANGE
OF DATA
ALLOWED
SDA
Address
SPI
I2C: 1100000
I2C: 1100001
I2C: 1100010
Figure 30. Valid Bit Transfer
A start condition is a transition from high to low on the SDA
line while SCL is high. The start condition is always generated
by the master to initialize the data transfer.
I²C SERIAL PORT OPERATION
The AD9523 I2C port is based on the I2C fast mode standard.
The AD9523 supports both I2C protocols: standard mode
(100 kHz) and fast mode (400 kHz).
The AD9523 I2C port has a 2-wire interface consisting of a
serial data line (SDA) and a serial clock line (SCL). In an I2C
bus system, the AD9523 is connected to the serial bus (data bus
SDA and clock bus SCL) as a slave device, meaning that no clock
is generated by the AD9523. The AD9523 uses direct 16-bit
(two bytes) memory addressing instead of traditional 8-bit
(one byte) memory addressing.
A stop condition is a transition from low to high on the SDA
line while SCL is high. The stop condition is always generated
by the master to end the data transfer.
SDA
SCL
S
P
START
CONDITION
STOP
CONDITION
08439-161
SP0
Low
High
Low
High
Table 23. I2C Bus Definitions
SCL
Table 22. Serial Port Mode Selection
SP1
Low
Low
High
High
I²C Bus Characteristics
08439-160
The AD9523 serial control port is a flexible, synchronous serial
communications port that allows an easy interface with many
industry-standard microcontrollers and microprocessors.
The AD9523 serial control port is compatible with most
synchronous transfer formats, including I2C, Motorola® SPI,
and Intel® SSR protocols. The AD9523 I2C implementation
deviates from the classic I2C specification in two specifications,
and these deviations are documented in Table 16. The serial
control port allows read/write access to all registers that
configure the AD9523.
Figure 31. Start and Stop Conditions
A byte on the SDA line is always eight bits long. An acknowledge
bit must follow every byte. Bytes are sent MSB first.
The acknowledge bit is the ninth bit attached to any 8-bit data byte.
An acknowledge bit is always generated by the receiving device
(receiver) to inform the transmitter that the byte has been received.
The acknowledge bit is accomplished by pulling the SDA line low
during the ninth clock pulse after each 8-bit data byte.
Rev. D | Page 28 of 60
Data Sheet
AD9523
MSB
ACK FROM
SLAVE RECEIVER
2
1
SCL
3 TO 7
8
9
ACK FROM
SLAVE RECEIVER
1
2
3 TO 7
8
9
10
P
S
08439-162
SDA
Figure 32. Data Transfer Process (Master Write Mode, 2-Byte Transfer)
SDA
ACK FROM
MASTER RECEIVER
1
2
3 TO 7
8
9
1
2
3 TO 7
S
8
9
10
P
08439-163
SCL
NON-ACK FROM
MASTER RECEIVER
Figure 33. Data Transfer Process(Master Read Mode, 2-Byte Transfer)
The no acknowledge bit is the ninth bit attached to any 8-bit
data byte. A no acknowledge bit is always generated by the
receiving device (receiver) to inform the transmitter that the
byte has not been received. The no acknowledge bit is
accomplished by leaving the SDA line high during the ninth
clock pulse after each 8-bit data byte.
Data Transfer Process
The master initiates data transfer by asserting a start condition,
which indicates that a data stream follows. All I²C slave devices
connected to the serial bus respond to the start condition.
The master then sends an 8-bit address byte over the SDA line,
consisting of a 7-bit slave address (MSB first), plus a R/W bit.
This bit determines the direction of the data transfer, that is,
whether data is written to or read from the slave device
(0 is write, 1 is read).
The peripheral whose address corresponds to the transmitted
address responds by sending an acknowledge bit. All other devices
on the bus remain idle while the selected device waits for data
to be read from or written to it. If the R/W bit is 0, the master
(transmitter) writes to the slave device (receiver). If the R/W bit is 1,
the master (receiver) reads from the slave device (transmitter).
(control registers) address bytes with the high address byte first.
This addressing scheme gives a memory address of up to 216 − 1 =
65,535. The data bytes after these two memory address bytes are
register data written into the control registers. In read mode, the
data bytes after the slave address byte are register data read from
the control registers. A single I2C transfer can contain multiple data
bytes that can be read from or written to control registers whose
address is automatically incremented starting from the base
memory address.
When all data bytes are read or written, stop conditions are
established. In write mode, the master (transmitter) asserts
a stop condition to end data transfer during the 10th clock pulse
following the acknowledge bit for the last data byte from the slave
device (receiver). In read mode, the master device (receiver)
receives the last data byte from the slave device (transmitter) but
does not pull it low during the ninth clock pulse. This is known as a
no acknowledge bit. Upon receiving the no acknowledge bit, the
slave device knows that the data transfer is finished and releases
the SDA line. The master then takes the data line low during the
low period before the 10th clock pulse and high during the 10th
clock pulse to assert a stop condition.
The format for these commands is described in the Data
Transfer Format section.
A repeated start (Sr) condition can be used in place of a stop
condition. Furthermore, a start or stop condition can occur at
any time, and partially transferred bytes are discarded.
Data is then sent over the serial bus in the format of nine clock
pulses, one data byte (eight bits) from either master (write mode)
or slave (read mode), followed by an acknowledge bit from the
receiving device. The number of bytes that can be transmitted per
transfer is unrestricted. In write mode, the first two data bytes
immediately after the slave address byte are the internal memory
For an I2C data write transfer containing multiple data bytes,
the peripheral drives a no acknowledge for the data byte that
follows a write to Register 0x234, thereby ending the I2C transfer.
For an I2C data read transfer containing multiple data bytes,
the peripheral drives data bytes of 0x00 for subsequent reads that
follow a read from Register 0x234.
Rev. D | Page 29 of 60
AD9523
Data Sheet
Data Transfer Format
Send byte format. The send byte protocol is used to set up the register address for subsequent commands.
S
Slave Address
W
A
RAM Address High Byte
A
RAM Address Low Byte
A
P
A
P
A
P
A
P
Write byte format. The write byte protocol is used to write a register address to the RAM, starting from the specified RAM address.
S
Slave Address
W
A
RAM Address
High Byte
A
RAM Address
Low Byte
A
RAM
Data 0
RAM
Data 1
A
RAM
Data 2
A
Receive byte format. The receive byte protocol is used to read the data byte(s) from the RAM, starting from the current address.
S
Slave Address
R
A
RAM Data 0
A
RAM Data 1
A
RAM Data 2
Read byte format. The combined format of the send byte and the receive byte.
S
Slave
Address
W
RAM Address
High Byte
A
A
RAM Address
Low Byte
A
Sr
Slave
Address
R
A
RAM
Data 0
A
RAM
Data 1
A
RAM
Data 2
I²C Serial Port Timing
SDA
tSET; DAT
tFALL
tLOW
tFALL
tHLD; STR
tRISE
tSPIKE
tRISE
tIDLE
tHLD; STR
S
tHIGH
tHLD; DAT
tSET; STP
tSET; STR
Sr
Figure 34. I²C Serial Port Timing
Table 24. I²C Timing Definitions
Parameter
fI2C
tIDLE
tHLD; STR
tSET; STR
tSET; STP
tHLD; DAT
tSET; DAT
tLOW
tHIGH
tRISE
tFALL
tSPIKE
Description
I²C clock frequency
Bus idle time between stop and start conditions
Hold time for repeated start condition
Setup time for repeated start condition
Setup time for stop condition
Hold time for data
Setup time for data
Duration of SCL clock low
Duration of SCL clock high
SCL/SDA rise time
SCL/SDA fall time
Voltage spike pulse width that must be suppressed by the input filter
Rev. D | Page 30 of 60
P
S
08439-165
SCL
Data Sheet
AD9523
SPI SERIAL PORT OPERATION
Pin Descriptions
SCLK (serial clock) is the serial shift clock. This pin is an input.
SCLK is used to synchronize serial control port reads and writes.
Write data bits are registered on the rising edge of this clock,
and read data bits are registered on the falling edge. This pin is
internally pulled down by a 40 kΩ resistor to ground.
SDIO (serial data input/output) is a dual-purpose pin and acts
either as an input only (unidirectional mode) or as an input/
output (bidirectional mode). The AD9523 defaults to the
bidirectional input/output mode.
SDO (serial data out) is used only in the unidirectional input/
output mode as a separate output pin for reading back data.
CS (chip select bar) is an active low control that gates the read
and write cycles. When CS is high, the SDO and SDIO pins
enter a high impedance state. The CS pin is internally pulled up
by a 40 kΩ resistor to VDD3_REF.
CS
SDIO/SDA
AD9523
SERIAL
CONTROL
PORT
SDO
08439-034
SCLK/SCL
Figure 35. Serial Control Port
SPI Mode Operation
In SPI mode, single or multiple byte transfers are supported, as
well as MSB first or LSB first transfer formats. The AD9523 serial
control port can be configured for a single bidirectional input/
output pin (SDIO only) or for two unidirectional input/output
pins (SDIO/SDO). By default, the AD9523 is in bidirectional
mode. Short instruction mode (8-bit instructions) is not
supported. Only long (16-bit) instruction mode is supported.
A write or a read operation to the AD9523 is initiated by pulling
CS low.
The CS stalled high mode is supported in data transfers where
three or fewer bytes of data (plus instruction data) are transferred
(see Table 25). In this mode, the CS pin can temporarily return
high on any byte boundary, allowing time for the system controller
to process the next byte. CS can go high only on byte boundaries;
however, it can go high during either phase (instruction or data)
of the transfer.
During this period, the serial control port state machine enters
a wait state until all data is sent. If the system controller decides
to abort the transfer before all of the data is sent, the state machine
must be reset either by completing the remaining transfers or by
returning CS low for at least one complete SCLK cycle (but fewer
than eight SCLK cycles). Raising the CS pin on a nonbyte
boundary terminates the serial transfer and flushes the buffer.
