AC275: Microsemi CCGA to FBGA Adapter Socket Instructions App Note

Application Note AC275
CCGA to FBGA
Adapter Sockets
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . .
The CCGA to FBGA Adapter Socket . . . . . . . . .
CCGA to FBGA Ceramic Adapter Configurations . . .
Assembly Procedure. . . . . . . . . . . . . . . . . .
PCB Pad Layout . . . . . . . . . . . . . . . . . . . .
Alignment Pins. . . . . . . . . . . . . . . . . . . . .
Reflow Profile . . . . . . . . . . . . . . . . . . . . .
CCGA to FBGA Adapter Pin Mapping List . . . . . .
Prototyped Product, Adapter, and PCB Design Matrix
Support . . . . . . . . . . . . . . . . . . . . . . . .
Related Documents . . . . . . . . . . . . . . . . . .
List of Changes . . . . . . . . . . . . . . . . . . . .
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.1
.1
.3
.4
.7
.8
.9
.9
.9
11
11
11
Introduction
Microsemi® SoC Products Group recently introduced RTAX-S/L, the next generation designed-for-space
antifuse field programmable gate arrays (FPGAs). RTAX-S/L, with up to four million system gates, is SoC
Products Group's highest density family, providing the space designer with nearly 250 k ASIC gates and
error correction and detection (EDAC) protected static RAM. RTAX-S/L is the first SoC Products Group
family designed for use in the ceramic column grid array (CCGA) package configuration. SoC Products
Group has developed a low cost prototyping methodology for RTAX-S/L using the Axcelerator® family of
FPGAs.
RTAX-S/L is a derivative of the Axcelerator family. RTAX-S/L FPGAs can be prototyped using the
comparable commercial Axcelerator device at a much lower cost than the equivalent space device. SoC
Products Group has developed a CCGA to fine pitch ball grid array (FBGA) adapter socket to reduce
RTAX-S/L development costs. SoC Products Group is also offering the CG624 package with the
RTSX72SU, using the A54SX72A as the prototyping vehicle.
This assembly procedure document covers the RTAX-S/L and RTSX-SU product families, which explains
what a CCGA-FBGA adapter socket is, defines the component parts, and describes how to assemble the
adapter. Once the adapter is assembled, the care and handling are similar to a CCGA packaged device.
The intention of the prototyping adaptors is to provide functional validation and not at-speed timing
validation. The prototyping adaptors may limit the performance of the FPGA I/O buffers.
The CCGA to FBGA Adapter Socket
The CCGA to FBGA adapter socket has a CCGA ceramic package configuration on the bottom and an
FBGA configuration on top. The SoC Products Group CG (abbreviated for CCGA or ceramic column grid
array) to FG (abbreviated for FBGA or fine pitch ball grid array) adapter socket offering allows for easy
prototyping when using an FG package to prototype a CG package. The ordering part numbers are listed
in Table 1 on page 2.
November 2011
© 2011 Microsemi Corporation
1
CCGA to FBGA Adapter Sockets
Table 1 • Ordering Part Numbers
Adapter Socket
Ordering Part Number
CG624 to FG484
SK-SX72-CG624RTFG484
Prototyped and Prototype Device
For prototyping RTSX72SU-CG624 or A54SX72A-CG624
using A54SX7A FG484
CG624 to FG896 SK-AX1-AX2-KITTOP and
SK-AX1-CG624-KITBTM
For prototyping RTAX1000S-CG624, RTAX1000SL-CG624, or
AX1000-CG624 using AX1000-FG896 package
CG624 to FG896 SK-AX1-AX2-KITTOP and
SK-AX2-CG624-KITBTM
For prototyping RTAX2000S-CG624, RTAX2000SL-CG624, or
AX2000-CG624 using AX2000-FG896 package
Figure 1 • CCGA to FBGA Adapter Socket Components
Notes:
