Hermetic Package Mechanical Configuration Package Devices Cavity Weight Lid Heat Spreader (grams) (mils) (mm) PG84 A1010B Up 8.0 690x690 No CQ84 A1020B Up 2.2 520x520 No PG84 A1020B Up 8.0 690x690 No PG100 A1225XL Up – 550x550 No PG132 A1240A Up 11.0 720x720 No PG132 A1240XL Up 11.0 720x720 No CQ172 A1280A Up 8.8 870x870 No PG176 A1280A Up 18.2 870x870 17.00x17.00 (inside of package) CQ172 A1280XL Up 8.8 870x870 No PG176 A1280XL Up 19 870x870 No CQ256 A14100A Up 13.0 860x860 No PG257 A14100A Down 27.3 860x860 No CQ132 A1425A Up 5.8 650x650 No PG175 A1440A Down 19 670x670 No CQ196 A1460A Up 11.1 770x770 No PG207 A1460A Down 24.5 770x770 No CQ84 A32100DX Up 2.2 550x550 No CQ208 A32200DX Up 18.5 900x900 22.85x22.85x0.50 CQ256 A32200DX Down - 900x900 22.86x22.86x0.50 CQ208 A42MX36 Up 8.8 770x770 No CQ256 A42MX36 Down 13.0 770x770 No CQ208 A54SX16 Up 8.8 520x520 No CQ256 A54SX16 Up 15.0 520x520 18.29x18.29x0.50 1. 2. 3. 4. 5. 6. 7. Device weights are approximate values. There might be slight variations from lot to lot and device to device. For increased accuracy, Actel recommends weighing the parts that are being used. CQFP package weights do not include the ceramic lead frame, therefore they are the approximate weights after devices are trim-and-formed. Dimensions for CQFPs are recorded as mean design dimensions (X,Y, and Z as thickness) and tolerance shall be applied. The overall package thickness is: ceramic thickness + lid thickness (typical ~0.60 mm) + HS (0.50mm if exist). HS thickness is 0.50mm and brazed to the surface of the ceramic substrate. Total HS thickness is 1.27mm with only 0.50mm extended outside of the ceramic surface. Cavity down CQFPs have their lid on the bottom side when attached to PCBs. The trim-form mechanical samples for both 32200DX and MX36 are interchangeable, since the 32200DX HS is facing upward. All CQFPs in the same group of configuration (for example, CQ208, cavity up, no HS) are interchangeable as trim-form mechanical samples. All CQFPs and CPGAs have their lids and heat sinks grounded to the ground plane within the packages. 1 Weight Lid Heat Spreader Package Devices Cavity (grams) (mils) (mm) CQ208 A54SX32 Up 8.8 590x590 No CQ256 A54SX32 Up 14.5 590x590 12.07x12.70x0.50q CQ208 A54SX32A Up 8.8 720x720 No CQ256 A54SX32A Up 13.0 720x720 No CQ208 A54SX72A Up 8.8 720x720 No CQ256 A54SX72A Up 13.0 720x720 No CQ208 APA1000 Up 8.8 900x900 No CQ352 APA1000 Up 27.4 900x900 No CQ352 AX2000 Up 27.4 1000x1000 No CG624 AX2000 Up 13.28 1000x1000 No CQ84 RH1020 Up 2.2 520x520 No CQ172 RH1280 Up 8.8 870x870 No CQ84 RT1020 Up 2.2 520x520 No CQ172 RT1280A Up 8.8 870x870 No CQ256 RT14100A Up 13.0 860x860 No CQ132 RT1425A Up 5.8 650x650 No CQ196 RT1460A Up 11.1 770x770 No CQ208 RT54SX16 Up 8.8 590x590 No CQ256 RT54SX16 Up 14.5 860x860 12.07x12.70x0.50 CQ208 RT54SX32S Up 8.8 720x720 No CQ256 RT54SX32S Up 13 720x720 No CC256 RT54SX32S Up - 590x490 No CQ208 RT54SX72S Up 15.5 900x900 22.85x22.85x0.50 CQ256 RT54SX72S Up 20.2 900x900 22.86x22.86x0.50 CQ352 RTAX1000S Up 27.4 1000x1000 No CG624 RTAX1000S Up 13.28 1000x1000 No CQ352 RTAX2000S Up 27.4 1075x1075 No CG624 RTAX2000S Up 13.28 1160x1160 No 1. 2. 3. 4. 5. 6. 7. 2 Device weights are approximate values. There might be slight variations from lot to lot and device to device. For increased accuracy, Actel recommends weighing the parts that are being used. CQFP package weights do not include the ceramic lead frame, therefore they are the approximate weights after devices are trim-and-formed. Dimensions for CQFPs are recorded as mean design dimensions (X,Y, and Z as thickness) and tolerance shall be applied. The overall package thickness is: ceramic thickness + lid thickness (typical ~0.60 mm) + HS (0.50mm if exist). HS thickness is 0.50mm and brazed to the surface of the ceramic substrate. Total HS thickness is 1.27mm with only 0.50mm extended outside of the ceramic surface. Cavity down CQFPs have their lid on the bottom side when attached to PCBs. The trim-form mechanical samples for both 32200DX and MX36 are interchangeable, since the 32200DX HS is facing upward. All CQFPs in the same group of configuration (for example, CQ208, cavity up, no HS) are interchangeable as trim-form mechanical samples. All CQFPs and CPGAs have their lids and heat sinks grounded to the ground plane within the packages. Hermetic Package Mechanical Configuration For more information, visit our website at http://www.actel.com www.actel.com Actel Corporation Actel Europe Ltd. Actel Japan Actel Hong Kong 2061 Stierlin Court Mountain View, CA 94043-4655 USA Phone 650.318.4200 Fax 650.318.4600 Dunlop House, Riverside Way Camberley, Surrey GU15 3YL United Kingdom Phone +44 (0)1276.401450 Fax +44 (0)1276.401490 EXOS Ebisu Building 4F 1-24-14 Ebisu Shibuya-ku Tokyo 150, Japan Phone +81.03.3445.7671 Fax +81.03.3445.7668 39th Floor, One Pacific Place 88 Queensway, Admiralty Hong Kong Phone +852.227.35712 Fax +852.227.35999 © 2003 Actel Corporation. All rights reserved. Actel and the Actel logo are trademarks of Actel Corporation. All other brand or product names are the property of their respective owners. 51700043-1/11.03