IRF JANTXV2N7225

PD - 90554E
POWER MOSFET
THRU-HOLE (TO-254AA)
Product Summary
IRFM250
JANTX2N7225
JANTXV2N7225
REF:MIL-PRF-19500/592
200V, N-CHANNEL
®
HEXFET MOSFET TECHNOLOGY
Part Number
RDS(on)
ID
IRFM250
0.100 Ω
27.4A
HEXFET® MOSFET technology is the key to International
Rectifier’s advanced line of power MOSFET transistors. The
efficient geometry design achieves very low on-state resistance combined with high transconductance. HEXFET
transistors also feature all of the well-established advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature
stability. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers,
audio amplifiers, high energy pulse circuits, and virtually
any application where high reliability is required. The
HEXFET transistor’s totally isolated package eliminates the
need for additional isolating material between the device
and the heatsink. This improves thermal efficiency and
reduces drain capacitance.
TO-254AA
Features:
n
n
n
n
n
n
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Electrically Isolated
Dynamic dv/dt Rating
Light-weight
Absolute Maximum Ratings
Parameter
ID @ VGS = 10V, TC = 25°C
ID @ VGS = 10V, TC = 100°C
IDM
PD @ TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
T STG
Continuous Drain Current
Continuous Drain Current
Pulsed Drain Current ➀
Max. Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy ➁
Avalanche Current ➀
Repetitive Avalanche Energy ➀
Peak Diode Recovery dv/dt ➂
Operating Junction
Storage Temperature Range
Lead Temperature
Weight
Units
27.4
17
110
150
1.2
±20
500
27.4
15.0
5.0
-55 to 150
A
W
W/°C
V
mJ
A
mJ
V/ns
o
300 ( 0.063 in.(1.6mm) from case for 10s)
9.3 (Typical)
C
g
For footnotes refer to the last page
www.irf.com
1
1/9/01
IRFM250
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Min
Typ Max Units
Test Conditions
BVDSS
Drain-to-Source Breakdown Voltage
∆BV DSS/∆T J Temperature Coefficient of Breakdown
Voltage
RDS(on)
Static Drain-to-Source On-State
Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
IDSS
Zero Gate Voltage Drain Current
200
—
—
V
VGS = 0V, ID = 1.0mA
—
0.28
—
V/°C
Reference to 25°C, ID = 1.0mA
—
—
2.0
9.0
—
—
—
—
—
—
—
—
0.100
0.105
4.0
—
25
250
Ω
IGSS
IGSS
Qg
Q gs
Q gd
td(on)
tr
td(off)
tf
LS + LD
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
6.8
100
-100
115
22
60
35
190
170
130
—
Ciss
C oss
C rss
CDC
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Drain-to-Case Capacitance
—
—
—
—
3500
700
110
12
—
—
—
—
VGS = 10V, ID = 17A ➃
VGS = 10V, ID = 27.4A
VDS = VGS, ID = 250µA
VDS > 15V, IDS = 17A ➃
VDS= 160V ,VGS=0V
VDS = 160V,
VGS = 0V, TJ = 125°C
VGS = 20V
VGS = -20V
VGS =10V, ID = 27.4A
VDS = 100V
V
S( )
Ω
µA
nA
nC
VDD = 50V, ID = 44A,
VGS =10V, RG = 2.35Ω
ns
nH
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from package)
pF
VGS = 0V, VDS = 25V
f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
IS
ISM
VSD
t rr
Q RR
Continuous Source Current (Body Diode)
Pulse Source Current (Body Diode) ➀
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
ton
Forward Turn-On Time
—
—
—
—
—
—
—
—
—
—
27.4
110
1.9
950
9.0
Test Conditions
A
V
nS
µC
Tj = 25°C, IS = 27.4A, VGS = 0V ➃
Tj = 25°C, IF = 27.4A, di/dt ≤ 100A/µs
VDD ≤ 50V ➃
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
Min Typ Max Units
RthJC
RthJCS
Junction-to-Case
Case-to-Sink
—
—
RthJA
Junction-to-Ambient
—
— 0.83
0.21 —
—
Test Conditions
°C/W
48
Typical socket mount
Note: Corresponding Spice and Saber models are available on the G&S Website.