In streaming mode (see Table 25), any number of data bytes can
be transferred in a continuous stream. The register address is
automatically incremented or decremented (see the SPI MSB/LSB
First Transfers section). CS must be raised at the end of the last
byte to be transferred, thereby ending streaming mode.
Communication Cycle—Instruction Plus Data
There are two parts to a communication cycle with the AD9523.
The first part writes a 16-bit instruction word into the AD9523,
coincident with the first 16 SCLK rising edges. The instruction
word provides the AD9523 serial control port with information
regarding the data transfer, which is the second part of the
communication cycle. The instruction word defines whether
the upcoming data transfer is a read or a write, the number of
bytes in the data transfer, and the starting register address for
the first byte of the data transfer.
Write
If the instruction word is for a write operation, the second part
is the transfer of data into the serial control port buffer of the
AD9523. Data bits are registered on the rising edge of SCLK.
The length of the transfer (one, two, or three bytes or streaming
mode) is indicated by two bits (W1, W0) in the instruction byte.
When the transfer is one, two, or three bytes but not streaming, CS
can be raised after each sequence of eight bits to stall the bus
(except after the last byte, where it ends the cycle). When the bus
is stalled, the serial transfer resumes when CS is lowered. Raising
the CS pin on a nonbyte boundary resets the serial control port.
During a write, streaming mode does not skip over reserved or
blank registers, and the user can write 0x00 to the reserved
register addresses.
Because data is written into a serial control port buffer area, and
not directly into the actual control registers of the AD9523, an
additional operation is needed to transfer the serial control port
buffer contents to the actual control registers of the AD9523,
thereby causing them to become active. The update registers
operation consists of setting the self-clearing IO_UPDATE bit,
Register 0x234[0] (see Table 57). Any number of data bytes can
be changed before executing an update registers operation. The
update registers simultaneously actuates all register changes that
have been written to the buffer since any previous update.
Read
The AD9523 supports only the long instruction mode. If the
instruction word is for a read operation, the next N × 8 SCLK
cycles clock out the data from the address specified in the
instruction word, where N is 1 to 3 as determined by Bits[W1:W0].
If N = 4, the read operation is in streaming mode, continuing
until CS is raised. During an SPI read, serial data on SDIO (or SDO
in the case of 4-wire mode) transitions on the SCLK falling edge,
and is normally sampled on the SCLK rising edge. To read the last
bit correctly, the SPI host must be able to tolerate a zero hold time.
In cases where zero hold time is not possible, the user can either use
streaming mode and delay the rising edge of CS, or sample the
serial data on the SCLK falling edge. However, to sample the data
correctly on the SCLK falling edge, the user must ensure that
Rev. D | Page 31 of 60
AD9523
Data Sheet
the setup time is greater than tDV (time data valid). Streaming
mode does not skip over reserved or blank registers.
SPI MSB/LSB FIRST TRANSFERS
The AD9523 instruction word and byte data can be MSB first
or LSB first. Any data written to Register 0x000 must be mirrored:
Bit 7 is mirrored to Bit 0, Bit 6 to Bit 1, Bit 5 to Bit 2, and Bit 4 to
Bit 3. This makes it irrelevant whether LSB first or MSB first is
in effect. The default for the AD9523 is MSB first.
The default mode of the AD9523 serial control port is the
bidirectional mode. In bidirectional mode, both the sent data
and the readback data appear on the SDIO pin. It is also possible to
set the AD9523 to unidirectional mode. In unidirectional mode,
the readback data appears on the SDO pin.
When LSB first is set by Register 0x000[1] and Register 0x000[6],
it takes effect immediately because it affects only the operation
of the serial control port and does not require that an update be
executed.
A readback request reads the data that is in the serial control
port buffer area or the data that is in the active registers (see
Figure 36).
When MSB first mode is active, the instruction and data bytes must
be written from MSB to LSB. Multibyte data transfers in MSB first
format start with an instruction byte that includes the register
address of the most significant data byte. Subsequent data bytes
must follow in order from the high address to the low address. In
MSB first mode, the serial control port internal address generator
decrements for each data byte of the multibyte transfer cycle.
CS
SDIO/SDA
SERIAL
CONTROL
PORT
UPDATE
REGISTERS
SDO
ACTIVE
REGISTERS
BUFFER
REGISTERS
08439-035
SCLK/SCL
When LSB first mode is active, the instruction and data bytes
must be written from LSB to MSB. Multibyte data transfers in
LSB first format start with an instruction byte that includes the
register address of the least significant data byte, followed by
multiple data bytes. In a multibyte transfer cycle, the internal
byte address generator of the serial port increments for each byte.
Figure 36. Relationship Between Serial Control Port Buffer Registers and
Active Registers
SPI INSTRUCTION WORD (16 BITS)
The MSB of the instruction word is R/W, which indicates
whether the instruction is a read or a write. The next two bits
([W1:W0]) indicate the length of the transfer in bytes. The final
13 bits are the address ([A12:A0]) at which to begin the read or
write operation.
The AD9523 serial control port register address decrements
from the register address just written toward 0x000 for multibyte
input/output operations if MSB first mode is active (default). If
LSB first mode is active, the register address of the serial control
port increments from the address just written toward 0x234 for
multibyte input/output operations. Unused addresses are not
skipped for these operations.
For a write, the instruction word is followed by the number of
bytes of data indicated by Bits[W1:W0] (see Table 25).
Table 25. Byte Transfer Count
W1
0
0
1
1
W0
0
1
0
1
Bytes to Transfer
1
2
3
Streaming mode
For multibyte accesses that cross Address 0x234 or Address 0x000
in MSB first mode, the SPI internally disables writes to subsequent
registers and returns zeros for reads to subsequent registers.
Streaming mode always terminates when crossing address
boundaries (as shown in Table 26).
Bits[A12:A0] select the address within the register map that is
written to or read from during the data transfer portion of the
communications cycle. For multibyte transfers, this address is
the starting byte address. In MSB first mode, subsequent bytes
decrement the address.
Table 26. Streaming Mode (No Addresses Are Skipped)
Write Mode
MSB First
Address Direction
Decrement
Stop Sequence
…, 0x001, 0x000, stop
Table 27. Serial Control Port, 16-Bit Instruction Word, MSB First
MSB
I15
LSB
I14
I13
I12
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
R/W
W1
W0
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Rev. D | Page 32 of 60
Data Sheet
AD9523
tDH
tHIGH
SCLK
DON'T CARE
SDIO
DON'T CARE
R/W
W1
W0
A12
tC
tSCLK
tLOW
CS
A11
A10
A9
A8
A7
A6
A5
D4
D3
D2
D1
D0
HIGH-IMEPDANCE
08439-138
tDS
tS
Figure 37. Serial Control Port Read—MSB First, 16-Bit Instruction, One Byte of Data
CS
SCLK DON'T CARE
SDIO DON'T CARE
R/W W1 W0 A12 A11 A10 A9 A8 A7
A6 A5
A4 A3 A2
A1 A0
D7 D6 D5 D4 D3
16-BIT INSTRUCTION HEADER
D2 D1 D0 D7
D6 D5
REGISTER (N) DATA
D4 D3 D2
D1 D0
DON'T CARE
REGISTER (N – 1) DATA
08439-038
DON'T CARE
Figure 38. Serial Control Port Write—MSB First, 16-Bit Instruction, Two Bytes of Data
CS
SCLK
DON'T CARE
SDIO
DON'T CARE
R/W W1 W0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
SDO DON'T CARE
16-BIT INSTRUCTION HEADER
REGISTER (N) DATA
REGISTER (N – 1) DATA
REGISTER (N – 2) DATA
REGISTER (N – 3) DATA
DON'T
CARE
08439-039
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Figure 39. Serial Control Port Read—MSB First, 16-Bit Instruction, Four Bytes of Data
tHIGH
tDS
tS
tDH
CS
DON'T CARE
SDIO
DON'T CARE
DON'T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
A6
A5
D4
D3
D2
D1
D0
DON'T CARE
08439-040
SCLK
tC
tCLK
tLOW
Figure 40. Serial Control Port Write—MSB First, 16-Bit Instruction, Timing Measurements
CS
SCLK
DATA BIT N
08439-041
tDV
SDIO
SDO
DATA BIT N – 1
Figure 41. Timing Diagram for Serial Control Port Register Read
CS
SCLK DON'T CARE
A0 A1 A2 A3
A4
A5 A6 A7 A8 A9 A10 A11 A12 W0 W1 R/W D0 D1 D2 D3 D4
16-BIT INSTRUCTION HEADER
D5 D6 D7 D0
REGISTER (N) DATA
D1 D2
D6
REGISTER (N + 1) DATA
Figure 42. Serial Control Port Write—LSB First, 16-Bit Instruction, Two Bytes of Data
Rev. D | Page 33 of 60
D3 D4 D5
D7
DON'T CARE
08439-042
SDIO DON'T CARE
DON'T CARE
AD9523
Data Sheet
tS
tC
CS
tCLK
tHIGH
SCLK
tLOW
tDS
SDIO
BIT N
BIT N + 1
Figure 43. Serial Control Port Timing—Write
Table 28. Serial Control Port Timing
Parameter
tDS
tDH
tCLK
tS
tC
tHIGH
tLOW
tDV
Description
Setup time between data and rising edge of SCLK
Hold time between data and rising edge of SCLK
Period of the clock
Setup time between the CS falling edge and SCLK rising edge (start of communication cycle)
Setup time between the SCLK rising edge and CS rising edge (end of communication cycle)
Minimum period that SCLK should be in a logic high state
Minimum period that SCLK should be in a logic low state
SCLK to valid SDIO and SDO (see Figure 41)
Rev. D | Page 34 of 60
08439-043
tDH
Data Sheet
AD9523
EEPROM OPERATIONS
The AD9523 contains an internal EEPROM (nonvolatile memory).
