5877KB

ZENIGATA LED
Feb. 10, 2015
SPECIFICATIONS
TIGER ZENI-LED
GW6TGCBG40C
2 700K ∼ 5 700K
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
Development DepartmentⅡ
Lighting Device Division
Electronic Components And Devices Group
http://www.sharp-world.com/products/device/
SHARP CORPORATION
sharp LD-E3-1-14-A
Model No. GW6TGCBG40C
Contents in this technical document be changed without any notice due to the product modification.
http://www.sharp-world.com/products/device/
●Handle this document carefully it contains material protected by international
copyright law. Any reproduction, full or in part, of this material is prohibited
without the express written permission of the company.
●When using the products covered herein,please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions.
(1) Please do verify the validity of this part after assembling it in customerʼs products,when
customer wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) The products covered herein are desigd and manufactured for the following application areas.
When using the products covered herein for the equipment listed in paragraph(3),even for the following
application areas, be sure to observe the precautions given in Paragraph(3).
Never use the products for the equipment listed in Paragraph(4).
・Office electronics
・Instrumentation and measuring equipment
・Machine tools
・Audiovisual equipment
・Home appliances
・Communication equipment other than for trunk lines
(3) These contemplating using the products covered herein for the following equipment which demands
high reliability, should first contact a sales representative of the company and then accept responsibility
for incorporating into the design fail-safe operation,redundansy, and other appropriate measures for
ensuring reliability and safety of the equipment and the overall system.
・Control and safety devices for airplanes, trains,automobiles, and other transportation equipment
・Mainframe computers
・Traffic control systems
・Gas leak detectors and automatic cutoff devices
・Rescue and security equipment
・Other safety devices and safety equipment, etc.
(4) Do not use the products covered herein for the followin equipment which demands extremely
high performance in terms of functionality, reliability, or accuracy.
・Aerospace equipment
・Communications equipment for trunk lines
・Control equipment for the nuclear power industry
・Medical equipment related to life support, etc.
(5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to
a sales representative of the company.
sharp LD-E3-1-14-B
Model No. GW6TGCBG40C
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GW6TGCBG40C Specifications
1. Application
These specifications apply to the light emitting diode module Model No. GW6TGCBG40C.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit
Refer to Page 2.
3. Ratings and characteristics
Refer to Page 3-6.
3-1.
3-2.
3-3.
3-4.
Absolute maximum ratings
Electro-optical characteristics
Derating curve
Characteristics diagram (TYP.)
4. Reliability
Refer to Page 7.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level
Refer to Page 8.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements
6-1.
6-2.
6-3.
6-4.
Refer to Page 9-11.
Chromaticity rank table
Packing
Label
Indication printed on product
7. Precautions
Refer to Page 12-15.
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2.External dimensions and equivalent circuit
24.0+0.50/-0.10 ①
(18.6)
(Unit:mm)
(R8.6)
Top view
20.0
+0.50/-0.10 (12.5)
②
3.5±0.1
(Φ17.2)
Side view
1.4±0.1
(Φ15.6)
1.0
±0.1
(1.6)
(Note)Values inside parentheses are reference values.
External sizes of ①,② are determined by maximum simensions,
that include salient areas on the edges of respective sides.
R
Warm White
2 700K
+connection
terminal
1
3
-connection
terminal
12 series × 8 parallel = 96 pcs of LEDs
R
Cool White
5 700K
2
4
12 series × 6 parallel = 72 pcs of LEDs
Unit
Material
Finish
mm
Substrate : Ceramics
Lens : Silicone resin
Terminal:Ag
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3.Ratings and characteristics
3-1.Absolute maximum ratings
Item
Symbol
Rating
Unit
Power Dissipation(※1,4)
P
34.0
W
Forward Current(※1,4)
IF
840
mA
Reverse Voltage(※2,4)
VR
-15
V
Operating Temperature(※3)
Topr
-30 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Junction Temperature
Tj
145
℃
(※1)Power dissipation and forward current are the value when the module temperature
is set lower than the rating by using an adequate heat sink.
(※2)Voltage resistible at initial connection error
(Not dealing with the possibility of always-on reverse voltage.)