For footnotes refer to the last page
2
www.irf.com
IRFM250
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
www.irf.com
3
IRFM250
13a & b
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 8. Maximum Safe Operating Area
www.irf.com
IRFM250
V DS
VGS
RD
D.U.T.
RG
+
-V DD
10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
VDS
90%
10%
VGS
Fig 9. Maximum Drain Current Vs.
Case Temperature
td(on)
tr
t d(off)
tf
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
www.irf.com
5
IRFM250
15V
L
VDS
D .U .T .
RG
IA S
20V
1
D R IV E R
+
- VD D
A
0 .01 Ω
tp
Fig 12a. Unclamped Inductive Test Circuit
V (B R )D S S
tp
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
IAS
Current Regulator
Same Type as D.U.T.
Fig 12b. Unclamped Inductive Waveforms
50KΩ
QG
12V
0
.2µF
.3µF
10 V
QGS
QGD
+
V
- DS
VGS
VG
3mA
Charge
Fig 13a. Basic Gate Charge Waveform
6
D.U.T.
IG
ID
Current Sampling Resistors
Fig 13b. Gate Charge Test Circuit
www.irf.com
IRFM250
Footnotes:
➀ Repetitive Rating; Pulse width limited by
➂ ISD ≤ 27.4A, di/dt ≤ 190A/µs,
maximum junction temperature.
➁ VDD = 50V, starting TJ = 25°C, L= 1.33mH
Peak IL = 27.4A, VGS = 10V
➃ Pulse width ≤ 300 µs; Duty Cycle ≤ 2%
VDD ≤ 200V, TJ ≤ 150°C
Case Outline and Dimensions — TO-254AA
0.12 [.005]
6.60 [.260]
6.32 [.249]
13.84 [.545]
13.59 [.535]
3.78 [.149]
3.53 [.139]
A
20.32 [.800]
20.07 [.790]
17.40 [.685]
16.89 [.665]
1
2
C
2X
A
22.73 [.895]
21.21 [.835]
20.32 [.800]
20.07 [.790]
17.40 [.685]
16.89 [.665]
3
17.40 [.685]
16.89 [.665]
0.84 [.033]
MAX.
0.36 [.014]
4.82 [.190]
3.81 [.150]
3.81 [.150]
1.14 [.045]
0.89 [.035]
2X
3.81 [.150]
2
13.84 [.545]
13.59 [.535]
1.27 [.050]
1.02 [.040]
B
R 1.52 [.060]
3
4.06 [.160]
3.56 [.140]
3X
1.14 [.045]
0.89 [.035]
0.36 [.014]
B
A
B A
NOT ES :
1.
2.
3.
4.
B
6.60 [.260]
6.32 [.249]
13.84 [.545]
13.59 [.535]
3.78 [.149]
3.53 [.139]
1
3X
3.81 [.150]
13.84 [.545]
13.59 [.535]
0.12 [.005]
1.27 [.050]
1.02 [.040]
DIME NS IONING & T OLERANCING PER AS ME Y14.5M-1994.
ALL DIMENS IONS ARE S HOWN IN MILLIMET ERS [INCHES ].
CONT ROLLING DIMENS ION: INCH.
CONFORMS TO JEDE C OUTLINE T O-254AA.
PIN AS S IGNMENT S
1 = DRAIN
2 = S OURCE
3 = GAT E
CAUTION
BERYLLIA WARNING PER MIL-PRF-19500
Packages containing beryllia shall not be ground, sandblasted, machined or have other operations performed on them
which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids that
will produce fumes containing beryllium.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 01/02
www.irf.com
7