2394KB

ZENIGATA LED
Feb 13, 2015
SPECIFICATIONS
Mega Zenigata with Natural Toning
GW6TGBJC50C
2 000K ~ 3 000K
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
Development DepartmentⅡ
Lighting Device Division
Electronic Components And Devices Group
http://www.sharp-world.com/products/device/
SHARP CORPORATION
sharp LD-E10-1-14-A
Model No. GW6TGBJC50C
Contents in this technical document be changed without any notice due to the product modification.
http://www.sharp-world.com/products/device/
●Handle this document carefully for it contains material protected by international copyright law.
Any reproduction, full or in part, of this material is prohibited without the express written permission
of the company.
●When using the products covered herein, please observe the conditions written herein and the
precautions outlined in the following paragraphs. In no event shall the company be liable for any damages
resulting form failure to strictly adhere to these conditions and precautions.
(1)Please do verify the validity of this part after assembling it in customerʼ s products, when customer
wants to make catalogue and instruction manual based on the specification sheet of this part.
(2)The products covered herein are designed and manufactured for the following application areas.
When using the products covered herein for the equipment listed in paragraph (3), even for the following
application areas, be sure to observe the precautions given in Paragraph (3). Never use the products
for the equipment listed in Paragraph (4).
*Office electronics
*Instrumentation and measuring equipment
*Machine tools
*Audiovisual equipment
*Home appliances
*Communication equipment other than for trunk limes
(3)These contemplating using the products covered herein for the following equipment which demands
high reliability,should first contact a sales representative of the company and then accept responsibility
for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for
ensuring reliability and safety of the equipment and the overall system.
*Control and safety devices for airplanes, trains, automobiles, and other transportation equipment
*Mainframe computers
*traffic control systems
*Gas leak detectors and automatic cutoff devices
*Rescue and security equipment
*Other safety devices and safety wquipment, etc.
(4)Do not use the products covered herein for the following equipment which demands extremely
high performance in terms of functionality, or accuracy.
*Aerospace equipment
*Communications equipment for trunk lines
*Control equipment for the nuclear power industry
*Medical equipment related to life support, etc.
(5)please direct all queries and comments regarding the interpretation of the above four Paragraphs to
a sales representative of the company.
●Please direct all queries regarding the products covered herein to a sales representative of the company.
sharp LD-E10-1-14-A
Model No. GW6TGBJC50C
Contents in this technical document be changed without any notice due to the product modification.
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GW6TGBJC50C Specifications
1. Application
These specifications apply to the light emitting diode module Model No. GW6TGBJC50C.
[ LED module (InGaN Blue LED chip + Phosphor) ]
Main application : Lighting
2. External dimensions and equivalent circuit
Refer to Page 2.
3. Ratings and characteristics
Refer to Page 3-6.
3-1.
3-2.
3-3.
3-4.
Absolute maximum ratings
Electro-optical characteristics
Derating curve
Characteristics diagram (TYP.)
4. Reliability
Refer to Page 7.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level
Refer to Page 8.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements
6-1.
6-2.
6-3.
6-4.
Refer to Page 9-12.
Chromaticity rank table
Packing
Label
Indication printed on product
7. Precautions
Refer to Page 13-16.
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2.External dimensions and equivalent circuit
24.0+0.50/-0.10 ①
(Unit:mm)
(18.6)
Top view
20.0
(12.5)
+0.50/-0.10
②
3.5±0.1
1.4±0.1
(Φ17.2)
Side view
(Φ15.6)
1.0
(1.6)
±0.1
(Note)Values inside parentheses are reference values.
External sizes of①、②are determined by maximum dimensions,
that include salient areas on the edges of respective sides.
High CCT block
Equivalent circuit
+connection
terminal
-connection
terminal
Low CCT block
Current control circuit
High CCT block 12 series × 8 parallel = 96 pcs of LEDs
Low CCT block 10 series × 2 parallel = 20 pcs of LEDs
Unit
Material
Drawing No.
mm
Substrate : Alumina Ceramic
52605044
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3.Ratings and characteristics
3-1.Absolute maximum ratings
Item
Symbol
Rating
Unit
Power Dissipation(※1,4)
P
41.6
W
Forward Current(※1,4)
IF
1 050
mA
Reverse Voltage(※2,4)
VR
-15
V
Operating Temperature(※3)
Topr
-30 ~ +100
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Junction Temperature
Tj
145
℃
*1 Power dissipation and forward current are the values when the module temperature
is set lower than the rating by using an adequate heat sink.
