SKB04N60 Fast IGBT in NPT-technology with soft, fast recovery anti-parallel EmCon diode C • 75% lower Eoff compared to previous generation combined with low conduction losses • Short circuit withstand time – 10 µs • Designed for frequency inverters for washing machines, fans, pumps and vacuum cleaners • NPT-Technology for 600V applications offers: - very tight parameter distribution - high ruggedness, temperature stable behaviour - parallel switching capability • Very soft, fast recovery anti-parallel EmCon diode 1 • Qualified according to JEDEC for target applications • Pb-free lead plating; RoHS compliant • Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/ Type SKB04N60 VCE IC VCE(sat) Tj 600V 4A 2.3V 150°C G E PG-TO-263-3-2 Marking Package K04N60 PG-TO-263-3-2 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage VCE 600 V DC collector current IC A TC = 25°C 9.4 TC = 100°C 4.9 Pulsed collector current, tp limited by Tjmax ICpul s 19 Turn off safe operating area VCE ≤ 600V, Tj ≤ 150°C - 19 Diode forward current IF TC = 25°C 10 TC = 100°C 4 Diode pulsed current, tp limited by Tjmax IFpul s 19 Gate-emitter voltage VGE ±20 V tSC 10 µs 2 Short circuit withstand time VGE = 15V, VCC ≤ 600V, Tj ≤ 150°C Ptot Power dissipation TC = 25°C Operating junction and storage temperature Tj , Tstg Soldering temperature (reflow soldering, MSL1) Ts 1 2 W 50 -55...+150 °C 245 °C J-STD-020 and JESD-022 Allowed number of short circuits: <1000; time between short circuits: >1s. 1 Rev. 2.3 Oct. 07 SKB04N60 Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, RthJC 2.5 RthJCD 4.5 RthJA 40 K/W junction – case Diode thermal resistance, junction – case 1) SMD version, device on PCB Electrical Characteristic, at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Value Unit min. Typ. max. 600 - - 1.7 2.0 2.4 - 2.3 2.8 1.2 1.4 1.8 T j =1 5 0° C - 1.25 1.65 3 4 5 T j =2 5 °C - - 20 T j =1 5 0° C - - 500 - - 100 nA 3.1 - S pF Static Characteristic Collector-emitter breakdown voltage V ( B R ) C E S V G E = 0V , I C = 5 00 µA Collector-emitter saturation voltage VCE(sat) V G E = 15 V , I C = 4 A T j =2 5 °C T j =1 5 0° C VF Diode forward voltage V V G E = 0V , I F = 4 A T j =2 5 °C Gate-emitter threshold voltage VGE(th) I C = 20 0 µA , V C E = V G E Zero gate voltage collector current ICES V C E = 60 0 V, V G E = 0 V Gate-emitter leakage current IGES V C E = 0V , V G E =2 0 V Transconductance gfs V C E = 20 V , I C = 4 A µA Dynamic Characteristic Ciss V C E = 25 V , - 264 317 Coss V G E = 0V , - 29 35 Reverse transfer capacitance Crss f= 1 MH z - 17 20 Gate charge QGate V C C = 48 0 V, I C =4 A - 24 31 nC - 7 - nH - 40 - A Input capacitance Output capacitance V G E = 15 V LE Internal emitter inductance measured 5mm (0.197 in.) from case 2) Short circuit collector current IC(SC) V G E = 15 V ,t S C ≤ 10 µs V C C ≤ 6 0 0 V, T j ≤ 1 5 0° C 1) 2 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70µm thick) copper area for collector connection. PCB is vertical without blown air. 2) Allowed number of short circuits: <1000; time between short circuits: >1s. 2 Rev. 2.3 