v3.3 Package Thermal Characteristics and Weights Table 1 • Package Thermal Characteristics and Weights ja Pin Count jc Still Air 1.0 m/s 200 ft/min 2.5 m/s 500 ft/min Units 84 6.0 33.0 27.2 24.7 C/W 100 5.2 27.0 22.2 20.2 C/W 132 4.8 25.0 20.6 18.7 C/W 175 4.6 23.0 19.0 17.2 C/W 176 4.6 23.0 19.0 17.2 C/W 207 3.5 21.0 17.3 15.7 C/W 257 2.8 15.0 12.4 11.2 C/W Ceramic Quad Flat Package (CQFP)1 84 2.0 40.0 33.0 30.0 C/W – Cavity Up 132 2.0 35.0 28.8 26.2 C/W 172 2.0 28.0 23.1 21.0 C/W 196 2.0 23.0 19.0 17.2 C/W 208 2.0 22.0 19.8 18.0 C/W 256 2.0 20.0 16.5 15.0 C/W 352 2.0 17.9 16.1 14.7 C/W 208 0.5 21.0 17.3 15.7 C/W 256 0.5 19.0 15.7 14.2 C/W 256 1.1 12.1 10.0 9.1 C/W Ceramic Column Grid Array (CCGA)3 624 6.5 8.9 8.5 8.0 C/W Plastic Leaded Chip Carrier (PLCC) 44 16.0 30.0 24.5 22.0 C/W 68 13.0 25.0 21.0 19.4 C/W 84 12.0 22.5 18.9 17.6 C/W 100 12.0 27.8 23.4 21.2 C/W 144 10.0 26.2 22.8 21.1 C/W 160 10.0 26.2 22.8 21.1 C/W 208 8.0 26.1 22.5 20.8 C/W 240 8.0 25.6 22.3 20.8 C/W 208 3.8 16.2 13.3 11.9 C/W 240 3.5 15.9 13.1 11.7 C/W Package Type Ceramic Pin Grid Array (CPGA) – Cavity Up with Heatsink Chip Carrier Land Grid (CCLG) 1, 2 Plastic Quad Flat Package (PQFP) PQFP with embedded Heat Spreader 1. qjc for CQFP and CCLG packages refers to the thermal resistance between the junction and the bottom of the package. 2. qjc for CG624 refers to the thermal resistance between the junction and the top of the package. 3. Thermal resistance from junction to board (èjb) for CG624 is 3.4 C/W. November 2012 © 2012 Microsemi Corporation 1 Package Thermal Characteristics and Weights Table 1 • Package Thermal Characteristics and Weights (continued) ja Pin Count jc Still Air 1.0 m/s 200 ft/min 2.5 m/s 500 ft/min Units 64 12.0 42.4 36.3 34.0 C/W 100 14.0 33.5 27.4 25.0 C/W 144 11.0 33.5 28.0 25.7 C/W 176 11.0 24.7 19.9 18.0 C/W 80 12.0 38.2 31.9 29.4 C/W 100 10.0 35.3 29.4 27.1 C/W 208 0.4 16.5 13.5 10.5 C/W 240 0.3 16.0 12.5 10.0 C/W 272 3.0 18.3 14.9 13.9 C/W 313 3.0 16.6 13.5 12.5 C/W 329 3.0 17.1 13.8 12.8 C/W 456 3.0 15.6 12.5 11.6 C/W 729 2.2 13.7 10.6 9.6 C/W 144 3.8 26.9 22.9 21.5 C/W 256 3.8 26.6 22.8 21.5 C/W 324 3.4 25.8 22.1 18.9 C/W – Pheriperal array 484 3.2 18.0 14.7 13.6 C/W – Full array 484 3.2 20.5 17.0 15.9 C/W 676 3.2 16.4 13.0 12.0 C/W 896 2.4 13.6 10.4 9.4 C/W 1152 1.8 12.0 8.9 7.9 C/W 49 72.2 59.5 54.1 C/W 128 54.1 44.6 40.6 C/W 180 57.8 47.6 43.3 C/W Package Type Thin Quad Flat Package (TQFP, 1.4mm) Very Thin Quad Flat Package (VQFP) Plastic Power (RQFP) Quad Flat Package Plastic Ball Grid Array (PBGA) Fine Pitch Ball Grid Array (FBGA) Chip Scale Package (CS) Quad Flat No Lead (QFN) – A3P030 132 0.1 21.1 16.4 14.8 C/W – A3P060 132 0.2 21.2 16.5 14.9 C/W – A3P125 132 0.3 21.3 16.6 15.0 C/W – A3P250 132 0.4 21.4 16.8 15.3 C/W 1. qjc for CQFP and CCLG packages refers to the thermal resistance between the junction and the bottom of the package. 2. qjc for CG624 refers to the thermal resistance between the junction and the top of the package. 3. Thermal resistance from junction to board (èjb) for CG624 is 3.4 C/W. 2 Package Weights The following table gives approximate weights for Microsemi system-on-chip (SoC) Products Group packages. Microsemi recommends that you weigh the parts yourself for more accurate values. Package weights may vary from lot to lot. Table 2: Package Weights Package Weight (grams) 84 CPGA 8.0 132 CPGA 11.0 175 CPGA 19.0 176 CPGA 19.0 207 CPGA 24.5 257 CPGA 27.3 84 CQFP 2.2 132 CQFP 5.8 172 CQFP 8.8 196 CQFP 11.1 208 CQFP 8.8 208 CQFP cavity up with heat sink 18.5 256 CQFP 13.0 256 CQFP cavity up with heat sink 20.2 352 CQFP 27.4 624 CCGA 13.28 256 CCLG 1.64 44 PLCC 2.4 68 PLCC 4.6 84 PLCC 6.8 100 PQFP 1.6 144 PQFP 5.2 160 PQFP 5.3 208 PQFP 5.2 208 PQFP DX 6.4 240 PQFP 7.0 240 PQFP DX 8.4 64 TQFP 0.3 100 TQFP 0.4 144 TQFP 1.3 176 TQFP 1.8 80 VQFP 0.5 3 Package Thermal Characteristics and Weights Table 2: Package Weights (continued) Package 4 Weight (grams) 100 VQFP 0.5 128 VQFP 0.5 176 VQFP 1.0 208 RQFP 10.0 240 RQFP 13.0 272 PBGA 2.8 313 PBGA 3.7 329 PBGA 3.4 456 PBGA 4.6 729 PBGA 4.86 144 FBGA 0.3 256 FBGA 0.9 324 FBGA 2.1 484 FBGA 2.7 676 FBGA 3.0 896 FBGA 3.8 1152 FBGA 4.8 49 CSP 0.1 128 CSP 0.3 180 CSP 0.4 81 CSP 0.03 121 CSP 0.06 196 CSP 0.2 201 CSP 0.1 281 CSP 0.2 288 CSP 0.2 289 CSP 0.6 48 QFN 0.5 68 QFN 0.2 108 QFN 0.2 132 QFN 0.3 180 QFN 0.5 36 UCS 0.01 81 UCS 0.02 List of Changes List of Changes The following table lists critical changes that were made in each revision of the document. Revision* Revision 5 (November 2012) Changes Modified Table 2 (SAR 32523). Page 3 Note: *The revision number is located in the part number after the hyphen. The part number is displayed at the bottom of the last page of the document. The digits following the slash indicate the month and year of publication. 5 Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 © 2012 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. 51700046-5/11.12