NB3N3020DTGEVB NB3N3020DTGEVB Evaluation Board User's Manual http://onsemi.com EVAL BOARD USER’S MANUAL Device Name: NB3N3020DTG (TSSOP−16) Board Name: NB3N3020DTGEVB Description Board Features The NB3N3020DTG is a high precision, low phase noise selectable clock multiplier. The device takes a 5 – 27 MHz fundamental mode parallel resonant crystal or a 2 − 210 MHz LVCMOS single ended clock source and generates a differential LVPECL output and a single ended LVCMOS/LVTTL output at a selectable clock output frequency which is a multiple of the input clock frequency. Three tri*level (Low, Mid, High) LVCMOS/LVTTL single ended select pins set one of 26 possible clock multipliers. An LVCMOS/LVTTL output enable (OE) tri*states clock outputs when low. This device is housed in 5 mm x 4.4 mm narrow body TSSOP−16 pin package. See datasheet NB3N3020/D (www.onsemi.com).The NB3N3020DTGEVB Evaluation board is designed to provide a flexible and convenient platform to quickly program, evaluate and verify the performance and operation of the NB3N3020DTG TSSOP*16 device under test: • Crystal source or external input clock source (SMA). • • One 25 MHz crystal is supplied. A TSSOP−16 NB3N3020DTG device is installed. Separate supply connectors for VDD, GND, and VEE (GND = SMAGND = 0 V) (banana jacks and Anvil Clips) Contents Description Board Features Board Layout Maps Test and Measurement Setup Procedures Appendix 1: Pin to Board Connection Information Appendix 2: Schematic Appendix 3: Bill of Materials, Lamination Stackup FRONT BACK Figure 1. NB3N3020DTGEVB Evaluation Board © Semiconductor Components Industries, LLC, 2014 January, 2014 − Rev. 2 1 Publication Order Number: EVBUM2063/D NB3N3020DTGEVB BOARD LAYOUT GND Jack Connector VDD ANVIL Connector VDD ANVIL Connectors GND ANVIL Connector OE2 CLK2 X1/CLK X2 CLK2B SEL2 CLK1 VEE ANVIL Connector VEE Jack Connector SEL1 SEL0 OE1 Figure 2. FRONT Board Layout Figure 3. FRONT Layer Design http://onsemi.com 2 NB3N3020DTGEVB VDD Jack Connector GND Jack Connector Crystal OE2 X1/CLK CLK2 X2 CLK2B SEL2 CLK1 VEE Jack Connector OE1 SEL1 SEL0 Figure 4. BACK Board Layout Figure 5. BACK Layer Design http://onsemi.com 3 NB3N3020DTGEVB TEST AND MEASUREMENT SET−UP AND PROCEDURE Step 1: Equipment 6. Time Transition Convertor: Agilent 14534 250 ps (or equivalent) 7. Phase noise Analyzer: Agilent E5052B (or equivalent) 1. Signal Generator: Agilent #33250A or HP8133 (or equivalent) 2. Tektronix TDS8000 Oscilloscope 3. Power Supply: Agilent #6624A or AG6626A DC (or equivalent) 4. Digital Voltmeter: Agilent 34410A or 34401 (or equivalent) 5. Matched Cables (> 20 GHz, SMA connectors): Storm or Semflex (or equivalent) Step 2: Lab Set−Up Procedure 1. Test Supply Setup: Board and Device Power Supply Connections are shown in Table 1. VDD, VEE, and GND and may be connected by banana jacks or anvil clip test points. Table 1. POWER SUPPLY CONNECTIONS Device Board Banana Jack Anvil Clip Test Point Comments VDD VDD BJ1 J11 VDD, VDD1, and VDD2 are shorted by R12 VDD VDD2 BJ1 J18 VDD VDD3 BJ1 J18 VEE BJ2 J7 DUTGND SMAGND BJ3 J19 Shield GND = 0 V GND SINGLE SUPPLY OPERATION (VDD = 3.3 V; GND =0.0 V; VEE = 0.0 V) must be used to sense the outputs. LVPECL outputs CLK2 and CLK2b must be terminated with 50 W into a VTT type current sinking supply of VDD − 