Oct. 07 SKB04N60 Switching Characteristic, Inductive Load, at Tj=25 °C Parameter Symbol Conditions Value min. typ. max. - 22 26 - 15 18 - 237 284 - 70 84 - 0.070 0.081 - 0.061 0.079 - 0.131 0.160 Unit IGBT Characteristic Turn-on delay time td(on) Rise time tr Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff Total switching energy Ets T j =2 5 °C , V C C = 40 0 V, I C = 4 A, V G E = 0/ 15 V , R G =67Ω , 1) L σ = 18 0 nH , 1) C σ = 18 0 pF Energy losses include “tail” and diode reverse recovery. trr ns mJ Anti-Parallel Diode Characteristic Diode reverse recovery time T j =2 5 °C , - 180 - tS V R = 2 00 V , I F = 4 A, - 15 - tF d i F / d t =2 0 0 A/ µs - 165 - ns Diode reverse recovery charge Qrr - 130 - nC Diode peak reverse recovery current Irrm - 2.5 - A Diode peak rate of fall of reverse recovery current during t b d i r r /d t - 180 - A/µs Switching Characteristic, Inductive Load, at Tj=150 °C Parameter Symbol Conditions Value min. typ. max. - 22 26 - 16 19 - 264 317 - 104 125 - 0.115 0.132 - 0.111 0.144 - 0.226 0.277 Unit IGBT Characteristic Turn-on delay time td(on) Rise time tr Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff Total switching energy Ets T j =1 5 0° C V C C = 40 0 V, I C = 4 A, V G E = 0/ 15 V , R G = 67 Ω, 1) L σ = 18 0 nH , 1) C σ = 18 0 pF Energy losses include “tail” and diode reverse recovery. trr T j =1 5 0° C - 230 - tS V R = 2 00 V , I F = 4 A, - 23 - tF d i F / d t =2 0 0 A/ µs - 227 - ns mJ Anti-Parallel Diode Characteristic Diode reverse recovery time ns Diode reverse recovery charge Qrr - 300 - nC Diode peak reverse recovery current Irrm - 4 - A Diode peak rate of fall of reverse recovery current during t b d i r r /d t - 200 - A/µs 1) Leakage inductance L σ a nd Stray capacity C σ due to dynamic test circuit in Figure E. 3 Rev. 2.3 Oct. 07 SKB04N60 t p =2 µ s Ic 0A 15 µ s IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT 20A T C =80°C 10A T C =110°C Ic 0A 10Hz 50 µ s 1A 200 µ s 1ms .1A DC 01A 1V 100Hz 1kHz 10kHz 100V 1000V VCE, COLLECTOR-EMITTER VOLTAGE Figure 2. Safe operating area (D = 0, TC = 25°C, Tj ≤ 150°C) 60W 12A 50W 10A IC, COLLECTOR CURRENT Ptot, POWER DISSIPATION f, SWITCHING FREQUENCY Figure 1. Collector current as a function of switching frequency (Tj ≤ 150°C, D = 0.5, VCE = 400V, VGE = 0/+15V, RG = 67Ω) 40W 30W 20W 10W 0W 25°C 10V 100kHz 8A 6A 4A 2A 50°C 75°C 100°C 0A 25°C 125°C TC, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (Tj ≤ 150°C) 50°C 75°C 100°C 125°C TC, CASE TEMPERATURE Figure 4. Collector current as a function of case temperature (VGE ≤ 15V, Tj ≤ 150°C) 4 Rev. 2.3 Oct. 07 15A 15A 12A 12A IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT SKB04N60 VGE=20V 9A 15V 13V 11V 9V 7V 5V 6A 3A 0A 0V 1V 2V 3V 4V Tj=+25°C IC, COLLECTOR CURRENT -55°C +150°C 10A 8A 6A 4A 2A 0A 0V 2V 4V 6V 8V 10V 6A 15V 13V 11V 9V 7V 5V 3A 1V 2V 3V 4V 5V VCE, COLLECTOR-EMITTER VOLTAGE Figure 6. Typical output characteristics (Tj = 150°C) VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE VCE, COLLECTOR-EMITTER VOLTAGE Figure 5. Typical output characteristics (Tj = 25°C) 12A 9A 0A 0V 