The EEPROM can be programmed by the user to create and
store a user-defined register setting file when the power is off.
This setting file can be used for power-up and chip reset as a
default setting. The EEPROM size is 512 bytes. Descriptions of
the EEPROM registers that control EEPROM operation can be
found in Table 58 and Table 59.
During the data transfer process, the write and read registers are
generally not available via the serial port, except for one readback
bit: STATUS_EEPROM (Register 0xB00[0]).
5.
6.
To determine the data transfer state through the serial port in
SPI mode, users can read the value of the STATUS_EEPROM
bit (1 = data transfer in process, and 0 = data transfer complete).
In I²C mode, the user can address the AD9523 slave port with
the external I²C master (send an address byte to the AD9523).
If the AD9523 responds with a no acknowledge bit, the data
transfer was not received. If the AD9523 responds with an
acknowledge bit, the data transfer process is complete. The user
can monitor the STATUS_EEPROM bit or use Register 0x232[4]
to program the STATUS0 pin to monitor the status of the data
transfer (see Table 55).
To transfer all 512 bytes to the EEPROM, it takes approximately
46 ms. To transfer the contents of the EEPROM to the active
register, it takes approximately 40 ms.
7.
To ensure that the data transfer has completed correctly, verify
that the EEPROM data error bit (Register 0xB0[0]) is 0. A value
of 1 in this bit indicates a data transfer error. When an EEPROM
save/load transfer is complete, wait a minimum of 10 µs before
starting the next EEPROM save/load transfer.
RESET, a hard reset (an asynchronous hard reset is executed by
briefly pulling RESET low), restores the chip either to the setting
stored in the EEPROM (the EEPROM pin = 1) or to the on-chip
setting (the EEPROM pin = 0). A hard reset also executes a
SYNC operation, which brings the outputs into phase alignment
according to the default settings. When the EEPROM is inactive
(the EEPROM pin = 0), it takes ~2 µs for the outputs to begin
toggling after RESET is issued. When the EEPROM is active
(the EEPROM pin = 1), it takes ~40 ms for the outputs to toggle
after RESET is brought high.
1.
2.
WRITING TO THE EEPROM
3.
The EEPROM cannot be programmed directly through the serial
port interface. To program the EEPROM and store a register
setting file, follow these steps:
1.
2.
3.
4.
Program the AD9523 registers to the desired circuit state.
If the user wants PLL2 to lock automatically after power-up,
the calibrate VCO bit (Register 0x0F3[1]) must be set to 1.
This allows VCO calibration to start automatically after
register loading. Note that a valid input reference signal
must be present during VCO calibration.
Program the EEPROM buffer registers to the necessary
settings as described in the Programming the EEPROM
Buffer Segment section.
Set the enable EEPROM write bit (Register 0xB02[0]) to 1
to enable the EEPROM.
Set the REG2EEPROM bit (Register 0xB03[0]) to 1.
Set the IO_UPDATE bit (Bit 0, Register 0x234[0]) to 1.
This starts the process of writing data into the EEPROM to
create the EEPROM setting file. This enables the EEPROM
controller to transfer the current register values, as well as
the memory address and instruction bytes from the EEPROM
buffer segment, into the EEPROM. After the write process
is completed, the internal controller sets the REG2EEPROM
bit back to 0.
The STATUS_EEPROM bit (Register 0xB00[0]) indicates
the data transfer status between the EEPROM and the
control registers (1 = data transfer in process, and 0 = data
transfer complete). At the beginning of the data transfer,
the STATUS_EEPROM bit is set to 1 by the EEPROM
controller and cleared to 0 at the end of the data transfer.
The user can access STATUS_EEPROM via the STATUS0
pin when the STATUS0 pin is programmed to monitor the
STATUS_EEPROM bit. Alternatively, the user can monitor
the STATUS_EEPROM bit directly.
When the data transfer is complete (STATUS_EEPROM = 0),
set the enable EEPROM write bit (Register 0xB02[0]) to 0.
Clearing the enable EEPROM write bit to 0 disables writing
to the EEPROM.
READING FROM THE EEPROM
The following reset related events can start the process of
restoring the settings stored in the EEPROM to the control
registers. When the EEPROM_SEL pin is set high, do any of
the following to initiate an EEPROM read:
Power up the AD9523.
Perform a hardware chip reset by pulling the RESET pin
low and then releasing RESET.
Set the self clearing soft reset bit (Bit 5, Register 0x000) to 1.
When the EEPROM_SEL pin is set low, set the self clearing
SOFT_EEPROM bit (Register 0xB02[1]) to 1. The AD9523 then
starts to read the EEPROM and loads the values into the AD9523
registers. If the EEPROM_SEL pin is low during reset or powerup, the EEPROM is not active, and the AD9523 default values
are loaded instead.
When using the EEPROM to automatically load the AD9523
register values and lock the PLL, the calibrate VCO bit
(Register 0x0F3[1]) must be set to 1 when the register values are
written to the EEPROM. This allows VCO calibration to start
automatically after register loading. A valid input reference
signal must be present during VCO calibration.
To ensure that the data transfer has completed correctly, verify
that the EEPROM data error bit (Register 0xB0[0]) is set to 0.
Rev. D | Page 35 of 60
AD9523
Data Sheet
A value of 1 in this bit indicates a data transfer error. When an
EEPROM save/load transfer is complete, wait a minimum of
10 µs before starting the next EEPROM save/load transfer.
PROGRAMMING THE EEPROM BUFFER SEGMENT
The EEPROM buffer segment is a register space that allows
the user to specify which groups of registers are stored to the
EEPROM during EEPROM programming. Normally, this
segment does not need to be programmed by the user. The
default power-up values for the EEPROM buffer segment allow
the user to store all of the register values from Register 0x000 to
Register 0x234 to the EEPROM.
For example, if the user wants to load only the output driver
settings from the EEPROM without disturbing the PLL register
settings currently stored in the EEPROM, the EEPROM buffer
segment can be modified to include only the registers that apply
to the output drivers and exclude the registers that apply to the
PLL configuration.
There are two parts to the EEPROM buffer segment: register
section definition groups and operational codes. Each register
section definition group contains the starting address and
number of bytes to be written to the EEPROM. Note that any
register within the EEPROM buffer segment can be defined as a
part of a definition group or an operational code.
If the AD9523 register map were continuous from Address 0x000
to Address 0x234, only one register section definition group
would consist of a starting address of 0x000 and a length of
563 bytes. However, the AD9523 register map is noncontiguous,
and the EEPROM is only 512 bytes long. Therefore, the register
section definition group tells the EEPROM controller how the
AD9523 register map is segmented.
There are three operational codes: IO_UPDATE, end-of-data,
and pseudo-end-of-data. It is important that the EEPROM
buffer segment always have either an end-of-data or a pseudoend-of-data operational code and that an IO_UPDATE
operation code appear at least once before the end-of-data
operational code.
Register Section Definition Group
The register section definition group is used to define a
continuous register section for the EEPROM profile. It consists
of three bytes. The first byte defines how many continuous
register bytes are in this group. If the user inputs 0x000 in the
first byte, it means there is only one byte in this group. If the
user inputs 0x001, it means there are two bytes in this group.
The maximum number of registers in one group is 128.
IO_UPDATE (Operational Code 0x80)
The EEPROM controller uses this operational code to generate
an IO_UPDATE signal to update the active control register bank
from the buffer register bank during the download process.
At a minimum, there should be at least one IO_UPDATE
operational code after the end of the final register section
definition group. This is needed so that at least one IO_UPDATE
occurs after all of the AD9523 registers are loaded when the
EEPROM is read. If this operational code is absent during a
write to the EEPROM, the register values loaded from the
EEPROM are not transferred to the active register space, and
these values do not take effect after they are loaded from the
EEPROM to the AD9523.
End-of-Data (Operational Code 0xFF)
The EEPROM controller uses the end-of-data operational code
to terminate the data transfer process between EEPROM and
the control register during the upload and download process.
The last item appearing in the EEPROM buffer segment should
be either this operational code or the pseudo-end-of-data
operational code.
Pseudo-End-of-Data (Operational Code 0xFE)
The AD9523 EEPROM buffer segment has 23 bytes that can
contain up to seven register section definition groups. If the
user wants to define more than seven register section definition
groups, the pseudo-end-of-data operational code can be used.
During the upload process, when the EEPROM controller
receives the pseudo-end-of-data operational code, it halts the
data transfer process, clears the REG2EEPROM bit (Bit 0,
Register 0xB03), and enables the AD9523 serial port. The user can
then program the EEPROM buffer segment again and reinitiate
the data transfer process by setting the REG2EEPROM bit to 1
and the IO_UPDATE bit (Bit 0, Register 0x234) to 1. The internal
I²C master then begins writing to the EEPROM, starting from
the EEPROM address held from the last writing.
This sequence enables more discrete instructions to be written
to the EEPROM than would otherwise be possible due to the
limited size of the EEPROM buffer segment. It also permits the
user to write to the same register multiple times with a different
value each time.
The next two bytes are the high byte and low byte of the
memory address (16 bits) of the first register in this group.