1. Top, from left: ceramic adapter, socket lid, socket housing.
2. Bottom, from left: socket interposer, alignment pins, fixing screws.
2
CCGA to FBGA Ceramic Adapter Configurations
CCGA to FBGA Ceramic Adapter Configurations
RTSX72SU (or A54SX72A) CG624 to A54SX72A FG484 Adapter Outline Dimension
RTAX1000S (or AX1000) CG624 to AX1000 FG896 Adapter Outline Dimension
RTAX2000S (or AX2000) CG624 to AX2000 FG896 Adapter Outline Dimension
Figure 2 • Ceramic Adapter Top View (Left) and Bottom View (Right) with Dimensions
3
CCGA to FBGA Adapter Sockets
Assembly Procedure
Step 1
Note: The -KITBTM parts for CG624 devices contain all the parts needed for Step 1. Both the SK-AX1CG624-KITBTM and SK-AX2-CG624-KITBTM contain the housing, ceramic adapter, eight screws
and two alignment pins.
Note: See Figure 11 on page 7 for an outline drawing of the CG624 to FG484 23x23 Adapter Socket.
Alignment pins can (optionally) be used prior to step 1 to align the housing to the ceramic adapter.
The same alignment pins can be (optionally) used to align the assembled housing plus adapter to
the circuit board just prior to Step 2. Reflow in "Step 2" on page 5 means that you must have put the
solder onto the board, place the assembled ceramic adapter onto the PCB, and then complete the
reflow. Placing the assembled adapter onto the PCB is made easier if the alignment pins are used,
but corresponding alignment holes must have been pre-drilled into the PCB during PCB
manufacture for this to work.
Tighten the socket housing to the adapter. Step 1 includes three sub-steps:
1. Turn the socket housing and ceramic adapter upside down (Figure 3).
2. Fasten the socket housing to the ceramic adapter using eight of the screws provided (Figure 4).
3. Turn the ceramic adapter (with socket housing) over (Figure 5 on page 5).
Front Socket
Housing
Back Socket
Housing
Figure 3 • View of Ceramic Adapter (Top) and Socket Housing (Bottom) Turned Over
Figure 4 • View of Ceramic Adapter Fastened to Socket Housing Using the Screws Provided
4
Assembly Procedure
Figure 5 • View of Adapter Socket Assembly with Socket Housing Attached
Step 2
Reflow the adapter to the printed circuit board (PCB) (Figure 6).
B
PC
Figure 6 • Adapter Reflowed to the PCB
Step 3
Place the socket interposer into the adapter (Figure 7).
B
PC
B
PC
Figure 7 • Socket Interposer Placement in the Adapter Assembly
5
CCGA to FBGA Adapter Sockets
Step 4
Place the FBGA package into the adapter (Figure 8).
B
PC
B
PC
Figure 8 • View of the FPGA Package Placement in the Adapter Assembly
Step 5
Fasten the socket lid to the socket housing using the remaining eight screws provided (Figure 9).
B
PC
B
PC
Figure 9 • View of the Socket Lid and Screw Placement
Note: If prototyping CG624 parts using AX1000-FG896 or AX2000-FG896, -KITTOP contains the screws,
interposer, and lid. The SoC Products Group part for these components is SK-AX1-AX2-KITTOP.
6
PCB Pad Layout
PCB Pad Layout
Pads should be laid out according to the solder column dimensions of the CG package. Refer to the CG
package drawing and the SoC Products Group application note, CCGA. Since the socket adapter’s
overall size is larger than the actual CG package, you must consider the size difference between the
socket adapter and CG package during board layout, particularly if the same board will be used for both
prototyping and production. Figure 10 shows PCB pad layout specifications.