*2 The maximum rating of reverse voltage is assumed, after considering the voltage that occur due to initial
connection error that may occur suddenly.
(Not dealing with the possibility of always-on reverse voltage.)
*3 Operating temperature is the Case temperature Tc
(Refer to measuring point for case temperature in the next page.)
Refer to "Derating curve" in the next page as for operating current.
*4 Tc = 25℃
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3-2.Electro-optical characteristics
(Tj=25℃)
CCT
2000K
Item
MIN.
TYP.
MAX.
Unit
25.8
(30.4)
33.4
V
120
(155)
-
lm
-
(0.5251)
-
-
y
-
(0.4120)
-
-
General Color Rendering Index※8
Ra
90
(94)
-
-
Forward Voltage※5
VF
30.5
(35.8)
39.6
V
Luminous Flux※6
Φ
2430
(2860)
-
lm
Chromaticity
x
-
(0.4370)
-
-
Forward Voltage※5
VF
Luminous Flux※6
Φ
Chromaticity
x
Coordinates※7
3000K
Symbol
Condition
IF =80mA
IF =950mA
Coordinates※7
y
-
(0.4030)
-
-
General Color Rendering Index※8
Ra
90
(92)
-
-
(Note) Values inside parentheses are shown for reference purpose only.
*5 (After 5 ms drive, Measurement tolerance: ± 3 %)
*6 Monitored by Sharp's 1m integrating sphere and Otsuka electronics SR-2000A
(After 5 ms drive, Measurement tolerance: ± 10 %)
*7 Monitored by Sharp's 1m integrating sphere and Otsuka electronics SR-2000A
(After 5 ms drive, Measurement tolerance: ± 0.005)
*8 Monitored by Sharp's 1m integrating sphere and Otsuka electronics SR-2000A
(After 5 ms drive, Measurement tolerance: ± 2)
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3-3.Derating curve
Forward Current Derating Curve
1100
Forward CurrentI F [mA]
1000
900
800
700
600
500
400
300
200
100
0
-30 -20 -10
0
10
20
30
40
50
60
70
80
90
100 110
Case Temperature Tc[℃]
(Note) To keep the case temperature lower than the rating, enough heat-radiation performance needs to
be secured by using an adequate heat sink.
For soldering connection, please evaluate in your circumstance to make sure soldering reliability.
( Above derating curve is specified to LED device, not for soldering connection )
And please consider to avoid physical stress between wire and substrate,
and some protection like silicon bond on top of soldered wire is recommended.
Please ensure the maintenance of heat radiation not to exceed case temperature over the rating
in operation.
(Measuring point for case temperature)
Please take note of the following, when measuring case temperature.
1 The LED device mounting surface should be flat/plain surface.
2 The substrate surface temperature should be uniform.
3 Do not solder this area when you measuring case temperature.
measuring point
Thermal Resistance:1.30℃/W(Typical value)
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3-4.Characteristics diagram(TYP.)
Forward Current vs. Forward Voltage
40.0
Tj=25℃
35.0
Tj=25℃
3000
Luminous Flux (lm)
30.0
25.0
V (V)
F
Forward Current vs. Luminous Flux
3500
20.0
15.0
10.0
2500
2000
1500
1000
500
5.0
0
0.0
0
200
400
600
800
1000
0
1200
200
400
I (mA)
F
600
800
1000
1200
I (mA)
F
xy Chromaticity profile
Forward Current I vs.