Rev. D | Page 36 of 60
Data Sheet
AD9523
Table 29. Example of an EEPROM Buffer Segment
Register Address (Hex)
Bit 7 (MSB)
Start EEPROM Buffer Segment
0xA00
0
0xA01
0xA02
0xA03
0
0xA04
0xA05
0xA06
0
0xA07
0xA08
0xA09
0xA0A
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 (LSB)
Number of bytes of the first group of registers (Bits[6:0])
Address of the first group of registers (Bits[15:8])
Address of the first group of registers (Bits[7:0])
Number of bytes of the second group of registers (Bits[6:0])
Address of the second group of registers (Bits[15:8])
Address of the second group of registers (Bits[7:0])
Number of bytes of the third group of registers (Bits[6:0])
Address of the third group of registers (Bits[15:8])
Address of the third group of registers (Bits[7:0])
IO_UPDATE operational code (0x80)
End-of-data operational code (0xFF)
Rev. D | Page 37 of 60
AD9523
Data Sheet
DEVICE INITIALIZATION FLOW CHARTS
The flowcharts in this section show a typical AD9523
initialization routine using an evaluation software generated
setup file (.stp) and calibration routines designed for robust
system startup. Other valid start up sequences exist and, as
such, these flow charts are provided as recommendations.
The count variables (RST_COUNT and CAL_COUNT) in
the AD9523 device initialization flow chart act as system level
count limits for the loop to prevent an infinite loop. These
count variables are not AD9523 device settings or status
readbacks.
Rev. D | Page 38 of 60
Data Sheet
AD9523
START
USER POWER
SUPPLIES
INITIALIZATION AND
POWER-ON RESET
WAIT
APPLY VDD
(ALL DOMAINS)
VDD SETTLED?
NO
YES
POR: WAIT 60ms
CHIP LEVEL RESET LOOP
APPLY REFERENCE
INPUT(S)
RST_COUNT =
RST_COUNT + 1
RST_COUNT = 0
ISSUE A PIN LEVEL
RESET OR SOFT RESET
SUBPROCESS:
WRITE REGISTERS
FROM
SETUP FILE
PLL2 RECALIBRATION LOOP
CAL_COUNT = 0
WRITE:
R0x0F3[1] = 0
ISSUE VCO
CALIBRATION
COMMAND
WRITE:
R0x234 = 0x01
WRITE:
R0x0F3[1] = 1
WRITE:
R0x234 = 0x01
NO
NO
CAL_COUNT =
CAL_COUNT + 1
CAL_COUNT > 1
START TIMEOUT CLOCK:
TIME = 0
YES
YES
RST_COUNT >0
RAISE FLAG FOR
DEBUGGING.
READ:
R0x22C TO R0x22D
PLL2 LOCK
DETECT POLLING
LOOP
NO
R0x22C[1] = 1
NO
TIMEOUT CLOCK:
TIME > 100ns
YES
YES
START TIMEOUT CLOCK:
TIME = 0
PLL1 LOCK
DETECT POLLING
LOOP
NO
R0x22C[0] = 1
NO
TIMEOUT CLOCK:
TIME >PLL2_TO1
YES
YES
1PLL2_TO IS A CALCULATED TIMEOUT VALUE. SEE THE THEORY OF OPERATION, COMPONENT BLOCKS—INPUT PLL (PLL1) FOR ITS FORMULA.
Figure 44. AD9523 Device Initialization
Rev. D | Page 39 of 60
08439-145
END
AD9523
Data Sheet
SOFTWARE
GENERATED
AD9523 SETUP
FILE
START
WRITE:
R0x000 TO R0x006
WRITE:
R0x010 TO R0x01D
WRITE:
R0x0F0 TO R0x0F9
WRITE:
R0x190 TO R0x1BB
WRITE:
R0x230 TO R0x233
WRITE:
R0xA00 TO R0xA16
END
08439-146
WRITE:
R0x234 = 0x01
Figure 45. Subprocess: Write Registers from Setup File
Rev. D | Page 40 of 60
Data Sheet
AD9523
POWER DISSIPATION AND THERMAL CONSIDERATIONS
The AD9523 is a multifunctional, high speed device that targets
a wide variety of clock applications. The numerous innovative
features contained in the device each consume incremental power.
If all outputs are enabled in the maximum frequency and mode
that have the highest power, the safe thermal operating conditions
of the device may be exceeded. Careful analysis and consideration
of power dissipation and thermal management are critical
elements in the proper application of the AD9523 device.
The AD9523 device is specified to operate within the industrial
temperature range of –40°C to +85°C. This specification is
conditional, however, such that the absolute maximum junction
temperature is not exceeded (as specified in Table 17). At
high operating temperatures, extreme care must be taken when
operating the device to avoid exceeding the junction temperature
and potentially damaging the device.
A maximum junction temperature is listed in Table 1 with the
ambient operating range. The ambient range and maximum
junction temperature specifications ensure the performance of
the device, as guaranteed in the Specifications section.
Many variables contribute to the operating junction temperature
within the device, including
•
•
•
•
Selected driver mode of operation
Output clock speed
Supply voltage
Ambient temperature
The combination of these variables determines the junction
temperature within the AD9523 device for a given set of
operating conditions.
The AD9523 is specified for an ambient temperature (TA). To
ensure that TA is not exceeded, an airflow source can be used.
Use the following equation to determine the junction
temperature on the application PCB:
Clock speed directly and linearly influences the total power
dissipation of the device and, therefore, the junction temperature.
Two operating frequencies are listed under the incremental power
dissipation parameter in Table 3. Using linear interpretation is
a sufficient approximation for frequencies not listed in the table.
When calculating power dissipation for thermal consideration,
the amount of power dissipated in the 100 Ω resistor must be
removed. If using the data in Table 2, this power is already
removed. If using the current vs. frequency graphs provided in
the Typical Performance Characteristics section, the power into
the load must be subtracted, using the following equation:
Differential Output Voltage Swing 2
100 Ω
EVALUATION OF OPERATING CONDITIONS
The first step in evaluating the operating conditions is to
determine the maximum power consumption (PD) internal
to the AD9523. The maximum PD excludes power dissipated
in the load resistors of the drivers because such power is external
to the device. Use the power dissipation specifications listed in
Table 3 to calculate the total power dissipated for the desired
configuration. The base typical configuration parameter in
Table 3 lists a power of 428 mW, which includes one LVPECL
output at 122.88 MHz. If the frequency of operation is not listed
in Table 3, see the Typical Performance Characteristics section,
current vs. frequency and driver mode to calculate the power
dissipation; then add 20% for maximum current draw. Remove
the power dissipated in the load resistor to achieve the most
accurate power dissipation internal to the AD9523. See Table 30
for a summary of the incremental power dissipation from the base
power configuration for two different examples.
Table 30. Temperature Gradient Examples
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the user at the
top center of the package.
ΨJT is the value from Table 18.
PD is the power dissipation of the AD9523.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of ΨJB are provided for package comparison and PCB
design considerations.
CLOCK SPEED AND DRIVER MODE
Description
Example 1
Base Typical
Configuration
Output Driver
Output Driver
Total Power
Example 2
Base Typical
Configuration
Output Driver
Total Power
Mode
Frequency
(MHz)
Maximum
Power (mW)
428
6 × LVPECL
6 × LVDS
122.88
245.76
330
110
868
428
13 × LVPECL
983.04
2066
2500
The second step is to multiply the power dissipated by the thermal
impedance to determine the maximum power gradient. For this
example, a thermal impedance of θJA = 20.1°C/W was used.
Rev. D | Page 41 of 60
AD9523
Data Sheet
Example 1
THERMALLY ENHANCED PACKAGE MOUNTING
GUIDELINES
(868 mW × 20.1°C/W) = 17.4°C
With an ambient temperature of 85°C, the junction temperature is
TJ = 85°C + 17.4°C = 102°C
See the AN-772 Application Note, A Design and Manufacturing
Guide for the Lead Frame Chip Scale Package (LFCSP), for more
information about mounting devices with an exposed paddle.
This junction temperature is below the maximum allowable.
Example 2
(2500 mW × 20.1°C/W) = 50.2°C
With an ambient temperature of 85°C, the junction temperature is
TJ = 85°C + 50°C = 135°C
This junction temperature exceeds the maximum allowable
range. To operate in the condition of Example 2, the ambient
temperature must be lowered to 65°C.
Rev. D | Page 42 of 60
Data Sheet
AD9523
CONTROL REGISTERS
CONTROL REGISTER MAP
Register addresses that are not listed in Table 31 are not used, and writing to those registers has no effect. Registers that are marked as
reserved must never have their values changed. When writing to registers with bits that are marked reserved, the user must take care to
always write the default value for the reserved bits.
Table 31. Control Register Map
Addr
Register
(Hex)
Name
Serial Port Configuration
SPI mode
0x000
serial port
configuration
I2C mode
serial port
configuration
Readback
0x004
control
EEPROM
0x005
customer
0x006
version ID
Input PLL (PLL1)
PLL1 REFA
0x010
R divider
0x011
control
0x012
0x013
PLL1 REFB
R divider
control
0x014
PLL1 reference
test divider
PLL1 reserved
PLL1 feedback
N divider
control
0x015
0x016
0x017
0x018
PLL1 charge
pump control
0x019
(MSB)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Soft reset
Reserved
Reserved
Soft reset
Reserved
LSB first/
address
increment
Reserved
Soft reset
Reserved
Reserved
Soft reset
LSB first/
address
increment
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
SDO
active
(LSB)
Bit 0
Default
Value
(Hex)
SDO active
0x00
Reserved
0x00
Read back
active registers
0x00
EEPROM customer version ID[7:0] (LSB)
EEPROM customer version ID[15:8] (MSB)
10-bit REFA R divider[7:0] (LSB)
Reserved
10-bit REFB R divider[7:0] (LSB)
Reserved
Reserved
Reserved
Reserved
Reserved
0x00
0x00
10-bit REFA R divider[9:8]
(MSB)
10-bit REFB R divider[9:8]
(MSB)
REF_TEST divider
Reserved
Reserved
Reserved Reserved
10-bit PLL1 feedback divider[7:0] (LSB)
Reserved
PLL1
charge
pump
tristate
Reserved
Reserved
Reserved
0x01A
PLL1
input receiver
control
REF_TEST
input
receiver
enable
REFB
differential
receiver
enable
REFA
differential
receiver
enable
0x01B
REF_TEST,
REFA, REFB,
and ZD_IN
control
Reserved
Reserved
Zero delay
mode
0x01C
PLL1
miscellaneous
control
Enable
REFB R
divider independent
division
control
OSC_CTRL
control
voltage to
VCC/2
when ref
clock fails
Reserved
OSC_IN signal
feedback
for PLL1
Antibacklash
pulse width control
REFA
receiver
enable
Input
REFA, REFB
receiver
powerdown
control
enable
ZD_IN
differen.
