1670KB

ZENIGATA LED
Feb 10, 2015
SPECIFICATIONS
MINI ZENIGATA-LED
GW6BGS**HED
**:27,30,40,50
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
Development DepartmentⅡ
Lighting Device Division
http://www.sharp-world.com/products/device/
Electronic Components And Devices Group
SHARP CORPORATION
sharp LD-E5-10-14-B
Model No. GW6BGS**HED
Contents in this technical document be changed without any notice due to the product modification.
http://www.sharp-world.com/products/device/
●Handle this document carefully it contains material protected by international
copyright law. Any reproduction, full or in part, of this material is prohibited
without the express written permission of the company.
●When using the products covered herein,please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions.
(1) Please do verify the validity of this part after assembling it in customerʼs products,when
customer wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) The products covered herein are desigd and manufactured for the following application areas.
When using the products covered herein for the equipment listed in paragraph(3),even for the following
application areas, be sure to observe the precautions given in Paragraph(3).
Never use the products for the equipment listed in Paragraph(4).
・Office electronics
・Instrumentation and measuring equipment
・Machine tools
・Audiovisual equipment
・Home appliances
・Communication equipment other than for trunk lines
(3) These contemplating using the products covered herein for the following equipment which demands
high reliability, should first contact a sales representative of the company and then accept responsibility
for incorporating into the design fail-safe operation,redundansy, and other appropriate measures for
ensuring reliability and safety of the equipment and the overall system.
・Control and safety devices for airplanes, trains,automobiles, and other transportation equipment
・Mainframe computers
・Traffic control systems
・Gas leak detectors and automatic cutoff devices
・Rescue and security equipment
・Other safety devices and safety equipment, etc.
(4) Do not use the products covered herein for the followin equipment which demands extremely
high performance in terms of functionality, reliability, or accuracy.
・Aerospace equipment
・Communications equipment for trunk lines
・Control equipment for the nuclear power industry
・Medical equipment related to life support, etc.
(5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to
a sales representative of the company.
sharp LD-E5-10-14-B
Model No. GW6BGS**HED
Contents in this technical document be changed without any notice due to the product modification.
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GW6BGS**HED Specifications
1. Application
These specifications apply to the light emitting diode module Model No. GW6BGS**HED.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit
Refer to Page 2.
3. Ratings and characteristics
Refer to Page 3-6.
3-1.
3-2.
3-3.
3-4.
Absolute maximum ratings
Electro-optical characteristics
Derating curve
Characteristics diagram (TYP.)
4. Reliability
Refer to Page 7.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level
Refer to Page 8.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements
6-1.
6-2.
6-3.
6-4.
Refer to Page 9-12.
Chromaticity rank table
Packing
Label
Indication printed on product
7. Precautions
Refer to Page 13-16.
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2.External dimensions and equivalent circuit
15.0 +0.5
/ -0.1
http://www.sharp-world.com/products/device/
①
(11.6)
(Unit:mm)
12.0
+0.5 / -0.1
②
Top view
(6.5)
3.5
1.4
±0.1
±0.1
(Φ10.0)
(Φ8.8)
Side view
(1.6)
1.0
±0.1
(Note)Values inside parentheses are reference values.
External sizes of ①,② are determined by maximum simensions,
that include salient areas on the edges of respective sides.
R
+connection
terminal
-connection
terminal
12 series × 5 parallel = 60 pcs of LEDs
Unit
Material
Finish
mm
Substrate : Ceramics
Lens : Silicone resin
Terminal:Ag
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3.Ratings and characteristics
3-1.Absolute maximum ratings
Item
Symbol
Rating
Unit
Power Dissipation(※1,4)
P
25.7
W
Forward Current(※1,4)
IF
650
mA
Reverse Voltage(※2,4)
VR
-15
V
Operating Temperature(※3)
Topr
-30 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Junction Temperature
Tj
145
℃
*1 Power dissipation and forward current are the values when the module temperature
is set lower than the rating by using an adequate heat sink.
*2 The maximum rating of reverse voltage is assumed, after considering the voltage that occur due to initial
connection error that may occur suddenly.