CCT
F
Tj=25℃
0.42
Tj=25℃
3500
3000
0.415
CCT(K)
2500
0.41
Y
(80mA)
(100mA)
0.405
1500
(200mA)
1000
(950mA)
0.4
2000
500
0.395
0.4
0.45
X
0.5
0
0.55
0
Case Temperature Tc vs. Forward Voltage V F
Luminous Flux (lm)
(950mA)
34.0
V (V)
F
800
1000
3000
36.0
32.0
30.0
(80mA)
28.0
26.0
24.0
2500
2000
1500
1000
500
22.0
(80mA)
0
20.0
0
20
40
60
80
Case Temperature Tc(℃)
0
100
20
40
60
80
Case Temperature Tc(℃)
100
Spectrum at Tj=25℃
Case Temperature Tc vs. CCT
3500
1.2
3000
Normalized Intensity(arb.)
(950mA)
2500
CCT(K)
400
600
I (mA)
F
Case Temperature Tc vs. Luminous Flux
3500
38.0
200
2000
(80mA)
1500
1000
500
1
0.8
(950mA)
0.6
0.4
(80mA)
0.2
0
0
0
20
40
60
80
300
100
Case Temperature Tc(℃)
500
700
900
Wavelength(nm)
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4.Reliability
The reliability of products shall be satisfied with items listed below.
4-1.Test items and test conditions
Confidence level:90%
No.
Test item
Test conditions
1
Temperature Cycle
2
3
4
5
samples Defective
LTPD
n
C
(%)
- 40 ℃(30 min) ~ + 100 ℃(30 min), 100 cycles
11
0
20
Tstg = + 60 ℃, RH = 90 %, Time = 1000 h
11
0
20
Tstg = + 100℃, Time = 1000 h
11
0
20
Tstg = - 40 ℃, Time = 1000 h
11
0
20
Tc = 80 ℃, I F = 950 mA, Time = 1000 h
11
0
20
Shock
Acceleration: 15000 m/s , Pulse width: 0.5 ms
Direction: 3 directions (X, Y and Z)
3 trials in each direction
5
0
50
Vibration
Frequency: 100 to 2000 Hz for 4 minutes per trial
Acceleration: 200 m/s 2
Direction: 3 directions (X, Y and Z)
4 trials in each direction
5
0
50
Temperature Humidity
Storage
High Temperature
Storage
Low Temperature
Storage
Steady State
Operaring Life
2
6
7
4-2.Failure criteria
No.
Parameter
Symbol
1
2
Forward Voltage
Luminous Flux
VF
Φ
Failure criteria
V F >Initial value×1.1
Φ <Initial value×0.7
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5.Quality level
5-1.Applied standard (ISO2859-1)
5-2.Sampling inspection (A single normal sampling plan,level S-4)
5-3.Inspection items and defect criteria
No.
Item
Defect criteria
1
No radiation
No light emitting
2
3
Electro-optical
Not conforming to the specification
characteristics
External
(Forward voltage, Luminous flux and Chromaticity values)
dimensions
(External dimensions of ①and②shown in Page2)
as defective only when electro-optical characteristics is affected by.
<If any question arises regardless of above mentioned criterion>
Appearance
Major
defect
AQL
0.1
Not conforming to the specification
Nonconformity observed in product appearance is determined
4
Classification
Minor
defect
0.4
■Foreign material,scratch, or bubble at emitting area:0.8mm
■Fiber generation at emitting area:0.2mm ib width and 2.5mm inlengh
■Foreign material at connection terminal:0.8mmΦ
■Substrate burr on edge:Over dimension tolerance
(Note) Products with removable foreign material attached on is not determined to be defective.
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6.Supplements
6-1.Chromaticity rank table (Tolerance:x,y±0.005)
(Tj=25℃)
Chromaticity coordinates
Rank
1
2 000K
x
y
Point 1 Point 2 Point 3 Point 4
0.5097 0.5311 0.5404 0.5190
0.4060 0.4060 0.4180 0.4180
3 000K
x
y
0.4287 0.4404 0.4454 0.4334
0.3980 0.3980 0.4080 0.4080
(I F =80mA)
(I F =950mA)
---- Black Body curve
Chromaticity Diagram
0.460
0.440
0.420
0.400
y
2200K
0.380
2000K
2700K
3000K
0.360
0.340
0.320
0.400
0.420
0.440
0.460
0.480
0.500
0.520
0.540
0.560
0.580
x
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6-2.Packing
・ One tray composed of 40 pieces
・ 5 trays(200 piecies)and one upper lid-tray in one moisture-proof bag
・ 2 bags(400 pieces) in one carton
・ Dimensions of outer carton:235×220×90mm (Reference value)
(Note 1)Thre are cases of one carton composed of one bag (200 pieces)
(Note 2) State of packing is dubject to change.