receiver
mode
enable
ZD_IN
singleended
receiver
mode
enable
(CMOS
mode)
Reference selection mode
Rev. D | Page 43 of 60
0x00
0x00
0x00
Reserved
Reserved
10-bit PLL1 feedback divider[9:8]
(MSB)
PLL1 charge pump control
Enable SPI
control of
antibacklash
pulse width
REFB receiver
enable
0x00
0x00
0x00
0x00
0x00
0x0C
PLL1 charge pump mode
0x00
OSC_IN
single-ended
receiver
mode enable
(CMOS mode)
OSC_IN
differential
receiver mode
enable
0x00
REFB
single-ended
receiver
mode enable
(CMOS mode)
REFA
single-ended
receiver
mode enable
(CMOS mode)
0x00
Reserved
Reserved
0x00
AD9523
Data Sheet
Addr
(Hex)
0x01D
Register
Name
PLL1 loop
filter zero
resistor control
(MSB)
Bit 7
Reserved
Bit 6
Reserved
Bit 5
Reserved
Bit 4
Reserved
Bit 3
Bit 2
0x01E
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Output PLL (PLL2)
PLL2 charge
0x0F0
pump control
PLL2
0x0F1
feedback
N divider
control
0x0F2
PLL2 control
0x0F3
VCO control
0x0F4
VCO divider
control
0x0F5
PLL2 loop
filter control
(9 bits)
0x0F6
0x0F9
Reserved
to
0x0FE
Clock Distribution
Channel 0
0x190
control
0x191
0x192
0x193
0x194
0x195
0x196
0x197
0x198
0x199
0x19A
0x19B
0x19C
0x19D
0x19E
Channel 1
control
Channel 2
control
Channel 3
control
Channel 4
control
Bit 1
PLL1 loop filter, RZERO
Reserved
(LSB)
Bit 0
Default
Value
(Hex)
0x00
Reserved
0x00
PLL2 charge pump control
A counter
0x00
B counter
PLL2 lock
detector
powerdown
Reserved
Reserved
Enable
frequency
doubler
Reserved
Reserved
Reserved
Reserved
Reserved
Pole 2 resistor (RPOLE2)
Enable SPI
control of
antibacklash
pulse width
Force release
of distribution
sync when
PLL2 is
unlocked
Reserved
Antibacklash
pulse width control
Treat
reference
as valid
Force
VCO to
midpoint
frequency
VCO
divider
powerdown
Zero resistor (RZERO)
0x04
PLL2 charge pump mode
Calibrate VCO
(not autoclearing)
0x00
Pole 1 capacitor (CPOLE1)
0x00
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Invert
divider
output
Ignore
sync
Powerdown
channel
Lower power
mode
Invert
divider
output
Invert
divider
output
Invert
divider
output
Invert
divider
output
Ignore
sync
Ignore
sync
Ignore
sync
Ignore
sync
Rev. D | Page 44 of 60
0x00
VCO divider
Reserved
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
Lower power
Powermode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
Lower power
Powermode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
PowerLower power
down
mode
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
Lower power
Powermode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
Reserved
0x03
Bypass internal
RZERO resistor
Reserved
0x00
0x00
Driver mode
0x00
10-bit channel divider[9:8] (MSB)
Driver mode
0x1F
0x04
0x20
10-bit channel divider[9:8] (MSB)
Driver mode
0x1F
0x04
0x00
10-bit channel divider[9:8] (MSB)
Driver mode
0x1F
0x04
0x20
10-bit channel divider[9:8] (MSB)
Driver mode
0x1F
0x04
0x00
10-bit channel divider[9:8] (MSB)
0x1F
0x04
Data Sheet
Addr
(Hex)
0x19F
0x1A0
0x1A1
0x1A2
0x1A3
0x1A4
0x1A5
0x1A6
0x1A7
0x1A8
0x1A9
0x1AA
0x1AB
0x1AC
0x1AD
0x1AE
0x1AF
0x1B0
0x1B1
0x1B2
0x1B3
0x1B4
0x1B5
0x1B6
0x1B7
0x1B8
0x1B9
0x1BA
0x1BB
Register
Name
Channel 5
control
Channel 6
control
Channel 7
control
Channel 8
control
Channel 9
control
Channel 10
control
Channel 11
control
Channel 12
control
Channel 13
control
AD9523
(MSB)
Bit 7
Invert
divider
output
Invert
divider
output
Invert
divider
output
Invert
divider
output
Invert
divider
output
Invert
divider
output
Invert
divider
output
Invert
divider
output
Invert
divider
output
Bit 6
Ignore
sync
Ignore
sync
Ignore
sync
Ignore
sync
Ignore
sync
Ignore
sync
Ignore
sync
Ignore
sync
Ignore
sync
PLL1 output
control
Reserved
Reserved
PLL1 output
channel
control
PLL1
output
driver
powerdown
Reserved
Bit 5
Powerdown
channel
Bit 4
Lower power
mode
Bit 3
Bit 2
Bit 1
Driver mode
(LSB)
Bit 0
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
Lower power
PowerDriver mode
mode
down
channel
10-bit channel divider[7:0] (LSB)
Divider phase[5:0]
10-bit channel divider[9:8] (MSB)
PLL1 output
Reserved
Out PLL1 output
CMOS driver
strength
Route VCXO
Route VCXO
Route
Route
Reserved
Reserved
clock to Ch 0
clock to Ch 1
VCXO
VCXO
divider input
divider input
clock to
clock to
Ch 2
Ch 3
divider
divider
input
input
Rev. D | Page 45 of 60
Default
Value
(Hex)
0x20
0x1F
0x04
0x00
0x1F
0x04
0x20
0x1F
0x04
0x00
0x1F
0x04
0x20
0x1F
0x04
0x00
0x1F
0x04
0x20
0x1F
0x04
0x00
0x1F
0x04
0x20
0x1F
0x04
0x00
0x80
AD9523
Addr
Register
(Hex)
Name
Readback
0x22C
Readback 0
Data Sheet
(MSB)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
(LSB)
Bit 0
Status PLL1
feedback
clock
Reserved
Status
VCXO
Status
REF_TEST
Status
REFB
Status
REFA
Lock detect
PLL2
Lock detect
PLL1
Reserved
Reserved
Holdover
active
Reserved
VCO
calibration
in progress
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Selected
reference
(in auto
mode)
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
0x22D
Readback 1
Status PLL2
reference
clock
Reserved
0x22E
0x22F
Other
0x230
0x231
0x232
Readback 2
Readback 3
Reserved
Reserved
Reserved
Reserved
Status signals
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Enable
STATUS_
EEPROM on
STATUS0 pin
Status Monitor 0 control
Status Monitor 1 control
STATUS1 STATUS0
Reserved
pin
pin
divider
divider
enable
enable
Reserved
Reserved
Reserved
Reserved
Reserved
0x233
Power-down
control
Update all
registers
EEPROM Storage Sequence
Serial port
0xA00
configuration
0xA01
0xA02
Readback
0xA03
control and
EEPROM
0xA04
customer
0xA05
version ID
0x234
0xA06
0xA07
0xA08
0xA09
0xA0A
0xA0B
0xA0C
0xA0D
0xA0E
0xA0F
0xA10
0xA11
0xA12
Input PLL
(PLL1)
Output PLL
(PLL2)
Clock
distribution
Clock input
and REF
Other
0xA13
0xA14
0xA15
IO_UPDATE
0xA16
End of data
PLL1
powerdown
Reserved
EEPROM Buffer Segment
Default Setting: Size of transfer: one byte
EEPROM Buffer Segment
Default Setting: Starting address 0x0000
EEPROM Buffer Segment
Default Setting: Size of transfer: three bytes
EEPROM Buffer Segment
Default Setting: Starting address 0x0004
EEPROM Buffer Segment
Default Setting: Size of transfer: 15 bytes
EEPROM Buffer Segment
Default Setting: Starting address 0x0010
EEPROM Buffer Segment
Default Setting: Size of transfer: 15 bytes
EEPROM Buffer Segment
Default Setting: Starting address 0x00F0
EEPROM Buffer Segment
Default Setting: Size of transfer: 44 bytes
EEPROM Buffer Segment
Default Setting: Starting address 0x0190
EEPROM Buffer Segment
Default Setting: Size of transfer: two bytes
EEPROM Buffer Segment
Default Setting: Starting address 0x01E0
EEPROM Buffer Segment
Default Setting: Size of transfer: four bytes
EEPROM Buffer Segment
Default Setting: Starting address 0x0230
EEPROM Buffer Segment
Default Setting: Command: IO_UPDATE
EEPROM Buffer Segment
Default Setting: Command: End of data
Rev. D | Page 46 of 60
PLL2
power-down
Sync dividers
(manual
control)
0: sync signal
inactive
1: dividers
held in sync
(same as
SYNC pin low)
Distribution
power-down
IO_UPDATE
Default
Value
(Hex)
0x00
0x00
0x00
0x07
0x00
0x00
0x00
0x00
0x02
0x00
0x04
0x0E
0x00
0x10
0x0E
0x00
0xF0
0x2B
0x01
0x90
0x01
0x01
0xE0
0x03
0x02
0x30
0x80
0xFF
Data Sheet
Addr
Register
(Hex)
Name
EEPROM Control
STATUS_
0xB00
EEPROM
(read only)
EEPROM error
0xB01
checking
readback
(read only)
EEPROM
0xB02
Control 1
EEPROM
0xB03
Control 2
AD9523
(MSB)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
SOFT_
EEPROM
Reserved
Rev. D | Page 47 of 60
(LSB)
Bit 0
STATUS_
EEPROM
(read only)
EEPROM
data error
(read only)
Enable
EEPROM write
REG2EEPROM
Default
Value
(Hex)
0x00
0x00
0x00
0x00
AD9523
Data Sheet
CONTROL REGISTER MAP BIT DESCRIPTIONS
Serial Port Configuration (Address 0x000 to Address 0x006)
Table 32. SPI Mode Serial Port Configuration
Address
0x000
0x004
Bits
7
Bit Name
SDO active
6
LSB first/
address
increment
5
Soft reset
4
[3:0]
Reserved
Mirror[7:4]
0
Readback
active registers
Description
Selects unidirectional or bidirectional data transfer mode. This bit is ignored in I2C mode.