(Not dealing with the possiblity of always-on reverse voltage.)
*3 Operating temperature is the Case temperature Tc
(Refer to measuring point for case temperature in the next page.)
Refer to “Derating curve” in the next page as for operating current.
*4 Tc = 25℃
3
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3-2.Electro-optical characteristics
Item
common
27
(Tj=90℃)
Symbol
Condition
MIN.
Forward Voltage※5
VF
I F =400mA
31.6
(36.0) 39.6
V
Luminous Flux※6
Φ
865
(980)
-
lm
x
-
(0.4610)
-
-
-
(0.4150)
-
-
-
-
(2720)
-
K
General Color Rendering Index※8
Ra
90
(93)
-
-
Luminous Flux※6
Φ
915
(1040)
-
lm
x
-
(0.4370)
-
-
-
(0.4030)
-
-
-
-
(2990)
-
K
General Color Rendering Index※8
Ra
90
(93)
-
-
Luminous Flux※6
Φ
955
(1080)
-
lm
x
-
(0.3820)
-
-
-
(0.3800)
-
-
-
-
(3980)
-
K
General Color Rendering Index※8
Ra
90
(92)
-
-
Luminous Flux※6
Φ
970
(1100)
-
lm
x
-
(0.3480)
-
-
-
(0.3600)
-
-
-
-
(4920)
-
K
Ra
87
(90)
-
-
Chromaticity Coordinates※7
y
Color Temperature
30
Chromaticity Coordinates※7
y
Color Temperature
40
Chromaticity Coordinates※7
y
Color Temperature
50
Chromaticity Coordinates※7
y
Color Temperature
General Color Rendering Index※8
I F =400mA
I F =400mA
I F =400mA
I F =400mA
TYP.
MAX.
Unit
(Note) Values inside parentheses are shown for reference purpose only.
*5 (After 20 ms drive, Measurement tolerance: ± 3%)
*6 Monitored by Sharpʼ s 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 10%)
*7 Monitored by Sharpʼ s 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 0.005)
*8 Monitored by Sharpʼ s 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Measurement tolerance: ± 2)
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3-3.Derating curve
Forward Current Derating Curve
700
Forward Current I F [mA]
600
500
400
300
200
100
0
-30 -20 -10
0
10
20
30
40
50
60
70
Case Temperature Tc[℃]
80
90
100 110
(Note) To keep the case temperature lower than the rating enough heat-radiation performance needs to
be secured by using an adequate heat sink(refer to section8-③).
For soldering connection,please evaluate in your usage environment to make sure soldering reliability.
(Above derating curve is specified to LED device,not for soldering connection)
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation does not exceed case temperature over the rating
in operation.
(Measuring point for case temperature)
Please take note of the following,when measuring case temperature.
1 The LED device mounting surface should be flat/plain surface.
2 The substrate surface temperature should be uniform.
measuring point
Thermal Resistance:2.7℃/W(Typical value)
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3-4.Characteristics diagram(TYP.)
Forward Current vs. Relative Luminous Flux
Tj=90℃
160
140
120
100
80
60
40
20
0
0
100
200
300
400
500
600
600
500
400
300
200
100
0
700
I F = 400mA
Forward Voltage V F [V]
Relative Luminous Flux [%]
80
60
40
20
0
30
60
32
33
34
35
36
37
38
I F= 400mA
38
100
0
31
Case Temperature vs.Forward Voltage
Case Temperature vs. Relative Luminous Flux
120
Tj=90℃
700
Forward Current I F [mA]
Relative Luminous Flux [%]
Forward Voltage vs. Forward Current
37
36
35
34
33
90
Case Temperature Tc [℃]
0
30
60
90
Case Temperature Tc [℃]
(Note)Characteristics data shown here are for reference purpose only.(Not guaranteed data)
6
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4.Reliability
4-1.Test items and test conditions
No.