<Outer carton>
<One bag>
200 pieces×2bags=400 pieces 40 pieces×5 trays=200 pieces
<One tray>
5×8=40 pieces
(225mm)
Silica gel
Silica gel
10
(210mm)
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6-3.Label
・ Lot No.indication
1) Outer carton
XX 11 B 25
① ② ③ ④
①Production plant code
Following label is attached on outer carton.
(Note 3) Label format is subjected to change.
SHIPMENT TABLE
PART No. GW6TGBJC50C
QUANTITY:400
RANK
SHARP
④Shipping date(01 ~ 31)
←Lot No.
1
CORPORATION
(from january to Doccmber in ABC order)
←Quantity
XX12B01
MADE IN ***********
③Shipping month
←Model number
←(Model number+ suffix code)
(GW6TGBJC50CX)
LOT No.
②Shipping year(Year last 2 digits)
←Rank
RC
※Notation may be different
←Production country
・ MADE IN ****
・ MADE IN ****
SHARP LABEL
・ Lot No.indication
XX 1 9 G 11 123 A
① ② ③ ④ ⑤ ⑥ ⑦
2)Moisture-Proof bag
Following label is attached on moisture-proof bags.
(Note 3) Label format is subjected to change.
SHIPMENT TABLE
PART No. GW6TGBJC50C
(GW6TGBJC50CX)
LOT No.
SHARP
XX20G01054A
CORPORATION
MADE IN ***********
SHARP LABEL
RC
②Shipping year(Year last digit)
③Shipping month(1 ~ 9 or O,N,D)
④Fixed code G
←Model number
⑤Shipping date (01 ~ 31)
←(Model number+suffix code)
QUANTITY:200 RANK 1
①Production plant code
←Quantity
⑥Serial No.
←Lot No.
⑦Backup code A
←Production country
※Notation may be different
・ MADE IN ****
・ MADE IN ****
Model No. &
6-4. Indication printed on product
Model No. and control No. are indicated on substrate surface.
1) Model No. & Rank:
1st line:Abbreviated Model No 'GBJCC ' is indicated."
2nd line:Rank:
2) Control No.
Indicated as follows;
12 B 11
① ② ③
① Year of production (the last two figures of the year)
② Month of production
(to be indicated alphabetically with January corresponding to A)
③ Date of production (01~31)
Control No.
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7.Precautions
① Storage conditions
Please follow the conditions below.
・ Before opend:Temperature 5 ~ 30℃, Relative humidity less than 60%.
(Before opened LED should be used within a year)
・ After opened:Temperature 5 ~ 30℃, Relative humidity less than 60%.
(Please apply soldering within 1 week)
・ Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged,which may affect soldering.
② Usage conditions
This product is not designed for use under any of the following conditionds.
Pleasecarefully check the performance and reliability well enough in case of using under
any of the following conditions;
・ In a please with a lot of moisture,dew condensation,briny air, and corrosive gas.
(CL,H2S,NH3,SO2,NOX,etc)
・ Under the direct sumlight,outdoor exposure,and in a dusty please.
・ In water, oil,medical finrd, and organic solvent.
Please do not use component parts like rujbberwhich may contain sulfur(gasket packing,
adhesive material,etc.)
Please note that any strong acidic or alcoholic elements could effect the silicon resin used
in the LED device.
The heat and light released from the LED device,could generate halogen gas from the surounding
materials,which may have adverse impact on the module.Before using please consider carefully
about this issue.
③ Heat radiation and Installation
If forward curent (I F ) is applied to single-state module at any curent,there is a risk of damaging
LED or emitting smoke,due to increase in temperature.
Equip with specified heat radiator(heat sink),and avoid heart being stuffed inside the module.
Material of substrate is alumina ceramic.IF installed inappropriately,trouble of insufficient heat
radiation may occur,which may result in board cracks or lighting defects due to overheat.
Please take particular notice for installation.
Refer to the following cautions while installing the LED device on heat sink.