0: SDIO pin used for write and read; SDO is high impedance (default).
1: SDO used for read; SDIO used for write; unidirectional mode.
SPI MSB or LSB data orientation. This bit is ignored in I2C mode.
0: data-oriented MSB first; addressing decrements (default).
1: data-oriented LSB first; addressing increments.
Soft reset.
1 (self-clearing): soft reset; restores default values to internal registers.
Reserved.
Bits[3:0] should always mirror Bits[7:4] so that it does not matter whether the part is in MSB first or LSB
first mode (see Register 0x000[6]). Set bits as follows:
Bit 0 = Bit 7.
Bit 1 = Bit 6.
Bit 2 = Bit 5.
Bit 3 = Bit 4.
For buffered registers, serial port readback reads from actual (active) registers instead of from the
buffer.
0 (default): reads values currently applied to the internal logic of the device.
1: reads buffered values that take effect on the next assertion of the input/output update.
Table 33. I2C Mode Serial Port Configuration
Address
0x000
0x004
Bits
[7:6]
5
Bit Name
Reserved
Soft reset
4
[3:0]
Reserved
Mirror[7:4]
0
Read back
active registers
Description
Reserved.
Soft reset.
1 (self-clearing): soft reset; restores default values to internal registers.
Reserved.
Bits[3:0] should always mirror Bits[7:4]. Set bits as follows:
Bit 0 = Bit 7.
Bit 1 = Bit 6.
Bit 2 = Bit 5.
Bit 3 = Bit 4.
For buffered registers, serial port readback reads from actual (active) registers instead of from the
buffer.
0 (default): reads values currently applied to the internal logic of the device.
1: reads buffered values that take effect on the next assertion of the input/output update.
Table 34. EEPROM Customer Version ID
Address
0x005
Bits
[7:0]
0x006
[7:0]
Bit Name
EEPROM
customer
version ID (LSB)
EEPROM
customer
version ID (MSB)
Description
16-bit EEPROM ID, Bits[7:0]. This register, along with Register 0x006, allows the user to store a unique
ID to identify which version of the AD9523 register settings is stored in the EEPROM. It does not affect
AD9523 operation in any way (default: 0x00).
16-bit EEPROM ID, Bits[15:8]. This register, along with Register 0x005, allows the user to store a unique
ID to identify which version of the AD9523 register settings is stored in the EEPROM. It does not affect
AD9523 operation in any way (default: 0x00).
Rev. D | Page 48 of 60
Data Sheet
AD9523
Input PLL (PLL1) (Address 0x010 to Address 0x01D)
Table 35. PLL1 REFA R Divider Control
Address
0x010
Bits
[7:0]
Bit Name
REFA R divider
0x011
[1:0]
REFA R divider
Description
10-bit REFA R divider, Bits[7:0] (LSB). Divide-by-1 to divide-by-1023.
00000000, 00000001: divide-by-1.
10-bit REFA R divider, Bits[9:8] (MSB).
Table 36. PLL1 REFB R Divider Control1
Address
0x012
Bits
[7:0]
Bit Name
REFB R divider
0x013
[1:0]
REFB R divider
1
Description
10-bit REFB R divider, Bits[7:0] (LSB). Divide-by-1 to divide-by-1023.
00000000, 00000001: divide-by-1.
10-bit REFB R divider, Bits[9:8] (MSB).
Requires Register 0x01C[7] = 1b for division that is independent of REFA division.
Table 37. PLL1 Reference Test Divider
Address
0x014
Bits
[7:6]
[5:0]
Bit Name
Reserved
REF_TEST divider
Description
Reserved
6-bit reference test divider. Divide-by-1 to divide-by-63.
000000, 000001: divide-by-1.
Table 38. PLL1 Reserved
Address
0x015
Bits
[7:0]
Bit Name
Reserved
Description
Reserved
Table 39. PLL1 Feedback N Divider Control
Address
0x016
Bits
[7:0]
Bit Name
PLL1 feedback N divider control
(N_PLL1)
0x017
[1:0]
PLL1 feedback N divider control
(N_PLL1)
Description
10-bit feedback divider, Bits[7:0] (LSB). Divide-by-1 to divide-by-1023.
00000000, 00000001: divide-by-1.
10-bit feedback divider, Bits[1:0] (MSB).
Table 40. PLL1 Charge Pump Control
Address
0x018
Bits
7
[6:0]
Bit Name
PLL1 charge pump tristate
PLL1 charge pump control
0x019
[7:5]
4
Reserved
Enable SPI control of antibacklash
pulse width
[3:2]
Antibacklash pulse width control
[1:0]
PLL1 charge pump mode
Description
Tristates the PLL1 charge pump.
These bits set the magnitude of the PLL1 charge pump current. Granularity is ~0.5 µA
with a full-scale magnitude of ~63.5 µA.
Reserved.
Setting this bit allows user control of the antibacklash pulse width setting in
Register 0x019[3:2].
0 (default): antibacklash period is forced to high.
1: antibacklash period defined by Register 0x019[3:2].
Controls the PFD antibacklash period. These bits default to the high setting unless
reprogrammed using Register 0x019[4] = 1b. The high setting decreases the
maximum allowable PLL1 PFD rate. See Table 7 for ranges.
00: minimum.
01: low.
10: high (initial state unless changed via Register 0x019[4] = 1b).
11: maximum.
Controls the mode of the PLL1 charge pump.
00 (default): tristate.
01: pump up.
10: pump down.
11: normal.
Rev. D | Page 49 of 60
AD9523
Data Sheet
Table 41. PLL1 Input Receiver Control
Address
0x01A
Bits
7
Bit Name
REF_TEST input receiver enable
6
REFB differential receiver enable
5
REFA differential receiver enable
4
REFB receiver enable
3
REFA receiver enable
2
Input REFA and REFB receiver
power-down control enable
1
OSC_IN single-ended receiver
mode enable (CMOS mode)
0
OSC_IN differential receiver mode
enable
Description
1: enabled.
0: disabled (default).
1: differential receiver mode.
0: single-ended receiver mode (also depends on Register 0x01B[1]) (default).
1: differential receiver mode.
0: single-ended receiver mode (also depends on Register 0x01B[0]) (default).
REFB receiver power-down control mode only when Bit 2 = 1.
1: enable REFB receiver.
0: power down (default).
REFA receiver power-down control mode only when Bit 2 = 1.
1: enable REFA receiver.
0: power down (default).
Enables power-down control of the input receivers, REFA and REFB.
1: power-down control enabled.
0: both receivers enabled (default).
Selects which single-ended input pin is enabled when in single-ended receiver mode
(Register 0x01A[0] = 0).
1: negative receiver from oscillator input (OSC_IN pin) selected.
0: positive receiver from oscillator input (OSC_IN pin) selected (default).
1: differential receiver mode.
0: single-ended receiver mode (also depends on Bit 1) (default).
Table 42. REF_TEST, REFA, REFB, and ZD_IN Control
Address
0x01B
Bits
[7:6]
5
Bit Name
Reserved
Zero delay mode
4
OSC_IN signal feedback for PLL1
3
ZD_IN single-ended receiver
mode enable (CMOS mode)
2
ZD_IN differential receiver
mode enable
1
REFB single-ended receiver
mode enable (CMOS mode)
0
REFA single-ended receiver
mode enable (CMOS mode)
Description
0: reserved (default).
Selects the zero delay mode used (via the ZD_IN pin) when Register 0x01B[4] = 0.
Otherwise, this bit is ignored.
1: internal zero delay mode. The zero delay receiver is powered down. The internal
zero delay path from Distribution Divider Channel 0 is used.
0: external zero delay mode. The ZD_IN receiver is enabled.
Controls the input PLL feedback path, local feedback from the OSC_IN receiver or
zero delay mode.
1: OSC_IN receiver input used for the input PLL feedback (non-zero delay mode).
0: zero delay mode enabled (also depends on Register 0x01B[5] to select the zero
delay path.
Selects which single-ended input pin is enabled when in the single-ended receiver
mode (Register 0x01B[2] = 0).
1: ZD_IN pin enabled.
0: ZD_IN pin enabled.
1: differential receiver mode.
0: single-ended receiver mode (also depends on Register 0x01B[3]).
Selects which single-ended input pin is enabled when in single-ended receiver mode
(Register 0x01A[6] = 0).
1: REFB pin enabled.
0: REFB pin enabled.
Selects which single-ended input pin is enabled when in single-ended receiver mode
(Register 0x01A[5] = 0).
1: REFA pin enabled.
0: REFA pin enabled.
Rev. D | Page 50 of 60
Data Sheet
AD9523
Table 43. PLL1 Miscellaneous Control
Address
0x01C
1
Bits
7
Bit Name
Enable REFB R divider
independent division control
6
OSC_CTRL control voltage to
VCC/2 when reference clock fails
5
[4:2]
Reserved
Reference selection mode
[1:0]
Reserved
Description
1: REFB R divider is controlled by Register 0x012 and Register 0x013.