1
2
3
4
5
Test item
Temperature Cycle
Temperature Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Steady State
Operaring Life
Confidence level:90%
samples Defective
Test conditions
LTPD
n
C
(%)
-40℃(30 min)~ +100℃(30 min),100cycles
11
0
20
Tstg=+60℃,RH=90%,Time=1 000 h
11
0
20
Tstg=+100℃,Time=1 000 h
11
0
20
11
0
20
11
0
20
5
0
50
5
0
50
Tstg=-40℃,Time=1 000 h
Tc=60℃,IF=650mA,Time=1000 h
2
6
Shock
Acceleration:15000m/s,Pulse width:0.5ms
Direction:3 directions (X,Y and Z)
Frequency:100 ~ 2000Hz for 4 minutes per trial
7
Vibration
Acceleration:200m/s2
Direction:3 directions (X,Y and Z)
4 trials each direction
4-2.Failure criteria
No.
Parameter
Symbol
1
2
Forward Voltage
Luminous Flux
VF
Φ
Failure criteria
V F >Initial value×1.1
Φ <Initial value×0.7
7
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5.Quality level
5-1.Applied standard (ISO2859-1)
5-2.Sampling inspection (A single normal sampling plan,level S-4)
5-3.Inspection items and defect criteria
No.
Item
1
No radiation
2
3
Defect criteria
No light emitting
Electro-optical
Not conforming to the specification
characteristics
External
(Forward voltage, Luminous flux and Chromaticity values)
dimensions
Appearance
Major
defect
AQL
0.1
Not conforming to the specification
(External dimensions of ①and②shown in Page2)
Nonconformity observed in product appearance is determined
4
Classification
as defective only when electro-optical characteristics is affected by.
Minor
<If any question arises regardless of above mentioned criterion>
defect
■Foreign material,scratch, or bubble at emitting area:0.8mm
0.4
■Fiber generation at emitting area:0.2mm ib width and 2.5mm inlengh
■Foreign material at connection terminal:0.8mmΦ
■Substrate burr on edge:Over dimension tolerance
(Note) Products with removable foreign material attached on are not determined to be defective.
(Note) Substrate cracks that do not effect the electrical/optical charecterustics are not determined to be defective.
8
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6.Supplements
6-1.Chromaticity rank table (Tolerance:x,y±0.005)
2 700K
3 000K
x
y
(IF=400mA,Tj=90℃)
Chromaticity coordinates
Point 1 Point 2 Point 3 Point 4
0.4590 0.4535 0.4630 0.4685
0.4200 0.4100 0.4100 0.4200
5 000K
x
y
(IF=400mA,Tj=90℃)
Chromaticity coordinates
Point 1 Point 2 Point 3 Point 4
0.3800 0.3745 0.3840 0.3895
0.3850 0.3750 0.3750 0.3850
Rank
1
4 000K
Rank
1
1
Rank
1
0.425
0.425
0.415
1
2800K
2700K
y
y
3 000K Chromaticity Diagram
0.435
0.405
x
y
(IF=400mA,Tj=90℃)
Chromaticity coordinates
Point 1 Point 2 Point 3 Point 4
0.3460 0.3405 0.3500 0.3555
0.3650 0.3550 0.3550 0.3650
Rank
2 700K Chromaticity Diagram
0.415
x
y
(IF=400mA,Tj=90℃)
Chromaticity coordinates
Point 1 Point 2 Point 3 Point 4
0.4350 0.4295 0.4390 0.4445
0.4080 0.3980 0.3980 0.4080
0.405
1
0.395
2600K
3100K
0.395
0.440
0.450
0.460
x
0.470
0.385
0.415
0.480
9
0.425
3000K
2900K
0.435
x
0.445
0.455
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4 000K Chromaticity Diagram
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5 000K Chromaticity Diagram
0.380
0.400
5200K
0.380
1
y
y
4800K
4600K
0.370
0.390
0.360
1
0.350
0.370
4100K
3900K
3800K
4000K
0.360
0.360
5000K
0.370
0.380
x
0.390
0.400
10
0.340
0.330
0.340
0.350
x
0.360
0.370
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Model No. GW6BGS**HED
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6-2.Packing
・ One tray composed of 80 pieces
・ 5 trays(400 piecies)and one upper lid-tray in one moisture-proof bag
・ 2 bags(800 pieces) in one carton
・ Dimensions of outer carton:235×220×90mm (Reference value)
(Note 1)Thre are cases of one carton composed of one bag (400 pieces)
(Note 2) State of packing is dubject to change.