5V 14A VGE=20V VGE, GATE-EMITTER VOLTAGE Figure 7. Typical transfer characteristics (VCE = 10V) 4.0V 3.5V IC = 8A 3.0V IC = 4A 2.5V 2.0V 1.5V 1.0V -50°C 0°C 50°C 100°C 150°C Tj, JUNCTION TEMPERATURE Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (VGE = 15V) 5 Rev. 2.3 Oct. 07 SKB04N60 td(off) t, SWITCHING TIMES t, SWITCHING TIMES t d(off) tf 100ns t d(on) 100ns tf t d(on) tr 10ns 0A 2A 4A 6A 8A tr 10ns 0Ω 10A IC, COLLECTOR CURRENT Figure 9. Typical switching times as a function of collector current (inductive load, Tj = 150°C, VCE = 400V, VGE = 0/+15V, RG = 67Ω, Dynamic test circuit in Figure E) 50 Ω 100 Ω 150 Ω 200 Ω RG, GATE RESISTOR Figure 10. Typical switching times as a function of gate resistor (inductive load, Tj = 150°C, VCE = 400V, VGE = 0/+15V, IC = 4A, Dynamic test circuit in Figure E) VGE(th), GATE-EMITTER THRESHOLD VOLTAGE 5.5V t, SWITCHING TIMES td(off) 100ns tf td(on) tr 10ns 0°C 50°C 100°C 5.0V 4.5V 4.0V max. 3.5V typ. 3.0V 2.5V min. 2.0V 150°C -50°C Tj, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, VCE = 400V, VGE = 0/+15V, IC = 4A, RG = 67Ω, Dynamic test circuit in Figure E) 0°C 50°C 100°C 150°C Tj, JUNCTION TEMPERATURE Figure 12. Gate-emitter threshold voltage as a function of junction temperature (IC = 0.2mA) 6 Rev. 2.3 Oct. 07 SKB04N60 0.6mJ 0.4mJ *) Eon and Ets include losses due to diode recovery. *) Eon and Ets include losses due to diode recovery. E, SWITCHING ENERGY LOSSES E, SWITCHING ENERGY LOSSES 0.5mJ E ts * 0.4mJ 0.3mJ E on * 0.2mJ E off 0.1mJ 0.0mJ 0A 2A 4A 6A 8A 0.3mJ E ts * 0.2mJ E off 0.1mJ E on * 0.0mJ 0Ω 10A IC, COLLECTOR CURRENT Figure 13. Typical switching energy losses as a function of collector current (inductive load, Tj = 150°C, VCE = 400V, VGE = 0/+15V, RG = 67Ω, Dynamic test circuit in Figure E) 50 Ω 100 Ω 150 Ω 200 Ω RG, GATE RESISTOR Figure 14. Typical switching energy losses as a function of gate resistor (inductive load, Tj = 150°C, VCE = 400V, VGE = 0/+15V, IC = 4A, Dynamic test circuit in Figure E) 0.3mJ E, SWITCHING ENERGY LOSSES *) Eon and Ets include losses due to diode recovery. 0.2mJ E ts * 0.1mJ E on * E off 0.0mJ 0°C 50°C 100°C 150°C Tj, JUNCTION TEMPERATURE Figure 15. Typical switching energy losses as a function of junction temperature (inductive load, VCE = 400V, VGE = 0/+15V, IC = 4A, RG = 67Ω, Dynamic test circuit in Figure E) 7 Rev. 2.3 Oct. 07 SKB04N60 25V C iss 15V 120V C, CAPACITANCE VGE, GATE-EMITTER VOLTAGE 20V 480V 10V 100pF C oss 5V C rss 10pF 0V 0nC 10nC 20nC 30nC 0V QGE, GATE CHARGE Figure 16. Typical gate charge (IC = 4A) 30V 70A IC(sc), SHORT CIRCUIT COLLECTOR CURRENT tsc, SHORT CIRCUIT WITHSTAND TIME 20V VCE, COLLECTOR-EMITTER VOLTAGE Figure 17. Typical capacitance as a function of collector-emitter voltage (VGE = 0V, f = 1MHz) 25 µ s 20 µ s 15 µ s 10 µ s 5µ s 0µ s 10V 10V 11V 12V 13V 14V 60A 50A 40A 30A 20A 10A 0A 10V 15V VGE, GATE-EMITTER VOLTAGE Figure 18. Short circuit withstand time as a function of gate-emitter voltage (VCE = 600V, start at Tj = 25°C) 12V 14V 16V 18V 20V VGE, GATE-EMITTER VOLTAGE Figure 19. Typical short circuit collector current as