0: REFB R divider is set to the same setting as the REFA R divider (Register 0x010
and Register 0x011). This requires that, for the loop to stay locked, the REFA and
REFB input frequencies must be the same.
High permits the OSC_CTRL control voltage to be forced to midsupply when the
feedback or input clocks fail. Low tristates the charge pump output.
1: OSC_CTRL control voltage goes to VCC/2.
0: OSC_CTRL control voltage tracks the tristated (high impedance) charge pump
(through the buffer).
Reserved.
Programs the REFA, REFB mode selection (default = 000).
REF_SEL
Pin
Bit 4
Bit 3
Bit 2
Description
X1
0
0
0
Nonrevertive: stay on REFB.
X1
0
0
1
Revert to REFA.
X1
0
1
0
Select REFA.
X1
0
1
1
Select REFB.
0
1
X1
X1
REF_SEL pin = 0 (low): REFA.
1
1
X1
X1
REF_SEL pin = 1 (high): REFB.
0: reserved (default).
X = don’t care.
Table 44. PLL1 Loop Filter Zero Resistor Control
Address
0x01D
Bits
[7:4]
[3:0]
Bit Name
Reserved
PLL1 loop filter, RZERO
Description
Reserved.
Programs the value of the zero resistor, RZERO.
Bit 3
Bit 2
Bit 1
Bit 0
RZERO Value (kΩ)
0
0
0
0
883
0
0
0
1
677
0
0
1
0
341
0
0
1
1
135
0
1
0
0
10
0
1
0
1
10
0
1
1
0
10
0
1
1
1
10
1
0
0
0
Use external resistor
Rev. D | Page 51 of 60
AD9523
Data Sheet
Output PLL (PLL2) (Address 0x0F0 to Address 0x0F6)
Table 45. PLL2 Charge Pump Control
Address
0x0F0
Bits
[7:0]
Bit Name
PLL2 charge pump control
Description
These bits set the magnitude of the PLL2 charge pump current. Granularity is ~3.5 µA
with a full-scale magnitude of ~900 µA.
Table 46. PLL2 Feedback N Divider Control
Address
0x0F1
Bits
[7:6]
[5:0]
Bit Name
A counter
B counter
A Counter (Bits[7:6])
A = 0 or A = 1
A = 0 to A = 2
A = 0 to A = 2
A = 0 to A = 3
Description
A counter word.
B counter word.
Feedback Divider Constraints
B Counter (Bits[5:0])
B=4
B=5
B=6
B≥7
Allowed N Division (4 × B + A)
16, 17
20, 21, 22
24, 25, 26
28, 29 … continuous to 255
Table 47. PLL2 Control
Address
0x0F2
Bits
7
Bit Name
PLL2 lock detector power-down
6
5
Reserved
Enable frequency doubler
4
Enable SPI control of antibacklash
pulse width
[3:2]
Antibacklash pulse width control
[1:0]
PLL2 charge pump mode
Description
Controls power-down of the PLL2 lock detector.
1: lock detector powered down.
0: lock detector active.
Default = 0; value must remain 0.
Enables doubling of the PLL2 reference input frequency.
1: enabled.
0: disabled.
Setting this bit allows user control of the antibacklash pulse width setting in
Register 0x0F2[3:2].
0 (default): antibacklash period is forced to high.
1: antibacklash period defined by Register 0x0F[3:2] (recommended setting).
Controls the PFD antibacklash period. These bits default to the high setting unless
reprogrammed using Register 0x0F2[4] = 1b. The high setting decreases the
maximum allowable PLL2 PFD rate. See Table 12 for ranges.
00 minimum.
01: low.
10: high (initial state unless changed via Register 0x0F2[4] = 1b).
11: maximum.
Controls the mode of the PLL2 charge pump.
00: tristate.
01: pump up.
10: pump down.
11 (default): normal.
Rev. D | Page 52 of 60
Data Sheet
AD9523
Table 48. VCO Control
Address
0x0F3
Bits
[7:5]
4
Bit Name
Reserved
Force release of distribution
sync when PLL2 is unlocked
3
Treat reference as valid
2
Force VCO to midpoint frequency
1
Calibrate VCO (not autoclearing)
0
Reserved
Description
Reserved.
0 (default): distribution is held in sync (static) until the output PLL locks for the first
time. Then it is automatically released from sync with all dividers synchronized.
1: overrides the PLL2 lock detector state; forces release of the distribution from sync.
0 (default): uses the PLL1 VCXO indicator to determine when the reference clock to
the PLL2 is valid.
1: treats the reference clock as valid even if PLL1 does not consider it to be valid.
Selects VCO control voltage functionality.
0 (default): normal VCO operation.
1: forces VCO control voltage to midscale.
1: initiates VCO calibration (this is not an autoclearing bit).
0: resets the VCO calibration.
Reserved.
Table 49. VCO Divider Control
Address
0x0F4
Bits
[7:4]
3
Bit Name
Reserved
VCO divider power-down
[2:0]
VCO divider
Description
Reserved.
1: powers down the divider.
0: normal operation.
Note that the VCO divider connects to all output channels.
Bit 2
Bit 1
Bit 0
Divider Value
0
0
0
Divide-by-4
0
0
1
Divide-by-5
0
1
0
Divide-by-6
0
1
1
Divide-by-7
1
0
0
Divide-by-8
1
0
1
Divide-by-9
1
1
0
Divide-by-10
1
1
1
Divide-by-11
Rev. D | Page 53 of 60
AD9523
Data Sheet
Table 50. PLL2 Loop Filter Control
Address
0x0F5
0x0F6
Bits
[7:6]
Bit Name
Pole 2 resistor (RPOLE2)
[5:3]
Zero resistor (RZERO)
[2:0]
Pole 1 capacitor (CPOLE1)
[7:1]
0
Reserved
Bypass internal RZERO
resistor
Description
Bit 7
Bit 6
RPOLE2 (Ω)
0
0
900
0
1
450
1
0
300
1
1
225
Bit 5
Bit 4
Bit 3
RZERO (Ω)
0
0
0
3250
0
0
1
2750
0
1
0
2250
0
1
1
2100
1
0
0
3000
1
0
1
2500
1
1
0
2000
1
1
1
1850
Bit 2
Bit 1
Bit 0
CPOLE1 (pF)
0
0
0
0
0
0
1
8
0
1
0
16
0
1
1
24
1
0
0
24
1
0
1
32
1
1
0
40
1
1
1
48
Reserved.
Bypasses the internal RZERO resistor (RZERO = 0 Ω). Requires the use of a series external zero
resistor. This bit is the MSB of the loop filter control register (Address 0x0F5 and Address 0x0F6).
Rev. D | Page 54 of 60
Data Sheet
AD9523
Clock Distribution (Register 0x190 to Register 0x1B9)
Table 51. Channel 0 to Channel 13 Control (This Same Map Applies to All 14 Channels)
Address
0x190
Bits
7
6
Bit Name
Invert divider output
Ignore sync
5
Power-down channel
4
Lower power mode
(differential modes only)
[3:0]
Driver mode
0x191
[7:0]
0x192
[7:2]
Channel divider,
Bits[7:0] (LSB)
Divider phase
[1:0]
Channel divider, Bits[9:8] (MSB)
Description
Inverts the polarity of the divider’s output clock.
0: obeys chip-level SYNC signal (default).
1: ignores chip-level SYNC signal.
1: powers down the entire channel.
0: normal operation.
Reduces power used in the differential output modes (LVDS/LVPECL/HSTL). This
reduction may result in power savings, but at the expense of performance. Note that
this bit does not affect output swing and current, just the internal driver power.
1: low strength/lower power.
0: normal operation.
Driver mode.
Bit 3 Bit 2 Bit 1 Bit 0 Driver Mode
0
0
0
0
Tristate output
0
0
0
1
LVPECL (8 mA)
0
0
1
0
LVDS (3.5 mA)
0
0
1
1
LVDS (7 mA)
0
1
0
0
HSTL-0 (16 mA)
0
1
0
1
HSTL-1 (8 mA)
0
1
1
0
CMOS (both outputs in phase)
+ Pin: true phase relative to divider output
− Pin: true phase relative to divider output
0
1
1
1
CMOS (opposite phases on outputs)
+ Pin: true phase relative to divider output
− Pin: complement phase relative to divider output
1
0
0
0
CMOS
+ Pin: true phase relative to divider output
− Pin: high-Z
1
0
0
1
CMOS
+ Pin: high-Z
− Pin: true phase relative to divider output
1
0
1
0
CMOS
+ Pin: high-Z
− Pin: high-Z
1
0
1
1
CMOS (both outputs in phase)
+ Pin: complement phase relative to divider output
− Pin: complement phase relative to divider output
1
1
0
0
CMOS (both outputs out of phase)
+ Pin: complement phase relative to divider output
− Pin: true phase relative to divider output
1
1
0
1
CMOS
+ Pin: complement phase relative to divider output
− Pin: high-Z
1
1
1
0
CMOS
+ Pin: high-Z
− Pin: complement phase relative to divider output
1
1
1
1
Tristate output
Division = Channel Divider Bits[9:0] + 1. For example, [9:0] = 0 is divided by 1, [9:0] = 1
is divided by 2 … [9:0] = 1023 is divided by 1024. 10-bit channel divider, Bits[7:0] (LSB).
Divider initial phase after a sync is asserted relative to the divider input clock (from the
VCO divider output). LSB = ½ of a period of the divider input clock.
Phase = 0: no phase offset.
Phase = 1: ½ period offset, …
Phase = 63: 31 period offset.
10-bit channel divider, Bits[9:8] (MSB).