<Outer carton>
<One bag>
<One tray>
400 pieces×2bags=800 pieces
80 pieces×5 trays=400 pieces
10×8=80 pieces
(225mm)
Silica gel
Silica gel
11
(210mm)
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6-3.Label
1) Outer carton
Following label is attached on outer carton.
・ Lot No.indication
(Note 3) Label format is subjected to change.
SHIPMENT TABLE
PART No. GW6BGS**HED
QUANTITY:800
SHARP
←Quantity
XX11B25
RANK
←Model number
←(Model number+ suffix code)
(GW6BGS**HEDM)
LOT No.
XX 11 B 25
① ② ③ ④
①Production plant code
③Shipping month
←Lot No.
1
(from january to Doccmber in ABC order)
←Rank
CORPORATION
RC
MADE IN ***********
←Production country
④Shipping date(01 ~ 31)
・ MADE IN ****
※Notation may be different
・ MADE IN ****
SHARP LABEL
・ Lot No.indication
1)Moisture-Proof bag
Following label is attached on moisture-proof bags.
(Note 3) Label format is subjected to change.
SHIPMENT TABLE
PART No. GW6BGS**HED
QUANTITY:400 RANK 1
SHARP
5020G2064A
CORPORATION
MADE IN ***********
←Model number
←Quantity
③Shipping month(1 ~ 9 or O,N,D)
④Fixed code G
⑥Serial No.
←Production country
⑦Backup code A
・ MADE IN ****
・ MADE IN ****
SHARP LABEL
①Production plant code
⑤Shipping date (01 ~ 31)
←Lot No.
RC
XX 1 9 G 11 123 A
① ② ③ ④ ⑤ ⑥ ⑦
②Shipping year(Year last digit)
←(Model number+suffix code)
(GW6BGS**HEDM)
LOT No.
②Shipping year(Year last 2 digits)
※Notation may be different
Model No. and control No. are indicated on substrate surface.
1)Model No.
Abbreviated Model No” 6BGS**HED” is indicated.
2)Control No.
Indicated as follows;
GS**D - 1
① F 11
② ③ ④
①Production plant code(to be indicated alphabetically)
②Year of production(the last two figures of the year)
③Month of production
(to be indicated alphabetically with january corresponding to A)
④Date of production(01 ~ 31)
⑤Rank:Chromaticity rank is indicated as follows;
Control No.
Rank 1→1
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7.Precautions
① Storage conditions
Please follow the conditions below.
・ Before opend:Temperature 5 ~ 30℃, Relative humidity less than 60%.
(Before opened LED should be used within a year)
・ After opened:Temperature 5 ~ 30℃, Relative humidity less than 60%.
(Please apply soldering within 1 week)
・ Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged,which may affect soldering.
② Usage conditions
This product is not designed for use under any of the following conditionds.
Pleasecarefully check the performance and reliability well enough in case of using under
any of the following conditions;
・ In a please with a lot of moisture,dew condensation,briny air, and corrosive gas.
(CL,H2S,NH3,SO2,NOX,etc)
・ Under the direct sumlight,outdoor exposure,and in a dusty please.
・ In water, oil,medical finrd, and organic solvent.
Please do not use component parts like rujbberwhich may contain sulfur(gasket packing,
adhesive material,etc.)
Please note that any strong acidic or alcoholic elements could effect the silicon resin used
in the LED device.
The heat and light released from the LED device,could generate halogen gas from the surounding
materials,which may have adverse impact on the module.Before using please consider carefully
about this issue.
③ Heat radiation and Installation
If forward curent (IF) is applied to single-state module at any curent,there is a risk of damaging
LED or emitting smoke,due to increase in temperature.
Equip with specified heat radiator(heat sink),and avoid heart being stuffed inside the module.
Material of substrate is alumina ceramic.IF installed inappropriately,trouble of insufficient heat
radiation may occur,which may result in board cracks or lighting defects due to overheat.
Please take particular notice for installation.
Refer to the following cautions while installing the LED device on heat sink.