(※3)Case temperature Tc (Refer to measuring point for case temperature in the page No5.)
Refer to "Derating curve" in the next page as for operating current.
(※4)Tc=25℃
(※5)Absolute maximum of Power Dissipation and Forward Current are for summation of
1-3 (warm white) and 2-4 (cool white), not for individual value of each input.
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3-2.Electro-optical characteristics
(Tj=25℃)
CCT
2700K
Item
Symbol
Forward Voltage※5
VF
Luminous Flux※6
Φ
MIN.
TYP.
MAX.
Unit
34.0
37.0
40.0
V
1650
(1840)
-
lm
-
(0.458)
-
-
-
(0.412)
-
-
Ra
93
(96)
-
-
Forward Voltage※5
VF
35.0
38.0
41.0
V
Luminous Flux※6
Φ
1950
(2170)
-
lm
-
(0.330)
-
-
-
(0.340)
-
-
87
(90)
-
-
Chromaticity
x
Coordinates※7
y
General Color
Rendering Index※8
5700K
Chromaticity
x
Coordinates※7
y
General Color
Rendering Index※8
Condition
IF =700mA
IF _1-3
IF =700mA
IF _2-4
Ra
(Note) Values inside parentheses are shown for reference purpose only.
※5
(After 20 ms drive, Tj = 25 ℃, Measurement tolerance: ± 3 %)
※6 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Tj = 25 ℃, Measurement tolerance: ± 10 %)
※7 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Tj = 25 ℃, Measurement tolerance: ± 0.005)
※8 Monitored by Sharp's 8 inch integrating sphere and Otsuka electronics MCPD-LE3400
(After 20 ms drive, Tj = 25 ℃, Measurement tolerance: ± 2)
4
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3-3.Derating curve
Forward Current Derating Curve
900
Forward Current I F [mA]
800
700
600
500
400
300
200
100
0
-30
-20 -10
0
10
20
30
40
50
60
70
80
90
100 110
Case Temperature T [℃]
(Note) To keep the case temperature lower than the rating, enough heat-radiation performance needs to
be secured by using an adequate heat sink.
For soldering connection, please evaluate in your circumstance to make sure soldering reliability.
( Above derating curve is specified to LED device, not for soldering connection )
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation not to exceed case temperature over the rating
in operation.
(Measuring point for case temperature)
measuring point
Thermal resistance:1.35℃/W(2700K ・ I _1-3、
standard value)
F
1.91℃/W(5700K ・ I _2-4、
standard value)
F
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3-4.Characteristics diagram(TYP.)
Forward current If vs Forward Voltage [email protected]=25℃
Forward current If vs Luminous [email protected]=25℃
3000
35
30
25
20
15
10
Luminous Flux (lm)
Vf (V)
45
40
Warm white (1-3)
Cool white (2-4)
5
0
0
100
200
300
400
500
If (mA)
600
700
800
2500
2000
1500
1000
Warm white (1-3)
500
0
900
Cool white (2-4)
0
100
Vf (V)
Luminous Flux (lm)
Warm white (1-3)
Cool white (2-4)
37
36
35
34
700
800
900
1500
1000
Warm white (1-3)
Cool white (2-4)
500
20
30
40
50
60
70
Case Temperature Tc (℃)
80
90
0
100
20
30
1.0
50
60
70
Case Temperature Tc (℃)
0.42
0.39
y
0.6
0.4
(70, 510)
5100K
580
Wavelength (nm)
680
0.3
0.32
780
0.35
6000
600
5500
500
5000
400
4500
CCT (K)
700
300
3500
100
3000
200
300
400
500
If (1-3) (mA)
0.38
x
0.41
(700, 60)
2900K
0.44
0.47
600
700
800
630mA
4000
200
100
100
If ratio vs [email protected]=25℃
If profile at [email protected]=25℃
0
(400, 250)
3200K
(150, 460)
4600K
0.33
0.2
480
90
(300, 330)
3500K
0.36
380
80
0.45
0.8
0.0
40
xy Chromaticity profile at several [email protected]=25℃
Warm white (1-3)
Cool white (2-4)
1.2
Normalized Intensity (arb.)