2.0 V per Figure 6. High Impedance probes must be used to sense the signal levels. Single supply operation may be accomplished by shunting GND (SMAGND) and VEE (DUTGND). Input and output levels are not shifted, but High Impedance Probes Figure 6. Typical Device Termination Setup and Termination for Single Ended Operation (High Impedance Scope or Probes) SPLIT SUPPLY OPERATION (VDD = 2.0 V; GND = 0.0 V; VEE = −1.3 V) LVPECL outputs (CLK2 and CLK2b) directly to a 50 W input impedance counter or oscilloscope (or use of Low Impedance probes) per Figure 7. All input and output levels will be offset or shifted −1.3 V. The LVCMOS output CLK1 will be properly terminated but also offset or shifted −1.3 V. Low Impedance (50 W) probes must be used to sense the signal levels. For offset or split supply operation, the VDD supply is offset −1.3 V to 2.0 V with respect to GND (SMAGND) and VEE is set to −1.3 V for 3.3 V supply span operation. Supply variance is done by adjusting the VEE supply (±5%). Split supply operation offers the advantage of connecting the http://onsemi.com 4 NB3N3020DTGEVB Figure 7. Typical Device Termination Setup and Termination for Split Supply Operation (50 W Low Impedance Scope or Probes) 2. Inputs: (see Appendix 1, Device Pin to Board Connection Information) SINGLE SUPPLY OPERATION (VDD = 3.3 V; GND = 0.0 V; VEE = 0.0 V) SPLIT SUPPLY OPERATION (VDD = 2.0 V; GND = 0.0 V; VEE = −1.3 V) For a Single Ended input to X1/CLK operation, remove the crystal loading caps C41 and C42 and bridge the small topside trace gap from the device input pin to the SMA connector by installing R14 (a Zero W resistor). Do not install R16. Do not drive X2. Use a LVCMOS Clock amplitude signal from 2 MHz to 210 MHz which satisfies datasheet VIH and VIL to drive X1/CLK. Input tr/tf transition edges should be about 250 ps. Use a TTC (Time transition Convertor) such as Agilent 14534 (250 ps) or equivalent, if needed, to slow faster edges. Termination of a signal generator may be accomplished by placing a 50 W resistor (to GND) at location C42. The mounted crystal does not need to be removed for Single Ended input operation. For Crystal operation use a fundamental Parallel Resonant crystal (see Datasheet section on “Recommended Crystal Parameters”) from 5 MHz to 27 MHz. The board is supplied with a thru–hole 25 MHz crystal installed, but alternatively has the tabs for a surface mount crystal. The Crystal mount is located on the back (underside) of the board and is permanently connected to the device inputs by traces. Crystal Load capacitors (C41 and C42) of 27 mF are mounted. Device frequency is selected by three level inputs SEL0, SEL1, SEL2. Jumpers J10 (SEL0), J13 (SEL1), and J14 (SEL2) may be set to either VDD (HI), VEE (LO), or floated open (MID) to program the output frequency of operation per datasheet Table 2. Jumpers may be removed to drive SEL0/1/2 directly with spec VIH, VIL, or VIM levels. Note SEL0/1/2 inputs will default to VDD/2 (MID) when left floating open. High Impedance probes must be used to sense the signal levels. Inputs OE1 and OE2 may be jumpered to VEE (GND) for a LOW level (DISABLED) using J15 (OE1) or J12 (OE2). If floated open (jumper removed), pin will default to a HIGH level (ENABLED). High Impedance probes must be used to sense the