a) Solder Mask Window
(Diameter)
45˚ Typical
b) Diameter
c) Dia
A
Solderable
Surface
b) Mounting Pad
(Diameter)
Section A–A
d) Via Solder Mask Window
(Diameter)
A
e) Via
(Diameter)
0.3mm Line
f) Land
(Diameter)
g) Typical
h
Feature 1.27mm Pitch 1.00mm Pitch
a
0.851mm
0.8mm
0.749mm
0.7mm
b
0.72mm
0.67mm
c
d
0.483mm
0.38mm
e
0.305mm
0.20mm
0.56mm
0.46mm
f
0.635mm
0.50mm
g
0.635mm
0.50mm
h
Figure 10 • PCB Pad Layout Specifications
G) Screws X16 #0–18,1/4L
A) Socket Lid
H) Alignment Pins X2
B) FG896 Package
FG
48
4
C) Socket Interposer
40.00
D) Socket Housing
FG484
40.00
F) Ceramic Adapter
Unit: mm
14. 96
14. 03
Figure 11 • CG624 to FG484 23x23 Adapter Socket Outline Drawing
7
CCGA to FBGA Adapter Sockets
G) Screws X16 #0–18,1/4L
A) Socket Lid
H) Alignment Pins X2
B) FG896 Package
FG
89
6
C) Socket Interposer
43.00
D) Socket Housing
FG896
43.00
F) Ceramic Adapter
14.96
14.03
Unit: mm
Figure 12 • CG624 to FG896 Adapter Socket Outline Drawing
Note:
1. A set of boards will require at least one -KITTOP and one -KITBTM kit for each board. The
-KITTOP components may be moved from board to board for testing one at a time, if a cost saving is
required.
2. SK-AX1-AX2-KITTOP contains a socket lid (A), an interposer (C), eight screws and two alignment
pins (half of G).SK-AX1-CG624-KITBTM contains the socket housing (D) a unique ceramic adapter
for AX1000 use (F), eight screws and two alignment pins. (half of G).
3. SK-AX2-CG624-KITBTM contains socket housing (D), a unique ceramic adapter for AX2000 use
(F), eight screws and two alignment pins (half of G).
Alignment Pins
There are two alignment pins for aligning the socket housing to the adapter. The same pins can be used
to align the assembled adapter socket to the PCB. Alignment holes on the PCB are optional. You must
decide whether or not to include alignment holes on a board. Two alignment pins are included in the KITBTM units. No alignment pins are included in -KITTOP units.
8
Reflow Profile
Reflow Profile
Since reflow profiles depend heavily upon the size of the board and other components, you must perform
additional fine tuning from the general profile shown in Figure 13.
250
200
180˚C
150
Temperature (˚C)
220˚C:
30 Seconds Maximum
Maximum Package Body
Temperature = 220˚C (±5˚C)
125
˚C
80
to 1
1˚C to 3˚C
Per Second
˚C
1˚C to 4˚C
Per Second
Keep Temperature
Above 183˚C
(Solder Melting Point)
For at Least 60 Seconds
100
120 Seconds
Minimum
50
0
1˚C to 3˚C
Per Second
50
100
150
200
250
300
Time (Seconds)
Figure 13 • Sample Temperature Profile for Infrared (IR) or Convection Reflow
CCGA to FBGA Adapter Pin Mapping List
The CCGA to FBGA adapter is routed from the FBGA package to match the existing die pad available to
the CCGA device being prototyped (Table 2 on page 10).
Prototyped Product, Adapter, and PCB Design Matrix
Designing the PCB for a specific product requires an understanding of which adapter socket will work.
Each adapter socket is routed differently, depending on the commercial Axcelerator FG package used for
prototyping and the Axcelerator device or RadTolerant equivalent derivative being prototyped. Table 3 on
page 10 shows the combinations that will work.