600
2000
[email protected]=25℃
If (2-4) (mA)
400 500
If (mA)
2500
38
0
300
Juction Temperature Tj vs Luminous [email protected]=700mA
Juction Temperature Tj vs Forward Voltage [email protected]=700
mA
33
200
2500
0.0
620mA
600mA
630mA
650mA
710mA
760mA
780mA
0.2
0.4
0.6
If(2-4) ratio in total If
0.8
1.0
(Note)Characteristics data shown here are for reference purpose only.(Not guaranteed data)
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4.Reliability
4-1.Test items and test conditions
No.
Test item
1
Temperature Cycle
2
Temperature Humidity
Storage
Confidence level:90%
Samples Defective
Test conditions
LTPD
(%)
n
C
- 40 ℃(30 min) ~ + 100 ℃(30 min), 100 cycles
11
0
20
Tstg = + 60 ℃, RH = 90 %, Time = 1000 h
11
0
20
3
High Temperature
storage
Tstg=+100℃,Time=1 000 h
11
0
20
4
Low Temperature
storage
Tstg=-40℃,Time=1 000 h
11
0
20
5
Steady State
operating Life
11
0
20
6
Shock
Acceleration: 15000 m/s2, Pulse width: 0.5 ms
Direction: 3 directions (X, Y and Z)
3 trials in each direction
5
0
50
Vibration
Frequency: 100 to 2000 Hz for 4 minutes per
trial Acceleration: 200 m/s2
Direction: 3 directions (X, Y and Z)
4 trials in each direction
5
0
50
7
Tc=90℃,IF=700mA,Time=1000 h
4-2. Failure criteria
No.
1
2
Parameter
Symbol
Forward Voltage
VF
Φ
Luminous Flux
Failure criteria
V F > Initial value × 1.1
Φ < Initial value × 0.7
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5.Quality level
5-1. Applied standard (ISO2859-1)
5-2. Sampling inspection (A single normal sampling plan, level S-4.)
5-3. Inspection items and defect criteria
No.
Item
Defect criteria
1
No radiation
2
Electro-optical Not conforming to the specification
characteristics (Forward voltage, Luminous flux and Chromaticity)
3
External
dimensions
Not conforming to the specified dimensions
(External dimensions of ① and ② shown in Page 2)
Appearance
Nonconformity observed in product appearance is determined
as defective only when electro-optical characteristics is affected by.
<If any question arises regardless of above mentioned criterion>
■Foreign material, scratch, or bubble at emitting area: 0.8 mm φ
■Fiber generation at emitting area: 0.2 mm in width and 2.5 mm
in length
■Foreign material at connection terminal: 0.8 mm φ
■Substrate burr on edge: Over dimension tolerance
4
No light emitting
Classification
AQL
Major
defect
0.1
Minor
defect
0.4
(Note) Products with removable foreign material attached on is not determined to be defective.
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6.Supplements
6-1.Chromaticity rank table
(Tolerance:x,y±0.005)
2 700K
x
y
(IF=700mA,Tj=25℃)
Chromaticity Diagram
Point 1 Point 2 Point 3 Point 4
0.4552 0.4480 0.4608 0.4680
0.4220 0.4020 0.4020 0.4220
5 700K
x
y
0.3269 0.3200 0.3331 0.3400
0.3500 0.3300 0.3300 0.3500
Rank
1
Chromaticity Diagram
0.460
0.440
3 000K
2 700K
0.420
0.400
y
5 000K
0.380
5 700K
0.360
0.340
0.320
0.300
0.320
0.340
0.360
0.380
9
x
0.400
0.420
0.440
0.460
0.480
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6-2. Packing
・ One tray composed of 40 pieces
5 trays (200 piecies) and one upper lid-tray in one moisture-proof bag
・ 2 bags (400 pieces) in one carton
Dimensions of outer carton: 235 × 220 × 90 mm (Reference value)
(Note 1) There are cases of one carton composed of one bag. (200 pieces)
(Note 2) State of packing is subject to change.