signal levels. For a Single Ended input to X1/CLK operation, remove the crystal loading caps C41 and C42 and bridge the small topside trace gap from the device input pin to the SMA connector by installing R14 (a Zero W resistor). Do not install R16. Do not drive X2. Use −1.3 V offset LVCMOS Clock amplitude signal from 2 MHz to 210 MHz which satisfies datasheet VIH and VIL to drive X1/CLK. Input tr/tf transition edges should be about 250 ps. Use a TTC (Time Transition Convertor) such as Agilent 14534 (250 ps) or equivalent, if needed to supply proper edges. Termination of a signal generator may be accomplished by placing a 50 W resistor (to GND) at location C42. The mounted crystal does not need to be removed for Single Ended input operation. For Crystal operation use a fundamental Parallel Resonant crystal (see Datasheet section on “Recommended Crystal Parameters”) from 5 MHz to 27 MHz. The board is supplied with a thru–hole 25 MHz crystal installed, but alternatively has the tabs for a surface mount crystal. The Crystal mount is located on the back (underside) of the board and is permanently connected to the device inputs by traces. Crystal Load capacitors (C41 and C42) of 27 mF are mounted. Device frequency is selected by 3 level inputs SEL0, SEL1, SEL2. Jumpers J10 (SEL0), J13 (SEL1), and J14 (SEL2) may be set to either VDD (HI), VEE (LO), or floated open (MID) to program the output frequency of operation per datasheet Table 2. Jumpers may be removed to drive SEL0/1/2 directly with −1.3 V offset datasheet VIH, VIL, or VIM levels. Note SEL0/1/2 inputs will default to VDD/2 (MID) when left floating open. All input and output levels will be offset or shifted −1.3 V. Inputs OE1 and OE2 may be jumpered to VEE (GND) for a LOW level (DISABLED) using J15 (OE1) or J12 (OE2). If floated open (jumper removed), pin will default to a HIGH level (ENABLED). High Impedance probes must be used to sense the signal levels. All input and output levels will be offset or shifted −1.3 V. http://onsemi.com 5 NB3N3020DTGEVB 3. Outputs: LVPECL outputs (CLK2, CLK2b): Alternatively, use of a VTT current sinking regulated supply may be avoided by populating R6 (82 W) and R7 (130 W) to terminate CLK2 and populating R2 (82 W) and R3 (130 W) to terminate CLK2b as per Figure 8 Alternative Device Termination Setup for On−Board Termination. High Impedance probes must be used to sense the signal levels. SINGLE SUPPLY OPERATION (VDD = 3.3 V; GND = 0.0 V’ VEE = 0.0 V) Externally connect LVPECL outputs CLK2 and CLK2b through a 50 W terminating resistor to a VTT current sinking regulated supply set to VDD−2V per Figure 6. High Impedance probes must be used to sense the signal levels. Figure 8. Alternative Device Termination Setup for On−Board Termination SPLIT SUPPLY OPERATION (VDD = 2.0 V; GND = 0.0 V; VEE = −1.3 V) Alternatively, LVPECL outputs CLK2 and CLK2b may be terminated on the board by populating R6 (82 W) and R7 (130 W) to terminate CLK2 and populating R2 (82 W) and R3 (130 W) to terminate CLK2b as per Figure 6. High Impedance probes must be used to sense the signal levels. NOTE: THE READINGS OF THE OUTPUT VOLTAGE LEVELS WILL BE OFFSET − 1.3 V. Externally connect LVPECL outputs CLK2 and CLK2b directly to a counter or scope (with 50 W input impedance) or use Low Impedance