・ Apply thermolysis adhesive,adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only,check the effectiveness and reliability before
fixing. If LED comes off from heat radiator,unusual temperature rise entails hazardous phenomena
including device deterioration,comming off of solder at leads,and emitting smoke,slong with LED
device deffects.
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・ When LED device is mechanically fixed or locked,Please take into consideration regarding the
method of attachment due to fail from stress.
・ Please apply appropriate stress and design carefully,when fixing the LED device using holder.
Any excessive or uneven stress could break LED deviceʼ s substrate.
・ Avoid convexly uneven boards. Convex board is subject to substrate cracking or debasement
of heat release.
・ It is recommented to apply adhesive or adhesive sheet with high thermal conductivity for
radiation of heat effectively.
・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and
long termperiod,which may affect light output or color due to change of reflectance from backside.
・ Any excessive or uneven stress on the ceramic substrate could break the substrate.
Please design such that,proper/uniform stress is applied on the substrate,when fixing the LED
device using a holder.
・ When fixing the LED device with a holder,please take note if any excessive or uneven stress is
applied when pressing the substrate with holder.Due to this,the gap may arise between LED
device and adhesive material,which may affect the heat dissipation of the device.
・ Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers,please handle by side part of ceramic or the specified area shown below.
(0.5)
(6.0)
Handring area
(4.0)
・ The outer edges of the substrate may be uneven in some cases. Please avoid choosing these
areas as fixing points,while designing for installation.
・ In case of using heat radiation sheet or heat radiation adhesive,light reflection or absorption of
these materials may influence the output of LED device. and hence careful consideration is required
while choosing the radiation sheet ro adhesive.
④ Connecting method
Use soldering for connections. Follow the conditioons mentioned below,to preserve the connection
strength.
・ Use soldering iron with thermo controller(tip temperature 380℃,within 5 seconds per one place.
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・ Secure the solderwettability on whole solder pad and leads.
・ During the soldering process,put the ceramic board on materials whose conductivity is poor
enough not to radiate heat of soldering.
・ Warm up(with using a heated plate) the substrate is recommended before soldering.
(preheat condition:100℃~ 150℃,within 60sec)
・ Avoid touching any part of resin with soldering iron.
・ This product is not designed for reflow and flow soldering.
・ Avoid such lead arrangement as applying stress to solder-applied area.
・ Please do not detach solder and make re-solder.
・ Please solder evenly on each electrode.
・ Please prevent flux from touching to resin.
・ Do the soldering on stable stand.Avoid soldering on moving or vibrating objects.
・ Please avoid touching the soldering unit to resin.
⑤ Static electricity
This product is subject to static electricity,so take measures like wearing wrist band to cope with
it. Install circuit protection device to drive circuit, if necessary.
⑥ Drive method
・ Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs
when they are out of operation.
・ Module is composed of LEDs connected in both series and parallel.
Constant voltage power supply runs off more than specified current amount due to lowered VF
caused by temperature rise.Constant current power supply is recommended to drive.
・ Be cautious while putting on/off the power supply,as excess current,excess voltage or reverse
voltage may get injucted to the device in some cases.
⑦ Cleaning
Avoid cleaning,since LED device may be effected in some cases by cleaning.
⑧ Color-tone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method,light spread condition,or ambient temperature.
Please verify your actual conditions before use.
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⑨ Safety
・ Looking directly at LEDs for a long time may result in hurting your eyes.
・ In case that excess curent(over ratings)is supplied to the device,hazardous phenomena
including abnormal heat generation,emitting smoke,or catching fire can caused.
Take appropriate measures to excess current and voltage.
・ In case of solder connecting method,there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity
caused by contact.
・ Please confirm the safety standards or regulations of application devices.
・ Please be careful with substrate edges,that may injure your hands.
⑩ Other cautions
Guarantee covers the compliance to the quality standards mentioned in the specifications,
however it does not cover the compatibility with application of the end-use,including
assembly and usage environment.
In case any quality problems ocurred in the application of end-use,details will be separately
discussed and determined between the parties hereto.
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sharp LD-E5-10-14-B
http://www.sharp-world.com/products/device/
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