< Outer carton >
< One bag >
< One tray >
200 pieces × 2 bags = 400 pieces
40 pieces × 5 trays = 200 pieces
5 × 8 = 40 pieces
Silica gel
Silica gel
10
(225mm)
(210mm)
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6-3. Label
1) Outer box
Following label is attached on moisture-proof bags.
SHIPMENT TABLE
PART No. GW6TGCBG40C
(GW6TGCBG40C)
QUANTITY:400
LOT No.
RANK
SHARP
XX12B25
MADE IN ***********
←(Model number+ suffix code)
RC
②Shipping year(Year last 2 digits)
←Lot No.
③Shipping month
(from january to Doccmber in ABC order)
←Production country
④Shipping date(01 ~ 31)
・ MADE IN ****
※Notation may be different
・ MADE IN ****
SHARP LABEL
XX 12 B 25
① ② ③ ④
①Production plant code
←Quantity
←Rank
1
CORPORATION
←Model number
・ Lot No.indication
・ Lot No. indication
1) Moisture-Proof bag
XX 2 3 G 01 001 A
① ② ③ ④ ⑤ ⑥ ⑦
Following label is attached on moisture-proof bags.
(Note 3) Label format is subjected to change.
SHIPMENT TABLE
PART No. GW6TGCBG40C
QUANTITY:200 RANK 1
LOT No.
SHARP
XX20G01054A
CORPORATION
MADE IN ***********
②Shipping year(Year last digit)
←Model number
←(Model number+suffix code)
(GW6TGCBG40C)
RC
SHARP LABEL
①Production plant code
←Quantity
③Shipping month(1 ~ 9 or O,N,D)
④Fixed code G
←Lot No.
⑤Shipping date (01 ~ 31)
←Production country
⑥Serial No.
・ MADE IN ****
⑦Backup code A
・ MADE IN ****
※Notation may be different
Model No. and control No. are indicated on substrate surface.
1)Model No.
Abbreviated Model No. " 6TGCBG40C " is indicated.
2)Control No.
Indicated as follows;
XX 12 B 01 - 1
① ② ③ ④ ⑤
① Production plant code (to be indicated alphabetically)
② Year of production (the last two figures of the year)
③ Month of production
Model No.
Control No.
(to be indicated alphabetically with January corresponding to A)
④ Date of production (01 ~ 31)
⑤Rank: Chromaticity rank is indicated as follows;
Rank 1 → 1
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7.Precautions
① Storage conditions
Please follow the conditions below.
・ Before opened: Temperature 5 ~ 30 ℃, Relative humidity less than 60 %.
(Before opened LED should be used within a year)
・ After opened: Temperature 5 ~ 30 ℃, Relative humidity less than 60 %.
(Please apply soldering within 1 week)
・ After opened LED should be kept in an aluminum moisture proof bag with a moisture
absorbent material (silica gel).
・ Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged, which may affect soldering.
② Usage conditions
This product is not designed for the use under any of the following conditions.
Please carefully check the performance and reliability well enough in case of using under any of the
following conditions;
・ In a place with a lot of moisture, dew condensation, briny air, and corrosive gas.
(Cl, H2S, NH3, SO2, NOX, etc.)
・ Under the direct sunlight, outdoor exposure, and in a dusty place.
・ In water, oil, medical fluid, and organic solvent.
Please do not use component parts like rubber which may contain sulfur
(gasket packing, adhesive material,etc.).
Please note that any strong acidic or alcoholic elements could effect the silicon resin used in the
LED device. The heat and light released from the LED device, could generate halogen gas from the
surrounding materials, which may have adverse impact on the module. Before using please consider
carefully about this issue.
③ Heat radiation and Installation
If forward current (IF) is applied to single-state module at any current, there is a risk of damaging LED
or emitting smoke, due to increase in temperature.
Equip with specified heat radiator(heat sink), and avoid heat being stuffed inside the module.
Material of substrate is alumina ceramic. If installed inappropriately, trouble of insufficient heat radiation may
occur , which may result in board cracks or lighting defects due to overheat. Please take particular notice for
installation.
Refer to the following cautions while installing the LED device on heat sink.