9
CCGA to FBGA Adapter Sockets
Table 2 • CCGA to FBGA Adapter Pin Mapping List Documents
Adapter Socket
Ordering Part Number
Prototyped and
Prototype Device
Adapter Pin Mapping List
Document Number
CG624 to FG484 SK-SX72-CG624RTFG484 For prototyping
www.microsemi.com/soc/te
chdocs/package/default.as
RTSX72SU-CG624 or
px
A54SX72A-CG624 using
A54SX72A FG484
CG624 to FG896 SK-AX1-AX2-KITTOP and
SK-AX1-CG624-KITBTM
For prototyping
RTAX1000S-CG624,
RTAX1000SL-CG624, or
AX1000-CG624 using
AX1000-FG896 package
CG624 to FG896 SK-AX1-AX2-KITTOP and
SK-AX2-CG624-KITBTM
For prototyping
RTAX2000S-CG624,
RTAX2000SL-CG624, or
AX2000-CG624 using
AX2000-FG896 package
Table 3 • PCB Design Matrix
Prototyped Product
Adapter Part Number
Prototype Vehicle
PCB Design
A54SX72A-CG624
SK-SX72-CG624RTFG484
A54SX72A-FG484
A54SX72A-CG624
RTSX72SU-CG624
SK-SX72-CG624RTFG484
A54SX72A-FG484
A54SX72A-CG624
AX1000-CG624
SK-AX1-AX2-KITTOP and
SK-AX1-CG624-KITBTM
AX1000-FG896
AX1000-CG624
AX2000-CG624
SK-AX1-AX2-KITTOP and
SK-AX2-CG624-KITBTM
AX2000-FG896
AX2000-CG624
RTAX1000SL-CG624
SK-AX1-AX2-KITTOP and
SK-AX1-CG624-KITBTM
AX1000-FG896
AX1000-CG6241
RTAX2000SL-CG624
SK-AX1-AX2-KITTOP and
SK-AX2-CG624-KITBTM
AX2000-FG896
AX2000-CG6241
RTAX1000SL-CG624
SK-AX1-AX2-KITTOP and
SK-AX1-CG624-KITBTM
AX1000-FG896
RTAX1000S-CG6241,2
RTAX2000SL-CG624
SK-AX1-AX2-KITTOP and
SK-AX2-CG624-KITBTM
AX2000-FG896
RTAX2000S-CG624 1,2
Note:
1. The PCB designer should consider the eight pin-pairs of the Phase-Locked Loop (PLL) analog
power supply (VCCPLA/VCOMPLA, VCCPLB/VCOMPLB, VCCPLC/VCOMPLC,
VCCPLD/VCOMPLD, VCCPLE/VCOMPLE,VCCPLF/VCOMPLF, VCCPLG/VCOMPLG, and
VCCPLH/VCOMPLH). They should be treated as follows:
VCCPLA/B/C/D/E/F/G/H – there are eight in each device. VCCPLA supports the PLL associated with
global resource HCLKA,VCCPLB supports the PLL associated with global resource HCLKB, etc.
These PLL analog power supply pins should be connected to 1.5 V, whether or not the PLL is used.
Refer to the Axcelerator Family FPGAs and RTAX-S/L Family FPGAs datasheets for pin assignment
information.
VCOMPLA/B/C/D/E/F/G/H – these are compensation reference signals for the internal PLLs. There
are eight in each device. VCOMPLA supports the PLL associated with global resource HCLKA,
VCOMPLE supports the PLL associated with global resource HCLKE, etc.
10
Support
The VCOMPLX pins should be left floating if the PLL is not being used. Refer to the Axcelerator
Family FPGAs and RTAX-S/L Family FPGAs datasheets for pin assignment information.
2. Since the AX and the RTAX-S/L devices are exactly pin compatible except for the PLL, which the
RTAX-S/L does not have, designing the PCB with VCCPL(X) pins connected to 1.5 V will not affect
the function of the RTAX-S/L devices. Pins for VCOMPL(X) can be designed with land patterns only.
These 16 PLL pins are not connected internally inside the RTAX-S/L packages.
Support
Visit Technical Support online at www.microsemi.com/soc/support/search/default.aspx
Email Technical Support at [email protected]
Call Technical Support between 7:00 AM and 6:00 PM Pacific Time, Monday through Friday:
650.318.4460
800.262.1060
Related Documents
Application Notes
Ceramic Column Grid Arrays (CCGA)
www.microsemi.com/soc/documents/CCGA_AN.pdf
Datasheets
Axcelerator Family FPGAs
www.microsemi.com/soc/documents/AX_DS.pdf
RTAX-S RadTolerant FPGAs
www.microsemi.com/soc/documents/RTAXS_DS.pdf
Pin Mapping Lists
All pin mapping lists are available at www.microsemi.com/soc/techdocs/package/default.aspx.
List of Changes
The following table lists critical changes that were made in each revision of the document.
Revision*
Changes
Page
55900016-4/11.11
Added 2 lines at the end of "Introduction" section (SAR 33472).
1
55900016-3/7.06
All tables were updated to include current ordering part numbers
1, 10,
and 11
Clarifying notes added to Step 5 and Figure 12
6, 9
Note: *The revision number is located in the part number after the hyphen. The part number is displayed at the bottom
of the last page of the document. The digits following the slash indicate the month and year of publication.
11
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55900016-4/11.11
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