EIA Standard Board Layout of Soldered Pad for QFP Devices and QFP Surface Mount Socket

EIA Standard Board Layout of Soldered Pad for QFP Devices
and QFP Surface Mount Socket
Figure 1 • Board Layout of Solder Pad Dimension
Table 1 contains the board layout soldered pad dimensions for Microsemi Quad Flat Packs only. If you
are using surface mount sockets for prototyping, see Table 2 for layout dimensions.
Table 1 • QFP Package Layout Dimensions
Dim. PQ100
PQ144
PQ160 PQ160
PQ/
PQ/
VQ/
3.2 mm 3.9 mm RQ 208 RQ 240 VQ 80 TQ 100
VQ
128
VQ
176
TQ
64
TQ
144
TQ
176
Md
20.4
28.4
28.4
29.2
28.2
32.2
13.8
13.8
13.8
19.8
10.1
19.8
23.8
Me
14.4
28.4
28.4
29.2
28.2
32.2
13.8
13.8
13.8
19.8
10.1
19.8
23.8
e
0.65
0.65
0.65
0.65
0.5
0.5
0.65
0.5
0.4
0.4
0.5
0.5
0.5
0.3-
0.3-
0.4
0.4
0.30.4
1.6
1.6
1.6
b2
I2
0.30-0.5 0.30-0.5 0.30-0.5 0.30-0.5 0.3-0.4
1.8
1.8
1.8
1.8
1.6
0.3-0.4 0.3-0.5 0.3-0.4 0.25- 0.250.30 0.30
1.6
1.8
1.6
1.6
1.6
Note: Dimension = millimeters
May 2012
© 2012 Microsemi Corporation
1
Table 2 contains board layout soldered pad dimensions to be used if you are using surface mount
sockets for prototyping and Microsemi Quad Flat Packs for production. These dimensions will accept
both surface mount sockets and actual QFP packages. Refer to Figure 1 for alignment pin location layout
and overall dimensions. However, it is recommended that different solder mask openings be used for
prototype sockets and production QFP packages.
Table 2 • Combined QFP Package and Socket Layout Dimensions
Dim.
PQ100
PQ144
PQ160
3.2 mm
PQ160
3.9 mm
PQ/
PQ/
RQ 208 RQ 240
VQ 80
VQ/
TQ 100
TQ 64
TQ
144
TQ
176
Md
20.4
28.4
28.4
29.2
28.2
32.2
13.8
13.8
10.1
19.8
23.8
Me
14.4
28.4
28.4
29.2
28.2
32.2
13.8
13.8
10.1
19.8
23.8
Zd
26.8
35.2
35.2
35.2
32.1
36.1
17.2
17.1
13.5
23.3
27.3
Ze
20.8
35.2
35.2
35.2
32.1
36.1
17.2
17.1
13.5
23.3
27.3
e
0.65
0.65
0.65
0.65
0.5
0.5
0.65
0.5
0.5
0.5
0.5
0.30-0.5
0.30-0.5
0.3-0.4
0.3-0.4
0.3-0.5
0.3-0.4
b2
0.30-0.5 0.30-0.5
Socket
SYSYSYSYSYSYSYSYPart
PQ100-1 PQ144-1 PQ160-1 PQ160-1 PQ208-2 PQ240 VQ80-2 VQ100-1
Number
0.3-0.4 0.3-0.4 0.3-0.4
SYTQ64
SYSYTQ144 TQ176
Note:
1. If sockets other than those specified in Table 2 are used, make sure to check the socket drawing
before finalizing the mount pad layout.
2. For
positioning
pin
holes
dimension,
refer
to
www.microsemi.com/soc/documents/MechDrwngSocket.pdf.
each
socket
drawing
at:
3. Dimension = millimeters
Table 3 contains board layout soldered pad dimensions to be used if you are using a prototype socket
and a packaged device. It is recommended that different solder mask openings be used for prototype
sockets and production QFP packages.
Table 3 • Combined CQ208, QFP208 and Prototype Socket/ Combined CQ256 and CQ256 –
FG484 Adapter Socket/Combined CQ352 and CQ352 – FG896 Adapter Socket
PQ/RQ208/CQ2081
Dim.
CQ2561/CQ256-FG484
adapter socket
CQ3521/CQ352-FG896 adapter socket1
Md
28.2
40.5
51.50
Me
28.2
40.5
51.50
Zd
35.1
42.5
54.50
Ze
35.1
42.5
54.50
e
0.5
0.5
0.5
b2
0.3-0.4
0.3-0.4
0.3-0.4
Socket Part Number
SY-PQ208-2
1). SI-SX72-ACQ256SFG484 1). SK-AX1000-CQ352RTFG896
2). SI-SX32-ACQ256SFG484 2). SK-AX2000-CQ352RTFG896
Note: 1. Md, Me, Zd, and Ze dimensions are based on trim and form data from Fancort Industries Inc. If
you are using trim and form from another vendor, Md, Me, Zd,and Ze could be different. It is for
PCB layout reference only.
2. Dimension = millimeters
2
3
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55900010-4/05.12
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