Probes (50 W) per Figure 7. NOTE: THE READINGS OF THE OUTPUT VOLTAGE LEVELS WILL BE OFFSET −1.3 V. http://onsemi.com 6 NB3N3020DTGEVB APPENDIX 1: DEVICE PIN TO BOARD CONNECTION INFORMATION (SEE CURRENT DATASHEET) Table 2. DEVICE PINS TO BOARD CONNECTION Device Pin Device Pin Name Board Connection I/O Description 1 VDD VDD Positive Supply Positive Supply pin. All Supply pins must be connected for proper operation 2 X1/CLK X1/CLK Crystal Interface Oscillator Input from Crystal. Single ended Clock Input. 3 X2 X2 Crystal Interface Oscillator Output to drive Crystal 4 SEL2 SEL2 Tri*Level Input Frequency select input 2. 5 SEL1 SEL1 Tri*Level Input Frequency select input 1 6 SEL0 SEL0 Tri*Level Input Frequency select input 0 7 OE1 OE1 LVCMOS Input Input pin OE1 accepts LVCMOS levels to control CLK1(tri− states CLK1 when LOW, open pin defaults to HIGH ) 8/ GND VEE Negative Supply DUT GND. All Supply pins must be connected for proper operation 9 GND VEE Negative Supply DUT GND. All Supply pins must be connected for proper operation 10 CLK1 CLK1 LVCMOS Output LVCMOS Output 11 VDD VDD2, POWER Positive Supply pin. All Supply pins must be connected for proper operation 12 GND VEE Negative Supply DUT GND 13 CLK2 CLK2 LVPECL Output True LVPECL Output 14 CLK2b CLK2b LVPECL Output Invert LVPECL Output 15 VDD VDD3 POWER Positive Supply pins. All Supply pins must be connected for proper operation 16 OE2 OE2 LVCMOS Input Input pin OE2 accepts LVCMOS levels to control LVPECL Output CLK2 and CLK2b (when LOW forces CLK1 LOW and CLK2b HIGH, open pin defaults to HIGH ) http://onsemi.com 7 NB3N3020DTGEVB APPENDIX 2: SCHEMATIC Figure 9. Schematic http://onsemi.com 8 NB3N3020DTGEVB APPENDIX 3: BILL OF MATERIALS, LAMINATION STACKUP, AND ASSEMBLY NOTES Table 3. BILL OF MATERIAL Item Qty Schematic Value Size MFG P/N Description 1 3 BJ1−BJ3 ITT POMONA ELECTRONICS B−JACK 1/4−32 THREAD BANANAJACK 2 8 C2,C3,C5,C8,C14,C 16,C18,C21 .01ufd 0402 AVX Corporation 04023C103KAT2A CAP CERM .01UF 10% 25V X7R 3 9 C1,C4,C6,C11,C15, C17,C19,C20,C22 .01ufd 0603 Murata GRM188R71H103KA01D CAP CER 10000PF 50V 10% X7R 4 2 5 2 C7, C10 .01ufd 0805 TDK C2012X7R1H103K CAP CER .01UF 50V X7R 10% C41,C42 27pfd 0603 AVX Corporation 06031A270FAT2A CAP CERM 27PF 1% 100V NP0 6 3 7 2 C9,C12,C13 10ufd 7343 J12,J15 2 Pin 8 5 J10,J12,J13,J14,J15 9 3 J10,J13,J14 3 Pin 10 1 R1 33.2 0805 0 0805 Kemet T491C106K016AT CAPACITOR TANT 10UF 16V 10% SMD Sullins PEC36SACN CONN HEADER .100 SINGL STR 36POS SULLINS ELECTRONICS CORP STC02SYAN CONN JUMPER SHORTING TIN Sullins PEC36SACN CONN HEADER .100 SINGL STR 36POS Panasonic − ECG ERJ−2RKF33R2X RES 33.2 W 1/16W 1% 0805 SMD Emerson Network Power Connectivity Solutions 142−0701−801 Johnson SMA Connector − Side Launch 11 1 R12 12 10 J1,J2,J3,J4,J5,J6,J8 ,J9,J16,J17 13 4 J7,J11,J18,J19 SMT KEYSTONE ELECTRONICS 5016 PC TEST POINT “ANVIL” COMPACT SMT 14 2 Y1 Crystal Socket Receptacle BOTTOM Ampere 2−330808−8 RECEPTACLE FOR LEADED CRYSTAL 0.013−0.21 30AU 15 4 Standoff Nylon Standoff 16 4 Screw Nylon Screw 17 1 C2 0402 NOT INSTALLED 18 9 R2,R3,R4,R5,R6,R7 ,R8,R11,R15 0805 NOT INSTALLED 19 2 R14,R16 20 1 Y1 22 1 U1 0603 25 MHz NOT INSTALLED Abracon ABL−25.000MHZ−B2F Through Hole Crystal On Semi NB3N3020DTG 16 lead TSSOP DUT Figure 10. 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