Rev. D | Page 55 of 60
AD9523
Data Sheet
Table 52. PLL1 Output Control (PLL1_OUT, Pin 72)
Address
0x1BA
Bits
[7:5]
4
Bit Name
Reserved
PLL1 output CMOS driver
strength
[3:0]
PLL1 output divider
Description
Reserved
CMOS driver strength
1: weak
0: strong
0000: divide-by-1
0001: divide-by-2 (default)
0010: divide-by-4
0100: divide-by-8
1000: divide-by-16
No other inputs permitted
Table 53. PLL1 Output Channel Control
Address
0x1BB
Bits
7
[6:4]
3
Bit Name
PLL1 output driver power-down
Reserved
Route VCXO clock to
Channel 3 divider input
2
Route VCXO clock to
Channel 2 divider input
1
Route VCXO clock to
Channel 1 divider input
0
Route VCXO clock to
Channel 0 divider input
Description
PLL1 output driver power-down
Reserved
1: channel uses VCXO clock. Routes VCXO clock to divider input.
0: channel uses VCO divider output clock
1: channel uses VCXO clock. Routes VCXO clock to divider input.
0: channel uses VCO divider output clock
1: channel uses VCXO clock. Routes VCXO clock to divider input.
0: channel uses VCO divider output clock
1: channel uses VCXO clock. Routes VCXO clock to divider input.
0: channel uses VCO divider output clock
Readback (Address 0x22C to Address 0x22D)
Table 54. Readback Registers (Readback 0 and Readback 1)
Address
0x22C
0x22D
Bits
7
Bit Name
Status PLL2 reference clock
6
Status PLL1 feedback clock
5
Status VCXO
4
Status REF_TEST
3
Status REFB
2
Status REFA
1
Lock detect PLL2
0
Lock detect PLL1
[7:4]
3
Reserved
Holdover active
2
Selected reference
(in auto mode)
1
0
Reserved
VCO calibration in progress
Description
1: OK
0: off/clocks are missing
1: OK
0: off/clocks are missing
1: OK
0: off/clocks are missing
1: OK
0: off/clocks are missing
1: OK
0: off/clocks are missing
1: OK
0: off/clocks are missing
1: locked
0: unlocked
1: locked
0: unlocked
Reserved
1: holdover is active (both references are missing)
0: normal operation
Selected reference (applies only when the device automatically selects the reference;
for example, not in manual control mode)
1: REFB
0: REFA
Reserved
1: VCO calibration in progress
0: VCO calibration not in progress
Rev. D | Page 56 of 60
Data Sheet
AD9523
Other (Address 0x230 to Address 0x234)
Table 55. Status Signals
Address
0x230
0x231
Bits
[7:6]
[5:0]
Bit Name
Reserved
Status Monitor 0 control
Description
Reserved
Bit 5
Bit 4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Bit 3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
Bit 2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Bit 1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Bit 0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Muxout
GND
PLL1 and PLL2 locked
PLL1 locked
PLL2 locked
Both references are missing (REFA and REFB)
Both references are missing and PLL2 is locked
REFB selected (applies only to auto select mode)
REFA is OK
REFB is OK
REF_TEST is OK
VCXO is OK
PLL1 feedback is OK
PLL2 reference clock is OK
Reserved
REFA and REFB are OK
All clocks are OK (except REF_TEST)
PLL1 feedback is divide-by-2
PLL1 PFD down divide-by-2
PLL1 REF divide-by-2
PLL1 PFD up divide-by-2
GND
GND
GND
GND
All bit combinations after 010111 are reserved
[7:6]
[5:0]
Reserved
Status Monitor 1 control
Reserved
Bit 5
Bit 4
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Bit 3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
Bit 2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
Bit 1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Bit 0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Muxout
GND
PLL1 and PLL2 locked
PLL1 locked
PLL2 locked
Both references are missing (REFA and REFB)
Both references are missing and PLL2 is locked
REFB selected (applies only to auto select mode)
REFA is OK
REFB is OK
REF_TEST is OK
VCXO is OK
PLL1 feedback is OK
PLL2 reference clock is OK
Reserved
REFA and REFB are OK
All clocks are OK (except REF_TEST)
GND
GND
GND
GND
PLL2 feedback is divide-by-2
PLL2 PFD down divide-by-2
PLL2 REF divide-by-2
PLL2 PFD up divide-by-2
All bit combinations after 010111 are reserved
Rev. D | Page 57 of 60
AD9523
Address
0x232
Bits
[7:5]
4
3
Data Sheet
Bit Name
Reserved
Enable STATUS_EEPROM
on STATUS0 pin
STATUS1 pin divider
enable
2
STATUS0 pin divider
enable
1
0
Reserved
Sync dividers
(manual control)
Description
Reserved.
Enables the EEPROM status on the STATUS0 pin.
1: enable status.
Enables a divide-by-4 on the STATUS1 pin, allowing dynamic signals to be viewed at a lower
frequency (such as the PFD input clocks). Not to be used with dc states on the status pins,
which occur when the settings of Register 0x231[5:0] are in the range of 000000 to 001111.
1: enabled.
0: disabled.
Enables a divide-by-4 on the STATUS0 pin, allowing dynamic signals to be viewed at a lower
frequency (such as the PFD input clocks). Not to be used with dc states on the status pins,
which occur when the settings of Register 0x230[5:0] are in the range of 000000 to 001111.
1: enable.
0: disable.
Reserved.
Set bit to put dividers in sync; clear bit to release. Functions like SYNC pin low.
1: sync.
0: normal.
Table 56. Power-Down Control
Address
0x233
Bits
[7:3]
2
Bit Name
Reserved
PLL1 power-down
1
PLL2 power-down
0
Distribution powerdown
Description
Reserved.
1: power-down (default).
0: normal operation.
1: power-down (default).
0: normal operation.
Powers down the distribution.
1: power-down (default).
0: normal operation.
Table 57. Update All Registers
Address
0x234
Bits
[7:1]
0
Bit Name
Reserved
IO_UPDATE
Description
Reserved.
This bit must be set to 1 to transfer the contents of the buffer registers into the active registers,
which happens on the next SCLK rising edge. This bit is self-clearing; that is, it does not have
to be set back to 0.
1 (self-clearing): update all active registers to the contents of the buffer registers.
EEPROM Buffer (Address 0xA00 to Address 0xA16)
Table 58. EEPROM Buffer Segment
Address
0xA00
to
0xA16
Bits
[7:0]
Bit Name
EEPROM Buffer
Segment Register 1 to
EEPROM Buffer
Segment Register 23
Description
The EEPROM buffer segment section stores the starting address and number of bytes that are
to be stored and read back to and from the EEPROM. Because the register space is noncontiguous,
the EEPROM controller needs to know the starting address and number of bytes in the register
space to store and retrieve from the EEPROM. In addition, there are special instructions for the
EEPROM controller: operational codes (that is, IO_UPDATE and end-of-data) that are also stored in
the EEPROM buffer segment. The on-chip default setting of the EEPROM buffer segment
registers is designed such that all registers are transferred to/from the EEPROM, and an IO_UPDATE
is issued after the transfer (see the Programming the EEPROM Buffer Segment section).
Rev. D | Page 58 of 60
Data Sheet
AD9523
EEPROM Control (Address 0xB00 to Address 0xB03)
Table 59. STATUS_EEPROM
Address
0xB00
Bits
[7:1]
0
Bit Name
Reserved
STATUS_EEPROM
(read only)
Description
Reserved.
This read-only bit indicates the status of the data transferred between the EEPROM and the
buffer register bank during the writing and reading of the EEPROM. This signal is also
available at the STATUS0 pin when Register 0x232[4] is set.
0: data transfer is complete.
1: data transfer is not complete.
Table 60. EEPROM Error Checking Readback
Address
0xB01
Bits
[7:1]
0
Bit Name
Reserved
EEPROM data error
(read only)
Description
Reserved.
This read-only bit indicates an error during the data transfer between the EEPROM and the buffer.
0: no error; data is correct.
1: incorrect data detected.
Table 61. EEPROM Control 1
Address
0xB02
Bits
[7:2]
1
Bit Name
Reserved
SOFT_EEPROM
0
Enable EEPROM write
Description
Reserved.
When the EEPROM_SEL pin is tied low, setting the SOFT_EEPROM bit resets the AD9523 using
the settings saved in EEPROM.
1: soft reset with EEPROM settings (self-clearing).
Enables the user to write to the EEPROM.
0: EEPROM write protection is enabled. User cannot write to EEPROM (default).
1: EEPROM write protection is disabled. User can write to EEPROM.
Table 62. EEPROM Control 2
Address
0xB03
Bits
[7:1]
0
Bit Name
Reserved
REG2EEPROM
Description
Reserved.
Transfers data from the buffer register to the EEPROM (self-clearing).
1: setting this bit initiates the data transfer from the buffer register to the EEPROM (writing
process); it is reset by the I²C master after the data transfer is done.
Rev. D | Page 59 of 60
AD9523
Data Sheet
OUTLINE DIMENSIONS
10.10
10.00 SQ
9.90
0.60
0.42
0.24
0.60
0.42
0.24
0.30
0.23
0.18
55
54
72
1
PIN 1
INDICATOR
PIN 1
INDICATOR
9.85
9.75 SQ
9.65
0.50
BSC
0.50
0.40
0.30
18
37
BOTTOM VIEW
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
0.25 MIN
8.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4
06-25-2012-C
12° MAX
19
36
TOP VIEW
1.00
0.85
0.80
5.45
5.30 SQ
5.15
EXPOSED
PAD
Figure 46. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
10 mm × 10 mm Body, Very Thin Quad
(CP-72-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD9523BCPZ
AD9523BCPZ-REEL7
AD9523/PCBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2010–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08439-0-9/15(D)
Rev. D | Page 60 of 60
Package Option
CP-72-6
CP-72-6