・ Apply thermolysis adhesive,adhesive sheet or peculiar connector when mounted on heat radiator.
In case of applying adhesive or adhesive sheet only,check the effectiveness and reliability before
fixing. If LED comes off from heat radiator,unusual temperature rise entails hazardous phenomena
including device deterioration,comming off of solder at leads,and emitting smoke,slong with LED
device deffects.
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・ When LED device is mechanically fixed or locked,Please take into consideration regarding the
method of attachment due to fail from stress.
・ Please apply appropriate stress and design carefully,when fixing the LED device using holder.
Any excessive or uneven stress could break LED deviceʼ s substrate.
・ Avoid convexly uneven boards. Convex board is subject to substrate cracking or debasement
of heat release.
・ It is recommented to apply adhesive or adhesive sheet with high thermal conductivity for
radiation of heat effectively.
・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and
long termperiod,which may affect light output or color due to change of reflectance from backside.
・ Any excessive or uneven stress on the ceramic substrate could break the substrate.
Please design such that,proper/uniform stress is applied on the substrate,when fixing the LED
device using a holder.
・ When fixing the LED device with a holder,please take note if any excessive or uneven stress is
applied when pressing the substrate with holder.Due to this,the gap may arise between LED
device and adhesive material,which may affect the heat dissipation of the device.
・ Do not touch resin part including white resin part on the surface of LED.
No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.
When using tweezers,please handle by side part of ceramic or the specified area shown below.
Current control circuit
Handling area
・ The outer edges of the substrate may be uneven in some cases. Please avoid choosing these
areas as fixing points,while designing for installation.
・ In case of using heat radiation sheet or heat radiation adhesive,light reflection or absorption of
these materials may influence the output of LED device. and hence careful consideration is required
while choosing the radiation sheet ro adhesive.
④ Connecting method
Use soldering for connections. Follow the conditioons mentioned below,to preserve the connection
strength.
・ Use soldering iron with thermo controller(tip temperature 380℃,within 5 seconds per one place.
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・ Secure the solderwettability on whole solder pad and leads.
・ During the soldering process,put the ceramic board on materials whose conductivity is poor
enough not to radiate heat of soldering.
・ Warm up(with using a heated plate) the substrate is recommended before soldering.
(preheat condition:100℃~ 150℃,within 60sec)
・ Avoid touching any part of resin with soldering iron.
・ This product is not designed for reflow and flow soldering.
・ Avoid such lead arrangement as applying stress to solder-applied area.
・ Please do not detach solder and make re-solder.
・ Please solder evenly on each electrode.
・ Please prevent flux from touching to resin.
・ Do the soldering on stable stand.Avoid soldering on moving or vibrating objects.
・ Please avoid touching the soldering unit to resin.
⑤ Static electricity
This product is subject to static electricity,so take measures like wearing wrist band to cope with
it. Install circuit protection device to drive circuit, if necessary.
⑥ Drive method
・ Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs
when they are out of operation.
・ Module is composed of LEDs connected in both series and parallel.
Constant voltage power supply runs off more than specified current amount due to lowered VF
caused by temperature rise.Constant current power supply is recommended to drive.
・ Be cautious while putting on/off the power supply,as excess current,excess voltage or reverse
voltage may get injucted to the device in some cases.
⑦ Cleaning
Avoid cleaning,since LED device may be effected in some cases by cleaning.
⑧ Color-tone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method,light spread condition,or ambient temperature.
Please verify your actual conditions before use.
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⑨ Safety
・ Looking directly at LEDs for a long time may result in hurting your eyes.
・ In case that excess curent(over ratings)is supplied to the device,hazardous phenomena
including abnormal heat generation,emitting smoke,or catching fire can caused.
Take appropriate measures to excess current and voltage.
・ In case of solder connecting method,there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity
caused by contact.
・ Please confirm the safety standards or regulations of application devices.
・ Please be careful with substrate edges,that may injure your hands.
⑩ Other cautions
Guarantee covers the compliance to the quality standards mentioned in the specifications,
however it does not cover the compatibility with application of the end-use,including
assembly and usage environment.
In case any quality problems ocurred in the application of end-use,details will be separately
discussed and determined between the parties hereto.
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