a function of gate-emitter voltage (VCE ≤ 600V, Tj = 150°C) 8 Rev. 2.3 Oct. 07 SKB04N60 500ns 560nC trr, REVERSE RECOVERY TIME IF = 8A 300ns 200ns IF = 4A IF = 2A 100ns 0ns 40A/µs 120A/µs 200A/µs 280A/µs Qrr, REVERSE RECOVERY CHARGE 480nC 400ns d i F / d t, DIODE CURRENT SLOPE Figure 20. Typical reverse recovery time as a function of diode current slope (VR = 200V, Tj = 125°C, Dynamic test circuit in Figure E) IF = 8A IF = 4A IF = 2A 2A 120A/µs 200A/µs 280A/µs OF REVERSE RECOVERY CURRENT d i r r /d t, DIODE PEAK RATE OF FALL Irr, REVERSE RECOVERY CURRENT 240nC IF = 2A 160nC 80nC 120A/µs 200A/µs 280A/µs 360A/µs 400A/µs 6A 0A 40A/µs IF = 4A d i F / d t, DIODE CURRENT SLOPE Figure 21. Typical reverse recovery charge as a function of diode current slope (VR = 200V, Tj = 125°C, Dynamic test circuit in Figure E) 8A 4A 320nC 0nC 40A/µs 360A/µs IF = 8A 400nC 320A/µs 240A/µs 160A/µs 80A/µs 0A/µs 40A/µs 360A/µs d i F / d t, DIODE CURRENT SLOPE Figure 22. Typical reverse recovery current as a function of diode current slope (VR = 200V, Tj = 125°C, Dynamic test circuit in Figure E) 120A/µs 200A/µs 280A/µs 360A/µs diF/dt, DIODE CURRENT SLOPE Figure 23. Typical diode peak rate of fall of reverse recovery current as a function of diode current slope (VR = 200V, Tj = 125°C, Dynamic test circuit in Figure E) 9 Rev. 2.3 Oct. 07 SKB04N60 8A 2.0V I F = 8A 4A VF, FORWARD VOLTAGE IF, FORWARD CURRENT 6A 150°C 100°C 25°C 2A I F = 4A 1.5V -55°C 0A 0.0V 0.5V 1.0V 1.5V 1.0V 2.0V VF, FORWARD VOLTAGE Figure 24. Typical diode forward current as a function of forward voltage -40°C 0°C 40°C 80°C 120°C Tj, JUNCTION TEMPERATURE Figure 25. Typical diode forward voltage as a function of junction temperature 0 10 K/W 0 ZthJC, TRANSIENT THERMAL IMPEDANCE ZthJCD, TRANSIENT THERMAL IMPEDANCE D=0.5 D=0.5 0.2 0.1 0.05 R,(K/W) 0.128 0.387 0.346 1.360 2.280 0.02 -1 10 K/W 0.01 single pulse R2 10µs 100µs 1ms 10ms 100ms 0.2 0.1 0.05 -1 10 K/W 0.02 0.01 -2 10 K/W R,(K/W) 0.815 0.698 0.941 0.046 τ, (s) 0.0407 5.24*10-3 4.97*10-4 4.31*10-5 R1 single pulse C 1 = τ 1 / R 1 C 2 = τ 2 /R 2 -2 10 K/W 1µs R1 τ, (s) 0.085 7.30*10-3 4.69*10-3 7.34*10-4 5.96*10-5 10 K/W R2 C 1 = τ 1 / R 1 C 2 = τ 2 /R 2 -3 10 K/W 1µs 1s tp, PULSE WIDTH Figure 26. Diode transient thermal impedance as a function of pulse width (D = tp / T) 10µs 100µs 1m s 10m s 100m s 1s tp, PULSE WIDTH Figure 28. IGBT transient thermal impedance as a function of pulse width (D = tp / T) 10 Rev. 2.3 Oct. 07 SKB04N60 PG-TO263-3-2 11 Rev. 2.3 Oct. 07 SKB04N60 i,v tr r =tS +tF diF /dt Qr r =QS +QF IF tS QS Ir r m tr r tF 10% Ir r m QF dir r /dt 90% Ir r m t VR Figure C. Definition of diodes switching characteristics τ1 τ2 r1 r2 τn rn Tj (t) p(t) r1 r2 rn Figure A. Definition of switching times TC Figure D. Thermal equivalent circuit Figure E. Dynamic test circuit Leakage inductance Lσ =180nH an d Stray capacity C σ =180pF. Figure B. Definition of switching losses 12 Rev. 2.3 Oct. 07 SKB04N60 Edition 2006-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 11/5/07. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 13 Rev. 2.3 Oct. 07