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BALF-SPI-01D3
50 Ω nominal input / conjugate match balun to SPIRIT1,
with integrated harmonic filter
Datasheet  production data
Features
 50 Ω nominal input / conjugate match to
SPIRIT1
 Low insertion loss
 Low amplitude imbalance
 Low phase imbalance
 Small footprint
Flip-Chip package 6 bumps
Benefits
Figure 1. Pin coordinates (top view)
 Very low profile (< 670 μm)
 High RF performance
 RF BOM and area reduction
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 868 MHz and 915 MHz impedance matched
balun filter
 Optimized for SPIRIT1 sub GHz RFIC
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Description
Figure 2. Application schematic (top view)
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The BALF-SPI-01D3 uses STMicroelectronics
IPD technology on non-conductive glass
substrate which optimize RF performance.
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STMicroelectronics BALF-SPI-01D3 is an ultra
miniature balun. The BALF-SPI-01D3 integrates
matching network and harmonics filters. Matching
impedance has been customized for the SPIRIT1
ST transceiver.
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This is information on a product in full production.
DocID025035 Rev 5
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Characteristics
1
BALF-SPI-01D3
Characteristics
Table 1. Absolute maximum ratings (limiting values)
Value
Symbol
Parameter
Unit
Min.
Input power RFIN
PIN
VESD
TOP
Typ.
Max.
-
20
ESD ratings human body model (JESD22-A114-C), all I/O one at a
time while others connected to GND
2000
-
ESD ratings machine model, all I/O
200
-
Operating temperature (JESD22-A115-C), all I/O
-40
-
dBm
V
+85
°C
Table 2. Impedances (Tamb = 25 °C)
Value
Symbol
Parameter
Unit
ZRX
Nominal differential RX balun impedance
ZTX
Nominal TX filter impedance
ZANT
Antenna impedance
Min.
Typ.
Max.
-
match to SPIRIT1
-
Ω
-
50
-
Ω
Table 3. RF performance (Tamb = 25 °C)
Value
Symbol
F
Parameter
Test condition
Frequency range (bandwidth)
Unit
Min.
Typ.
Max.
779
868
956
MHz
S21RX-ANT
Insertion loss in bandwidth
without mismatch loss (RX balun)
-1.7
-2
dB
S21TX-ANT
Insertion loss in bandwidth
without mismatch loss (TX filter)
-1.4
-2
dB
S11ANT
Input return loss in bandwidth (RX balun)
-23
-15
dB
S11ANT
Input return loss in bandwidth (TX filter)
-15
-12
dB
10
15
°
0.35
0.8
dB
imb
Output phase imbalance (RX balun)
Aimb
Output amplitude imbalance (RX balun)
Att
2/12
Harmonic levels (TX filter)
5
Attenuation at 2fo
-35
Attenuation at 3fo
-40
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dBm
BALF-SPI-01D3
1.1
Characteristics
RF measurement (Rx balun)
Figure 3. Insertion loss (Tamb = 25 °C)
Figure 4. Return loss antenna (Tamb = 25 °C)
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Figure 5. Phase imbalance (Tamb = 25 °C)
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Figure 6. Amplitude imbalance (Tamb = 25 °C)
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Characteristics
1.2
BALF-SPI-01D3
RF measurement (Tx filter)
Figure 7. Transmission (Tamb = 25 °C)
Figure 8. Insertion loss (Tamb = 25 °C)
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Figure 9. Attenuation (Tamb = 25 °C)
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Figure 10. Return loss antenna (Tamb = 25 °C)
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BALF-SPI-01D3
2
Application information
Application information
Figure 11. Application board EVB (4 layers)
Figure 12. TX output measurements with BALF-SPI-01D3 at 868 MHz
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Application information
BALF-SPI-01D3
Figure 13. TX output power measurements over frequency with BALF-SPI-01D3
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Figure 14. Harmonic measurements at Pout = 10 dBm with BALF-SPI-01D3
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BALF-SPI-01D3
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Package information
Package information

Epoxy meets UL94, V0

Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Flip-Chip package information
Figure 15. Flip-Chip package outline
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Table 4. Flip-Chip package mechanical data
Description
Parameter
Min.
Typ.
Max.
Unit
0.590
0.650
0.710
mm
A
Bump height + substrate thickness
A1
Bump height
0.200
mm
A2
Substrate thickness
0.400
mm
b
Bump diameter
0.210
0.250
0.290
mm
D
Y dimension of the die
1.950
2.000
1.950
mm
D1
Y pitch
0.960
1.000
1.040
mm
D2
Y pitch2
0.460
0.500
0.540
mm
E
X dimension of the die
1.350
1.400
1.450
mm
E1
X pitch
0.790
0.820
0.850
mm
fD1
Distance from bump to edge of die on Y
axis
0.295
mm
fD2
Distance from bump to edge of die on Y
axis
0.195
mm
ccc
0.05
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mm
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Package information
BALF-SPI-01D3
Figure 16. Recommended balun land pattern
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DocID025035 Rev 5
BALF-SPI-01D3
Package information
Figure 17. Footprint - 3 mils stencil -non solder
mask defined
Figure 18. Footprint - 3 mils stencil - solder
mask defined
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Figure 20. Footprint - 5 mils stencil - solder
mask defined
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Package information
BALF-SPI-01D3
Figure 21. Marking
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Figure 22. Flip Chip tape and reel specifications
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More information is available in the STMicroelectronics Application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
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BALF-SPI-01D3
4
Ordering information
Ordering information
Table 5. Ordering information
5
Order code
Marking
Weight
Base Qty
Delivery mode
BALF-SPI-01D3
SJ
3.0 mg
5000
Tape and Reel
Revision history
Table 6. Document revision history
Date
Revision
Changes
27-Aug-2013
1
Initial release.
03-Oct-2013
2
Updated document title. Updated Table 1 with JESD22 references.
15-May-2015
3
Updated Figure 1 and Figure 15. Added Figure 19 and Figure 20.
18-Sep-2015
4
Updated Figure 15 and added Table 4.
17-Nov-2015
5
Updated Figure 2 and Figure 15.
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BALF-SPI-01D3
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acknowledgement.
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