・ Apply thermolysis adhesive, adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only, check the effectiveness and reliability before fixing.
If LED comes off from heat radiator, unusual temperature rise entails hazardous phenomena including
device deterioration, coming off of solder at leads, and emitting smoke, along with LED device deffects.
・ When LED device is mechanically fixed or locked, Please take into consideration regarding the method of
attachment due to fail from stress.
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・ Please apply appropriate stress and design carefully, when fixing the LED device using holder. Any
excessive or uneven stress could break LED deviceʼ s substrate.
・ Avoid convexly uneven boards.
Convex board is subject to substrate cracking or debasement of heat release.
・ It is recommended to apply adhesive or adhesive sheet with high thermal conductivity
for radiation of heat effectively.
・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and long term
period, which may affect light output or color due to change of reflectance from backside.
・ Any excessive or uneven stress on the ceramic substrate could break the substrate. Please design such that,
proper/uniform stress is applied on the substrate, when fixing the LED device using a holder.
・ When fixing the LED device with a holder, please take note if any excessive or uneven stress is applied
when pressing the substrate with holder. Due to this, the gap may arise between LED device and
adhesive material, which may affect the heat dissipation of the device.
・ Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers, please handle by ceramic substrate part and avoid touching resin part.
For mounting, please handle by side part of ceramic or the specified area shown below.
Handling area
・ The outer edges of the substrate may be uneven in some cases. Please avoid choosing these areas as fixing
points, while designing for installation.
・ In case of using heat radiation sheet or heat radiation adhesive, light reflection or absorption of these
materials may influence the output of LED device. Especially, the color change that occur due to l
ong-term use has direct impact on output of LED devices, and hence careful consideration is required
while choosing the radiation sheet ro adhesive.
13
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④ Connecting method
Use soldering for conncetions. Follow the conditions mentioned below, to preserve the connection strength.
・ Use soldering iron with thermo controller (tip temperature 380 ℃), within 5 seconds per one place.
・ Secure the solderwettability on whole solder pad and leads.
・ During the soldering process, put the ceramic board on materials whose conductivity is poor enough
not to radiate heat of soldering.
・ Warm up (with using a heated plate) the substrate is recommended before soldering.
( preheat condition: 100 ℃ ~ 150 ℃, within 60 sec )
・ Avoid touching any part of resin with soldering iron.
・ This product is not designed for reflow and flow soldering.
・ Avoid such lead arrangement as applying stress to solder-applied area.
・ Please do not detach solder and make re-solder.
・ Please solder evenly on each electrode.
・ Please prevent flux from touching to resin.
・ Do the soldering on stable stand. Avoid soldering on moving or vibrating objects.
・ Please avoid touching the soldering unit to resin.
⑤ Static electricity
This product is subject to static electricity, so take measures like wearing wrist band to cope with it.
Install circuit protection device to drive circuit, if necessary.
⑥Drive method
・ Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs
when they are out of operation.
・ Module is composed of LEDs connected in both series and parallel.
Constant voltage power supply runs off more than specified current amount due to lowered VF
caused by temperature rise. Constant current power supply is recommended to drive.
・ Be cautious while putting on/off the power supply, as excess current, excess voltage or reverse voltage may
get injucted to the device in some cases.
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⑦ Cleaning
Avoid cleaning, since LED device may be effected in some cases by cleaning.
⑧ Color-tone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method, light spread condition, or ambient temperature.
Please verify your actual conditions before use.
⑨ Safety
・Looking directly at LEDs for a long time may result in hurting your eyes.
・In case that excess current (over ratings) is supplied to the device, hazardous phenomena including
abnormal heat generation, emitting smoke, or catching fire can be caused.
Take appropriate measures to excess current and voltage.
・ In case of solder connecting method, there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact.
・ Please confirm the safety standards or regulations of application devices.
・ Please be careful with substrate edges, that may injure your hands.
⑩ Other cautions
Guarantee covers the compliance to the quality standards mentioned in the specifications,
however it does not cover the compatibility with application of the end-use, including assembly
and usage environment.
In case any quality problems occurred in the application of end-use, details will be separately discussed
and determined between the parties hereto.
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